WO2007049640A1 - Exposure method and exposure apparatus - Google Patents

Exposure method and exposure apparatus Download PDF

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Publication number
WO2007049640A1
WO2007049640A1 PCT/JP2006/321259 JP2006321259W WO2007049640A1 WO 2007049640 A1 WO2007049640 A1 WO 2007049640A1 JP 2006321259 W JP2006321259 W JP 2006321259W WO 2007049640 A1 WO2007049640 A1 WO 2007049640A1
Authority
WO
WIPO (PCT)
Prior art keywords
photomask
alignment mark
belt
substrate
shaped substrate
Prior art date
Application number
PCT/JP2006/321259
Other languages
French (fr)
Japanese (ja)
Inventor
Ken Miyake
Ken Imanishi
Original Assignee
San Ei Giken Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by San Ei Giken Inc. filed Critical San Ei Giken Inc.
Publication of WO2007049640A1 publication Critical patent/WO2007049640A1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70791Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0008Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0269Marks, test patterns or identification means for visual or optical inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1545Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/166Alignment or registration; Control of registration

Definitions

  • the present invention relates to an exposure method and an exposure apparatus in which a pair of photomasks are arranged on both sides of a belt-shaped substrate conveyance path, and a pattern is transferred to both surfaces of the belt-shaped substrate by the pair of photomasks.
  • the present invention relates to an alignment technique between a material and a pair of photomasks.
  • a wiring pattern such as an electric circuit is formed on a flexible substrate, which is a belt-shaped base material, using a photomask, by a circuit formation technique including an exposure process, a development process, an etching process, and the like. ing.
  • a circuit formation technique including an exposure process, a development process, an etching process, and the like.
  • an alignment mark is provided on each of the flexible substrate and the photomask; both alignment marks are read by a CCD camera. That is, the relative position between the flexible substrate and the photomask is adjusted based on the mark position information from the image read by the CCD camera (see, for example, Patent Document 1).
  • the flexible substrate 100 which is a strip-shaped material, is transported in the longitudinal direction T by the transport means.
  • Photosensitive material photoresist
  • a planned exposure range 101 is set substantially continuously along the longitudinal direction.
  • each planned exposure area 101 there are translucent alignment marks. 102 are provided.
  • the first photomask 103 and the second photomask 104 are arranged to face each other on both sides of the flexible substrate 100 to be transported.
  • the first photomask 103 is provided with a first pattern portion 103a.
  • Non-transparent alignment marks 105 are provided at two locations outside the diagonal position of the first pattern portion 103a.
  • the second photomask 104 is provided with a second pattern portion 104a.
  • Non-transparent alignment marks 106 are provided at two positions outside the diagonal position of the first photomask 103 and outside the diagonal position of the second pattern portion 104a. .
  • the pair of alignment marks 105, 105 and the alignment marks 106, 106 provided on the first photomask and the second photomask in this way are arranged at different diagonal positions.
  • the alignment marks 105 and 106 are non-transparent marks with the same circular shape, and it is difficult to identify which mark when reading with a CCD camera. It was a force that had to be provided at different positions so that it was not necessary.
  • the first photomask 103 and the second photomask 104 are vertically adjusted with respect to the flexible substrate 100 by position adjusting means (not shown).
  • the CCD camera 107 is disposed at a position farther from the first photomask 103 with respect to the flexible substrate 100 and is set to be movable in the surface direction of the flexible substrate 100.
  • the exposure range 101 of the flexible substrate 100 is disposed substantially opposite to the first and second photomasks 103 and 104. Then, the positions of the four alignment marks 102, 105, 106 on the flexible substrate 100 are read by the CCD camera 107. Based on the position information of the mark obtained as a result, the positions of the first photomask 103 and the second photomask 104 with respect to the flexible substrate 100 are adjusted to perform alignment.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2004-347964
  • the first photomask 103 and the second photomask 104 are aligned with reference to different alignment marks 102 on the flexible substrate 100. Therefore, if there are variations in the positioning accuracy, image recognition accuracy, etc. of each alignment mark 102, the first photomask 103 and the second photomask 104 will be placed in a standing position under the influence of the variation. become. Therefore, the force between the flexible substrate 100 and the first and second photomasks 103 and 104 is aligned with high accuracy. The force between the first photomask 103 and the second photomask 104 can be aligned with high accuracy. There is no problem. If the first photomask 103 and the second photomask 104 are not aligned with high accuracy, the positions of the patterns on both sides of the flexible substrate 100 are shifted.
  • the present invention solves the above-mentioned problems, and an exposure method and an exposure method capable of aligning not only between the belt-shaped substrate and the first and second photomasks but also between the first photomask and the second photomask with high accuracy. And an exposure apparatus.
  • the invention according to the first aspect of the present invention is an exposure method, wherein a belt-like substrate having a photosensitive material formed on both sides is intermittently fed along the longitudinal direction thereof to an exposure processing position.
  • the first photomask and the second photomask are arranged so as to face both surfaces of the belt-shaped substrate, respectively, and light is transmitted through the first photomask and the second photomask to both surfaces of the belt-shaped substrate.
  • the exposure method transfers the pattern drawn on each of the first photomask and the second photomask onto both surfaces of the belt-like substrate by irradiating the belt-like substrate, and the belt-like substrate and the first photomask
  • the second photomask is provided with a plurality of alignment marks at opposite positions to align the belt-shaped substrate, the first photomask and the second photomask with each other.
  • a single CCD camera simultaneously aligns three alignment marks, the alignment mark provided on the strip-shaped substrate at the position and the alignment mark provided on each of the first photomask and the second photomask.
  • at least one of the first photomask and the second photomask is moved in the X, Y, and 0 directions based on the data obtained as a result.
  • the gist of the present invention is that the band-shaped substrate, the first photomask, and the second photomask are arranged in a standing manner.
  • the invention according to the second aspect of the present invention is an exposure apparatus, wherein a predetermined exposure range is set continuously along the longitudinal direction, and alignment marks are provided at a plurality of positions for each predetermined exposure range.
  • the belt-shaped base material, the base material transporting means for transporting the belt-shaped base material in the longitudinal direction, and the belt-shaped base material transport path are arranged at positions sandwiching the belt-shaped base material, and alignment marks are provided at a plurality of positions, respectively.
  • the first and second photomasks and a CCD camera are provided, and the alignment marks at the plurality of positions of the first and second photomasks are respectively arranged at positions corresponding to the same alignment marks on the belt-shaped substrate.
  • the CCD camera can simultaneously read three alignment marks at the corresponding positions of the belt-shaped substrate, the first photomask, and the second photomask. Based on the data obtained as a result, the first and second photomasks can be read simultaneously.
  • Position adjustment means for aligning the belt-shaped substrate, the first photomask, and the second photomask by moving at least one of the masks in the X, Y, and 0 directions is provided, and the first mask and the second photomask are aligned with respect to both surfaces of the belt-shaped substrate.
  • the gist is to transfer the patterns drawn on the first and second photomasks onto both sides of the belt-like substrate by irradiating light through the first and second photomasks.
  • FIG. 1 is a view showing the arrangement of a conventional flexible substrate and a first photomask.
  • FIG. 2 is a sectional view taken along line II-II in FIG.
  • FIG. 3 is a schematic block diagram of an exposure apparatus according to an embodiment of the present invention.
  • FIG. 4 is a diagram showing the arrangement of the flexible substrate and the first photomask as seen in the direction of arrow A in FIG.
  • FIG. 5 is a cross-sectional view taken along line V—V in FIG.
  • FIG. 6 is an enlarged view of a main part of part C of FIG.
  • FIG. 7 is a view of the first photomask side force shown in FIG. 6 and shows the state of three alignment marks at an accurate alignment position.
  • FIG. 8 is an enlarged view of a main part showing three alignment marks of the first modification.
  • FIG. 9 is a view of the first photomask side force shown in Fig. 8, and shows a state of three alignment marks at an accurate alignment position of the first modified example.
  • FIG. 10 is a diagram showing an arrangement of a flexible substrate and a first photomask of a second modified example.
  • FIG. 11 is a cross-sectional view taken along the line XI-XI in FIG.
  • FIG. 3 is a schematic block diagram of an exposure apparatus
  • FIG. 4 is an arrangement of a flexible substrate and a first photomask viewed from the direction of arrow A in FIG.
  • Fig. 5 is a cross-sectional view taken along the line V-V in Fig. 4
  • Fig. 6 is an enlarged view of the main part of section C in Fig. 5,
  • Fig. 7 is a diagram showing the state of three alignment marks at the alignment position. is there.
  • the exposure apparatus 1 includes a base plate 2 and a housing 3 installed on the base plate 2.
  • a dark room 3a is formed in the housing 3.
  • the base material conveying means 4 includes a reel 5 for feeding installed on one base plate 2 outside the casing 3, and a take-up reel installed on the other base plate 2 outside the casing 3. 6, a plurality of guide rolls 7a to 7n for forming a predetermined conveyance path between the feeding reel 5 and the take-up reel 6 and a flexible substrate 10 which is a belt-shaped substrate. With roll 8. Most of the transfer path is arranged in the dark room 3a. Between the guide roll 7f at the lower position and the guide roll 7h at the upper position in the dark room 3a, it is regarded as a vertical conveyance section for conveying the flexible substrate 10 in the vertical direction.
  • the flexible substrate 10 that is a belt-like base material is wound around the feeding reel 5 and the take-up reel 6 at both ends, and is arranged along the transport path of the base material transport means 4. ing.
  • the flexible substrate 10 is transported by the base material transport means 4 with its longitudinal direction as the transport direction T.
  • a photosensitive material is applied to both surfaces of the flexible substrate 10.
