JP2000171980A - Both-side exposing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a loss time from being prolonged so much even though an exposure time is prolonged. SOLUTION: As to a work holding base for holding a substrate material P and making the material P opposed to an exposure mask 55; the one 21L exclusive for exposing one exposure surface and the one 21R exclusive for exposing the other exposure surface are provided. Thus, such an operation phase as the receiving, the carrying, the exposing and the previous processing of an unexposed substrate material and that of the substrate material, whose one surface is exposed, can be deviated, so that the loss time for exposure waiting can be prevented from occurring even in the case of only one light source.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a double-side exposure apparatus. More specifically, a double-sided exposure apparatus that sequentially exposes exposed surfaces on both sides of a plate to be exposed such as a printed circuit board material or a lead frame material through an exposure mask on which a predetermined exposure pattern is formed, particularly, one exposure light source is provided. And a double-side exposure apparatus.

[0002]

2. Description of the Related Art For example, in an exposure apparatus used in a process of manufacturing a high-density printed wiring board, an ultra-high pressure mercury lamp is usually used as an exposure light source in order to increase resolution. Although this type of mercury lamp is extremely expensive at a cost of about 500,000 yen, it must be used continuously because of its properties and has a life of only about 500 hours. The exposure apparatus is required to use one light source as much as possible and to improve the use efficiency of the light source as much as possible. That is, it is because the exposure cost (running cost of the light source) per printed circuit board material is to be minimized by completing as much exposure as possible during the life of the light source.

In order to increase the efficiency of use of the light source, the operating speed of various mechanical operating units such as a mechanism for transporting a printed circuit board material and an adjusting mechanism for aligning with an exposure mask is increased as much as possible. It is important to make the waiting time such as the exposure waiting time close to zero.

FIG. 13 shows an example 100 of a conventional double-sided exposure apparatus described in Japanese Patent Application No. 9-343971. In the figure, reference numeral 101 denotes a work holding base for detachably holding a printed circuit board material P. The work holding base 101 is provided with negative pressure suction plates 103 on both left and right sides. And two right and left mask holding mechanisms 109 each having an exposure mask 113.
L and 109R are repeatedly moved between exposure positions (positions indicated by solid lines).

Reference numeral 111 denotes a mercury short arc lamp as a light source. The path of light emitted from this lamp is illuminated from behind by an optical path switching means (not shown) to the left mask holding mechanism 109L and the right mask holding mechanism 109L. It is switched to an optical path for irradiating the mechanism 109R from behind. The receiving unit 105 is configured to preliminarily align the supplied unexposed printed circuit board material P, and then receive the unexposed printed circuit board material P on the negative pressure suction plate 103 on the left side of the work holding base 101 at the home position. I have.

When the work holding base 101, which has received the printed circuit board material P at the home position, comes to the exposure position, the left mask holding mechanism 109L moves the printed circuit board material P.
After the alignment is performed between the printed board material P and the exposure mask 113, the suction is steadily performed, and the exposure is performed on one of the exposure surfaces.

When the exposure is completed, the suction is released, and then the mask holding mechanism 109L on the left side retreats, and the single-sided exposed printed circuit board material P, which has just been exposed, is received by the left replacement hand 115L. To the right hand 115R. The printed circuit board material P delivered in this way is the work holding base 1 once returned to the home position.
When 01 comes to the exposure position, it is sucked and held by the negative pressure suction plate 103 on the right side, that is, is replaced. Then, the printed circuit board material P is placed on the negative pressure suction plate 103 on the right side.
Is held, the right mask holding mechanism 109R advances so as to come into contact with the printed circuit board material P, and after the printed board material P and the exposure mask 113 are aligned, it is steadily attracted, Here, exposure on the other exposure surface is performed. This completes the exposure on both sides.

When the exposure is completed, after the suction is released, the mask holding mechanism 109R on the left retreats, the work holding base 101 returns to the home position, and the negative pressure suction plate 103 on the left moves from the receiving portion 105 to the home position. While receiving the unexposed printed circuit board material P, the suction plate 103 on the right
The printed circuit board material P, which has been exposed on both sides, is removed by the removal unit 107.

