TWI481971B - Exposure method and exposure apparatus - Google Patents

Description

Exposure method and exposure device

The present invention relates to an exposure method and an exposure apparatus for use in the manufacture of a color filter for a liquid crystal panel or the like.

Conventionally, in the manufacture of a color filter for a liquid crystal panel, a coloring layer for forming red (R), green (G), and blue (B) on a substrate on which a black matrix is formed has been known. An exposure method and an exposure apparatus (refer to, for example, Japanese Patent Literature 1 and Japanese Patent Literature 2). In the exposure method, a substrate stage on which a substrate is placed is conveyed to an exposure portion and positioned, and in the exposure portion, exposure light from the light source portion is irradiated onto the substrate by a mask having a smaller area than the substrate. The area is reserved for the first exposure. Next, the substrate stage is only stepped by a predetermined distance, and the substrate is again positioned at the exposure portion, and then the second exposure is performed on the region that cannot be exposed at the first time. The pattern of the photomask is transferred over the entire surface of the large substrate in response to the above-described exposure.

Further, other conventional exposure methods or exposure apparatuses are described in, for example, Japanese Patent Literature 3 and Patent Document 4. In the exposure method, a sheet-like substrate (substrate) wound into a roller is pulled out of the exposure portion and positioned, and the exposure light from the light source portion is passed through a mask corresponding to the size of the unit substrate at the exposure portion, and is irradiated. A predetermined area on the sheet substrate is used to transfer the pattern of the reticle. Then, by pulling the sheet-like substrate out of the unit substrate to the exposed portion and positioning the film, the same exposure operation is repeated, and the pattern of the mask is sequentially transferred toward the longitudinal direction of the sheet substrate. Printed.

[Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. 2004-341280 (Japanese Patent Laid-Open Publication No. Hei No. Hei. Open bulletin 2001-264999

However, in the above-described conventional exposure method and exposure apparatus, it is necessary to intermittently perform the following operations: when the exposure of the predetermined region of the substrate (substrate) is completed, the exposure operation is temporarily ended and the mask is opposed to the substrate ( The substrate) is relatively stepwise moved, and the substrate (substrate) is again aligned with the mask. Therefore, there is a problem that it takes a long time to perform the exposure operation, and the exposure operation cannot be performed efficiently. Further, if the size of the mask is reduced in order to prevent the bending caused by the weight of the mask itself, the number of times of performing the exposure operation on the large substrate is increased, and the exposure time is also increased, making the aforementioned problem more remarkable. .

Furthermore, in order to reduce the number of repetitions of the aforementioned exposure operation, when a relatively large photomask is used, the exposure light requires a large amount of energy. Therefore, there is a limitation in the power limit of the light source section, and it is necessary to lengthen the irradiation time of the exposure light, and as a result, the problem of the exposure time cannot be shortened.

Further, in order to align the substrate (substrate) and the photomask in the exposure portion, it is necessary to separately form an alignment mark different from the pattern on both the substrate (substrate) and the photomask. There is a problem that the manufacturing steps of the substrate (substrate) and the photomask are complicated.

The present invention has been made in view of the above problems, and an object thereof is to provide an exposure method and an exposure apparatus which can efficiently expose a substrate having a wide exposure area using a small mask.

In order to solve the aforementioned problems, the present invention has the following features.

In other words, the exposure method of the present invention includes a step of transporting the substrate in a predetermined direction at a constant speed by the substrate transporting portion, and imaging is performed on the edge of the pattern of the reference pattern formed in advance on the substrate, and is detected on the substrate. a step of a conveyance direction and a reference position in a direction perpendicular to the conveyance direction; and when the reference pattern imaged by the imaging unit is moved from the imaging position to the exposure position by the substrate conveyance unit, the position of the mask is adjusted, and the a step of aligning the position of the mask with the aforementioned reference position on the substrate; and exposing the exposure light from the continuous light source to the mask disposed on the optical path of the exposure optical system at the exposure position, and illuminating the opening of the mask The image of the portion is transferred onto the substrate; and the exposed region along the substrate transport direction is continuously exposed.

In the exposure apparatus of the present invention, the substrate transporting unit transports the substrate in a fixed direction at a constant speed, and the exposure optical system passes the exposure light from the continuous light source through the mask to the substrate conveyed by the substrate transport unit. Irradiating the opening and transferring the image of the opening to the substrate; The imaging unit captures a pattern edge of a reference pattern formed in advance on the substrate during movement of the substrate, and the control device detects a conveyance direction on the substrate and the aforementioned direction based on the pattern edge image captured by the imaging unit a conveyance direction is a reference position in a direction perpendicular to the right angle, and when the reference pattern imaged by the imaging unit is moved from the imaging position to the exposure position, the position of the mask is adjusted such that the position of the mask is on the substrate The reference position is the same; and the control device continuously irradiates the substrate with the exposure light from the continuous light source while the substrate moves from the exposure start end on the substrate to the exposure terminal.

