CN106332472B - The preparation method of high-flexibility rigidity and flexibility combined printed circuit board - Google Patents
The preparation method of high-flexibility rigidity and flexibility combined printed circuit board Download PDFInfo
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- CN106332472B CN106332472B CN201610952602.6A CN201610952602A CN106332472B CN 106332472 B CN106332472 B CN 106332472B CN 201610952602 A CN201610952602 A CN 201610952602A CN 106332472 B CN106332472 B CN 106332472B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to a kind of preparation methods of high-flexibility rigidity and flexibility combined printed circuit board, the specific steps are as follows: internal layer flex plate and the pure glue-line of internal layer are carried out internal layer and overlapped；Internal layer pressing, bores internal layer hole and copper facing at milling flash；Pre-treatment press dry film, exposure, development, etches, moves back film and super roughening；By cover film after sawing sheet, drilling, windowing, it is bonded pressing and forming extruded on internal layer；Welding resistance, welding resistance exposure, welding resistance development, welding resistance solidification；It is laminated after outer layer rigid plate, internal layer flex plate and protection cap lamination, target punching, outer layer drilling removes copper facing behind dirty, the heavy copper hole of brill；Outer layer pre-treatment press dry film, route development, circuit etching, moves back film；Welding resistance is pre-baked, welding resistance exposure, welding resistance is developed, welding resistance solidifies；Take off protection cap；Change gold, stamp, reinforcing steel disc, pressing and forming；It is positioned by jig lamination, realizes layering, enhance the pliability of flex plate, while nor affecting on the requirement of product overall thickness, good hand touch, bending number is greater than 100,000 times.
Description
Technical field
The present invention relates to a kind of preparation methods of wiring board, and in particular to a kind of high-flexibility rigidity and flexibility combined printed circuit
The preparation method of plate.
Background technique
As mobile fingerprint identification flourishes, fingerprint module loading plate requires product size small, and heat resistance is high, has simultaneously
There are superior bending performance and the rigidity and flexibility combined printed circuit board of multifunction using more and more.But existing four layers of rigid-flexible combination
The hardened structure for closing 1-2-1, intermediate soft board layer hardness is larger, and number resistant to bending cannot fully meet the demand of mobile phone market, but
The some fingerprint recognition components of mobile phone are draw keys, since loading plate pliability not enough influences handfeel of keys.Existing production is rigid
The center flexing plate of flex combined board is unable to satisfy its requirement with common double surface soft board production pliability.
Summary of the invention
The present invention proposes a kind of preparation method of high-flexibility rigidity and flexibility combined printed circuit board regarding to the issue above, leads to
The positioning of jig lamination is crossed, layering is realized, enhances the pliability of flex plate, while nor affecting on the requirement of product overall thickness, feel
Good, bending number is greater than 100,000 times.
Specific technical solution is as follows:
The preparation method of high-flexibility rigidity and flexibility combined printed circuit board, the specific steps are as follows:
(1) prepreg and carrier film carry out sawing sheet, and carrier film is fitted on prepreg, bore location hole, punching；
(2) jig hole, punching are bored in the pure glue-line blanking of internal layer；
(3) jig hole is bored in internal layer flex plate blanking, and internal layer flex plate and the pure glue-line of internal layer are carried out internal layer and overlapped；
(4) internal layer pressing is carried out after internal layer overlapping, milling flash, bores internal layer hole and copper facing；
(5) after internal layer copper facing, internal layer pre-treatment is carried out, interior laminating film exposure, development, etches, moves back film and super thick
Change；
(6) by cover film after sawing sheet, drilling, windowing, it is bonded pressing and forming extruded on internal layer；
(7) solidify after pressing through internal layer welding resistance, the exposure of internal layer welding resistance, the development of internal layer welding resistance, internal layer welding resistance；；
(8) it is laminated after outer layer rigid plate, internal layer flex plate, prepreg and carrying film lamination, is carried out using X-Ray
Target punching, outer layer drilling remove copper facing behind dirty, the heavy copper hole of brill；
(9) outer layer pre-treatment, outer laminating film, outer-layer circuit development, outer-layer circuit etch, move back film；
(10) outer layer welding resistance is pre-baked, the exposure of outer layer welding resistance, outer layer welding resistance is developed, outer layer welding resistance solidifies；
(11) protection cap is taken off；
(12) change gold, stamp, reinforcing steel disc, pressing and forming；
(13) electric performance test, finished product cleaning, product inspection, packaging shipment.