FIG. 14A is a time chart showing the operation of one type of the above-described double-side exposure apparatus 100, and the time required for each operation and processing is shown in FIG. As shown on a time scale of seconds.
The time required for exposure is usually about 3 seconds or less,
In this time chart, it is set to 3 seconds,
One cycle time from the reception of the unexposed printed circuit board material P to the reception of the next unexposed printed circuit board material P after the exposure of both sides is completed is 22 seconds. As can be seen from this figure, when the exposure time in using the double-sided exposure apparatus 100 is about 3 seconds, there is almost no waiting time from the end of the left exposure to the start of the right exposure.

[0010]

However, for example, depending on the type of the resist ink applied to the printed circuit board material P, there is a case where the exposure time must be increased. Even if all the exposure preparation operations are completed, it is not possible to start the exposure on the other exposure surface until the exposure on one exposure surface is completed, which causes a problem of loss time.

FIG. 14B is a time chart in a case where both sides are exposed for 8 seconds using the double-sided exposure apparatus 100. In this case, a waiting time of 5.5 seconds occurs from the time when the exposure preparation on the right is completed to the start of exposure, and the work holding base 101 moves to the home position after the delivery of the left printed circuit board material is completed. There is a 5.5 second wait until the exposure is possible, i.e., after the right exposure and post-processing. As a result, the time required for one cycle is 32 seconds. When this is compared with FIG. 14A, it takes about 1.5 times as long per cycle, so that the running cost of the lamp 111 jumps to almost 1.5 times.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and has as its object to provide a double-sided exposure apparatus capable of preventing a loss time from increasing even if an exposure time is extended. I do.

[0013]

In order to achieve this object, a double-side exposure apparatus according to the present invention is a double-side exposure apparatus for exposing both front and rear exposure surfaces of a plate to be exposed through an exposure mask on which a required exposure pattern is formed. A first mask holding mechanism to which an exposure mask used for exposing one of the exposed surfaces of the plate to be exposed is mounted, an exposure position facing the first mask holding mechanism, and a home for receiving an unexposed plate to be exposed. A first processing unit having a first work holding base moving between the first and second positions, a second mask holding mechanism to which an exposure mask used for exposure on the other exposure surface of the plate to be exposed is attached, A second processing unit having a second work holding base that moves between an exposure position facing the second mask holding mechanism and a home position where the exposed plate subjected to double-sided exposure is removed, and a first processing unit. A workpiece multiplication replacement means for replacing placed on the second work holding base after receiving an object to be exposed plate exposed with processing section in an orientation capable of exposing the other exposed surface, 1
And an optical system for selectively switching an optical path of light from the light source to an optical path toward the first processing unit and an optical path toward the second processing unit.

That is, according to the present invention, there is provided a work holding base for holding a plate to be exposed and facing the exposure mask, a work holding base dedicated to exposing one exposed surface of the plate to be exposed, and a work holding base for exposing the other exposed surface. And two dedicated ones. In this way, the operation phase of receiving and transferring an unexposed plate and exposure and pre-processing thereof is shifted from the operation phase of transferring and exposing a single-side exposed plate and exposure and pre-processing thereof. Can be

Therefore, the operation phases of the first processing unit and the second processing unit are changed so that the exposure by the second processing unit is performed while the operation other than the exposure by the first processing unit is performed. By shifting, even if there is one light source, it is possible to reliably prevent the occurrence of a loss time waiting for exposure. Further, in addition to the shift of the operation transfer, after the exposure in the first processing section is completed, the work transfer means shifts the exposed plate having been subjected to the one-sided exposure to the second position before the second work holding base comes to the exposure position. By setting the operation timing of each part so that the work holding base can be held by the work holding base, it is possible to prevent not only the exposure waiting time but also the movement holding time of the work holding base.

According to a second aspect of the present invention, in the double-sided exposure apparatus according to the first aspect, the plate to be exposed is held by the work holding base by setting the plate to be exposed to a vertical posture at least until both sides are exposed. It is intended to be performed. With this configuration, since exposure is performed with the exposure mask and the plate to be exposed both upright, it is possible to considerably prevent the occurrence of exposure failure due to adhesion of dust.

