CN108401373B - Circuit board and exposure fool-proofing method thereof - Google Patents
Circuit board and exposure fool-proofing method thereof Download PDFInfo
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- CN108401373B CN108401373B CN201810146281.XA CN201810146281A CN108401373B CN 108401373 B CN108401373 B CN 108401373B CN 201810146281 A CN201810146281 A CN 201810146281A CN 108401373 B CN108401373 B CN 108401373B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Abstract
The invention relates to a circuit board and an exposure fool-proofing method thereof, comprising the following steps: acquiring first position information and second position information on a substrate according to a preset requirement; selecting a third sub-hole from a third hole group of the substrate, acquiring third position information, and generating first positioning information by the first position information, the second position information and the third position information; matching the first positioning information with corresponding preset first information, if so, entering the next step, otherwise, sending an error prompt by the system; and acquiring first exposure information and carrying out exposure according to the first exposure information. The third sub-holes are selected in the third hole group according to different exposure requirements, different first positioning groups and first positioning information are formed, the first positioning information can be obtained for exposure after being successfully matched with the preset first information, compared with a traditional exposure mode, the probability of error of the exposure information is reduced, the exposure fool-proofing effect is achieved, the exposure success rate is improved, and the production cost is reduced.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a circuit board and an exposure fool-proofing method thereof.
Background
The exposure process is one of the basic processes commonly used in circuit board processing. The package substrate needs to be aligned when being exposed by using an ldi (laser direct imaging), and an alignment target on the package substrate is captured by a CCD (Charge-coupled Device) lens of an exposure machine during alignment, so as to achieve positioning and complete exposure.
The conventional alignment targets are usually disposed at four corners of the package substrate to form an alignment surface. However, in actual production, different types of exposed products and exposure requirements are involved, such as different exposure surfaces of different products and different exposure patterns, so that exposure errors are easily generated and the products are scrapped, thereby increasing the production cost of enterprises.
Disclosure of Invention
Therefore, it is necessary to provide a circuit board and an exposure fool-proofing method thereof for solving the problem that exposure errors are easy to occur during circuit board processing.
The technical scheme is as follows:
an exposure fool-proofing method comprises the following steps:
(1) acquiring the position of a first sub-hole on the substrate according to a first preset requirement and generating first position information, and acquiring the position of a second sub-hole on the substrate according to a second preset requirement and generating second position information;
(2) selecting a third sub-hole from a third hole group of the substrate according to a third preset requirement, and acquiring the position of the third sub-hole to generate third position information, wherein the first sub-hole, the second sub-hole and the third sub-hole form a first positioning group, and the first position information, the second position information and the third position information generate first positioning information;
(3) matching the first positioning information with corresponding preset first information, if the first positioning information is matched with the preset first information, executing the step (4), otherwise, sending an error reporting prompt by the system;
(4) and acquiring first exposure information corresponding to the preset first information, and exposing on the substrate according to the first exposure information.
According to the exposure fool-proofing method, the third sub-holes can be selected from the third hole group according to different exposure requirements, different first positioning groups and different first positioning information can be formed, the first exposure information corresponding to the preset first information can be obtained for exposure after the different first positioning information is successfully matched with the corresponding preset first information, compared with a traditional exposure mode, the probability of error of the exposure information is reduced, the exposure fool-proofing effect is achieved, the exposure success rate is improved, and the production cost is reduced.
The technical solution is further explained below:
in one embodiment, step (1) further includes:
acquiring plate surface information and exposure direction information of a substrate;
in step (3), before the first positioning information is matched with the preset first information, the method further includes:
acquiring preset information corresponding to the plate surface information and the exposure direction information, wherein the preset information comprises a plurality of preset sub information, and the preset sub information comprises preset first information;
and acquiring preset sub-information corresponding to the first positioning information from the preset information and generating preset first information.
The exposure information comprises plate surface information and exposure direction information, the plate surface information and the exposure direction information correspond to preset information, after the preset information is determined, the preset sub information is selected based on the selected first positioning information, and the preset first information is formed.
In one embodiment, before step (1), the method further comprises:
processing a first sub-hole and a second sub-hole at a first preset position of a substrate;
and processing a plurality of third unit holes at a second preset position of the substrate, wherein the third unit holes are arranged at a third preset interval and form a third hole group, and the third unit holes comprise third sub-holes.
