CN114340195B - Processing method of rigid-flexible printed circuit board and printed circuit board - Google Patents
Processing method of rigid-flexible printed circuit board and printed circuit board Download PDFInfo
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- CN114340195B CN114340195B CN202111680447.4A CN202111680447A CN114340195B CN 114340195 B CN114340195 B CN 114340195B CN 202111680447 A CN202111680447 A CN 202111680447A CN 114340195 B CN114340195 B CN 114340195B
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Abstract
The invention discloses a processing method of a rigid-flexible printed circuit board, which comprises the following processing steps: the first step, making the first solder mask exposure data of the rigid layer; a second step of exposing the rigid layer using the first solder resist exposure data; a third step of manufacturing second solder mask exposure data of the flexible layer; and a fourth step of exposing the flexible layer using the second solder resist exposure data. First solder mask exposure data of the rigid layer is prepared, then the rigid layer is exposed by using the first solder mask exposure data, then second exposure data of the flexible layer is prepared, and then the flexible layer is exposed by using the second exposure data. The rigid layer and the flexible layer are exposed to light respectively, and then the exposure is performed by using the respective data. The solder mask deviation caused by inconsistent offset expansion and contraction after the flexible board and the rigid board are combined and pressed can be avoided.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a rigid-flexible printed circuit board and a processing method thereof.
Background
The printed circuit board has been invented for decades now, and as a basic component of electronic product equipment, the function of the printed circuit board is difficult to replace in a short period, along with the increase of product difficulty and function, in order to meet the requirements of customers, a rigid-flex printed circuit board is formed by combining a soft board and a hard board, the rigid-flex printed circuit board changes the traditional planar design concept and expands the three-dimensional space concept, and the application range of the rigid-flex printed circuit board mainly comprises: aerospace (such as high-end airplane-mounted weapon navigation systems and military airplanes), advanced medical equipment, digital cameras and the like, so that the rigid-flex printed circuit board product is a necessary trend for the development of the printed circuit board industry.
However, in the production process of the rigid-flex printed circuit board product, the rigid layer and the flexible layer have different heights due to the inconsistent offset and shrinkage after the pressing of the combination of the soft board and the hard board and the difference in height between the rigid layer and the flexible layer, so that the problem of solder resist deviation occurs during solder resist exposure.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a processing method of a rigid-flex printed circuit board, which can eliminate the inconsistent offset and expansion of a rigid layer and a flexible layer after lamination due to the combination of a soft board and a hard board and the height difference of the rigid layer and the flexible layer, thereby avoiding the situation of solder mask deviation during solder mask exposure.
The invention also provides a printed circuit board manufactured by the processing method.
According to the processing method of the rigid-flexible printed circuit board of the embodiment of the first aspect of the invention, the processing method of the rigid-flexible printed circuit board comprises the following processing steps: the first step, making the first solder mask exposure data of the rigid layer; a second step of exposing the rigid layer using the first solder resist exposure data; a third step of manufacturing second solder mask exposure data of the flexible layer; and a fourth step of exposing the flexible layer using the second solder resist exposure data.
The processing method of the rigid-flexible printed circuit board provided by the embodiment of the invention at least has the following beneficial effects: first solder mask exposure data of the rigid layer are firstly prepared, then the rigid layer can be exposed by using the first solder mask exposure data, then second exposure data of the flexible layer are prepared, and then the flexible layer can be exposed by using the second exposure data. The rigid layer and the flexible layer are respectively used as exposure data, and then the respective data are used for exposure, so that the solder mask deviation caused by inconsistent offset, expansion and contraction after the flexible plate and the rigid plate are combined and pressed can be avoided.
According to some embodiments of the invention, the first step is followed by a fifth step of blocking light for the information of the flexible layer.
According to some embodiments of the invention, the third step is followed by a sixth step of blocking light for the information of the rigid layer.
According to some embodiments of the invention, before the second step, a seventh step of selecting a mark-to-solder-resist alignment target on the rigid layer is further included.
According to some embodiments of the present invention, before the fourth step, an eighth step of selecting a mark-to-solder-resist alignment target on the flexible layer is further included.
According to some embodiments of the invention, the first step further comprises a ninth step of preparing a semi-finished product to be solder-resist exposed, printing ink on the rigid-flex printed wiring board, drying the printed wiring board, and waiting for exposure production.
According to some embodiments of the invention, the fourth step is followed by a tenth step of solder resist development of the rigid-flex printed wiring board.