  • the first photomask 11 and the second photomask 12 are arranged to face each other on both sides of the flexible substrate 10 in the vertical conveyance section of the base material conveyance means 4.
  • the first and second photomasks 11 and 12 have first and second pattern portions 11a and 12a on which desired patterns are drawn, respectively.
  • the first photomask 11 is held by a support. This support is supported by the first frame 14 via the first position adjusting means 13. Therefore, the first photomask 11 is moved by the position adjusting means 13 in the ⁇ , ⁇ , ⁇ (rotation direction of the ridge surface) direction parallel to the surface of the flexible substrate 10 and is positioned relative to the flexible substrate 10. It can be adjusted.
  • the second photomask 12 is held by a support. This support is supported by the second frame 16 via the second position adjusting means 15. Therefore, the second photomask 12 can be adjusted to a relative position with respect to the flexible substrate 10 by being moved in the X, ⁇ , and ⁇ directions parallel to the surface of the flexible substrate 10 by the position adjusting means 15. And
  • a light irradiation means 17 comprising a light source (not shown) and first and second mirrors 18 and 19, both surfaces of the flexible substrate 10 are irradiated.
  • the patterns drawn on the first photomask 11 and the second photomask are transferred.
  • the CCD camera 20 serving as a mark reading means is arranged at a position farther from the first photomask 11 with respect to the flexible substrate 10, and is movable in the X and Y directions on a plane parallel to the surface of the flexible substrate 10. Is provided.
  • an image processing device (not shown) is used for calculation, and alignment is performed based on the calculation result.
  • an exposure exposure range 21 (shown in FIG. 4) is set through a certain interval (or may be continuous), and each Alignment marks 22 (shown in FIGS. 4 to 6) are provided at four locations for each exposure range 21.
  • Four alignment marks 22 are provided at four positions outside the four corners of the planned exposure area 21.
  • Each alignment mark 22 has a translucent circular shape, and its peripheral portion is formed of a non-translucent member.
  • each alignment mark 25 of 1 has a non-translucent annular shape.
  • the peripheral portion of each alignment mark 25 of the first photomask 11 is formed of a translucent member.
  • the four alignment marks 26 of the second photomask 12 are provided at positions corresponding to the four alignment marks 22 of the flexible substrate 10.
  • Each alignment mark 26 of the second photomask 12 is a non-transparent circle.
  • a peripheral portion of each alignment mark 26 of the second photomask 12 is formed of a translucent member.
  • the annular alignment mark 25 of the first photomask 11 in which the outer diameter of the alignment mark 22 of the flexible substrate 10 is the largest is the second largest.
  • the circular alignment mark 26 of the photomask 12 is set smaller than the smallest circular inner circumference.
  • the flexible substrate 10 is transported by a predetermined distance by the substrate transport means 4, and the planned exposure range 21 of the flexible substrate 10 is disposed substantially opposite to the first and second photomasks 11 and 12.
  • the peripheral position of the flexible substrate 10 is read with the CCD camera 20 around the four alignment marks 22.
  • the CCD camera 20 since the flexible substrate 10 is positioned at a predetermined position with respect to the first and second photomasks 11 and 12 by the transport of the base material transport means 4, the CCD camera 20 has three positions. The alignment marks 22, 25 and 26 can be read simultaneously.
  • the amount of positional deviation between the flexible substrate 10 and the first and second photomasks 11 and 12 is calculated using at least two of the four mark image data. Based on the positional deviation amounts of the first photomask 11 and the second photomask 12, the position of the first photomask 11 is set by the first position adjusting means 13, and the position of the second photomask 12 is set by the second position adjusting means. Adjust by 15 respectively.
  • the CCD camera 20 reads the three alignment marks 22, 25, and 26 again, and confirms that the position is an accurate alignment position. Confirmation work may be omitted.
  • the three alignment marks 22, 25 and 26 are in the state shown in FIG. In Fig. 7, areas with low brightness levels are hatched. Show.
  • the light irradiation means 17 irradiates the flexible substrate 10 with the first irradiation light Ll and the second irradiation light L2 through the first photomask 11 and the second photomask 12, respectively.
  • desired patterns are respectively transferred to both surfaces of the flexible substrate 10.
  • the pattern is continuously transferred to the exposure range 21 of the flexible substrate 10.
  • the first photomask 11 and the second photomask 12 are both aligned based on the Cf alignment mark 22 of the flexible substrate 10 in the above-described alignment step. Even if an error occurs in the position accuracy and image recognition accuracy of the alignment mark 22 of the flexible substrate 10, it is not easily affected by the error. Accordingly, not only the flexible substrate 10 and the first and second photomasks 11 and 12 but also the first photomask 11 and the second photomask 12 can be aligned with high accuracy.
  • a sensor for detecting the end face of the belt-like substrate is provided in front of the exposure unit, and the front and back photomasks or substrates are moved in the X direction based on the end face position information detected by the sensor.
  • the alignment mark 22 of the flexible substrate 10 is a translucent circular shape
  • the alignment mark 25 of the first photomask 11 is a non-translucent annular shape
  • the alignment mark 26 of the second photomask 12 is a non-transparent circle having a smaller diameter than the annular inner circumferential circle.
  • the size of each of the alignment marks 22, 25, 26 of the flexible substrate 10, the first photomask 11, and the second photomask 12 is the largest outer diameter of the alignment mark 22 of the flexible substrate 10. 1
  • the circular alignment mark 25 of the second photomask 12 with the next largest annular alignment mark 25 of the photomask 11 is set to the smallest size, so the three alignment marks 22, 25 and 26 are read simultaneously. be able to.
  • the first photomask 11 may be provided with a circular alignment mark
  • the second photomask 12 may be provided with an annular alignment mark!
  • the base material conveyance path is formed along the vertical direction of the flexible substrate 10. Since the first and second photomasks 11 and 12 are opposed to each other in the vertical conveyance section, the flexible substrate 10 does not get caught by its own weight. It is easy to maintain the flatness of the flexible substrate 10 without increasing the tension more than necessary. For this reason, the flexible substrate 10 can be aligned with high accuracy with a small dimensional change. In addition, dust hardly adheres to the flexible substrate 10 and the first and second photomasks 11 and 12. Furthermore, since a long optical path can be secured as compared with the case where the exposed portion is in the horizontal portion, faithful transfer with higher-quality parallel light is possible.
  • FIG. 8 and 9 show a first modified example of the alignment mark
  • FIG. 8 is an enlarged view of a main part showing three alignment marks
  • FIG. 9 shows three alignment marks at accurate alignment positions. It is a figure which shows the state of.
  • the alignment mark 30 of the flexible substrate 10 is a transparent circle, and its peripheral portion is formed of a non-transmissive member.
  • the alignment mark 31 of the first photomask 11 is a non-transparent annular shape.
  • a peripheral portion of each alignment mark 31 of the first photomask 11 is formed of a translucent member.
  • the alignment mark 32 of the second photomask 12 is a non-transparent circle.
  • the peripheral portion of each alignment mark 32 of the second photomask 12 is formed of a translucent member.
  • the size of the alignment marks 30, 31, 32 of the flexible substrate 10, the first photomask 11, and the second photomask 12 is the largest in the annular alignment mark 31 of the first photomask 11.
  • the circular alignment mark 32 of the second photomask 12 with the next largest alignment mark 30 on the flexible substrate 10 is set to the smallest size.
  • FIG. 10 and 11 show a second modification of the alignment mark
  • FIG. 10 is a view showing the arrangement of the flexible substrate and the first photomask
  • FIG. 11 is a cross-sectional view taken along the line XI-XI in FIG.
  • the mask 12 is provided with auxiliary alignment marks 22a, 25a, and 26a in addition to the force provided with the alignment marks 22, 25, and 26 having the same configuration as the embodiment.
  • the flexible substrate 10 is provided with the auxiliary alignment mark 22a outside the planned exposure range 21 and at an intermediate position between the two alignment marks 22.
  • the first and second photomasks 11 and 12 are provided with auxiliary alignment marks 25a and 26a, respectively, at outer positions that do not face the flexible substrate 10 and at the same position in the longitudinal direction T of the flexible substrate 10. Yes.
  • the auxiliary alignment mark 22a of the flexible substrate 10 has a translucent circular shape, and its peripheral portion is formed of a non-translucent member.
  • the auxiliary alignment mark 25a of the first photomask 11 has a non-translucent annular shape.
  • a peripheral portion of the auxiliary alignment mark 25a of the first photomask 11 is formed of a translucent member.
  • the auxiliary alignment mark 26a of the second photomask 12 is a non-translucent circle.
  • the peripheral position of the auxiliary alignment mark 26a of the second photomask 12 is formed of a translucent member.
  • auxiliary alignment marks 25a and 26a there are the following methods. That is, if the positions of the second photomask 12 and the flexible substrate 10 are largely displaced by the alignment marks 22, 25, and 26 as in the above embodiment, the flexible substrate 10 causes the second photomask 12 to The alignment mark 26 is hidden and cannot be read.
  • the three alignment marks 22, 25, 26 are circular and annular, but are not limited to this.
  • Three alignment marks 1S If the shape can be read by one CCD camera, it can be used as a square and a rectangular frame, or as a polygon and a polygonal frame.
  • the band-shaped material is the flexible substrate 10, but a plurality of rigid substrates may be connected in a band shape. Not only a strip-shaped material but also a rigid substrate may be used.
  • each exposure scheduled range 21 of the flexible substrate 10, the first pattern portion l la of the first photomask 11, and the second of the second photomask 12 are used.
  • Alignment marks 22, 25, and 26 are provided at four locations on the pattern portion 12a, respectively, but at least two locations may be provided. If only two positions are provided, the number of reading positions of the alignment marks 22, 25, and 26 is reduced compared to the conventional example, so that the exposure time is shortened and the manufacturing cost is reduced. However, when more than two locations are provided as in this embodiment, alignment with high accuracy and high reliability is possible.