In the exposure apparatus of the present invention, it is preferable that the control device performs position adjustment in a direction perpendicular to the conveyance direction of the mask based on a reference position in a direction perpendicular to the substrate conveyance direction.

Further, in the exposure apparatus of the present invention, the control device preferably adjusts the position of the rotation angle of the mask based on the inclination of the conveyance direction of the counter substrate obtained by the detection of each of the reference devices.

Further, in the exposure apparatus of the present invention, the substrate transporting unit may wind the sheet-like substrate from the storage roller around the winding wheel, and move the exposure light along a plane perpendicular to the optical path of the exposure optical system.

According to the exposure method and the exposure apparatus of the present invention, the shape of the mask opening can be continuously transferred and exposed while the substrate is transported by the substrate transport unit. Therefore, even when a small mask is used, there is no need for exposure due to intermittent step movement of the substrate, and efficient exposure of the substrate having the wide exposure region can be performed.

Further, the reference position of the substrate may be detected by a reference pattern formed in advance on the substrate, and the position of the mask may be adjusted based on the reference position. Therefore, it is not necessary to form an alignment mark on the substrate and the mask in order to accurately expose the predetermined region of the substrate, and it is not necessary to form an alignment mark for the position adjustment of the mask.

The exposure apparatus according to the embodiment in which the position is adjusted in a direction perpendicular to the conveyance direction of the mask can be aligned with the reference position in a direction perpendicular to the conveyance direction of the substrate, and the mask can be surely masked at the right angle. Position adjustment of the direction. Therefore, the exposure of the exposure region along the substrate transport direction can be performed correctly.

The exposure apparatus of the embodiment in which the position of the rotation angle of the mask is adjusted can be aligned with the inclination angle of the relative substrate conveyance direction, and the positional adjustment of the rotation angle of the mask can be surely performed. Therefore, the positional adjustment of the mask can be more accurately performed in accordance with the change in the position of the substrate to be conveyed, and the exposure of the predetermined exposure region can be more accurately performed.

The exposure apparatus of the embodiment in which the sheet substrate is wound from the storage roller to the winding roller and the exposure portion is moved along a plane perpendicular to the optical path of the exposure optical system does not need to connect a plurality of exposure regions corresponding to the unit substrate. The sheet-like substrate is stepwise moved in each exposure region corresponding to each unit substrate, and the exposure operation is intermittently repeated. Therefore, it is possible to expose a large number of substrates extremely efficiently and improve productivity.

Hereinafter, an exposure apparatus according to a first embodiment of the present invention will be described with reference to Figs. 1, 2A and 2B.

In the first embodiment, the exposure apparatus 1 includes an exposure optical system 3, an exposure station (exposure unit) 2, and a substrate transport unit 5 that transports a substrate 4 that is under the exposure optical system 3 and is an exposure target. 6. The specific portion on the substrate 4 is imaged; the image recognition light source 7 illuminates the substrate 4 from below at the exposure station 2; the control device 8 is connected to the respective device portions and controls the devices . The exposure light from the exposure optical system 3 is irradiated onto the substrate 4 through an opening provided in the mask 11 of the exposure optical system 3, and the pattern according to the shape of the opening is transferred onto the substrate 4.

The exposure optical system 3 includes a lamp (continuous light source) 9 and is composed of an ultrahigh pressure mercury lamp or the like; the illumination lens 10 is disposed below the lamp 9 and projects the exposure light from the lamp 9 downward; The mask 11 is provided below the illumination lens 10. The optical axis (light path) S of the exposure optical system 3 is set in the vertical direction, and the mask 11 is positioned in a horizontal plane perpendicular to the optical axis S. The aforementioned lamp 9 is continuously illuminated with exposure light before being instructed to be extinguished. Further, the mask 11 is composed of a rectangular flat plate having a long side in the Y-axis direction (the vertical direction in the second A and second FIGS. 2A) perpendicular to the paper surface in the first drawing. The central portion of the short side of the X-axis direction (the left-right direction in the first drawing, the second drawing, the second drawing, and the second drawing) is at a right angle to the Y-axis direction y, and is disposed in the Y-axis direction at a predetermined interval in the Y-axis direction y. A plurality of rectangular openings 11a and 11a having a long side in the direction x (two in the illustrated example). The length of the opening portion 11a in the X-axis direction is set to be, for example, the same as the length of the pixel 18 (described later) of the substrate 4 in the X-axis direction. The size of the mask 11 is only required to have a sufficient area for providing the openings 11a and 11a. Therefore, the mask 11 is wide in the X-axis direction X of the substrate 4, and is much smaller than the length of the unit substrate (the substrate corresponding to the size of one liquid crystal panel or the like is referred to as "unit substrate") in the X-axis direction x ( Refer to Figures 2A and 2B).