According to some embodiments of the invention, in the fourth step, exposing the flexible layer is performed using a soldermask DI machine.
According to some embodiments of the invention, in the eighth step, the punctuation aligns an alignment target of the solder mask DI machine.
According to the printed wiring board of the embodiment of the second aspect of the present invention, the printed wiring board is manufactured by the above-described method of processing the rigid-flex printed wiring board of the embodiment of the first aspect.
The printed circuit board provided by the embodiment of the invention at least has the following beneficial effects: the processing method solves the problem of resistance welding deviation of the rigid-flexible printed circuit board, and ensures the high precision performance of resistance welding of the rigid-flexible printed circuit board, thereby improving the product quality of the rigid-flexible printed circuit board, further improving the satisfaction degree of customers, and having good industrial application prospect.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic flow chart of a method for processing a rigid-flex printed wiring board according to an embodiment of the present invention;
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explanation and should not be construed as limiting the invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1, according to a method for processing a rigid-flex printed wiring board according to an embodiment of the first aspect of the present invention, the method for processing a rigid-flex printed wiring board includes the following processing steps: the first step, making the first solder mask exposure data of the rigid layer; a second step of exposing the rigid layer using the first solder resist exposure data; a third step of manufacturing second solder mask exposure data of the flexible layer; and a fourth step of exposing the flexible layer using the second solder resist exposure data.
First solder mask exposure data of the rigid layer is prepared, then the rigid layer is exposed by using the first solder mask exposure data, then second exposure data of the flexible layer is prepared, and then the flexible layer is exposed by using the second exposure data. The rigid layer and the flexible layer are exposed to light respectively, and then the exposure is performed by using the respective data. The solder mask deviation caused by inconsistent offset expansion and contraction after the flexible board and the rigid board are combined and pressed can be avoided.
In some embodiments of the present invention, the first step is followed by a fifth step of blocking light from the data of the flexible layer. When the first group of welding exposure of the rigid layer is carried out, in order to prevent the exposure machine from exposing the data of the flexible layer and damage the data of the flexible layer, the light shielding material is suitable for shielding the data of the flexible layer, and the data of the flexible layer can be ensured to meet the production requirement.
Similarly, in some embodiments of the present invention, the third step is followed by a sixth step of blocking light from the data of the rigid layer. In the above embodiment, when the second set of solder exposures of the flexible layer is performed, in order to prevent the exposure machine from exposing the data of the rigid layer and damaging the data of the rigid layer, the light-shielding material is applied to shield the data of the rigid layer from light, so as to ensure that the data of the rigid layer meets the production requirements.
In some embodiments of the present invention, before the second step, a seventh step is further included, where the seventh step is to select a mark-to-solder-resist-alignment target on the rigid layer. It can be thought that when the first solder mask exposure of the rigid layer is performed, in order to ensure that the positioning is accurate and the exposed position is accurate and error-free, the mark point used for positioning on the rigid layer is aligned with the target point of the solder mask alignment, so that the solder mask machine can accurately expose the first exposure data on the rigid layer on the basis of positioning to the mark point through the target point. The accurate counterpoint of mark and target point ensures accurate exposure position, and then has ensured the quality of product.
Similarly, in some embodiments of the present invention, the fourth step further includes an eighth step before the fourth step, where the eighth step is to select a mark-to-solder-resist-alignment target point on the flexible layer. It is conceivable that, when the second solder mask exposure of the flexible layer is performed, in order to ensure that the positioning is accurate and the exposed position is accurate and error-free, the target point on the flexible layer for positioning is aligned with the target point for solder mask alignment, so that the solder mask machine can accurately expose the second exposure data on the flexible layer on the basis of positioning the target point to the target point through the target point. The accurate counterpoint of mark and target point ensures accurate exposure position, and then has ensured the quality of product.
In some embodiments of the invention, the first step further comprises a ninth step of preparing a semi-finished product to be solder-resist exposed, printing ink on the rigid-flex printed circuit board, drying, and waiting for exposure production. Before entering the exposure process, preparing the rigid-flex printed circuit board which is well pressed, brushing printing ink, and then drying to enter the waiting exposure process. The rigid-flex printed circuit board prepared on the production line enters a stage to be exposed, and is closely matched with the exposure process, so that the efficiency of exposure production can be improved.
In some embodiments of the present invention, the fourth step is further followed by a tenth step of solder resist development of the rigid-flex printed wiring board. And after the first solder mask data on the rigid layer and the second solder mask exposure data on the flexible layer are exposed, solder mask development can be carried out, and after the solder mask development, the exposed pad is the required pad position in the first solder mask data and the second solder mask exposure data.