According to a third aspect of the present invention, in the double-sided exposure apparatus according to the first aspect, the left and right mask holding mechanisms are arranged in a positional relationship facing each other, and the operation of changing the plate to be exposed by the work changing means is performed. At the timing when the work holding base is at the home position, the operation is performed only in the direction facing the mask holding mechanism. In this case, since a special space required for changing the plate to be exposed is hardly necessary, the apparatus can be downsized accordingly.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A printed board material double-sided exposure apparatus 1 according to an embodiment of the present invention will be described below with reference to the drawings. (Refer to FIGS. 1 to 3 for the structure.) Reference numeral 3 denotes an outer casing of the printed board material double-sided exposure apparatus 1. A vertical wall-shaped mechanism base 5 is provided at a substantially intermediate position in the front-rear direction (the front side toward FIG. 1 is the front side and the left side in FIG. 1 is the left side) inside the outer casing 3. The rear space of the mechanism base 5 is mainly an optical system arrangement chamber 7. Further, a horizontal partition plate 9 is disposed at an intermediate portion in the height direction in a space on the front side from the mechanism base 5, and a lower side of the partition plate 9 is a receiving / removing chamber 11,
The upper side is the exposure chamber 13. A passage opening 9 a is formed in a middle portion of the partition plate 9 in the left-right direction, which serves as a passage between the receiving / extracting chamber 11 and the exposure chamber 13. A work inlet 15 is formed on the left side wall of the outer casing 3, and a work outlet 17 is formed on the right side wall.

In the outer casing 3, two left and right work holding elevators 21L and 2L which move vertically through the passage opening 9a.
1R is provided, and mask holding mechanisms 23L and 23R are provided on both left and right sides of the movement trajectory of the work holding elevators 21L and 21R in the exposure chamber 13. The first processing unit 25L is configured by the left work holding elevator 21L and the mask holding mechanism 23L, and the second processing unit 25R is configured by the right work holding elevator 21R and the mask holding mechanism 23R. The first processing unit 25L is a part that mainly performs exposure on one exposure surface of the printed circuit board material P, and the second processing unit 25R is a part that mainly performs exposure on the other exposure surface of the printed circuit board material P. .

A loader mechanism 27 is provided on the left side of the movement locus of the work holding elevator 21L in the receiving / unloading chamber 11, and the receiving conveyor 2 is provided on the left side of the loader mechanism 27.
9 are arranged. The left end of the receiving conveyor 29 faces the work entrance 15, and the printed circuit board material transferred on a supply conveyor (not shown) extending from the left with respect to the outer casing 3 passes through the P work entrance 15. Get on the receiving conveyor 29. The printed board material P is supplied in a state where an ultraviolet-curable resist film is formed on both front and back surfaces. Then, the printed board material P placed on the receiving conveyor 29 is transferred to the upper surface of the loader mechanism 27 by a driving roller (not shown) of the receiving conveyor 29.

The loader mechanism 27 has a function of adsorbing and holding the printed circuit board material P transferred to the upper surface by negative pressure means and a position of the leading edge of the printed board material P to a pre-alignment sensor 31 (see FIG. 1). After the pre-alignment is completed, the pre-alignment function is rotated by 90 ° as shown by a two-dot chain line in FIG. And move horizontally. In order to perform such an operation, the loader mechanism 27 is supported by a rotating shaft 33 extending so as to protrude forward from the mechanism base 5.
Are supported by moving means (not shown) provided to be movable in the left-right direction on the rear side of the mechanism base 5.

An unloader mechanism 35 is provided on the right side of the locus of movement of the right work holding elevator 21R, and an unloading conveyor 37 is provided on the right side of the unloader mechanism 35. The unloader mechanism 35 has its upper surface brought to a negative pressure state by negative pressure means (not shown) at any time,
The posture is changed between a horizontal posture indicated by a solid line in FIG. 1 and a horizontal posture in which the upper surface thereof is turned by 90 ° and the upper surface is directed to the left side, and moves horizontally in this horizontal posture. In order to perform such an operation, the unloader mechanism 35 is also supported by a rotating shaft 33 'extending so as to protrude forward from the mechanism base 5, and this rotating shaft 33' is connected to the rear side of the mechanism base 5. And is supported by a moving means (not shown) provided so as to be movable in the left-right direction.