The first sub-hole, the second sub-hole and the third unit holes are processed in advance, so that the corresponding first positioning group can be selected conveniently, and the production efficiency is improved.
In one embodiment, in step (2), selecting the third sub-aperture further includes: and selecting a third unit hole from the third hole group according to a preset third selection rule and forming a third sub-hole. The selection can be performed according to a preset third selection rule, the selection rule can be specified according to experience, and the selection rule can also be specified according to the requirements of customers, so that the processing control capability is improved.
In one embodiment, the third predetermined pitch is greater than 50 μm. The third preset interval is the setting interval between the third unit holes and cannot be too small, so that the machining and positioning accuracy is prevented from being influenced.
In one embodiment, in step (1), the position of the first sub-aperture and the position of the second sub-aperture are both obtained through an electronic lens, and first position information and second position information are respectively generated. The electronic lens of the exposure machine is used for obtaining, the obtaining operation is simple and convenient, the full-automatic operation requirement is met, and the control and the management are convenient.
In one embodiment, in step (3), the system error reporting process further includes: the system sends out prompt information of alignment failure and controls to send out alarm sound or control the alarm lamp to flash. The system error reporting can be in a variety of ways, two of which are provided herein to facilitate alerting personnel to follow-up processing.
In one embodiment, the predetermined position of the substrate is provided with a plurality of first unit holes, the first unit holes are arranged at a first predetermined interval and form a first hole group, the first unit holes include first sub-holes, and in step (1), before obtaining the position of the first sub-holes, the method further includes: selecting a first unit hole from the first hole group according to a preset first selection rule and forming a first sub-hole;
or the preset position of the substrate is provided with a plurality of second unit holes, the second unit holes are arranged at a second preset interval and form a second hole group, the second unit holes comprise second sub-holes, and in the step (1), before the position of the second sub-holes is obtained, the method further comprises: and selecting a second unit hole from the second hole group according to a preset second selection rule and forming a second sub-hole.
According to the processing requirement, the first hole group or/and the second hole group can be established to obtain more positioning group selections and meet more diversified exposure processing requirements.
In one embodiment, in step (4), acquiring preset first exposure information corresponding to the preset first information includes the following steps:
acquiring preset exposure information, wherein the preset exposure information comprises a plurality of preset sub-exposure information, and the preset sub-exposure information comprises preset first exposure information;
and acquiring preset sub-exposure information corresponding to the preset first information from the preset exposure information and forming preset first exposure information.
The preset exposure sub-information corresponds to the preset first information, so that the exposure information cannot be mistaken, the exposure fool-proofing capability is improved, and the yield of the exposure process is improved.
The circuit board is processed by adopting the exposure fool-proofing method according to any one of the technical schemes.
The exposure fool-proofing method is adopted, so that the yield of the exposure process is improved, the yield of the whole circuit board is improved, and the production cost is reduced.
Drawings
FIG. 1 is a flow chart of an exposure fool-proofing method;
FIG. 2 is a schematic view of the positioning of a substrate during exposure;
FIG. 3 is a partial schematic view of portion A of FIG. 2;
FIG. 4 shows a positioning set for substrate exposure.
100. A first unit hole, 200, a second unit hole, 300, a third unit hole, 400, a fourth unit hole, 500, and a substrate.
Detailed Description
Embodiments of the present invention are described in detail below with reference to the accompanying drawings:
it will be understood that when an element is referred to herein as being "secured" to another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the embodiment shown in fig. 1, an exposure fool-proofing method includes the following steps:
(1) acquiring the position of a first sub-hole on the substrate 500 according to a first preset requirement and generating first position information, and acquiring the position of a second sub-hole on the substrate 500 according to a second preset requirement and generating second position information;
(2) selecting a third sub-hole from a third hole group of the substrate 500 according to a third preset requirement, and acquiring the position of the third sub-hole to generate third position information, wherein the first sub-hole, the second sub-hole and the third sub-hole form a first positioning group, and the first position information, the second position information and the third position information generate first positioning information;
(3) matching the first positioning information with corresponding preset first information, if the first positioning information is matched with the preset first information, executing the step (4), otherwise, sending an error reporting prompt by the system;
(4) first exposure information corresponding to the preset first information is acquired, and exposure is performed on the substrate 500 according to the first exposure information.