In some embodiments of the invention, in the fourth step, exposing the flexible layer is performed using a solder resist DI machine. In the rigid-flex printed wiring board, since the thicknesses of the rigid layer and the flexible layer are not uniform, there is a difference in height between the rigid layer and the flexible layer. Generally, the height of the flexible layer is lower than that of the rigid layer, so that the problem of solder mask virtual light of the flexible layer caused by height difference can be avoided by using a solder mask DI machine to expose the flexible layer, the exposure quality is improved, and the quality of the rigid-flex printed circuit board is ensured.
In some embodiments of the invention, in the eighth step, the alignment target of the DI machine is point aligned. In the above embodiment, when the solder resist DI machine is used to expose the flexible layer, the target of the solder resist DI machine can be aligned with the positioning mark point on the flexible layer, and the solder resist DI machine can expose the second exposure data on the flexible layer without error on the basis of positioning the target point to the mark point. The accurate counterpoint of mark point and target point ensures accurate exposure position, and then has ensured the quality of product.
According to the printed wiring board of the embodiment of the second aspect of the present invention, the printed wiring board is manufactured by the method for processing a rigid-flex printed wiring board according to any one of the embodiments of the first aspect. The processing method solves the problem of resistance welding deviation of the rigid-flexible printed circuit board, and ensures the high precision performance of resistance welding of the rigid-flexible printed circuit board, thereby improving the product quality of the rigid-flexible printed circuit board, further improving the satisfaction degree of customers, and having good industrial application prospect.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (9)
1. A processing method of a rigid-flexible printed circuit board is characterized by comprising the following processing steps:
the first step, making the first solder mask exposure data of the rigid layer;
a second step of exposing the rigid layer using the first solder resist exposure data;
a third step of manufacturing second solder mask exposure data of the flexible layer;
a fourth step of exposing the flexible layer using the second solder resist exposure data;
the method comprises a ninth step of preparing a semi-finished product to be subjected to solder mask exposure, printing ink on the rigid-flex printed circuit board, drying the printed circuit board and then waiting for exposure production.
2. The method for processing a rigid-flex printed wiring board according to claim 1, further comprising a fifth step of blocking light for the data of the flexible layer after the first step.
3. The method for processing a rigid-flex printed wiring board according to claim 1, further comprising a sixth step of blocking light for the data of the rigid layer after the third step.
4. The method for processing the rigid-flexible printed circuit board according to claim 1, further comprising a seventh step of selecting a mark-position solder-resist-position target point on the rigid layer before the second step.
5. The method for processing the rigid-flexible printed circuit board according to claim 1, wherein the fourth step is preceded by an eighth step of selecting a mark on the flexible layer to align the solder resist to the target.
6. The method of processing a rigid-flex printed wiring board according to claim 1, further comprising a tenth step of solder resist development of the rigid-flex printed wiring board after the fourth step.
7. The method of processing a rigid-flex printed wiring board according to claim 5, wherein in the fourth step, exposure of the flexible layer is performed using a solder resist DI machine.
8. The method for processing a rigid-flex printed wiring board according to claim 7, wherein in the eighth step, the marking points are aligned with alignment targets of the solder resist DI machine.
9. A printed wiring board produced by the method for processing a rigid-flex printed wiring board according to any one of claims 1 to 8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111680447.4A CN114340195B (en) | 2021-12-30 | 2021-12-30 | Processing method of rigid-flexible printed circuit board and printed circuit board |
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| CN202111680447.4A CN114340195B (en) | 2021-12-30 | 2021-12-30 | Processing method of rigid-flexible printed circuit board and printed circuit board |
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| CN114340195A CN114340195A (en) | 2022-04-12 |
| CN114340195B true CN114340195B (en) | 2023-02-07 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0810789B2 (en) * | 1989-01-12 | 1996-01-31 | 日本電気株式会社 | Method for manufacturing printed wiring board |
| CN106332472B (en) * | 2016-11-02 | 2019-03-19 | 江苏弘信华印电路科技有限公司 | The preparation method of high-flexibility rigidity and flexibility combined printed circuit board |
| CN111918490B (en) * | 2020-08-30 | 2024-05-07 | 深圳市实锐泰科技有限公司 | Manufacturing method of rigid-flex printed circuit board and rigid-flex printed circuit board |
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