  • the first photomask 11 and the second photomask 12 are disposed opposite to each other on both sides of a region (vertical transport section) in which the flexible substrate 10 is transported in the vertical direction.
  • a photomask may be disposed opposite to the upper and lower sides of the area in which 10 is conveyed in the horizontal direction.
  • the present invention is not limited to a circuit forming technique including an exposure process, a development process, an etching process, and the like, in addition to circuit patterns including an exposure process, a development process, an etching process, and the like using a photomask on a flexible substrate. Can be used in industrial fields.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

A substrate, a first photomask and a second photomask are highly accurately aligned. Three alignment marks (22, 25, 26) at corresponding positions on the flexible substrate (10), the first photomask (11) and the second photomask (12) are read at the same time by a CCD camera. Based on the mark position information from the read images, a relative position between the flexible substrate (10) and the first photomask (11) and that between the flexible substrate (10) and the second photomask (12) are adjusted and alignment is performed.

Description

明 細 書  Specification
露光方法及び露光装置  Exposure method and exposure apparatus
技術分野  Technical field
[0001] 本発明は、帯状基材の搬送経路の両側に一対のフォトマスクを配置し、この一対の フォトマスクによって帯状基材の両面にパターンを転写する露光方法及び露光装置 に関し、特に、帯状素材と一対のフォトマスク間の位置合わせ技術に係わる。  TECHNICAL FIELD [0001] The present invention relates to an exposure method and an exposure apparatus in which a pair of photomasks are arranged on both sides of a belt-shaped substrate conveyance path, and a pattern is transferred to both surfaces of the belt-shaped substrate by the pair of photomasks. The present invention relates to an alignment technique between a material and a pair of photomasks.
背景技術  Background art
[0002] 従来より、帯状基材であるフレキシブル基板にフォトマスクを用いて電気回路等の 配線パターンを、露光工程、現像工程、エッチング工程等を含む回路形成技術によ つて形成することが行われている。この露光工程に際しては、フレキシブル基板とフォ トマスク間を正確に位置合わせする必要がある。この位置合わせは、例えばフレキシ ブル基板とフォトマスクにそれぞ; 立置合わせマークを設け、双方の位置合わせマ ークを CCDカメラで読み取つている。即ち、 CCDカメラで読み取った画像からのマー ク位置情報に基づ 、てフレキシブル基板とフォトマスク間の相対的位置を調整して ヽ る (例えば、特許文献 1参照)。  Conventionally, a wiring pattern such as an electric circuit is formed on a flexible substrate, which is a belt-shaped base material, using a photomask, by a circuit formation technique including an exposure process, a development process, an etching process, and the like. ing. In this exposure process, it is necessary to accurately align the flexible substrate and the photomask. For this alignment, for example, an alignment mark is provided on each of the flexible substrate and the photomask; both alignment marks are read by a CCD camera. That is, the relative position between the flexible substrate and the photomask is adjusted based on the mark position information from the image read by the CCD camera (see, for example, Patent Document 1).
[0003] 近年、フレキシブル基板は、単なるフラットケーブルとして製作されるだけでなぐ硬 いプリント基板と同様に、半導体装置をはじめとする電子部品が実装可能な高精度、 高細密なパターンィ匕と多層化が求められつつある。それに伴い、露光においても、フ レキシブル基板に対するパターンの転写精度とともに基板表裏のパターン転写精度 も必要、つまり基板に対して 2枚のフォトマスクを高精度に位置合わせすると共に 2枚 のフォトマスク同士を互いに高精度に位置合わせする必要が生じてきた。  [0003] In recent years, flexible boards, like hard printed boards that can be manufactured simply as flat cables, can be mounted with high-precision, high-definition patterns and multilayers that can mount electronic components such as semiconductor devices. Is being sought. Along with this, the pattern transfer accuracy on the front and back of the substrate as well as the pattern transfer accuracy on the flexible substrate is required in the exposure, that is, the two photomasks are aligned with respect to the substrate with high accuracy and the two photomasks are aligned with each other. It has become necessary to align each other with high accuracy.
[0004] 以下、両面の露光を行う場合の従来の位置合わせ方法の一例を説明する。図 1及 び図 2において、帯状素材であるフレキシブル基板 100は、搬送手段によって長手 方向 Tに搬送される。フレキシブル基板 100の両面には、感光材(フォトレジスト)が 塗布されている。フレキシブル基板 100には、長手方向に沿って露光予定範囲 101 がほぼ連続的に設定されている。  [0004] Hereinafter, an example of a conventional alignment method when performing double-sided exposure will be described. In FIGS. 1 and 2, the flexible substrate 100, which is a strip-shaped material, is transported in the longitudinal direction T by the transport means. Photosensitive material (photoresist) is applied to both surfaces of the flexible substrate 100. In the flexible substrate 100, a planned exposure range 101 is set substantially continuously along the longitudinal direction.
[0005] この各露光予定範囲 101の四隅の外側の 4箇所には、透光性の位置合わせマーク 102がそれぞれ設けられている。第 1フォトマスク 103及び第 2フォトマスク 104は、搬 送されるフレキシブル基板 100の両面側にそれぞれ対向配置されている。図 2に示 すように、第 1フォトマスク 103には、第 1パターン部 103aが設けられている。第 1パタ ーン部 103aの対角位置の外側の 2箇所には、非透光性の位置合わせマーク 105が 設けられている。図 2に示すように、第 2フォトマスク 104には、第 2パターン部 104aが 設けられている。第 1フォトマスク 103の対角位置とは異なる対角位置で、第 2パター ン部 104aの対角位置の外側の 2箇所には、非透光性の位置合わせマーク 106が設 けられている。 [0005] In the four positions outside the four corners of each planned exposure area 101, there are translucent alignment marks. 102 are provided. The first photomask 103 and the second photomask 104 are arranged to face each other on both sides of the flexible substrate 100 to be transported. As shown in FIG. 2, the first photomask 103 is provided with a first pattern portion 103a. Non-transparent alignment marks 105 are provided at two locations outside the diagonal position of the first pattern portion 103a. As shown in FIG. 2, the second photomask 104 is provided with a second pattern portion 104a. Non-transparent alignment marks 106 are provided at two positions outside the diagonal position of the first photomask 103 and outside the diagonal position of the second pattern portion 104a. .
[0006] なお、このように第 1フォトマスク及び前記第 2フォトマスクに設けられたそれぞれ一 対の位置合わせマーク 105, 105と位置合わせマーク 106, 106力 互いに異なる対 角位置に配置される理由は、これら位置合わせマーク 105、 106は同じ円形の非透 光性マークであり、 CCDカメラで読み取る際にどちらかのマークかを特定することが 困難であるため、位置合わせマーク 105、 106が重ならないように別々の位置に設け る必要があった力 である。  [0006] It should be noted that the pair of alignment marks 105, 105 and the alignment marks 106, 106 provided on the first photomask and the second photomask in this way are arranged at different diagonal positions. The alignment marks 105 and 106 are non-transparent marks with the same circular shape, and it is difficult to identify which mark when reading with a CCD camera. It was a force that had to be provided at different positions so that it was not necessary.
[0007] 第 1フォトマスク 103及び第 2フォトマスク 104は、図示しない位置調整手段によって フレキシブル基板 100に対してそれぞ 立置調整される。  [0007] The first photomask 103 and the second photomask 104 are vertically adjusted with respect to the flexible substrate 100 by position adjusting means (not shown).
[0008] CCDカメラ 107は、フレキシブル基板 100を基準として第 1フォトマスク 103より遠い 位置に配置され、フレキシブル基板 100の面方向に移動自在に設定されている。  The CCD camera 107 is disposed at a position farther from the first photomask 103 with respect to the flexible substrate 100 and is set to be movable in the surface direction of the flexible substrate 100.
[0009] 上記構成において、搬送手段によってフレキシブル基板 100が所定距離だけ搬送 されると、フレキシブル基板 100の露光予定範囲 101が第 1及び第 2フォトマスク 103 , 104にほぼ対向配置される。すると、 CCDカメラ 107でフレキシブル基板 100の 4 箇所の位置合わせマーク 102, 105, 106の位置が読み取られる。その結果得られ たマークの位置情報に基づき、フレキシブル基板 100に対する第 1フォトマスク 103 及び第 2フォトマスク 104の位置を調整し、位置合わせを行う。  [0009] In the above configuration, when the flexible substrate 100 is transported by a predetermined distance by the transport means, the exposure range 101 of the flexible substrate 100 is disposed substantially opposite to the first and second photomasks 103 and 104. Then, the positions of the four alignment marks 102, 105, 106 on the flexible substrate 100 are read by the CCD camera 107. Based on the position information of the mark obtained as a result, the positions of the first photomask 103 and the second photomask 104 with respect to the flexible substrate 100 are adjusted to perform alignment.