The third sub-holes can be selected in the third hole group according to different exposure requirements, different first positioning groups and different first positioning information are formed, the first exposure information corresponding to the preset first information can be acquired for exposure after the different first positioning information is successfully matched with the corresponding preset first information, and compared with a traditional exposure mode, the exposure information error probability is reduced, the exposure fool-proofing effect is achieved, the exposure success rate is improved, and the production cost is reduced.
During traditional exposure, four positioning holes at four angular positions of the substrate 500 are usually adopted as positioning groups and form positioning information, the positioning information is matched with preset positioning information of an exposure machine, if the matching is successful, exposure information of exposure files is called for exposure, so that exposure errors easily occur, the same positioning group is adopted according to different exposure requirements of different substrates 500, the same positioning group cannot accurately correspond to a plurality of different exposure files, therefore, if different exposure requirements of different substrates 500 exist, the exposure files are easily mistakenly used, wrong exposure information is obtained, exposure failure is caused, scrapping of circuit boards is caused, production cost is increased, and the method is extremely unfavorable for enterprises.
This application adopts first sub-hole, second sub-hole and third sub-hole, first sub-hole, second sub-hole and third sub-hole location a plane, and form first locating bit group, and the third sub-hole is selected according to predetermineeing the requirement in the third punch combination, can select different third sub-holes and then form different first locating bit group in third punch combination when the exposure demand is different, different first locating bit group confirms different first locating information, first locating information corresponds different first information of predetermineeing, it corresponds specific first exposure information of predetermineeing to different first information of predetermineeing, thereby realize that the exposure demand corresponds with the first exposure information of predetermineeing in the exposure file that finally obtains is accurate, compare traditional exposure mode, the condition of exposure error is difficult to appear, the success rate of exposure technology has greatly improved, thereby play the effect that the exposure prevents slow-witted, reduction in production cost.
It should be noted that: the preset first exposure information includes information such as an exposure pattern.
In addition, the first preset requirement, the second preset requirement and the third preset requirement are all sub-requirements of the preset requirement.
Further, in step (1), the method further comprises: acquiring the position of the fourth sub-hole on the substrate 500 according to a preset requirement and generating fourth position information;
at this time, in step (2), the first sub-hole, the second sub-hole, the third sub-hole, and the fourth sub-hole form a first positioning group, and the first position information, the second position information, the third position information, and the fourth position information form first positioning information.
The first sub-hole, the second sub-hole, the third sub-hole, and the fourth sub-hole are respectively located at different positions of the substrate 500 to function to locate a plane.
Further, in step (1), the method further comprises:
acquiring plate surface information and exposure direction information of the substrate 500;
in step (3), before the first positioning information is matched with the preset first information, the method further includes:
acquiring preset information corresponding to the plate surface information and the exposure direction information, wherein the preset information comprises a plurality of preset sub information, and the preset sub information comprises preset first information;
and acquiring preset sub-information corresponding to the first positioning information from the preset information and generating preset first information.
The exposure information comprises plate surface information and exposure direction information, the plate surface information and the exposure direction information correspond to preset information, after the preset information is determined, the preset sub information is selected based on the selected first positioning information, and the preset first information is formed.
It should be noted that different exposure information corresponds to different preset information, and the preset information includes preset sub information respectively corresponding to different positioning groups. Therefore, after the exposure information is determined, the preset information is determined, and the corresponding preset sub-information is selected from the exposure information according to the selected first positioning group, wherein the selected preset sub-information is the preset first information
The two plate surfaces of the substrate 500 may have different exposure information or the same exposure information. If the first plate surface and the second plate surface of the substrate 500 have the same exposure pattern, only the exposure direction is opposite.
Further, before step (1), the method further comprises:
processing a first sub-hole and a second sub-hole at a first preset position of the substrate 500;
a plurality of third unit holes 300 are processed at a second predetermined position of the substrate 500, the third unit holes 300 are arranged at a third predetermined interval and form a third hole group, and the third unit holes 300 include third sub-holes.
The first sub-hole, the second sub-hole and the plurality of third unit holes 300 are processed in advance, so that the corresponding first positioning group can be selected subsequently, and the production efficiency is improved.