The right end of the take-out conveyor 37 faces the work outlet 17. When the right work holding elevator 21R holds the printed circuit board material P and descends to the home position, the unloader mechanism 35 removes the printed circuit board material P in a sideways posture and returns to a horizontal posture. Then, the printed circuit board material P removed by the unloader mechanism 35 is transferred to a take-out conveyor 37 by a drive roller (not shown) of the unloader mechanism 35, and passes through the work outlet 17 and rides on a transport conveyor (not shown). It is transported to the next step, for example, a developing step.

At the center of the rear surface of the mechanism base 5 in the left-right direction, two right and left sides extending parallel to each other in the up-down direction are provided.
The set of vertical guide rails 36 is fixed, and slide bases 39 are slidably supported on the left and right vertical guide rails 36, respectively. From these slide bases 39, horizontal arms 41 project forward, respectively. The arm 41 protrudes forward through a vertically long hole 5 a formed in the mechanism base 5.
R is individually fixed.

The work holding elevators 21L and 21R are
The printed board material P is vertically held while being sucked and held in a vertical posture. In the drawings, these work holding elevators 21L and 21R are shown only by a rectangular simple flat plate shape. However, in actuality, a moving base having a vertical wall shape and one surface of the moving base (the left work holding elevator 21L, a negative pressure suction plate provided with a large number of suction holes provided on the left side surface and the right work holding elevator 21R on the right side) and an intake system connected to the negative pressure suction plate. The printed circuit board material P is detachably sucked and held on the negative pressure suction plate.

The slide base 39 is moved by a ball screw rotated by a servo motor (not shown), and this movement causes the work holding elevators 21L, 21L to move.
R rises or falls through the passage opening 9 a of the partition plate 9. The movement of the workpiece holding elevators 21L and 21R is performed by moving the home position between the loader mechanism 27 and the unloader mechanism 35 as shown by a solid line in FIG. 1 and the left and right masks as shown by a two-dot chain line in FIG. Holding mechanisms 23L and 23
The exposure is performed between the exposure position and R.

Horizontal guide rails 45 (see FIG. 2) extending in the left-right direction are fixed to the left and right sides of the vertical guide rails 36 on the back of the mechanism base 5, and slide bases 47 are slidable on these horizontal guide rails 45, respectively. It is supported by. From the left and right slide bases 47, arms 49 project horizontally forward. This arm 49 is provided with a hole 5b formed in the mechanism base 5.
Through which the left mask holding mechanism 23L is fixed to the front end of the left arm 49.
A right side mask holding mechanism 23R is fixed to the front end of the reference numeral 9.

The slide base 47 has a ball nut (not shown), and a ball screw 53 rotated by a servo motor 51 is screwed to the ball nut. Accordingly, the rotation of the ball screw 53 moves the slide base 47 in the left-right direction, and the mask holding mechanisms 23L, 23R move in the left-right direction integrally therewith. The movement of the mask holding mechanisms 23L, 23R
A retracted position that is separated from the movement trajectories of the workpiece holding elevators 21L and 21R to some extent;
L and 21R are carried out between a forward position in contact with the printed circuit board material held.

In the drawing, the mask holding mechanisms 23L, 23R
Is shown only in a rectangular frame shape, but in practice, the base of this shape and one surface of the base (the right side surface in the left mask holding mechanism 23L and the left side surface in the right mask holding mechanism 23R) The alignment unit provided and the exposure mask 55 held by the alignment unit (FIG. 3)
In this case, the pattern is provided with a satin pattern), and a structure including a camera for detecting an alignment error is provided. By driving the alignment unit, the position of the exposure mask 55 is finely adjusted in a vertical plane.

A predetermined light transmitting pattern is provided on the exposure mask 55, and a photomask mark (not shown) is provided at a predetermined position. The camera overlaps the photomask mark with a reference hole of a printed circuit board material. An error is detected by looking, and the alignment unit performs a correction according to the error, thereby relatively aligning the exposure mask 55 with the printed circuit board material.

One lamp 61 is arranged in the lower part of the outer casing 3 in the center of the optical system arrangement chamber 7. The lamp 61 uses a mercury short arc lamp, and is provided in a direction in which light is irradiated directly upward. Above the lamp 61, a half-mirror-type rotating mirror 63 is provided. The rotating mirror 63 has a first position where the light from the lamp 61 is horizontally reflected to the left as shown by a broken line in FIG. 1 and a light from the lamp 61 as shown by a two-dot chain line in FIG. The posture is controlled between a second position where the light is horizontally reflected to the right and a neutral position where the posture is horizontal.