[0010] フレキシブル基板 100に対する第 1及び第 2フォトマスク 103, 104の位置調整を終 了すると、第 1及び第 2フォトマスク 103, 104を通して照射光 LI, L2をフレキシブル 基板 100の両面にそれぞれ照射し、フレキシブル基板 100の両面にパターンを転写 する。 特許文献 1:特開 2004— 347964号公報 [0010] When the position adjustment of the first and second photomasks 103 and 104 with respect to the flexible substrate 100 is completed, the irradiation lights LI and L2 are irradiated to both surfaces of the flexible substrate 100 through the first and second photomasks 103 and 104, respectively. Then, the pattern is transferred to both sides of the flexible substrate 100. Patent Document 1: Japanese Patent Application Laid-Open No. 2004-347964
発明の開示  Disclosure of the invention
[0011] し力しながら、上述した従来の露光時における位置合わせ方法では、フレキシブル 基板 100の異なる位置合わせマーク 102を基準として第 1フォトマスク 103と第 2フォ トマスク 104を位置合わせしている。そのため、各位置合わせマーク 102の位置精度 、画像認識精度等にバラツキがあると、そのバラツキの影響を受けて第 1フォトマスク 103と第 2フォトマスク 104がそれぞ; ^立置合わせされることになる。従って、フレキシ ブル基板 100と第 1及び第 2フォトマスク 103, 104間は高精度に位置合わせされる 力 第 1フォトマスク 103と第 2フォトマスク 104間を高精度に位置合わせすることがで きないという問題がある。第 1フォトマスク 103と第 2フォトマスク 104間が高精度に位 置合わせされな 、と、フレキシブル基板 100の両面のパターン同士の位置がずれた ものとなる。  However, in the above-described conventional alignment method during exposure, the first photomask 103 and the second photomask 104 are aligned with reference to different alignment marks 102 on the flexible substrate 100. Therefore, if there are variations in the positioning accuracy, image recognition accuracy, etc. of each alignment mark 102, the first photomask 103 and the second photomask 104 will be placed in a standing position under the influence of the variation. become. Therefore, the force between the flexible substrate 100 and the first and second photomasks 103 and 104 is aligned with high accuracy. The force between the first photomask 103 and the second photomask 104 can be aligned with high accuracy. There is no problem. If the first photomask 103 and the second photomask 104 are not aligned with high accuracy, the positions of the patterns on both sides of the flexible substrate 100 are shifted.
[0012] そこで、本発明は、上記課題を解決し、帯状基材と第 1及び第 2フォトマスク間のみ ならず第 1フォトマスクと第 2フォトマスク間も高精度に位置合わせできる露光方法及 び露光装置を提供することを目的とする。  [0012] Therefore, the present invention solves the above-mentioned problems, and an exposure method and an exposure method capable of aligning not only between the belt-shaped substrate and the first and second photomasks but also between the first photomask and the second photomask with high accuracy. And an exposure apparatus.
[0013] 本発明の第 1の特徴に係る発明は、露光方法であって、両面に感光性材料が形成 された帯状基材を、その長手方向に沿って間欠的に送り、露光処理位置には、前記 帯状基材の両面にそれぞれ対向するように、第 1フォトマスク及び第 2フォトマスクを 配置し、前記帯状基材の両面に対して前記第 1フォトマスク及び前記第 2フォトマスク を通して光を照射することにより、前記帯状基材の両面に前記第 1フォトマスク及び前 記第 2フォトマスクにそれぞれ描かれたパターンを転写する露光方法であって、前記 帯状基材と前記第 1フォトマスク及び前記第 2フォトマスクには、前記帯状基材と前記 第 1フォトマスク及び前記第 2フォトマスクを互いに位置合わせするために、対向する 位置に複数の位置合わせマークがそれぞれ設けられ、対向した位置の前記帯状基 材に設けられた位置合わせマークと、前記第 1フォトマスク及び前記第 2フォトマスク のそれぞれに設けられた位置合わせマークと、の 3つの位置合わせマークを同時に ひとつの CCDカメラで読み取り、その結果得られたデータに基づいて、前記第 1フォ トマスクと前記第 2フォトマスクのうち少なくとも一方を X, Y, 0方向に移動させて前記 帯状基材と前記第 1フォトマスク及び前記第 2フォトマスクをそれぞ; m立置合わせする ことを要旨とする。 [0013] The invention according to the first aspect of the present invention is an exposure method, wherein a belt-like substrate having a photosensitive material formed on both sides is intermittently fed along the longitudinal direction thereof to an exposure processing position. The first photomask and the second photomask are arranged so as to face both surfaces of the belt-shaped substrate, respectively, and light is transmitted through the first photomask and the second photomask to both surfaces of the belt-shaped substrate. The exposure method transfers the pattern drawn on each of the first photomask and the second photomask onto both surfaces of the belt-like substrate by irradiating the belt-like substrate, and the belt-like substrate and the first photomask And the second photomask is provided with a plurality of alignment marks at opposite positions to align the belt-shaped substrate, the first photomask and the second photomask with each other. A single CCD camera simultaneously aligns three alignment marks, the alignment mark provided on the strip-shaped substrate at the position and the alignment mark provided on each of the first photomask and the second photomask. And at least one of the first photomask and the second photomask is moved in the X, Y, and 0 directions based on the data obtained as a result. The gist of the present invention is that the band-shaped substrate, the first photomask, and the second photomask are arranged in a standing manner.
[0014] 本発明の第 2の特徴に係る発明は、露光装置であって、長手方向に沿って連続的 に露光予定範囲が設定され、各露光予定範囲毎に位置合わせマークが複数位置に 設けられた帯状基材と、帯状基材を長手方向に搬送する基材搬送手段と、帯状基材 の搬送経路の帯状基材を挟む位置にそれぞれ配置され、それぞれ複数位置に位置 合わせマークが設けられた第 1及び第 2フォトマスクと、 CCDカメラとを備え、第 1及び 第 2フォトマスクの複数位置の各位置合わせマークは、帯状基材の同じ位置合わせ マークに対応する位置にそれぞれ配置され、 CCDカメラは、帯状基材と第 1フォトマ スクと第 2フォトマスクの対応位置にある 3つの位置合わせマーク同時に読み取り可 能であり、その結果得られたデータに基づいて、第 1フォトマスクと第 2フォトマスクのう ち少なくとも一方を X, Y, 0方向に移動させて帯状基材と第 1フォトマスク及び第 2フ オトマスクをそれぞれ位置合わせする位置調整手段を備え、帯状基材の両面に対し て第 1及び第 2フォトマスクを通して光を照射することにより、帯状基材の両面に第 1 及び第 2フォトマスクにそれぞれ描かれたパターンを転写することを要旨とする。 図面の簡単な説明  [0014] The invention according to the second aspect of the present invention is an exposure apparatus, wherein a predetermined exposure range is set continuously along the longitudinal direction, and alignment marks are provided at a plurality of positions for each predetermined exposure range. The belt-shaped base material, the base material transporting means for transporting the belt-shaped base material in the longitudinal direction, and the belt-shaped base material transport path are arranged at positions sandwiching the belt-shaped base material, and alignment marks are provided at a plurality of positions, respectively. The first and second photomasks and a CCD camera are provided, and the alignment marks at the plurality of positions of the first and second photomasks are respectively arranged at positions corresponding to the same alignment marks on the belt-shaped substrate. The CCD camera can simultaneously read three alignment marks at the corresponding positions of the belt-shaped substrate, the first photomask, and the second photomask. Based on the data obtained as a result, the first and second photomasks can be read simultaneously. 2 Position adjustment means for aligning the belt-shaped substrate, the first photomask, and the second photomask by moving at least one of the masks in the X, Y, and 0 directions is provided, and the first mask and the second photomask are aligned with respect to both surfaces of the belt-shaped substrate. The gist is to transfer the patterns drawn on the first and second photomasks onto both sides of the belt-like substrate by irradiating light through the first and second photomasks. Brief Description of Drawings
[0015] [図 1]図 1は従来例のフレキシブル基板と第 1フォトマスクの配置を示す図である。  FIG. 1 is a view showing the arrangement of a conventional flexible substrate and a first photomask.
[図 2]図 2は図 1の II II線断面図である。  [FIG. 2] FIG. 2 is a sectional view taken along line II-II in FIG.
[図 3]図 3は本発明の実施の形態に係る露光装置の概略構成図である。  FIG. 3 is a schematic block diagram of an exposure apparatus according to an embodiment of the present invention.
[図 4]図 4は図 3の矢印 A方向力 見たフレキシブル基板と第 1フォトマスクの配置を 示す図である。  [FIG. 4] FIG. 4 is a diagram showing the arrangement of the flexible substrate and the first photomask as seen in the direction of arrow A in FIG.
[図 5]図 5は図 4の V— V線断面図である。  FIG. 5 is a cross-sectional view taken along line V—V in FIG.
[図 6]図 6は図 5の C部の要部拡大図である。  [FIG. 6] FIG. 6 is an enlarged view of a main part of part C of FIG.
[図 7]図 7は図 6に示す第 1フォトマスク側力 見た図であり、正確な位置合わせ位置 における 3つの位置合わせマークの状態を示す図である。  FIG. 7 is a view of the first photomask side force shown in FIG. 6 and shows the state of three alignment marks at an accurate alignment position.
[図 8]図 8は第 1変形例の 3つの位置合わせマークを示す要部拡大図である。  [FIG. 8] FIG. 8 is an enlarged view of a main part showing three alignment marks of the first modification.
[図 9]図 9は図 8に示す第 1フォトマスク側力 見た図であり、第 1変形例の正確な位置 合わせ位置における 3つの位置合わせマークの状態を示す図である。 [図 10]図 10は第 2変形例のフレキシブル基板と第 1フォトマスクの配置を示す図であ る。 [Fig. 9] Fig. 9 is a view of the first photomask side force shown in Fig. 8, and shows a state of three alignment marks at an accurate alignment position of the first modified example. FIG. 10 is a diagram showing an arrangement of a flexible substrate and a first photomask of a second modified example.
[図 11]図 11は図 10の XI— XI線断面図である。  FIG. 11 is a cross-sectional view taken along the line XI-XI in FIG.
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0016] 以下、本発明の実施の形態に係る露光方法及び露光装置の詳細を図面に基づい て説明する。  Hereinafter, details of an exposure method and an exposure apparatus according to an embodiment of the present invention will be described with reference to the drawings.