The preparation method of above-mentioned high-flexibility rigidity and flexibility combined printed circuit board, wherein in the wiring board being prepared
Interbed is with a thickness of 12.5 μm of pure glue-line, and pure glue-line is equipped with windowing, is the portion PCB on the inside of through-hole, at windowing is layering portion, opens
Side is the portion FPC outside window；
The upper surface of the middle layer is sequentially overlapped from bottom to top: with a thickness of 25 μm of upper layer polyimide layer, thickness
For 23 μm of L2 wiring board, with a thickness of 35 μm of upper layer cover film, with a thickness of 80 μm of upper layer prepreg, with a thickness of 50 μm
Upper layer FR4 layers, the L1 wiring board with a thickness of 33 μm and the upper layer solder mask with a thickness of 25 μm；
The lower surface of the middle layer is sequentially overlapped from top to bottom: with a thickness of 25 μm of lower layer's polyimide layer, thickness
For 23 μm of L3 wiring board, with a thickness of 35 μm of lower layer's cover film, with a thickness of 80 μm of lower layer's prepreg, with a thickness of 50 μm
Lower layer FR4 layers, the L4 wiring board with a thickness of 33 μm and lower layer's solder mask with a thickness of 25 μm；
The upper layer prepreg, lower layer's prepreg, upper layer FR4 layers, lower layer FR4 layers, L1 wiring board, L4 wiring board,
Upper layer solder mask and lower layer's solder mask are respectively positioned in the portion PCB, and reinforcement steel disc is fixed on the lower surface of lower layer's cover film, are mended
Strong steel disc is located in the portion FPC.
The preparation method of above-mentioned high-flexibility rigidity and flexibility combined printed circuit board, wherein the L2 line with a thickness of 23 μm
Contain the copper plate with a thickness of 15 μm in the plate of road.
The preparation method of above-mentioned high-flexibility rigidity and flexibility combined printed circuit board, wherein the upper layer cover film and lower layer
Contain the viscose with a thickness of 23 μm in cover film.
The preparation method of above-mentioned high-flexibility rigidity and flexibility combined printed circuit board, wherein described upper layer FR4 layers, lower layer FR4
Layer, upper layer prepreg, lower layer's prepreg, upper layer cover film, lower layer's cover film, upper layer polyimide layer, lower layer's polyamides are sub-
Several threading holes are equipped in amine layer and pure glue-line, L1 wiring board, L2 wiring board, L3 wiring board and L4 wiring board are via threading hole
Realize route connection.
The invention has the benefit that
Size of the present invention is small, and heat resistance is high, while having superior bending performance and multifunction, and the present invention is in bending
The pure glue-line in region is emptied, and is positioned by jig lamination, be pasted together bending region can not, the demixing zone Lai Shixian, still
The requirement of other parts flex plate overall thickness, good hand touch are had no effect on, bending number is greater than 100,000 times.
Detailed description of the invention
Fig. 1 is the cross-sectional view of wiring board of the present invention.
Fig. 2 is protection cap structure chart (1) of the present invention.
Fig. 3 is protection cap structure chart (2) of the present invention.
Fig. 4 is A-A sectional view of the present invention.
Fig. 5 is that the pure glue-line of internal layer of the present invention is punched schematic diagram.
Specific embodiment
Clear to be more clear technical solution of the present invention, the present invention is described further with reference to the accompanying drawing,
The technical characteristic of any pair of technical solution of the present invention carries out the scheme that equivalencing is obtained with conventional reasoning and each falls within guarantor of the present invention
Protect range.
Appended drawing reference
Pure glue-line 1, windowing 2, the portion PCB 3, layering portion 4, the portion FPC 5, upper layer polyimide layer 6, L2 wiring board 7, upper layer are covered
Epiphragma 8, upper layer prepreg 9, upper layer FR4 layer 10, L1 wiring board 11, upper layer solder mask 12, lower layer's polyimide layer 13, L3 line
Road plate 14, lower layer's cover film 15, lower layer's prepreg 16, lower layer's FR4 floor 17, L4 wiring board 18, lower layer's solder mask 19, reinforcement steel
Piece 20, carrier film 21, rear cover 22, rear cover main body 23, the first gasket group 24, the second gasket group 25 of group, the first gasket 26, second pad
Piece 27, empty avoiding chamber 29, avoiding hollow groove 210, third gasket 211, the 4th gasket 212, takes off cover slot 213 at carrying convex block 28.