An irradiation mirror 65L is arranged behind the left side of the left mask holding mechanism 23L.
An irradiation mirror 65R is disposed behind the right side of the 3R.
The reflection mirrors 67 are provided on both left and right ends of the optical system arrangement chamber 7, respectively.
Are arranged, and a fly-eye lens 69 is interposed between the reflecting mirror 67 and the rotating mirror 63, respectively. Therefore, when the rotating mirror 63 is at the first position, the light from the lamp 61 irradiates the exposure mask 55 of the left mask holding mechanism 23L via the left reflecting mirror 67 and the left irradiation mirror 65L. When the rotating mirror 63 is at the second position, the light passes through the right reflection mirror 67 and the right irradiation mirror 65R to the exposure mask 55 of the right mask holding mechanism 23R. The optical path is controlled to irradiate.

When the rotary mirror 63 is rotated to the first position while the left work holding elevator 21L holding the printed circuit board material P is at the exposure position, the light from the lamp 61 emits light on the left side. The printed board material P is irradiated through the exposure mask 55, whereby one exposure surface of the printed board material P is exposed by the exposure pattern of the left exposure mask 55. When the rotating mirror 63 moves to the second position while the printed circuit board material P is held by the right work holding elevator 21R at the exposure position, light from the lamp 61 passes through the right exposure mask 55. The printed board material P is irradiated, whereby the other exposed surface of the printed board material P is exposed by the exposure pattern of the exposure mask 55 on the right side.
This exposure is performed in a state where the exposure mask 55 is in close contact with the printed circuit board material P.

A ceiling base 71 is arranged on the mechanism base 5, and a guide rail 73 extending in the left-right direction is fixed to the upper surface of the ceiling base 71. Reference numerals 75L and 75R denote transfer mechanisms, and the transfer mechanisms 75L and 75R have transfer hands 77L and 77R. 79 denotes a slide base of the transfer mechanism 75L, 75R (see FIG. 3),
It has a long horizontal plate shape in front and back, and its rear end is slidably supported by a guide rail 73. The left slide base 79 is moved relatively short distance in the left and right direction by the air cylinder 81, and the right slide base 79 is moved relatively long distance in the left and right direction by the ball screw 85 rotated by the servo motor 83.

A transfer hand drive 87 is attached to the front end of the slide base 79. The transfer hand drive unit 87 has a parallel link 89, and the transfer hands 77L, 77R
Is attached. The transfer hands 77L and 77R have a hollow structure, and a large number of suction protrusions are provided on opposing side surfaces thereof. And transfer hand 7
A suction means (not shown) is connected to the internal space of 7L, 77R, and when the internal space becomes negative pressure, a negative pressure suction force acts on the tip end surface of the suction protrusion.

The parallel link 89 is connected to the transfer hand drive unit 8.
The angle posture is changed by approximately 90 degrees between the posture extending horizontally forward from 7 and the posture extending just below. Therefore, the transfer hands 77L and 77R are moved in the vertical direction while keeping the horizontal posture by the rotation of the parallel link 89, and the movement in this direction is performed by the mask holding mechanism 23L,
The operation is performed between a standby position higher than 23R and a lowering position slightly higher than the center of the mask holding mechanisms 23L and 23R as shown in FIG. The printed board material double-sided exposure apparatus 1 is configured as described above.

Next, the operation of the printed board material double-side exposure apparatus 1 will be described (see FIGS. 4 to 12). FIG. 12 shows a time chart of the operation of the device 1,
At the beginning of the operation, only the first processing unit 25L operates, and the operations marked with * in the figure are not performed until the first exposure processing by the first processing unit 25L is completed. The interval between the vertical broken lines in FIG.

In the initial state, the work holding elevators 21L, 21R are at the home position, the mask holding mechanisms 23L, 23R stand by at the retracted position, and the loader mechanism 2
7 and the unloader mechanism 35 stand by in an upward posture, and the transfer hands 77L and 77R are at the stand-by position. Further, the rotating mirror 63 is held at the neutral position, and the lamp 61 is turned on simultaneously with the start of operation. This lighting is not interrupted on the way, and the lamp 61 is kept on until the operation is completed.