[0017] 図 1〜図 5は本発明の実施の形態を示し、図 3は露光装置の概略構成図、図 4は図 3の矢印 A方向から見たフレキシブル基板と第 1フォトマスクの配置を示す図、図 5は 図 4の V— V線断面図、図 6は図 5の C部の要部拡大図、図 7は位置合わせ位置にお ける 3つの位置合わせマークの状態を示す図である。  1 to 5 show an embodiment of the present invention, FIG. 3 is a schematic block diagram of an exposure apparatus, and FIG. 4 is an arrangement of a flexible substrate and a first photomask viewed from the direction of arrow A in FIG. Fig. 5 is a cross-sectional view taken along the line V-V in Fig. 4, Fig. 6 is an enlarged view of the main part of section C in Fig. 5, and Fig. 7 is a diagram showing the state of three alignment marks at the alignment position. is there.
[0018] 図 3に示すように、露光装置 1は、ベースプレート 2とこのベースプレート 2上に設置 された筐体 3とを備えている。筐体 3内には、暗室 3aが形成されている。  As shown in FIG. 3, the exposure apparatus 1 includes a base plate 2 and a housing 3 installed on the base plate 2. In the housing 3, a dark room 3a is formed.
[0019] 基材搬送手段 4は、筐体 3外の一方のベースプレート 2上に設置された繰り出し用リ ール 5と、筐体 3外の他方のベースプレート 2上に設置された巻き取り用リール 6と、繰 り出し用リール 5と巻き取り用リール 6間に所定の搬送経路を形成するための複数の ガイドロール 7a〜7nと、帯状基材であるフレキシブル基板 10に搬送力を作用させる 駆動ロール 8とを備えている。搬送経路の大部分は、暗室 3a内に配置されている。暗 室 3a内の下方位置のガイドロール 7fと上方位置のガイドロール 7hとの間は、フレキ シブル基板 10を垂直方向に搬送する垂直搬送区間とされて ヽる。  [0019] The base material conveying means 4 includes a reel 5 for feeding installed on one base plate 2 outside the casing 3, and a take-up reel installed on the other base plate 2 outside the casing 3. 6, a plurality of guide rolls 7a to 7n for forming a predetermined conveyance path between the feeding reel 5 and the take-up reel 6 and a flexible substrate 10 which is a belt-shaped substrate. With roll 8. Most of the transfer path is arranged in the dark room 3a. Between the guide roll 7f at the lower position and the guide roll 7h at the upper position in the dark room 3a, it is regarded as a vertical conveyance section for conveying the flexible substrate 10 in the vertical direction.
[0020] 帯状基材であるフレキシブル基板 10は、その両端側が繰り出し用リール 5と巻き取 り用リール 6にそれぞれ巻かれており、且つ、基材搬送手段 4の搬送経路に沿って配 置されている。フレキシブル基板 10は、その長手方向を搬送方向 Tとして基材搬送 手段 4によって搬送される。フレキシブル基板 10の両面には、感光材が塗布されて いる。  [0020] The flexible substrate 10 that is a belt-like base material is wound around the feeding reel 5 and the take-up reel 6 at both ends, and is arranged along the transport path of the base material transport means 4. ing. The flexible substrate 10 is transported by the base material transport means 4 with its longitudinal direction as the transport direction T. A photosensitive material is applied to both surfaces of the flexible substrate 10.
[0021] 第 1フォトマスク 11と第 2フォトマスク 12は、基材搬送手段 4の垂直搬送区間でフレ キシブル基板 10の両面側にそれぞれ対向配置されて 、る。第 1及び第 2フォトマスク 11, 12は、それぞれ所望パターンが描かれた第 1及び第 2パターン部 11a, 12aを 有する。 [0022] 第 1フォトマスク 11は、支持体によって保持されている。この支持体は、第 1位置調 整手段 13を介して第 1フレーム 14に支持されている。従って、第 1フォトマスク 11は、 位置調整手段 13により、フレキシブル基板 10の面に平行な Χ、Υ、 θ (ΧΥ面の回転 方向)方向に移動されてフレキシブル基板 10との相対的な位置に調整され得るよう になっている。 The first photomask 11 and the second photomask 12 are arranged to face each other on both sides of the flexible substrate 10 in the vertical conveyance section of the base material conveyance means 4. The first and second photomasks 11 and 12 have first and second pattern portions 11a and 12a on which desired patterns are drawn, respectively. [0022] The first photomask 11 is held by a support. This support is supported by the first frame 14 via the first position adjusting means 13. Therefore, the first photomask 11 is moved by the position adjusting means 13 in the Χ, Υ, θ (rotation direction of the ridge surface) direction parallel to the surface of the flexible substrate 10 and is positioned relative to the flexible substrate 10. It can be adjusted.
[0023] 第 2フォトマスク 12は、支持体によって保持されている。この支持体は、第 2位置調 整手段 15を介して第 2フレーム 16に支持されている。従って、第 2フォトマスク 12は、 位置調整手段 15により、フレキシブル基板 10の面に平行な X、 Υ、 Θ方向に移動さ れてフレキシブル基板 10との相対的な位置に調整され得るようになって 、る。  [0023] The second photomask 12 is held by a support. This support is supported by the second frame 16 via the second position adjusting means 15. Therefore, the second photomask 12 can be adjusted to a relative position with respect to the flexible substrate 10 by being moved in the X, Υ, and Θ directions parallel to the surface of the flexible substrate 10 by the position adjusting means 15. And
[0024] 図示しない光源、第 1,第 2ミラー 18, 19からなる光照射手段 17によって、第 1フォ トマスク 11及び第 2フォトマスク 12を通して光を照射することにより、フレキシブル基 板 10の両面に、第 1フォトマスク 11、第 2フォトマスクにそれぞれ描かれたパターンを 転写する。  [0024] By irradiating light through the first photomask 11 and the second photomask 12 by a light irradiation means 17 comprising a light source (not shown) and first and second mirrors 18 and 19, both surfaces of the flexible substrate 10 are irradiated. The patterns drawn on the first photomask 11 and the second photomask are transferred.
[0025] マーク読み取り手段である CCDカメラ 20は、フレキシブル基板 10を基準として第 1 フォトマスク 11より遠い位置に配置され、フレキシブル基板 10の面と平行な面上を X , Y方向に移動自在に設けられている。  [0025] The CCD camera 20 serving as a mark reading means is arranged at a position farther from the first photomask 11 with respect to the flexible substrate 10, and is movable in the X and Y directions on a plane parallel to the surface of the flexible substrate 10. Is provided.
[0026] CCDカメラ 20からの画像データに基づ 、て画像処理装置(図示せず)で演算し、 その演算結果に基づ 、て位置合わせを行う。  [0026] Based on the image data from the CCD camera 20, an image processing device (not shown) is used for calculation, and alignment is performed based on the calculation result.
[0027] 図 4〜図 6に示すように、フレキシブル基板 10の長手方向には、露光予定範囲 21 ( 図 4に示す)が一定の間隔を介して (もしくは連続的でもよい)設定され、各露光予定 範囲 21毎に 4箇所に位置合わせマーク 22 (図 4〜図 6に示す)が設けられている。 4 箇所の位置合わせマーク 22は、露光予定範囲 21の四隅の外側位置の 4箇所に設 けられている。各位置合わせマーク 22は、透光性の円形であり、その周辺箇所が非 透光性部材で形成されて ヽる。  As shown in FIG. 4 to FIG. 6, in the longitudinal direction of the flexible substrate 10, an exposure exposure range 21 (shown in FIG. 4) is set through a certain interval (or may be continuous), and each Alignment marks 22 (shown in FIGS. 4 to 6) are provided at four locations for each exposure range 21. Four alignment marks 22 are provided at four positions outside the four corners of the planned exposure area 21. Each alignment mark 22 has a translucent circular shape, and its peripheral portion is formed of a non-translucent member.
[0028] 第 1及び第 2フォトマスク 11, 12の第 1及び第 2パターン部 11a, 12aの外側位置に は、 4箇所に位置合わせマーク 25, 26 (図 4〜図 6に示す)がそれぞれ設けられてい る。第 1フォトマスク 11の 4つの位置合わせマーク 25は、フレキシブル基板 10の 4箇 所の位置合わせマーク 22に全て対応する位置に設けられて 、る。第 1フォトマスク 1 1の各位置合わせマーク 25は、非透光性の円環状である。第 1フォトマスク 11の各位 置合わせマーク 25の周辺箇所は、透光性部材で形成されている。第 2フォトマスク 1 2の 4つの位置合わせマーク 26も、第 1フォトマスク 25のものと同様に、フレキシブル 基板 10の 4箇所の位置合わせマーク 22に全て対応する位置に設けられて 、る。第 2 フォトマスク 12の各位置合わせマーク 26は、非透光性の円形である。第 2フォトマス ク 12の各位置合わせマーク 26の周辺箇所は、透光性部材で形成されている。 [0028] There are four alignment marks 25 and 26 (shown in FIGS. 4 to 6) on the outer positions of the first and second pattern portions 11a and 12a of the first and second photomasks 11 and 12, respectively. It is provided. The four alignment marks 25 of the first photomask 11 are provided at positions corresponding to all of the four alignment marks 22 of the flexible substrate 10. 1st photomask 1 Each alignment mark 25 of 1 has a non-translucent annular shape. The peripheral portion of each alignment mark 25 of the first photomask 11 is formed of a translucent member. Similarly to the first photomask 25, the four alignment marks 26 of the second photomask 12 are provided at positions corresponding to the four alignment marks 22 of the flexible substrate 10. Each alignment mark 26 of the second photomask 12 is a non-transparent circle. A peripheral portion of each alignment mark 26 of the second photomask 12 is formed of a translucent member.