As shown in Figure 1, a kind of preparation method of high-flexibility rigidity and flexibility combined printed circuit board, the specific steps are as follows:
(1) prepreg and carrier film carry out sawing sheet, and carrier film is fitted on prepreg, bore location hole, punching；
(2) jig hole, punching are bored in the pure glue-line blanking of internal layer；
(3) jig hole is bored in internal layer flex plate blanking, and internal layer flex plate and the pure glue-line of internal layer are carried out internal layer and overlapped；
(4) internal layer pressing is carried out after internal layer overlapping, milling flash, bores internal layer hole and copper facing；
(5) after internal layer copper facing, internal layer pre-treatment is carried out, interior laminating film exposure, development, etches, moves back film and super thick
Change；
(6) by cover film after sawing sheet, drilling, windowing, it is bonded pressing and forming extruded on internal layer；
(7) solidify after pressing through internal layer welding resistance, the exposure of internal layer welding resistance, the development of internal layer welding resistance, internal layer welding resistance；；
(8) it is laminated after outer layer rigid plate, internal layer flex plate, prepreg and carrying film lamination, is carried out using X-Ray
Target punching, outer layer drilling remove copper facing behind dirty, the heavy copper hole of brill；
(9) outer layer pre-treatment, outer laminating film, outer-layer circuit development, outer-layer circuit etch, move back film；
(10) outer layer welding resistance is pre-baked, the exposure of outer layer welding resistance, outer layer welding resistance is developed, outer layer welding resistance solidifies；
(11) protection cap is taken off；
(12) change gold, stamp, reinforcing steel disc, pressing and forming；
(13) electric performance test, finished product cleaning, product inspection, packaging shipment.
The wiring board being prepared that is prepared through the invention as shown in Figure 1, the printed wiring board middle layer
For the pure glue-line 1 with a thickness of 12.5 μm, pure glue-line is equipped with through-hole 2, is the portion PCB 3 on the inside of through-hole, through hole is layering portion 4, logical
It is the portion FPC 5 on the outside of hole；
The upper surface of the middle layer is sequentially overlapped from bottom to top: with a thickness of 25 μm of upper layer polyimide layer 6, thickness
For 23 μm of L2 wiring board 7, with a thickness of 35 μm of upper layer cover film 8, with a thickness of 80 μm of upper layer prepreg 9, with a thickness of 50 μ
The upper layer FR4 layer 10 of m, the L1 wiring board 11 with a thickness of 33 μm and the upper layer solder mask 12 with a thickness of 25 μm；
The lower surface of the middle layer is sequentially overlapped from top to bottom: thick with a thickness of 25 μm of lower layer's polyimide layer 13
The L3 wiring board 14 that degree is 23 μm, with a thickness of 35 μm of lower layer's cover film 15, with a thickness of 80 μm of lower layer's prepreg 16, thickness
For 50 μm of lower layer FR4 layer 17, the L4 wiring board 18 with a thickness of 33 μm and lower layer's solder mask 19 with a thickness of 25 μm；
The upper layer prepreg, lower layer's prepreg, upper layer FR4 layers, lower layer FR4 layers, L1 wiring board, L4 wiring board,
Upper layer solder mask and lower layer's solder mask are respectively positioned in the portion PCB, are fixed with reinforcement steel disc 20 on the lower surface of lower layer's cover film,
Reinforcement steel disc is located in the portion FPC；
Contain the copper plate with a thickness of 15 μm in the L2 wiring board with a thickness of 23 μm；
Contain the viscose with a thickness of 23 μm in the upper layer cover film and lower layer's cover film；
Described upper layer FR4 layers, lower layer FR4 layers, upper layer prepreg, lower layer's prepreg, upper layer cover film, lower layer's covering
Be equipped with several threading holes on film, upper layer polyimide layer, lower layer's polyimide layer and pure glue-line, L1 wiring board, L2 wiring board,
L3 wiring board realizes that route is connected to via threading hole with L4 wiring board.