The mask 11 is supported on the upper surface of the mask stage 12 which is perpendicular to the optical axis S of the exposure optical system 3, and the line connecting the openings 11a and 11a is located on the optical axis S of the exposure optical system 3. on. The mask stage 12 is in a horizontal plane, and the position of the mask 11 in the Y-axis direction y and the axis around the center of the mask 11 can be adjusted by the drive unit 13 including a servo motor or a linear motor. Rotation angle. The mask driving unit 13 detects a moving position and a rotation angle of the mask stage 12 in the Y-axis direction y, and is provided with an encoder and a line sensor for feeding back the detected values to the control device 8. Equal position sensor and angle sensor (all not shown).

The board conveying unit 5 includes a housing roller 14 , a winding wheel 15 , and a board driving unit 16 . The storage roller 14 is disposed at one end of the exposure station 2 (the right side in FIG. 1), and the film 4 (sheet-shaped) substrate 4 is wound and stored. The winding roller 15 is disposed on the other end of the exposure station 2 (the left side in FIG. 1), and winds the substrate 4 pulled out from the storage roller 14. The substrate drive unit 16 is configured by an auxiliary motor or the like, and rotates the winding roller so that the substrate 4 is continuously conveyed in the traveling direction (constant direction) M along the X-axis direction x, and is wound around the winding roller 15 . The substrate driving unit 16 is provided with a position sensor such as an encoder or a line sensor for detecting a moving position of the substrate 4 in the X-axis direction and returning the detected value to the control device 8. Further, the substrate transport unit 5 is provided with two pairs of guide rollers 17a and 17b that are positioned in front of and behind the exposure station 2 (left and right in FIG. 1) and are rotated from the upper and lower sides of the substrate 4. By the guide rollers 17a and 17b, the substrate 4 is held horizontally under the mask table 12 and moved.

The substrate 4 is, for example, a color filter substrate. As shown in FIG. 2A, the black matrix BM includes pixels (reference patterns) 18 arranged in a matrix and having a rectangular opening. The pixel 18 is arranged linearly in a transport direction (X-axis direction x) of the substrate 4 as a column for each colored layer (red R, green G, and green B) at a right angle to the transport direction. The pixel row is arranged in the width direction (Y-axis direction y) of the substrate 4. The substrate 4 is attached to the exposure station 2, and the surface is moved along a horizontal plane perpendicular to the optical axis S of the optical system 3.

Further, the reference pattern is a wiring pattern, various electrode patterns, or the like in the semiconductor component, except for the embodiment.

The imaging unit 6 includes a half mirror 19 facing the image recognition illumination 7 and disposed between the illumination lens 10 and the mask 11 inside the exposure optical system 3; A linear charge coupled device (hereinafter also referred to as a linear CCD) 20 images an image reflected by the half mirror 19.

For example, the linear CCD 20 is formed by arranging the light receiving elements in a line shape in the Y-axis direction y in a line length larger than the width of the substrate 4 (the size in the Y-axis direction y). The position (imaging position) F of the optical axis S1 of the mirror 19 is from the position (exposure position) E of the optical axis S of the exposure optical system 3 to the rear direction of the direction M of the substrate 4 (in FIG. 1 and FIG. 2A). The figure and the right side in Fig. 2B are separated from the predetermined distance L in advance. Therefore, the front edge (pattern edge) 18e1 (the edge of the front side in the traveling direction M of the substrate 4) of the pixel 18 of the substrate 4 is imaged by the linear CCD 20 through the illumination light of the image recognition illumination 7 and passes through After the predetermined time, the pixel 18 reaches the center position (exposure position) E of the opening portion 11a of the mask 11 in the X-axis direction x. The linear CCD 20 further images the side edge (pattern edge) 18e2 of the pixel 18 of the substrate 4 in the Y-axis direction y.