[0029] 又、図 6及び図 7に詳しく示すように、フレキシブル基板 10の位置合わせマーク 22 の外径が最も大きぐ第 1フォトマスク 11の円環状の位置合わせマーク 25が次に大き ぐ第 2フォトマスク 12の円形の位置合わせマーク 26が最も小さぐ円環状の内周円 より小さく設定されている。  Further, as shown in detail in FIGS. 6 and 7, the annular alignment mark 25 of the first photomask 11 in which the outer diameter of the alignment mark 22 of the flexible substrate 10 is the largest is the second largest. 2 The circular alignment mark 26 of the photomask 12 is set smaller than the smallest circular inner circumference.
[0030] 図 3を用いて、前記露光装置 1の動作を説明する。  The operation of the exposure apparatus 1 will be described with reference to FIG.
[0031] まず、基材搬送手段 4によってフレキシブル基板 10を所定距離だけ搬送させ、フレ キシブル基板 10の露光予定範囲 21を第 1及び第 2フォトマスク 11, 12にほぼ対向 配置させる。  First, the flexible substrate 10 is transported by a predetermined distance by the substrate transport means 4, and the planned exposure range 21 of the flexible substrate 10 is disposed substantially opposite to the first and second photomasks 11 and 12.
[0032] 次に、 CCDカメラ 20でフレキシブル基板 10の 4箇所の位置合わせマーク 22を中 心としてその周辺位置を読み取る。ここで、フレキシブル基板 10は、上記した基材搬 送手段 4の搬送によって、第 1及び第 2フォトマスク 11, 12に対しておよそ所定の位 置に位置するため、 CCDカメラ 20で 3つの位置合わせマーク 22, 25, 26を同時に 読み取ることができる。  Next, the peripheral position of the flexible substrate 10 is read with the CCD camera 20 around the four alignment marks 22. Here, since the flexible substrate 10 is positioned at a predetermined position with respect to the first and second photomasks 11 and 12 by the transport of the base material transport means 4, the CCD camera 20 has three positions. The alignment marks 22, 25 and 26 can be read simultaneously.
[0033] 4箇所のマーク画像データの内の少なくとも 2箇所のデータを用いてフレキシブル 基板 10と第 1及び第 2フォトマスク 11. 12間の位置ずれ量をそれぞれ算出する。第 1 フォトマスク 11及び第 2フォトマスク 12の各位置ずれ量に基づいて、第 1フォトマスク 1 1の位置を第 1位置調整手段 13によって、第 2フォトマスク 12の位置を第 2位置調整 手段 15によってそれぞれ調整する。  [0033] The amount of positional deviation between the flexible substrate 10 and the first and second photomasks 11 and 12 is calculated using at least two of the four mark image data. Based on the positional deviation amounts of the first photomask 11 and the second photomask 12, the position of the first photomask 11 is set by the first position adjusting means 13, and the position of the second photomask 12 is set by the second position adjusting means. Adjust by 15 respectively.
[0034] 次に、位置調整が終了すると、 CCDカメラ 20で再び 3つの位置合わせマーク 22, 2 5, 26を読み取り、正確な位置合わせ位置となっていることを確認する。尚、確認作 業は省略しても良い。正確な位置合わせ位置では、 3つの位置合わせマーク 22, 25 , 26が図 7に示すような状態となる。図 7では、輝度レベルの低い領域をハッチングで 示している。 [0034] Next, when the position adjustment is completed, the CCD camera 20 reads the three alignment marks 22, 25, and 26 again, and confirms that the position is an accurate alignment position. Confirmation work may be omitted. At the correct alignment position, the three alignment marks 22, 25 and 26 are in the state shown in FIG. In Fig. 7, areas with low brightness levels are hatched. Show.
[0035] 次に、光照射手段 17によって、第 1照射光 Ll、第 2照射光 L2を、それぞれ第 1フォ トマスク 11、第 2フォトマスク 12を通してフレキシブル基板 10に照射する。これに伴い 、フレキシブル基板 10の両面に所望のパターンがそれぞれ転写される。上記したェ 程を繰り返すことによってフレキシブル基板 10の露光予定範囲 21に連続的にパター ンを転写する。  Next, the light irradiation means 17 irradiates the flexible substrate 10 with the first irradiation light Ll and the second irradiation light L2 through the first photomask 11 and the second photomask 12, respectively. As a result, desired patterns are respectively transferred to both surfaces of the flexible substrate 10. By repeating the above process, the pattern is continuously transferred to the exposure range 21 of the flexible substrate 10.
[0036] 以上、本発明によれば、上記した位置合わせ工程において、第 1フォトマスク 11と 第 2フォトマスク 12が共にフレキシブル基板 10の同 Cf立置合わせマーク 22を基準に 位置合わせされるため、仮にフレキシブル基板 10の位置合わせマーク 22の位置精 度、画像認識精度等に誤差が発生しても誤差の影響を受けにくい。従って、フレキシ ブル基板 10と第 1及び第 2フォトマスク 11, 12との間のみならず第 1フォトマスク 11と 第 2フォトマスク 12との間も高精度に位置合わせできる。  As described above, according to the present invention, the first photomask 11 and the second photomask 12 are both aligned based on the Cf alignment mark 22 of the flexible substrate 10 in the above-described alignment step. Even if an error occurs in the position accuracy and image recognition accuracy of the alignment mark 22 of the flexible substrate 10, it is not easily affected by the error. Accordingly, not only the flexible substrate 10 and the first and second photomasks 11 and 12 but also the first photomask 11 and the second photomask 12 can be aligned with high accuracy.
[0037] 尚、この実施の形態では、帯状基板の端面を検出するセンサを露光部前に設け、 そのセンサの検出する端面位置情報に基づいて、表裏のフォトマスク又は基板を X 方向に移動させ、正規の位置からのずれを補正させることで、 3つのマークが大きく ずれることなく確実に CCDカメラで 3つの位置合わせマーク 22, 25, 26を撮影できる ことになる。  In this embodiment, a sensor for detecting the end face of the belt-like substrate is provided in front of the exposure unit, and the front and back photomasks or substrates are moved in the X direction based on the end face position information detected by the sensor. By correcting the deviation from the normal position, the three alignment marks 22, 25, and 26 can be reliably photographed with the CCD camera without the three marks deviating greatly.
[0038] この実施の形態では、フレキシブル基板 10の位置合わせマーク 22は、透光性の円 形であり、第 1フォトマスク 11の位置合わせマーク 25は、非透光性の円環状であり、 第 2フォトマスク 12の位置合わせマーク 26は、この円環状の内周円より小径の非透 光性の円形である。そして、フレキシブル基板 10と第 1フォトマスク 11と第 2フォトマス ク 12の各位置合わせマーク 22, 25, 26の大きさは、フレキシブル基板 10の位置合 わせマーク 22の外径が最も大きぐ第 1フォトマスク 11の円環状の位置合わせマーク 25が次に大きぐ第 2フォトマスク 12の円形の位置合わせマーク 26が最も小さく設定 されているので 3つの位置合わせマーク 22, 25, 26を同時に読み取ることができる。  [0038] In this embodiment, the alignment mark 22 of the flexible substrate 10 is a translucent circular shape, and the alignment mark 25 of the first photomask 11 is a non-translucent annular shape, The alignment mark 26 of the second photomask 12 is a non-transparent circle having a smaller diameter than the annular inner circumferential circle. The size of each of the alignment marks 22, 25, 26 of the flexible substrate 10, the first photomask 11, and the second photomask 12 is the largest outer diameter of the alignment mark 22 of the flexible substrate 10. 1 The circular alignment mark 25 of the second photomask 12 with the next largest annular alignment mark 25 of the photomask 11 is set to the smallest size, so the three alignment marks 22, 25 and 26 are read simultaneously. be able to.
[0039] 尚、この実施の形態とは逆に、第 1フォトマスク 11に円形の位置合わせマークを、第 2フォトマスク 12に円環状の位置合わせマークを設けても良!、。  In contrast to this embodiment, the first photomask 11 may be provided with a circular alignment mark, and the second photomask 12 may be provided with an annular alignment mark!
[0040] この実施の形態では、基材搬送経路は、フレキシブル基板 10を垂直方向に沿って 搬送する垂直搬送区間を有し、この垂直搬送区間で第 1及び第 2フォトマスク 11, 12 を対向配置させたので、フレキシブル基板 10が自重によって橈まないため、露光時 において、フレキシブル基板 10に必要以上に張力をカ卩えずに、フレキシブル基板 1 0の平面度を維持しやすい。このため、フレキシブル基板 10の寸法変化が小さぐ高 精度に位置合わせすることができる。又、フレキシブル基板 10や第 1及び第 2フォト マスク 11, 12にゴミが付着し難い。更に、露光部が水平部にあるのに比べ、長い光 路を確保できるので、より高質の平行光による忠実な転写が可能である。 [0040] In this embodiment, the base material conveyance path is formed along the vertical direction of the flexible substrate 10. Since the first and second photomasks 11 and 12 are opposed to each other in the vertical conveyance section, the flexible substrate 10 does not get caught by its own weight. It is easy to maintain the flatness of the flexible substrate 10 without increasing the tension more than necessary. For this reason, the flexible substrate 10 can be aligned with high accuracy with a small dimensional change. In addition, dust hardly adheres to the flexible substrate 10 and the first and second photomasks 11 and 12. Furthermore, since a long optical path can be secured as compared with the case where the exposed portion is in the horizontal portion, faithful transfer with higher-quality parallel light is possible.