The structure of heretofore described protection cap is as in Figure 2-4, and the thickness h 1 of protection cap is 12.5 μm, including internal layer
Carrier film 21 and outer layer rear cover 22, the carrier film single-sided back-adhesive, using polyimides as material, the rear cover includes rear cover
Rear cover main body 23, rear cover main body two sides are respectively equipped with one group of first gasket group 24 and one group of second gasket group 25, first pad
Piece group includes first gasket 26 and four the second gaskets 27, and the first gasket is located at the top of the second gasket, the first gasket with
A carrying convex block 28 is equipped with below second gasket, the first gasket and the second gasket are rectangle structure, the first gasket
Width L1 be greater than the second gasket width L2, between the first gasket and the second gasket, between the second gasket and the second gasket
There are the empty avoiding chamber 29 that width L5 is 8.49mm, the inner wall of empty avoiding chamber is recessed inwardly to form the avoiding hollow groove 210 of arc-shaped structure；
The second gasket group includes the first third gasket 211 and four the 4th gaskets 212, and third gasket is located at the 4th pad
A carrying convex block is equipped with above the lower section of piece, third gasket and the 4th gasket, third gasket and the 4th gasket are length
Square structure, the width L3 of third gasket are equal to the width L1 of the first gasket, and the width L4 of the 4th gasket is equal to the second gasket
Between third gasket and the 4th gasket, there is empty avoiding chamber, the inner wall of empty avoiding chamber between the 4th gasket and the 4th gasket in width L2
It is recessed inwardly to form the avoiding hollow groove of arc-shaped structure；
First gasket of the first gasket group, the third gasket of the second gasket and the second gasket group, the 4th gasket alternating
Setting；
Shape, the size of the carrier film are identical as the shape of rear cover, size；
The carrier film extends outwardly 0.2mm relative to the rear cover at carrying convex block.
The central axes of the rear cover main body are equipped with one and take off cover slot 213, take off cover slot and are formed by etch process.Described
One gasket, the second gasket, third gasket and the 4th gasket length L7 be 14.90mm.The first gasket group or the second gasket
The width L6 of group is 120.58mm.
Claims (4)
1. the preparation method of high-flexibility rigidity and flexibility combined printed circuit board, it is characterized in that, the specific steps are as follows:
(1) prepreg and carrier film carry out sawing sheet, and carrier film is fitted on prepreg, bore location hole, punching；
(2) jig hole, punching are bored in the pure glue-line blanking of internal layer；
(3) jig hole is bored in internal layer flex plate blanking, and internal layer flex plate and the pure glue-line of internal layer are carried out internal layer and overlapped；
(4) internal layer pressing is carried out after internal layer overlapping, milling flash, bores internal layer hole and copper facing；
(5) after internal layer copper facing, internal layer pre-treatment is carried out, interior laminating film exposure, development, etches, moves back film and super roughening；
(6) by cover film after sawing sheet, drilling, windowing, it is bonded pressing and forming extruded on internal layer；
(7) solidify after pressing through internal layer welding resistance, the exposure of internal layer welding resistance, the development of internal layer welding resistance, internal layer welding resistance；
(8) it is laminated after outer layer rigid plate, internal layer flex plate, prepreg and carrying film lamination, carries out target using X-Ray
Punching, outer layer drilling remove copper facing behind dirty, the heavy copper hole of brill；
(9) outer layer pre-treatment, outer laminating film, outer-layer circuit development, outer-layer circuit etch, move back film；
(10) outer layer welding resistance is pre-baked, the exposure of outer layer welding resistance, outer layer welding resistance is developed, outer layer welding resistance solidifies；
(11) protection cap is taken off；
(12) change gold, stamp, reinforcing steel disc, pressing and forming；
(13) electric performance test, finished product cleaning, product inspection, packaging shipment；
The middle layer for the wiring board being prepared is the pure glue-line with a thickness of 12.5 μm, and pure glue-line is equipped with windowing, through-hole inside
For be at the portion PCB, windowing layering portion, windowing outside be the portion FPC；
The upper surface of the middle layer is sequentially overlapped from bottom to top: with a thickness of 25 μm of upper layer polyimide layer, with a thickness of 23 μ
The L2 wiring board of m, with a thickness of 35 μm of upper layer cover film, with a thickness of 80 μm of upper layer prepreg, with a thickness of 50 μm of upper layer
FR4 layers, the L1 wiring board with a thickness of 33 μm and the upper layer solder mask with a thickness of 25 μm；
The lower surface of the middle layer is sequentially overlapped from top to bottom: with a thickness of 25 μm of lower layer's polyimide layer, with a thickness of 23 μ
The L3 wiring board of m, with a thickness of 35 μm of lower layer's cover film, with a thickness of 80 μm of lower layer's prepreg, with a thickness of 50 μm of lower layer
FR4 layers, the L4 wiring board with a thickness of 33 μm and lower layer's solder mask with a thickness of 25 μm；
The upper layer prepreg, lower layer's prepreg, upper layer FR4 layers, lower layer FR4 layers, L1 wiring board, L4 wiring board, upper layer
Solder mask and lower layer's solder mask are respectively positioned in the portion PCB, and reinforcement steel disc, reinforcement steel are fixed on the lower surface of lower layer's cover film
Piece is located in the portion FPC.