The control device 8 is for controlling the entire device, and is connected to the image processing unit 21, the storage unit 22, the calculation unit 23, the lamp power supply unit 24, the substrate controller 25, and the mask controller 26, and is provided with The main control unit 27 that controls the operations of these operations is integrated. The image processing unit 21 detects the reference in the X-axis direction x and the Y-axis direction y of the substrate 4 based on the image data obtained by imaging the front edge 18e1 and the side edge 18e2 of the pixel 18 of the substrate 4 by the linear CCD 20. position. The memory unit 22 memorizes the design data of the black matrix BM of the substrate 4, the data on the reference position, and the operation program of the entire apparatus. The calculation unit 23 calculates the time from the imaging position F to the exposure position E by the distance L between the imaging position F and the exposure position E and the conveyance speed of the substrate 4, and the position of the front edge 18e1 of the pixel 18 is moved from the imaging position F to the exposure position E. The calculation unit 23 calculates that the substrate 4 of the side edge 18e2 detected by the image processing unit 21 is located at a reference position (Y-axis reference position) in the Y-axis direction y, and is located at the mask 11 (opening 11a). A positional shift between the positions of the Y-axis direction y; and an offset angle (inclination angle) θ or the like of the conveyance direction (X-axis direction x) of the substrate 4 in the plane including the XY axis. The lamp power supply unit 24 is in accordance with a reference position (X-axis reference position) in the X-axis direction of the substrate 4 according to the front edge 18e1, between the front end pixel 18a reaching the exposure position E and the last end pixel 18b reaching the exposure position E. The exposure light is continuously irradiated to the exposure position E by the aforementioned lamp 9. The substrate controller 25 operates the substrate driving unit 16 and transports the substrate 4 to the traveling direction M. The mask stage controller 26 operates the mask driving unit 13 to adjust the position of the mask stage 12 in the Y-axis direction y or to adjust the rotation angle of the mask stage 12 in the horizontal plane.

Next, the operation of the exposure apparatus 1 configured as described above and the exposure method according to an embodiment of the present invention will be described with reference to FIG.

First, when the exposure device 1 is operated by the control device 8 being operated, the image recognition illumination 7 is turned on by the command of the main control unit 27. At the same time, the substrate driving unit 16 of the substrate transport unit 5 is driven by the substrate controller 25, and the substrate 4 is pulled out from the storage roller 14 and wound by the winding roller 15, and the exposure station 2 is When it is kept horizontal, it is conveyed in the traveling direction M (step S1). In the meantime, the substrate 4 is irradiated from the lower side by the image recognition illumination 7, and the linear CCD 20 receives the light of the illumination light passing through the pixels 18 formed on the substrate 4 by the half mirror, thereby acquiring the image data of the pixel 18 ( Step S2).

The image data obtained by the linear CCD 20 is sent to the image processing unit 21 for processing. The image processing unit 21 detects the position (X-axis reference position) of the front edge 18e1 of each pixel 18 arranged along the Y-axis direction y, and the side of each column 18 of the column arranged along the X-axis direction x. The position of the square edge 18e2 (Y-axis reference position) (step S3). When the X-axis reference position and the Y-axis reference position of the leading pixel 18a in the traveling direction M of the substrate 4 are detected, the calculation unit 23 is based on the exposure position E of the exposure station 2 and the imaging position F. The distance L between the distances and the conveyance speed of the substrate 4 set in advance is calculated as the time during which the preceding pixel 18a reaches the exposure position E. At the same time, the calculation unit 23 calculates the positional deviation between the position of the opening 11a of the mask 11 in the Y-axis direction y and the Y-axis reference position (the positional deviation in the Y-axis direction y of the substrate 4 (Y-axis) Position offset)). Further, as shown in FIG. 2B, the calculation unit 23 is based on the displacement amount t of the X-axis reference position of the pair of pixels 18 and 18 which are arranged in the Y-axis direction y, and the distance u between the pair of pixels 18 and 18. The offset angle (the inclination angle with respect to the conveyance direction of the substrate 4) θ from the X and Y axes in the plane including the XY axis of the substrate 4 is calculated (step S4).

When the main control unit 27 detects the X-axis reference position of the pixel unit 18a in the forefront, the main control unit 27 counts the arrival time with a built-in timer. When the chronograph is completed, the main control unit 27 operates the mask driving unit 13 through the mask controller 26 to shift the Y-axis position of the substrate 4 calculated by the calculation unit 23 with the counter substrate 4. The inclination angle θ of the conveyance direction adjusts the position of the mask stage 12. The mask driving unit 13 is driven to adjust the rotation angle of the mask stage 12 in the Y-axis direction y and the horizontal plane (around the optical axis S of the exposure optical system 3) to make the mask 11 The positions of the openings 11a and 11a are correctly positioned on the exposure regions 28 and 28 of the substrate 4 (step S5). At the same time, the main control unit 27 issues a command to the lamp power supply unit 24 to turn on the lamp 9. The exposure light emitted from the lamp 9 is parallel light to the illumination lens 10, and is irradiated onto the substrate 4 through the openings 11a and 11a of the mask 11. Thereby, exposure for transferring the shape of the openings 18a and 18a to a predetermined position of the substrate 4 is performed (step S6).