Further, in the step (2), the selecting of the third sub-hole further includes: and selecting a third unit hole 300 from the third hole group according to a preset third selection rule, and forming a third sub-hole. The selection can be performed according to a preset third selection rule, the selection rule can be specified according to experience, and the selection rule can also be specified according to the requirements of customers, so that the processing control capability is improved.
Furthermore, the third sub-holes may be selected according to specific requirements, for example, only one third unit hole 300 may be selected to form the third sub-hole, and of course, if the positioning accuracy is further improved, at least one third unit hole 300 may be selected to form the first positioning group with the other first sub-holes and the other second sub-holes, and at this time, the third sub-hole includes at least one third unit hole 300. If four third cell holes 300 are selected, the four third cell holes 300 form a first positioning group together with the first sub-hole and the second sub-hole, and the third sub-hole is a hole understood in a broad sense and means that four third cell holes are included.
Similarly, a fourth unit hole 400 is selected from the fourth group of holes according to a fourth predetermined selection rule, and a fourth sub-hole in the embodiment is formed.
Further, the preset third selection rule may be a random selection rule, or may be selected in sequence based on the position of the third unit hole 300, or may be selected according to a designated selection rule such as interval selection of the third unit hole 300, or may be selected according to a selection rule given by a client to establish different positioning groups.
Further, the third predetermined pitch is greater than 50 μm. The third preset distance is a set distance between the third unit holes 300, and cannot be too small, so as to avoid affecting the processing and positioning accuracy.
Further, in the step (1), the position of the first sub-hole and the position of the second sub-hole are both acquired through an electronic lens, and first position information and second position information are respectively generated. The electronic lens of the exposure machine is used for obtaining, the obtaining operation is simple and convenient, the full-automatic operation requirement is met, and the control and the management are convenient.
Further, the electronic lens is a CCD lens of the exposure machine, and the CCD lens captures the position of the first sub-hole, the position of the second sub-hole, and the position of the third sub-hole on the substrate 500 and forms first position information, second position information, and third position information, respectively.
It should be noted that the first sub-aperture, the second sub-aperture and the third sub-aperture may be replaced by any form of target recognizable by the CCD lens.
Further, in step (3), the process of system error reporting further includes: the system sends out prompt information of alignment failure and controls to send out alarm sound or control the alarm lamp to flash. The system error reporting can be in a variety of ways, two of which are provided herein to facilitate alerting personnel to follow-up processing.
Further, a plurality of first unit holes 100 are disposed at a predetermined position of the substrate 500, the first unit holes 100 are disposed at a first predetermined interval and form a first hole group, the first unit holes 100 include first sub-holes, and in step (1), before acquiring a position of the first sub-hole, the method further includes: selecting a first unit hole 100 from the first hole group according to a preset first selection rule and forming a first sub-hole;
or a plurality of second unit holes 200 are arranged at preset positions of the substrate 500, the second unit holes 200 are arranged at a second preset interval and form a second hole group, the second unit holes 200 include second sub-holes, and in the step (1), before acquiring positions of the second sub-holes, the method further includes: and selecting a second unit hole 200 in the second hole group according to a preset second selection rule and forming a second sub-hole.
Furthermore, the preset first selection rule, the preset second selection rule and the preset third selection rule are given in advance in a script mode, and the preset first selection rule, the preset second selection rule and the preset third selection rule can be the same or different.
According to the processing requirement, the first hole group or/and the second hole group can be established to obtain more positioning group selections and meet more diversified exposure processing requirements.
Further, in the step (4), acquiring preset first exposure information corresponding to the preset first information includes the following steps:
acquiring preset exposure information, wherein the preset exposure information comprises a plurality of preset sub-exposure information, and the preset sub-exposure information comprises preset first exposure information;
and acquiring preset sub-exposure information corresponding to the preset first information from the preset exposure information and forming preset first exposure information.
The preset exposure sub-information corresponds to the preset first information, so that the exposure information is further prevented from making mistakes, the exposure fool-proofing capability is improved, and the yield of the exposure process is improved.