[0041] (位置合わせマークの第 1変形例)  [0041] (First modification of alignment mark)
図 8及び図 9は位置合わせマークの第 1変形例を示し、図 8は 3つの位置合わせマ ークを示す要部拡大図、図 9は正確な位置合わせ位置における 3つの位置合わせマ ークの状態を示す図である。  8 and 9 show a first modified example of the alignment mark, FIG. 8 is an enlarged view of a main part showing three alignment marks, and FIG. 9 shows three alignment marks at accurate alignment positions. It is a figure which shows the state of.
[0042] 図 8及び図 9に示すように、フレキシブル基板 10の位置合わせマーク 30は、透過性 の円形であり、その周辺箇所が非透過部材で形成されている。第 1フォトマスク 11の 位置合わせマーク 31は、非透光性の円環状である。第 1フォトマスク 11の各位置合 わせマーク 31の周辺箇所は、透光性部材で形成されている。第 2フォトマスク 12の 位置合わせマーク 32は、非透光性の円形である。第 2フォトマスク 12の各位置合わ せマーク 32の周辺箇所は、透光性部材で形成されている。そして、フレキシブル基 板 10と第 1フォトマスク 11と第 2フォトマスク 12の各位置合わせマーク 30, 31, 32の 大きさは、第 1フォトマスク 11の円環状の位置合わせマーク 31が最も大きぐフレキシ ブル基板 10の位置合わせマーク 30が次に大きぐ第 2フォトマスク 12の円形の位置 合わせマーク 32が最も小さく設定されて 、る。  As shown in FIGS. 8 and 9, the alignment mark 30 of the flexible substrate 10 is a transparent circle, and its peripheral portion is formed of a non-transmissive member. The alignment mark 31 of the first photomask 11 is a non-transparent annular shape. A peripheral portion of each alignment mark 31 of the first photomask 11 is formed of a translucent member. The alignment mark 32 of the second photomask 12 is a non-transparent circle. The peripheral portion of each alignment mark 32 of the second photomask 12 is formed of a translucent member. The size of the alignment marks 30, 31, 32 of the flexible substrate 10, the first photomask 11, and the second photomask 12 is the largest in the annular alignment mark 31 of the first photomask 11. The circular alignment mark 32 of the second photomask 12 with the next largest alignment mark 30 on the flexible substrate 10 is set to the smallest size.
[0043] この第 1変形例でも、フレキシブル基板 10と第 1フォトマスク 11と第 2フォトマスク 12 の位置合わせ位置及び少なくともその近傍位置では、図 9に示すように、 3つの位置 合わせマーク 30, 31, 32を同時に読み取ることができる。  Also in the first modification example, as shown in FIG. 9, at the alignment position of the flexible substrate 10, the first photomask 11 and the second photomask 12, and at least in the vicinity thereof, three alignment marks 30, 31 and 32 can be read simultaneously.
[0044] (位置合わせマークの第 2変形例)  [0044] (Second modification of alignment mark)
図 10及び図 11は位置合わせマークの第 2変形例を示し、図 10はフレキシブル基 板と第 1フォトマスクの配置を示す図、図 11は図 10の XI— XI線断面図である。  10 and 11 show a second modification of the alignment mark, FIG. 10 is a view showing the arrangement of the flexible substrate and the first photomask, and FIG. 11 is a cross-sectional view taken along the line XI-XI in FIG.
[0045] 図 10及び図 11に示すように、フレキシブル基板 10と第 1フォトマスク 11と第 2フォト マスク 12には、実施の形態と同一構成の位置合わせマーク 22, 25, 26がそれぞれ 設けられている力 その他に補助位置合わせマーク 22a, 25a, 26aがそれぞれ設け られている。 [0045] As shown in FIGS. 10 and 11, the flexible substrate 10, the first photomask 11, and the second photo The mask 12 is provided with auxiliary alignment marks 22a, 25a, and 26a in addition to the force provided with the alignment marks 22, 25, and 26 having the same configuration as the embodiment.
[0046] つまり、フレキシブル基板 10には、各露光予定範囲 21の外側で、且つ、 2つの位 置合わせマーク 22の中間位置に補助位置合わせマーク 22aが設けられている。第 1 及び第 2フォトマスク 11 , 12には、フレキシブル基板 10に対向配置しない外側位置 で、且つ、フレキシブル基板 10の長手方向 Tの同じ位置に各補助位置合わせマーク 25a, 26aがそれぞれ設けられている。  That is, the flexible substrate 10 is provided with the auxiliary alignment mark 22a outside the planned exposure range 21 and at an intermediate position between the two alignment marks 22. The first and second photomasks 11 and 12 are provided with auxiliary alignment marks 25a and 26a, respectively, at outer positions that do not face the flexible substrate 10 and at the same position in the longitudinal direction T of the flexible substrate 10. Yes.
[0047] フレキシブル基板 10の補助位置合わせマーク 22aは、透光性の円形であり、その 周辺箇所が非透光性部材で形成されている。第 1フォトマスク 11の補助位置合わせ マーク 25aは、非透光性の円環状である。第 1フォトマスク 11の補助位置合わせマー ク 25aの周辺箇所は、透光性部材で形成されている。第 2フォトマスク 12の補助位置 合わせマーク 26aは、非透光性の円形である。第 2フォトマスク 12の補助位置合わせ マーク 26aの周辺箇所は、透光性部材で形成されて 、る。  [0047] The auxiliary alignment mark 22a of the flexible substrate 10 has a translucent circular shape, and its peripheral portion is formed of a non-translucent member. The auxiliary alignment mark 25a of the first photomask 11 has a non-translucent annular shape. A peripheral portion of the auxiliary alignment mark 25a of the first photomask 11 is formed of a translucent member. The auxiliary alignment mark 26a of the second photomask 12 is a non-translucent circle. The peripheral position of the auxiliary alignment mark 26a of the second photomask 12 is formed of a translucent member.
[0048] また、補助位置合わせマーク 25a, 26aの利用法としては、以下のような方法がある 。即ち、上記実施の形態のように位置合わせマーク 22, 25, 26のみでは、第 2フォト マスク 12とフレキシブル基板 10の位置が大きくずれている場合には、フレキシブル 基板 10によって第 2フォトマスク 12の位置合わせマーク 26が隠れて読み取れない事 態が発生する。  [0048] Further, as a method of using the auxiliary alignment marks 25a and 26a, there are the following methods. That is, if the positions of the second photomask 12 and the flexible substrate 10 are largely displaced by the alignment marks 22, 25, and 26 as in the above embodiment, the flexible substrate 10 causes the second photomask 12 to The alignment mark 26 is hidden and cannot be read.
[0049] し力し、この第 2変形例では、第 2フォトマスク 12の位置合わせマーク 26がフレキシ ブル基板 10によって隠れてその位置を読み取れない場合でも、第 2フォトマスク 12 の補助位置合わせマーク 26aがフレキシブル基板 10によって隠れることがない。  In this second modification, even if the alignment mark 26 of the second photomask 12 is hidden by the flexible substrate 10 and cannot be read, the auxiliary alignment mark of the second photomask 12 can be read. 26a is not hidden by the flexible substrate 10.
[0050] そこで、フレキシブル基板 10と第 1フォトマスク 11と第 2フォトマスク 12間の粗い位置 合わせを 3つの補助位置合わせマーク 22a, 25a, 26aを使用して行うようにすれば、 その後に確実に CCDカメラで 3つの位置合わせマーク 22, 25, 26を読み取りできる ことになる。従って、フレキシブル基板 10と第 1フォトマスク 11と第 2フォトマスク 12間 の位置合わせをより確実に、且つ、スムーズに行うことができる。  [0050] Therefore, if the rough alignment between the flexible substrate 10, the first photomask 11, and the second photomask 12 is performed using the three auxiliary alignment marks 22a, 25a, and 26a, then it is ensured. In addition, the CCD camera can read the three alignment marks 22, 25, and 26. Therefore, alignment between the flexible substrate 10, the first photomask 11 and the second photomask 12 can be performed more reliably and smoothly.
[0051] (その他の実施の形態) 上述した実施の形態の開示の一部をなす論述および図面はこの発明を限定するも のであると理解すべきではない。この開示から当業者には様々な代替実施の形態、 実施例および運用技術が明らかとなろう。 [0051] (Other Embodiments) It should not be understood that the description and the drawings, which form part of the disclosure of the above-described embodiments, limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.
[0052] 例えば、上記実施の形態及びその各変形例では、 3つの位置合わせマーク 22, 2 5, 26は、円形と円環状であるが、これに限定されるものではなぐ三角形と三角枠状 、方形状と方形枠状、多角形と多角枠形としてもよぐ要は 3つの位置合わせマーク 1S ひとつの CCDカメラで読み取れる形状であればょ 、。  [0052] For example, in the above-described embodiment and its modifications, the three alignment marks 22, 25, 26 are circular and annular, but are not limited to this. Three alignment marks 1S If the shape can be read by one CCD camera, it can be used as a square and a rectangular frame, or as a polygon and a polygonal frame.
[0053] また、上記実施の形態及びその各変形例では、帯状素材はフレキシブル基板 10 であるが、複数のリジット基板が帯状に連結されたものであっても良い。帯状素材に 限らず、リジット基板であっても良い。  [0053] In the above-described embodiment and its modifications, the band-shaped material is the flexible substrate 10, but a plurality of rigid substrates may be connected in a band shape. Not only a strip-shaped material but also a rigid substrate may be used.