In the above-described exposure, the substrate 4 is continuously conveyed at a constant speed in the traveling direction M, and the linear CCD 20 images the front edge 18e1 and the side edge 18e2 of each pixel 18a. Thereby, the X-axis reference position and the Y-axis reference position of the substrate 4 are detected, and the Y-axis positional deviation of the substrate 4 and the inclination angle θ of the conveyance direction are adjusted to the position and rotation of the mask 11 in the Y-axis direction y. angle. Therefore, the position adjustment of the openings 11a and 11a of the mask 11 can be performed, and the predetermined exposure areas 28 and 28 of the substrate 4 can be accurately exposed.

When the exposure is performed and the X-axis reference position of the pixel 18b of the last row in the traveling direction M of the substrate 4 is detected, the time from the X-axis reference position to the exposure position E is delayed by the command from the main control unit 27. The lamp power supply unit is operated, and the lamp 9 is turned off, and the exposure operation to the substrate 4 is ended (step S7).

As described above, the exposure operation to the region corresponding to one unit substrate of the film-like (sheet-like) substrate 4 is completed. Then, while the substrate 4 is transported in the traveling direction M, the same exposure operation as described above is performed on the adjacent exposed regions, and by repeating the exposure operation, it is possible to continuously correspond to the majority along the longitudinal direction of the substrate. The area of the unit substrate 4 is exposed (proxy exposure).

The predetermined exposure regions 28 and 28 have a width D that matches the width of the opening portions 11a and 11a of the mask 11 in the short-side direction, and a plurality of rows arranged in the Y-axis direction of the substrate 4 with an interval P therebetween. The example shown is a strip of 2 rows). The exposure regions 28 and 28 surround the pixels 18 of the color layer of the red R of the color filter in the X-axis direction x and are along the X-axis direction x.

Further, the exposure operation for the regions of the other colored layers (green G, blue B) of the black matrix BM of the substrate 4 is performed by other identical exposure stations provided separately. Further, since the colored pigment is applied to the black matrix BM of the substrate 4 before the exposure operation, the colored pigment in the region exposed by the exposure is hardened. Therefore, when the exposed substrate is washed with the cleaning solution, the colored pigment in the unexposed region can be removed, and the pixels 18 of the respective colored layers R, G, and B are formed in the exposed region 28 by the hardened colored pigment. 28

As described above, the exposure method of the above-described embodiment is an exposure light that is continuous light from the lamp 9 at the exposure station 2 with respect to the substrate 4 in a state where the substrate conveyance unit 5 is conveyed in a constant direction at a constant speed. The openings 11a and 11a of the mask 11 provided on the optical axis S of the exposure optical system 3 are irradiated to transfer the images of the openings 11a and 11a onto the substrate 4. In this method, the front edge 18e1 and the side edge 18e2 of the pixel 18 formed in advance on the substrate 4 are imaged by the image pickup unit 6, and the conveyance direction (X-axis direction x) and the substrate 4 are detected. This conveyance direction is a X and Y reference position in the Y-axis direction y at right angles. When the pixel 18 imaged by the imaging unit 6 is moved to the exposure station 2, the position of the mask 11 is adjusted such that the position of the mask 11 coincides with the aforementioned reference position on the substrate 4, and the conveyance direction along the substrate 4 is made. The exposure areas 28, 28 are continuously exposed.

In addition, the exposure apparatus 1 of the first embodiment includes the substrate conveyance unit 5, and the substrate 4 accommodated in the storage roller 14 is wound around the winding roller 15 by the substrate driving unit 16, and the substrate 4 is driven at a constant speed. The exposure optical system 3 and the exposure optical system 3 irradiate the substrate 4 in a state of being transported by the substrate transport unit 5 with the continuous light from the lamp 9 through the openings 11a and 11a of the mask 11. The image of the openings 11a and 11a is transferred onto the substrate 4. The exposure apparatus 1 includes an imaging unit 6 that images an edge 18e1 and a side edge 18e2 of the pixel 18 formed in advance on the substrate 4 in the movement of the substrate 4, and the control device 8 captures the image based on the imaging unit 6. The image of the front edge 18e1 and the side edge 18e2 detects the conveyance direction on the substrate and the reference position in the Y-axis direction y at right angles to the conveyance direction, and the pixel 18 imaged by the imaging unit 6 moves from the imaging position to The position of the mask 11 is adjusted at the exposure position so that the position of the mask 11 coincides with the aforementioned reference position on the substrate 4. The control device 8 continuously irradiates the substrate 4 with the exposure light from the lamp 9 through the lamp light source unit 24 while the substrate 4 is moved from the exposure start end to the exposure terminal until the exposure terminal.