When the printed board material P is loaded on the receiving conveyor 29 from this state, the printed board material P is transferred to the loader mechanism 27 for pre-alignment as described above, and then the loader mechanism 27 is turned sideways. It moves to the right position (see FIG. 4). As a result, the printed circuit board material P held by the loader mechanism 27 is sucked and held by the work holding elevator 21L (“receiving” in FIG. 12). The work holding elevator 21L on the left side holding the printed circuit board material P as described above rises to the exposure position as shown by a two-dot chain line in FIG. 4 ("rise" in FIG. 12). Then, the loader mechanism 27 returns to the original position and executes the processing for the next printed circuit board material P,
Wait for the left work holding elevator 21L to come down to the home position.

When the left work holding elevator 21L comes to the exposure position, one exposure surface of the printed circuit board material P held by the left work holding elevator 21L faces the left mask holding mechanism 23L. Here, the mask holding mechanism 23L moves to the forward position (“forward” in FIG. 12), and the exposure mask 55 makes soft contact with the printed circuit board material P to perform the alignment (“Alignment” in FIG. 12). )), When this is completed, the mask 55 and the printed circuit board material P come into close contact with each other ("adsorption" in FIG. 12). Here, the rotating mirror 63 is rotated to the first position (“first position” in FIG. 12),
As a result, the ultraviolet light from the lamp 61 is irradiated on one of the exposed surfaces of the printed circuit board material P through the exposure mask 55 of the mask holding mechanism 23L, and the exposure on the exposed surface is performed (“exposure” in FIG. 12). This state is the state shown in FIG.

After a lapse of time (8 seconds) necessary for the exposure, the rotating mirror 63 is returned to the neutral position, and after the suction is released ("release of suction" in FIG. 12), the left mask holding mechanism 23L is released. It is returned to the retreat position ("retreat" in FIG. 12). Next, the transfer hand 77L on the left side
However, as shown in FIG. 6, it is moved to the right via the lowering position, is attracted to the printed circuit board material P, holds it, and retreats to the lowering position ("transfer" in FIG. 12). That is, the printed circuit board material P that has been exposed to one of the exposure surfaces is moved from the left work holding elevator 21L to the left transfer hand 77.
Delivered to L. When the delivery is completed, the left work holding elevator 21L descends to the home position as indicated by a two-dot chain line in the same figure ("down" in FIG. 12).

When the left work holding elevator 21L descends to the home position, it receives the next printed circuit board material P from the loader mechanism 27. On the other hand, when the left work holding elevator 21L descends to the home position, as shown in FIG. 7, the right transfer hand 77R moves to the left while maintaining the height of the standby position, and then descends to the descending position. Printed circuit board material P held by the transfer hand 77L on the left side
Opposing from the right side, where the transfer hand 77L on the left side
Moves rightward and transfers the printed board material P to the right transfer hand 77R (“delivery” in FIG. 12). The transfer hand 77R on the right hand side, which has received the printed circuit board material P11 in this manner, horizontally moves between the respective movement trajectories of the left and right work holding elevators 21L, 21R as shown by a two-dot chain line in FIG. And wait at that position (Fig. 1
2. Wait after receiving).

Next, the above-described operations of "up", "advance", "alignment", and "exposure" by the first processing unit 25L are similarly repeated, and immediately after the "alignment" of this operation is started. (This timing is the same as the work holding elevator 21 on the right in the second and subsequent cycles.
This is the same timing as when R moves from the exposure position to the home position. ), The transfer hand 77 on the right side
R moves to a position between the right work holding elevator 21R and the mask holding mechanism 23R (“to the right end” in FIG. 12). Here, the right work holding elevator 21R moves up to the exposure position (“up” in FIG. 12). Next, the right transfer hand 77R moves to the left, and the printed board material P (printed board material P that has been exposed on one side) is sucked and held by the right work holding elevator 21R (“Paste” in FIG. 12). ). This state is the state shown in FIG. 8, in which the printed board material P sucked and held by the right work holding elevator 21R has the other exposed surface facing right. That is, from the viewpoint of the surface held by the work holding elevator, the printed circuit board material P is turned upside down while being transferred. Thereafter, the right transfer hand 77R is returned to the standby position.