[0054] さらに、上記実施の形態及びその各変形例では、フレキシブル基板 10の各露光予 定範囲 21、第 1フォトマスク 11の第 1パターン部 l la、及び、第 2フォトマスク 12の第 2パターン部 12aに対して、 4箇所に位置合わせマーク 22, 25, 26をそれぞれ設け たが、最少で 2箇所に設ければ良い。 2箇所にのみ設けた場合には、従来例に較べ て位置合わせマーク 22, 25, 26の読み取り箇所が少なくなるため、露光作業の短時 間ィ匕、製造のコストダウンィ匕になる。但し、この実施の形態のように 2箇所より多く設け た場合には、高精度で、且つ、信頼性の高い位置合わせが可能である。  [0054] Further, in the above-described embodiment and each modification thereof, each exposure scheduled range 21 of the flexible substrate 10, the first pattern portion l la of the first photomask 11, and the second of the second photomask 12 are used. Alignment marks 22, 25, and 26 are provided at four locations on the pattern portion 12a, respectively, but at least two locations may be provided. If only two positions are provided, the number of reading positions of the alignment marks 22, 25, and 26 is reduced compared to the conventional example, so that the exposure time is shortened and the manufacturing cost is reduced. However, when more than two locations are provided as in this embodiment, alignment with high accuracy and high reliability is possible.
[0055] また、上記実施の形態では、フレキシブル基板 10を垂直方向に搬送する領域 (垂 直搬送区間)の両側に第 1フォトマスク 11と第 2フォトマスク 12とを対向配置したが、 フレキシブル基板 10を水平方向に搬送する領域の上下にフォトマスクを対向配置さ せる構成としても勿論よい。  [0055] In the above embodiment, the first photomask 11 and the second photomask 12 are disposed opposite to each other on both sides of a region (vertical transport section) in which the flexible substrate 10 is transported in the vertical direction. Of course, a photomask may be disposed opposite to the upper and lower sides of the area in which 10 is conveyed in the horizontal direction.
産業上の利用の可能性  Industrial applicability
[0056] 本発明は、フレキシブル基板にフォトマスクを用いて電気回路等の配線パターンを 、露光工程、現像工程、エッチング工程等を含む回路形成技術の他、長尺の基板に 露光を施す各種の産業分野で利用することができる。 [0056] The present invention is not limited to a circuit forming technique including an exposure process, a development process, an etching process, and the like, in addition to circuit patterns including an exposure process, a development process, an etching process, and the like using a photomask on a flexible substrate. Can be used in industrial fields.

Claims

請求の範囲 The scope of the claims
[1] 両面に感光性材料が形成された帯状基材を、その長手方向に沿って間欠的に送り 、露光処理位置には、前記帯状基材の両面にそれぞれ対向するように、第 1フォトマ スク及び第 2フォトマスクを配置し、前記帯状基材の両面に対して前記第 1フォトマス ク及び前記第 2フォトマスクを通して光を照射することにより、前記帯状基材の両面に 前記第 1フォトマスク及び前記第 2フォトマスクにそれぞれ描かれたパターンを転写す る露光方法であって、  [1] A strip-shaped substrate having a photosensitive material formed on both sides thereof is intermittently fed along the longitudinal direction thereof, and the first photomer is disposed at the exposure processing position so as to face both sides of the strip-shaped substrate. A first photomask and a second photomask, and irradiating light on both sides of the belt-like substrate through the first photomask and the second photomask, whereby the first photomask is applied to both sides of the belt-like substrate. An exposure method for transferring a pattern drawn respectively on a mask and the second photomask,
前記帯状基材と前記第 1フォトマスク及び前記第 2フォトマスクには、前記帯状基材 と記第 1フォトマスク及び前記第 2フォトマスクを互いに位置合わせするために、対向 する位置に複数の位置合わせマークがそれぞれ設けられ、  The band-shaped substrate, the first photomask, and the second photomask include a plurality of positions at opposite positions to align the band-shaped substrate, the first photomask, and the second photomask with each other. Each alignment mark is provided,
対向した位置の前記帯状基材に設けられた位置合わせマークと、前記第 1フォトマ スク及び前記第 2フォトマスクのそれぞれに設けられた位置合わせマークと、の 3つの 位置合わせマークを同時にひとつの CCDカメラで読み取り、その結果得られたデー タに基づいて、前記第 1フォトマスクと前記第 2フォトマスクのうち少なくとも一方を X, Υ, Θ方向に移動させて前記帯状基材と前記第 1フォトマスク及び前記第 2フォトマス クをそれぞ; 立置合わせすることを特徴とする露光方法。  Three CCD alignment marks, that is, the alignment mark provided on the belt-like substrate at the opposite positions and the alignment mark provided on each of the first photomask and the second photomask, are simultaneously combined into one CCD. Based on the data obtained by reading with a camera, at least one of the first photomask and the second photomask is moved in the X, Υ, and Θ directions to move the band-shaped substrate and the first photomask. An exposure method comprising: aligning a mask and the second photomask;
[2] 請求項 1記載の露光方法であって、 [2] The exposure method according to claim 1,
前記帯状基材の位置合わせマークは、透光性の円形であり、前記第 1フォトマスク と前記第 2フォトマスクの各位置合わせマークの一方は、非透光性の円環状であり、 他方はこの円環状の内周円より小径の非透光性の円形であることを特徴とする露光 方法。  The alignment mark of the band-shaped substrate is a translucent circle, one of the alignment marks of the first photomask and the second photomask is a non-translucent annular shape, and the other is An exposure method characterized by being a non-transparent circle having a smaller diameter than the annular inner circumference.
[3] 請求項 2記載の露光方法であって、  [3] The exposure method according to claim 2,
前記帯状基材と前記第 1フォトマスクと前記第 2フォトマスクの各位置合わせマーク の大きさは、前記帯状基材の位置合わせマークの外径が最も大きぐ前記第 1又は 第 2フォトマスクの円環状の位置合わせマークが次に大きぐ前記第 1又は第 2フォト マスクの円形の位置合わせマークが最も小さく設定されたことを特徴とする露光方法  The size of each alignment mark of the band-shaped substrate, the first photomask, and the second photomask is that of the first or second photomask in which the outer diameter of the alignment mark of the band-shaped substrate is the largest. An exposure method characterized in that the circular alignment mark of the first or second photomask having the next largest annular alignment mark is set to be the smallest.
[4] 請求項 2記載の露光方法であって、 前記帯状基材と前記第 1フォトマスクと前記第 2フォトマスクの各位置合わせマーク の大きさは、前記第 1又は第 2フォトマスクの円環状の位置合わせマークが最も大きく 、前記帯状基材の位置合わせマークが次に大きぐ前記第 1又は第 2フォトマスクの 円形の位置合わせマークが最も小さく設定されたことを特徴とする露光方法。 [4] The exposure method according to claim 2, The size of each alignment mark of the belt-shaped substrate, the first photomask, and the second photomask is the largest in the annular alignment mark of the first or second photomask. An exposure method, wherein the circular alignment mark of the first or second photomask having the next largest alignment mark is set to be the smallest.
[5] 長手方向に沿って連続的に露光予定範囲が設定され、各露光予定範囲毎に位置 合わせマークが複数位置に設けられた帯状基材と、 [5] A strip-shaped base material in which a planned exposure range is set continuously along the longitudinal direction, and alignment marks are provided at a plurality of positions for each planned exposure range;
前記帯状基材を長手方向に搬送する基材搬送手段と、  Base material transport means for transporting the belt-shaped base material in the longitudinal direction;
前記帯状基材の搬送経路の前記帯状基材を挟む位置にそれぞれ配置され、それ ぞれ複数位置に位置合わせマークが設けられた第 1及び第 2フォトマスクと、  A first photomask and a second photomask which are respectively arranged at positions sandwiching the belt-like substrate in the conveyance path of the belt-like substrate, and are provided with alignment marks at a plurality of positions, respectively.
CCDカメラとを備免、  With a CCD camera,
前記第 1及び第 2フォトマスクの複数位置の各位置合わせマークは、前記帯状基材 の同じ位置合わせマークに対応する位置にそれぞれ配置され、  The alignment marks at a plurality of positions of the first and second photomasks are respectively arranged at positions corresponding to the same alignment marks of the strip-shaped substrate,
前記 CCDカメラは、前記帯状基材と前記第 1フォトマスクと前記第 2フォトマスクの 対応位置にある 3つの位置合わせマーク同時に読み取り可能であり、  The CCD camera can simultaneously read three alignment marks at corresponding positions of the belt-shaped substrate, the first photomask, and the second photomask,
その結果得られたデータに基づいて、前記第 1フォトマスクと前記第 2フォトマスクの うち少なくとも一方を X, Y, 0方向に移動させて前記帯状基材と前記第 1フォトマスク 及び前記第 2フォトマスクをそれぞれ位置合わせする位置調整手段を備え、 前記帯状基材の両面に対して前記第 1及び第 2フォトマスクを通して光を照射する ことにより、前記帯状基材の両面に前記第 1及び第 2フォトマスクにそれぞれ描かれ たパターンを転写することを特徴とする露光装置。  Based on the data obtained as a result, at least one of the first photomask and the second photomask is moved in the X, Y, and 0 directions to move the band-shaped substrate, the first photomask, and the second photomask. Position adjusting means for aligning the photomasks respectively, and by irradiating light on both surfaces of the belt-shaped substrate through the first and second photomasks, the first and second surfaces on both surfaces of the belt-shaped substrate. 2. An exposure apparatus that transfers each pattern drawn on a photomask.
[6] 請求項 5記載の露光装置であって、 [6] The exposure apparatus according to claim 5,
前記基材搬送経路は、前記帯状基材を垂直方向に沿って搬送する垂直搬送区間 を有し、この垂直搬送区間で前記第 1及び第 2フォトマスクを対向配置させたことを特 徴とする露光装置。  The base material transport path has a vertical transport section for transporting the belt-shaped base material along a vertical direction, and the first and second photomasks are arranged to face each other in the vertical transport section. Exposure device.
PCT/JP2006/321259 2005-10-25 2006-10-25 Exposure method and exposure apparatus WO2007049640A1 (en)

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