Therefore, the exposure method and the exposure apparatus 1 of the above-described embodiment can continuously transfer and expose the shape of the opening 11a of the mask 11 while transporting the substrate 4 by the substrate conveyance unit 5. Therefore, even when a small mask is used, it is not necessary to perform exposure by intermittent step movement of the substrate 4, and the substrate 4 including the wide exposure region can be efficiently exposed.

Further, the reference position of the substrate 4 is detected by the pixel (reference pattern) 18 formed in advance on the substrate 4, and the position of the mask 11 can be adjusted based on the reference position. Therefore, it is possible to accurately expose the predetermined exposure regions 28, 28 of the substrate 4, and it is not necessary to form an alignment mark on the substrate 4 or the mask 11 for the positional adjustment of the mask 11, so that the manufacturing becomes easily.

Further, in the exposure apparatus 1, it is not necessary to connect the sheet-like substrate 4 to which the plurality of exposure regions 28 and 28 corresponding to the unit substrate are connected, and to sequentially move each exposure region corresponding to each unit substrate and intermittently perform exposure. operating. Therefore, most of the substrate 4 can be exposed extremely efficiently and productivity can be improved.

In the exposure apparatus 1, the control device 8 performs a Y-axis direction y at right angles to the conveyance direction of the mask 11 in accordance with each of the reference positions in the Y-axis direction y at a right angle to the conveyance direction of the substrate and the conveyance direction. The position is adjusted, and the positional adjustment of the rotation angle of the mask 11 is performed based on the inclination θ of the conveyance direction of the substrate 4 obtained by the detection of each of the reference positions. Therefore, the Y-axis reference position at a right angle to the conveyance direction of the substrate 4 and the inclination angle θ of the conveyance direction of the counter substrate 4 are aligned, and the position adjustment and the mask of the mask 11 in the Y-axis direction y can be simultaneously performed. The positional adjustment of the rotation angle θ of 11. Therefore, the position adjustment of the mask 11 can be more accurately performed in accordance with the change in the position of the substrate 4 to be conveyed, and the exposure of the predetermined exposure regions 28, 28 can be performed more accurately.

Next, an exposure apparatus 1A according to a second embodiment of the present invention will be described with reference to Fig. 4 .

In the exposure apparatus 1A, a flat unit substrate (substrate) 4a is placed on the substrate stage 30, and the substrate 4a is transported along the X-axis direction x of the exposure station 2 in the traveling direction M. The other components are the same as those of the exposure apparatus 1 of the above-described embodiment, and the same components are denoted by the same reference numerals, and their description will be omitted.

In the exposure apparatus 1A, the substrate stage 30 is disposed below the mask stage 12 along a horizontal plane perpendicular to the optical axis S of the exposure optical system 3. The substrate stage 30 is driven by the substrate controller 25 by a servo motor, a linear motor, or the like, which is driven by the substrate controller 25, and moves back and forth in the X-axis direction x. The substrate driving unit 16a is provided with a positional sense such as an encoder or a line sensor for detecting a moving position of the substrate 4a in the X-axis direction x and returning the detected value to the control device 8. Tester (not shown). The substrate stage 30 is formed in a frame structure so as not to block the illumination light of the image recognition illumination 7 from below, and the substrate 4 is supported by the peripheral portion thereof.

In the exposure apparatus 1A, the substrate driving unit 16a is driven by the command of the substrate controller 25, and the substrate stage 30 is moved in the direction M. The substrate 4a on the substrate stage 30 is conveyed toward the traveling direction M by the exposure station 2, and the predetermined exposure areas 28 and 28 are continuously exposed from the front end portion (exposure start end) of the traveling direction M by the exposure optical system 3. The exposure is stopped until the rear end portion (exposure terminal) of the direction M is performed. Then, once the exposure of one substrate 4a is completed, the substrate stage 30 is returned to the original position. The new substrate 4a is placed and the next exposure operation is performed. This action is repeated to perform an exposure operation. In the exposure operation, the mask 11 corresponding to the Y-axis positional shift of the Y-axis direction y of the substrate 4a and the inclination angle θ with respect to the conveyance direction is performed in the same manner as in the case of the exposure apparatus 1 of the first embodiment. Position adjustment.