2. the preparation method of high-flexibility rigidity and flexibility combined printed circuit board as described in claim 1, it is characterized in that, the thickness
Contain the copper plate with a thickness of 15 μm in the L2 wiring board that degree is 23 μm.
3. the preparation method of high-flexibility rigidity and flexibility combined printed circuit board as described in claim 1, it is characterized in that, it is described on
Contain the viscose with a thickness of 23 μm in layer cover film and lower layer's cover film.
4. the preparation method of high-flexibility rigidity and flexibility combined printed circuit board as described in claim 1, it is characterized in that, it is described on
FR4 layers of layer, lower layer FR4 layers, upper layer prepreg, lower layer's prepreg, upper layer cover film, lower layer's cover film, upper layer polyamides Asia
Several threading holes, L1 wiring board, L2 wiring board, L3 wiring board and L4 are equipped on amine layer, lower layer's polyimide layer and pure glue-line
Wiring board realizes route connection via threading hole.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610952602.6A CN106332472B (en) | 2016-11-02 | 2016-11-02 | The preparation method of high-flexibility rigidity and flexibility combined printed circuit board |
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| CN201610952602.6A CN106332472B (en) | 2016-11-02 | 2016-11-02 | The preparation method of high-flexibility rigidity and flexibility combined printed circuit board |
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| CN106332472B true CN106332472B (en) | 2019-03-19 |
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| CN114340195B (en) * | 2021-12-30 | 2023-02-07 | 珠海杰赛科技有限公司 | Processing method of rigid-flexible printed circuit board and printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102045949A (en) * | 2011-01-14 | 2011-05-04 | 深圳市兴森快捷电路科技股份有限公司 | Method for making rigid/flexible combined printed circuit board |
| CN103687346A (en) * | 2013-11-18 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Rigid-flexible combined printed circuit board preparation method |
| CN104507260A (en) * | 2014-12-16 | 2015-04-08 | 江门崇达电路技术有限公司 | Manufacturing method of rigid-flexible board with reinforce panel |
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2016
- 2016-11-02 CN CN201610952602.6A patent/CN106332472B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102045949A (en) * | 2011-01-14 | 2011-05-04 | 深圳市兴森快捷电路科技股份有限公司 | Method for making rigid/flexible combined printed circuit board |
| CN102045949B (en) * | 2011-01-14 | 2013-05-15 | 深圳市兴森快捷电路科技股份有限公司 | Method for making rigid/flexible combined printed circuit board |
| CN103687346A (en) * | 2013-11-18 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Rigid-flexible combined printed circuit board preparation method |
| CN104507260A (en) * | 2014-12-16 | 2015-04-08 | 江门崇达电路技术有限公司 | Manufacturing method of rigid-flexible board with reinforce panel |
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Effective date of registration: 20221230 Address after: 335000 No.2 Zhilian Avenue, high tech Industrial Development Zone, Yingtan City, Jiangxi Province Patentee after: Jiangxi Hongxin Flexible Electronic Technology Co.,Ltd. Address before: 212000 no.308-1, Nanxu Avenue, Runzhou District, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU HONGXIN HUAYIN CIRCUIT TECHNOLOGY Co.,Ltd. |
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