As shown in fig. 2 to 4, in fig. 2, a first sub-hole, a second sub-hole and a fourth sub-hole are formed on a substrate 500, the first sub-hole, the second sub-hole and the fourth sub-hole are all fixed positioning holes, twenty-five third unit holes 300 are formed on the substrate 500, and a third hole group is formed; in fig. 3, twenty-five third unit holes 300 are arranged at intervals of 0.15 mm; in fig. 4, one of the third unit holes 300 in the third hole group is selected and forms a third sub-hole, and the third sub-hole forms the first positioning group together with the remaining first, second and fourth sub-holes. The exposure alignment method provided in this embodiment can select one of the twenty-five groups, so the probability of the plate surface exposure error of each substrate 500 is reduced to 1/25, and since the substrate 500 includes two plate surfaces, the probability of the two plate surfaces error is reduced to (1/25) × (1/25) ═ 0.16%, compared with the conventional exposure method, the probability of the exposure error is greatly reduced, thereby reducing the production cost.
In fig. 2 to 4, it can be concluded that the third hole group is formed of 25 holes expanded by the periphery of the third unit hole 300 in the conventional exposure alignment point. Processing a third unit hole 300 at a third preset interval respectively right above, right below, right left, right above, left below, right above and right below the traditional third unit hole, so as to form 9 third unit holes together with the traditional third unit hole 300, then, continuously extending outwards for a circle according to preset requirements to obtain another 16 third unit holes 300, finally forming 25 third unit holes 300, and so on.
The positions of the upper part, the lower part, the left part, the right part, the upper left part, the lower left part, the upper right part and the lower right part are arranged, so that the third position information can be acquired more conveniently and quickly, the subsequent data calculation is facilitated, the coordinate data can be conveniently carried out according to the regular positions, and the calculation efficiency of the background is improved.
The first position information, the second position information and the like can be set and obtained on the basis of the same principle, so that the computing efficiency of the background is further improved.
Of course, if necessary, 9 third unit holes 300 may be provided to form the third hole group, and if only 9 third unit holes 300 are provided, the probability of two plate surface errors is reduced to (1/9) × (1/9) ═ 1.23%.
In addition, before the step (1), at least the information of the preset requirement, the preset first information and the preset first exposure information are input at the terminal which is in communication connection with the exposure machine. According to the needs, preset exposure information, preset information and the like can be input, and the skilled person can input specific preset information, requirements and the like according to actual needs.
The circuit board is processed by adopting the exposure fool-proofing method in any embodiment.
By adopting the exposure fool-proofing method, the yield of the exposure process is improved, the yield of the whole circuit board is improved, and the production cost is reduced.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. An exposure fool-proofing method is characterized by comprising the following steps:
(1) acquiring the position of a first sub-hole on a substrate according to a first preset requirement and generating first position information, and acquiring the position of a second sub-hole on the substrate according to a second preset requirement and generating second position information;
(2) selecting a third sub-hole from a third hole group of the substrate according to a third preset requirement, and acquiring the position of the third sub-hole to generate third position information, wherein the first sub-hole, the second sub-hole and the third sub-hole form a first positioning group, and the first position information, the second position information and the third position information generate first positioning information;
(3) matching the first positioning information with corresponding preset first information, if the first positioning information is matched with the preset first information, executing the step (4), otherwise, sending an error reporting prompt by the system;
(4) acquiring preset first exposure information corresponding to the preset first information, and exposing on the substrate according to the preset first exposure information;
in the step (1), the method further comprises:
acquiring plate surface information and exposure direction information of the substrate;
in the step (3), before the matching of the first positioning information and the preset first information, the method further includes:
acquiring preset information corresponding to the board surface information and the exposure direction information, wherein the preset information comprises a plurality of preset sub-information, and the preset sub-information comprises the preset first information;
and acquiring preset sub-information corresponding to the first positioning information from the preset information and generating the preset first information.
2. The exposure fool-proofing method according to claim 1, wherein the preset first exposure information includes exposure pattern information.
3. The exposure fool-proofing method according to claim 1, further comprising, before the step (1):
machining the first sub-hole and the second sub-hole at a first preset position of the substrate;
and processing a plurality of third unit holes at a second preset position of the substrate, wherein the third unit holes are arranged at a third preset interval and form a third hole group, and the third unit holes comprise third sub-holes.
4. The exposure fool-proofing method of claim 3, wherein in the step (2), the selecting of the third sub-hole further comprises: and selecting the third unit hole from the third hole group according to a preset third selection rule and forming a third sub-hole.