In the exposure apparatus 1A of the present embodiment, similarly to the exposure apparatus 1 of the above-described embodiment, the exposure operation can be continuously performed while transporting the substrate 4a. Therefore, the exposure method (proximity exposure) of the predetermined exposure regions 28 and 28 of the unit substrate 4a can be efficiently performed, and the exposure method of the first embodiment can be reliably carried out.

Next, an exposure apparatus 1B according to a third embodiment of the present invention will be described with reference to Fig. 5. In the exposure optical system 3b of the exposure apparatus 1B, the illumination lens 10 of the exposure optical system 3 of the exposure apparatus 1A of the second embodiment is replaced with a projection lens 10a, and the projection lens 10a is placed close to the substrate stage 30. The position of (substrate 4a). Further, the mask stage 12 is disposed between the projection lens 10a and the lamp 9. Further, the half mirror 19b is disposed between the projection lens 10a and the mask stage 12. The other components are the same as those of the exposure apparatus 1A of the above-described embodiment, and the same components are denoted by the same reference numerals, and their description will be omitted.

In the exposure apparatus 1B, during exposure operation, exposure light from the lamp 9 and continuous light passes through the opening 11a of the mask 11, and the projection lens 10a is irradiated onto the substrate 4a to open the opening 11a. The shape is transferred onto the substrate 4a. Therefore, when the substrate 4a is transported to the exposure station 2 in the direction M by the substrate stage 30 as in the case of the exposure apparatus 1A, the exposure optical system 3b is continuously performed on the predetermined exposure areas 28 and 28 of the substrate 4a. Exposure (projection exposure). In the exposure operation, similarly to the case of the exposure apparatus 1, the position adjustment of the mask 11 corresponding to the Y-axis positional shift of the substrate 4a in the Y-axis direction y and the inclination angle θ with respect to the conveyance direction is performed.

In addition, the position adjustment may be performed by moving the above-described mask stage 12, and the same driving unit as the mask driving unit 13 is attached to the projection lens 10a so as to move the projection lens 10a.

According to the exposure apparatus 1B of the present embodiment, the exposure operation can be continuously performed while transporting the substrate 4a in the same manner as the exposure apparatuses 1 and 1A of the above-described embodiment. Therefore, the predetermined exposure regions 28 and 28 of the unit substrate 4a can be efficiently performed. At the same time as the exposure, the exposure method according to the embodiment of the present invention can be reliably carried out.

Further, in the exposure method and the exposure apparatuses 1, 1A, and 1B of the above-described embodiment, the lamp power supply unit 24 is operated by the command from the main control unit 27, and the lamp 9 is turned on at the exposure start end of the substrate 4a. It is lit and exposed, and at the exposure terminal, the lamp 9 is turned off and the exposure is ended. A shutter may be provided below the lamp 9, and the shutter may be opened and closed in a state where the lamp 9 is turned on to start and end exposure of the exposure start end and the exposure terminal. Further, the exposure method and the exposure apparatuses 1, 1A, and 1B of the above-described embodiment are examples in which (R, G, B) which is suitable for manufacturing a color filter and forming a colored layer on a substrate on which a black matrix has been formed. However, the present invention is not limited thereto, and can be applied to the case of manufacturing a transparent thin film electrode of a liquid crystal panel, or the manufacture of other semiconductor elements, and the manufacture of a photomask or a reticle.

[Industrial Availability]

The exposure method and the exposure apparatus of the present invention can be used for producing a color filter for a liquid crystal panel, a transparent thin film electrode, and a semiconductor element. In the exposure method and the exposure apparatus, the shape of the mask opening can be continuously transferred and exposed while the substrate is being transported by the substrate transporting portion, and even when a small mask is used, it is not necessary to intermittently move the substrate. Exposure is performed to efficiently expose a substrate containing a wide exposure area.