While the exposure operation is being performed by the first processing unit 25L, in the second processing unit 25R, the right mask holding mechanism 23R moves to the forward position (see FIG. 12). Forward)), the exposure mask 55 makes soft contact with the other exposure surface of the printed circuit board material P,
The alignment is performed (“alignment” in FIG. 12). Immediately before the alignment is completed, the “exposure” is completed in the first processing unit 25L, and then the rotating mirror 63 is temporarily returned to the neutral position.

Then, in the second processing unit 25R,
When the "alignment" is completed, the exposure mask 55 of the mask holding mechanism 23R on the right side and the printed circuit board material P come into close contact with each other ("suction" in FIG. 12). Here, the rotating mirror 63 is rotated to the second position (“second position” in FIG. 12),
As a result, the other exposure surface of the printed circuit board material P is irradiated with the ultraviolet light from the lamp 61 through the exposure mask 55 of the mask holding mechanism 23R, and exposure is performed on the exposure surface (“exposure” in FIG. 12). This state is the state shown in FIG. 9. In the first processing unit 25L, the printed circuit board material P that has been exposed on one side is delivered from the work holding elevator 21L to the transfer hand 77L, and then the work holding elevator 21L is moved to the home. Go down to the position to receive the next printed circuit board material P.

While the exposure is being performed in the second processing section 25R, the right transfer hand 77R moves along the above-mentioned path and receives the printed circuit board material P, which has been exposed on one side, from the right transfer hand 77R. . This state is shown in FIG. Next, in the first processing unit 25L, the “lift” of the work holding elevator 21L and the “forward” and “alignment” of the mask holding mechanism 23L progress, and in the second processing unit 25L, the exposure ends. Then, the mask holding mechanism 23R "retreats", the work holding elevator 21R descends to the home position, and the unloader mechanism 35 removes the double-sided exposed printed circuit board material P from the work holding elevator 21R. This state is shown in FIG.

The removed printed circuit board material P is transferred to the outside of the outer casing 3 via the take-out conveyor 37. After this, FIG.
9, FIG. 10, and FIG. 11 are repeated in this order.

Looking at the transition of the above operation in the time chart of FIG. 12, there is no waiting time during which no operation or processing is performed, and one cycle time is 26.5 seconds. This time is one cycle time of the conventional apparatus 100 when the required exposure time is the same 8 seconds (FIG. 14).
(B)) Compared with 32 seconds, the time is reduced by approximately 17%. In other words, although the exposure time was extended by 5 seconds from 3 seconds on one side to 10 seconds on both sides,
It is possible to suppress the extension of 4.5 seconds for both surfaces (the loss time of 0.5 seconds in FIG. 14A is absorbed).

Although the embodiment of the present invention has been described in detail above, the specific configuration is not limited to this embodiment, and the design may be changed without departing from the scope of the present invention. Are also included in the present invention. For example, in the embodiments, the present invention is applied to a double-sided exposure apparatus for exposing a resist film of a printed circuit board material. However, the present invention is directed to performing exposure through an exposure mask on which a predetermined exposure pattern is formed. Can be widely applied as a double-sided exposure apparatus that performs double-sided exposure of various exposure target plates that require exposure.

In the embodiment, the work holding base is of a type in which the work holding base moves vertically.
The present invention can of course be applied to a type in which the work holding base moves in the horizontal direction.

[0051]

As described above, in the double-sided exposure apparatus according to the present invention, the receiving and transferring of the unexposed plate, the operation transfer such as the exposure and the pre-processing, and the single-sided exposed plate Since the transfer of the plate and the movement of the exposure and the operation such as pre-processing can be shifted, the exposure by the second processing unit is performed while the operation other than the exposure by the first processing unit is performed. In addition, by shifting the operation phases of the first processing unit and the second processing unit, it is possible to reliably prevent the occurrence of a loss time in waiting for exposure even with one light source.

According to the second aspect of the present invention, since the exposure is performed with the exposure mask and the plate to be exposed both upright, it is possible to substantially prevent the occurrence of exposure failure due to the adhesion of dust.