5. The exposure fool-proofing method according to claim 3, wherein the third predetermined pitch is larger than 50 μm.
6. The exposure fool-proofing method according to claim 1, wherein in the step (1), the position of the first sub-hole and the position of the second sub-hole are both obtained through an electronic lens and the first position information and the second position information are respectively generated.
7. The exposure fool-proofing method of claim 1, wherein in the step (3), the process of system error reporting further comprises: the system sends out prompt information of alignment failure and controls to send out alarm sound or control the alarm lamp to flash.
8. The exposure fool-proofing method according to claim 1, wherein a plurality of first unit holes are provided at predetermined positions of the substrate, the first unit holes are provided at a first predetermined pitch and form a first hole group, the first unit holes include the first sub-holes, and in the step (1), before acquiring the positions of the first sub-holes, the method further includes: selecting the first unit hole from the first hole group according to a preset first selection rule and forming a first sub-hole;
or a plurality of second unit holes are arranged at preset positions of the substrate, the second unit holes are arranged at a second preset interval and form a second hole group, the second unit holes comprise second sub-holes, and in the step (1), before the positions of the second sub-holes are obtained, the method further comprises: and selecting the second unit hole from the second hole group according to a preset second selection rule and forming the second sub-hole.
9. The exposure fool-proofing method according to any one of claims 1 to 8, wherein in the step (4), the obtaining of the preset first exposure information corresponding to the preset first information comprises the steps of:
acquiring preset exposure information, wherein the preset exposure information comprises a plurality of preset sub-exposure information, and the preset sub-exposure information comprises the preset first exposure information;
and acquiring the preset sub-exposure information corresponding to the preset first information from the preset exposure information, and forming the preset first exposure information.
10. A circuit board characterized in that the circuit board is subjected to exposure fool-proofing by the exposure fool-proofing method of any one of the preceding claims.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810146281.XA CN108401373B (en) | 2018-02-12 | 2018-02-12 | Circuit board and exposure fool-proofing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810146281.XA CN108401373B (en) | 2018-02-12 | 2018-02-12 | Circuit board and exposure fool-proofing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108401373A CN108401373A (en) | 2018-08-14 |
| CN108401373B true CN108401373B (en) | 2020-03-06 |
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| CN201810146281.XA Active CN108401373B (en) | 2018-02-12 | 2018-02-12 | Circuit board and exposure fool-proofing method thereof |
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| JP5117672B2 (en) * | 2005-10-25 | 2013-01-16 | サンエー技研株式会社 | Exposure method and exposure apparatus |
| CN103179812A (en) * | 2013-04-18 | 2013-06-26 | 梅州市志浩电子科技有限公司 | Manufacturing method of high-order multistage HDI (High Density Interconnection) printed circuit board |
| CN104023486A (en) * | 2014-06-11 | 2014-09-03 | 深圳华麟电路技术有限公司 | Soft and hard multiple-layer circuit board and method for forming electrical testing locating hole thereof |
| CN106054543A (en) * | 2016-08-17 | 2016-10-26 | 京东方科技集团股份有限公司 | Alignment method and alignment system |
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| CN2475052Y (en) * | 2001-04-03 | 2002-01-30 | 川宝科技股份有限公司 | Circuit board counterpoint device of exposure machine |
| KR101636461B1 (en) * | 2009-03-20 | 2016-07-05 | 삼성전자주식회사 | A hole construction for inputing and outputing sound of acoustic appliance in portable terminal |
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| JP5117672B2 (en) * | 2005-10-25 | 2013-01-16 | サンエー技研株式会社 | Exposure method and exposure apparatus |
| CN103179812A (en) * | 2013-04-18 | 2013-06-26 | 梅州市志浩电子科技有限公司 | Manufacturing method of high-order multistage HDI (High Density Interconnection) printed circuit board |
| CN104023486A (en) * | 2014-06-11 | 2014-09-03 | 深圳华麟电路技术有限公司 | Soft and hard multiple-layer circuit board and method for forming electrical testing locating hole thereof |
| CN106054543A (en) * | 2016-08-17 | 2016-10-26 | 京东方科技集团股份有限公司 | Alignment method and alignment system |
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