1, 1A, 1B. . . Exposure device

2. . . Exposure station (exposure section)

3, 3b. . . Exposure optical system

4, 4a. . . Substrate

5, 5a. . . Substrate handling unit

6. . . Camera department

7. . . Image recognition light source

8. . . Control device

9. . . Lamp (continuous light source)

10. . . Lighting lens

10a. . . Projection lens

11. . . Mask

11a. . . Opening

12. . . Masking station

13. . . Mask drive

14. . . Storage roller

15. . . Winding roller

16, 16a. . . Substrate drive unit

17, 17a, 17b, 31. . . Guide wheel

18, 18a, 18b. . . Pixel (pattern)

18e1. . . Front edge (pattern edge)

18e2. . . Side edge (pattern edge)

19, 19b. . . Half mirror

20. . . Linear CCD

twenty one. . . Image processing department

twenty two. . . Memory department

twenty three. . . Calculation department

twenty four. . . Lamp power supply

25. . . Substrate controller

26. . . Mask controller

27. . . Main control department

28. . . Exposure area

30. . . Substrate table

E. . . Exposure position

F. . . Camera position

S, S1. . . Optical axis

Fig. 1 is a system diagram showing an exposure apparatus according to a first embodiment of the present invention.

Fig. 2A is a plan view for explaining the adjustment of the mask position of the exposure apparatus according to the first embodiment of the present invention.

Fig. 2B is a plan view for explaining the adjustment of the mask position of the exposure apparatus according to the first embodiment of the present invention.

Fig. 3 is a flow chart showing the operation of the exposure apparatus according to the first embodiment of the present invention.

Fig. 4 is a system diagram showing an exposure apparatus according to a second embodiment of the present invention.

Fig. 5 is a system diagram showing an exposure apparatus according to a third embodiment of the present invention.

1. . . Exposure device

2. . . Exposure station (exposure section)

3. . . Exposure optical system

4. . . Substrate

5. . . Substrate handling unit

6. . . Camera department

7. . . Image recognition light source

8. . . Control device

9. . . Lamp (continuous light source)

10. . . Lighting lens

11. . . Mask

11a. . . Opening

12. . . Masking station

13. . . Mask drive

14. . . Storage roller

15. . . Winding roller

16. . . Substrate drive unit

17a, 17b. . . Guide wheel

18. . . Pixel (pattern)

19. . . Half mirror

20. . . Linear CCD

twenty one. . . Image processing department

twenty two. . . Memory department

twenty three. . . Calculation department

twenty four. . . Lamp power supply

25. . . Substrate controller

26. . . Mask controller

27. . . Main control department

E. . . Exposure position

F. . . Camera position

S1. . . Optical axis

Claims (5)

An exposure method includes a step of transporting a substrate in a fixed direction at a constant speed by a substrate transporting portion, and a linear CCD having a light receiving element arranged along a direction orthogonal to a transport direction of the substrate, which is formed in advance on the substrate a step of imaging the edge of the pattern of the reference pattern of the exposure target, and detecting the conveyance direction on the substrate and the reference position in a direction perpendicular to the conveyance direction; and the reference of the linear CCD When the pattern is moved from the imaging position to the exposure position by the substrate transporting portion, the position of the mask is adjusted so that the position of the opening corresponding to the mask matches the reference position on the substrate; and The exposure position irradiates the exposure light from the continuous light source through the mask disposed on the optical path of the exposure optical system, and irradiates the image of the opening of the mask onto the substrate and continues to the substrate A step of forming an exposure region along the aforementioned conveyance direction. An exposure apparatus includes a substrate conveyance unit that conveys a substrate at a constant speed in a predetermined direction, and an exposure optical system that passes an exposure light from a continuous light source through an opening of the mask to a substrate conveyed by the substrate conveyance unit. And irradiating the image of the opening portion onto the substrate; the linear CCD has a line orthogonal to the direction of transport of the substrate The light-receiving elements arranged in the direction image the edge of the pattern of the reference pattern of the exposure target formed in the exposure region of the substrate in advance during the movement of the substrate; and the control device detects the edge image of the pattern captured by the linear CCD a position of the conveyance direction on the substrate and a reference position at a right angle to the conveyance direction, and when the reference pattern imaged by the imaging unit is moved from the imaging position to the exposure position, the position of the mask is adjusted so that a position corresponding to the opening of the mask is equal to the reference position on the substrate; and the control device is configured to move from the exposure start end on the substrate to the exposure terminal before the exposure position The aforementioned exposure light of the continuous light source continuously illuminates the substrate. The exposure apparatus according to claim 2, wherein the control device performs position adjustment in a direction perpendicular to a conveyance direction of the mask based on a reference position in a direction perpendicular to a substrate conveyance direction. The exposure apparatus according to claim 2, wherein the control device performs position adjustment of the rotation angle of the mask based on the inclination of the substrate conveyance direction obtained by the detection of each of the reference positions. The exposure apparatus according to claim 2, wherein the substrate transporting unit winds the sheet-like substrate from the storage roller to the winding roller so that the exposure light is along a plane perpendicular to the optical path of the exposure optical system mobile.