According to the third aspect of the present invention, since a special space required for changing the plate to be exposed is hardly needed, the apparatus can be downsized accordingly.

[Brief description of the drawings]

FIG. 1 is a front view showing a printed board material double-sided exposure apparatus according to an embodiment of the present invention by cutting an outer casing.

FIG. 2 is a plan view of an essential part showing the double-sided exposure apparatus for printed circuit board material shown in FIG. 1 by cutting an outer casing;

FIG. 3 is a perspective view of a main part of the double-sided exposure device for printed circuit board material shown in FIG. 1;

FIG. 4 is a schematic front view showing a state in which an unexposed printed circuit board material is being received by a left work elevator in the printed circuit board material double-side exposure apparatus shown in FIG. 1;

FIG. 5 is a schematic front view showing a state where exposure is being performed by a first processing unit in the printed board material double-side exposure apparatus shown in FIG. 1;

6 is a schematic front view showing a state in which the transfer hand on the left side is receiving a printed circuit board material in the printed circuit board material double-side exposure apparatus shown in FIG. 1;

FIG. 7 is a schematic front view showing a state where left and right transfer hands are transferring a printed circuit board material in the printed circuit board material double-side exposure apparatus shown in FIG. 1;

8 is a schematic front view showing a state in which exposure by the first processing unit and attachment of the printed circuit board material to the right work elevator are performed in the printed circuit board material double-side exposure apparatus shown in FIG. 1;

9 is a schematic front view showing a state in which the left transfer hand receives the printed circuit board material and the second processing section performs exposure in the double-sided printed circuit board material exposure apparatus shown in FIG. 1;

10 is a schematic front view showing a state in which the left and right transfer hands are transferring the printed circuit board material while the exposure is being performed by the second processing unit in the printed circuit board material double-side exposure apparatus shown in FIG. 1; FIG.

11 is a schematic front view showing a state in which exposure by the first processing unit and removal of the printed circuit board material that has been subjected to double-sided exposure are performed in the printed circuit board material double-side exposure apparatus shown in FIG. 1;

FIG. 12 is a time chart of the operation of the printed circuit board double-sided exposure apparatus shown in FIG. 1;

FIG. 13 is a schematic view showing an example of a conventional double-sided exposure apparatus.

14 is a diagram showing two examples (A) and (B) of the operation of the double-sided exposure apparatus shown in FIG. 13 with different exposure times.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Double-sided exposure apparatus 21L First work holding base 21R Second work holding base 23L First mask holding mechanism 23R Second mask holding mechanism 25L First processing unit 25R Second processing unit 55 Exposure mask 61 Light source 63 , 65L, 65R, 67, 69 Optical system 75L, 75R Work changing means P Exposed plate

Claims (3)

[Claims] 1. A double-sided exposure apparatus for exposing both exposed surfaces of a plate to be exposed through an exposure mask on which a required exposure pattern is formed, wherein an exposure mask used for exposing one of the exposed surfaces of the plate to be exposed is mounted. A first mask holding mechanism, and a first work holding base that moves between an exposure position facing the first mask holding mechanism and a home position for receiving an unexposed plate to be exposed. Processing unit,
A second mask holding mechanism to which an exposure mask used for exposure on the other exposure surface of the plate to be exposed is mounted, an exposure position facing the second mask holding mechanism, and a home position to remove the double-sided exposed plate A second processing unit having a second work holding base moving between the first processing unit and the second work holding base after receiving the exposure target plate exposed in the first processing unit. Transfer means for transferring the light in a direction in which the light can be exposed, one light source, and selectively changing the optical path of light from the light source to an optical path toward the first processing unit and an optical path toward the second processing unit. A double-sided exposure apparatus comprising: a switching optical system. 2. The double-side exposure apparatus according to claim 1, wherein the plate to be exposed is held by the work holding base while the plate to be exposed is held in a vertical posture at least until the exposure of both sides is completed. A double-sided exposure apparatus characterized by the above-mentioned. 3. The double-side exposure apparatus according to claim 1, wherein the left and right mask holding mechanisms are arranged in a positional relationship opposed to each other, and the operation of changing the plate to be exposed by the work changing means is performed by the work holding base. A double-sided exposure apparatus, wherein the exposure is performed only in the direction facing the mask holding mechanism at the timing of coming to the position.