CN106879195A - A kind of Rigid Flex preparation method and device - Google Patents
A kind of Rigid Flex preparation method and device Download PDFInfo
- Publication number
- CN106879195A CN106879195A CN201710134697.5A CN201710134697A CN106879195A CN 106879195 A CN106879195 A CN 106879195A CN 201710134697 A CN201710134697 A CN 201710134697A CN 106879195 A CN106879195 A CN 106879195A
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- Prior art keywords
- uncapping
- region
- mould
- uncapped
- punched
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0271—Mechanical force other than pressure, e.g. shearing or pulling
Abstract
The invention provides the preparation method and device of a kind of Rigid Flex,The jointing material of Rigid Flex is open in advance in region of uncapping by mould,Can directly using the jointing material with open area during pressing,Simultaneously after Rigid Flex pressing,The core plate Core parts in region of uncapping are removed by way of mould is punched,The mode that need not be uncapped using laser,Avoid during laser is uncapped product quality hidden danger caused by carbonization phenomenon,Simultaneously,Due to that need not be uncapped using laser,Rigid Flex of the embodiment of the present invention for some numbers of plies,Individual layer Copper Foil core plate Core materials can be selected,The cost of raw material can be reduced,Again due to that need not be uncapped using laser,And it is punched mode of uncapping using mould,Substantial amounts of laser cutting device cost can be saved,Mould is uncapped and uncapping for whole Rigid Flex is completed by one-step punching,Uncapped compared to laser in hgher efficiency.
Description
Technical field
The present invention relates to printed wiring board manufacture technology field, more particularly to a kind of Rigid Flex preparation method and
Device.
Background technology
Before printed wiring board appearance, the connection between electronic component is all to be directly connected to realize by electric wire,
And it is present, printed wiring board manufacturing technology is got over and tends to ripe, and its is with low cost, can large-scale production, increasing application
In fields such as consumer electronics, medical treatment, automobile, space flight.
Printed wiring board includes rigid printed board and flexible printed circuit board, and rigid printed board (is also rigidity
Wiring board) durability preferably, flexible printed circuit board (being also FPC) better softness is occurred in that soft on this basis
Scleroma plywood, so-called Rigid Flex refers to one or more rigid regions and the printed wiring of one or more flex regions
The flexibility of plate, its durability for having rigid printed board concurrently and flexible printed circuit board, so as to have frivolous compact and resistance to
The features such as severe applied environment, it is particularly suitable in the accurate electricity such as portable consumer electronics product, medical electronics product, military equipment
Application in terms of son.
However, because current Rigid Flex needs process operations of uncapping, common processing procedure of uncapping in manufacturing process
Carried out by the way of laser cutting, the uncap soft or hard junction of mode of cutting of laser unavoidably has carbonization phenomenon, is carbonized
The presence of phenomenon causes product to there is certain quality hidden danger；Meanwhile, the correlation technique Rigid Flex structure shown in reference picture 1
And laser is uncapped the schematic diagram of cutting, Rigid Flex be typically included in FPC FPCB layers 1 of center and point
, in the FPC FPCB layers of rigid line flaggy 2 of 1 both sides, rigid line flaggy 2 is by jointing material 3 and FPCB layers 1 for cloth
Connection, the wherein FPCB layers 1 polyimides PI 5 that can include being coated with individual layer or bilayer Cu faces 4 again, in covering for the covering of Cu faces 4
Epiphragma layer 6, what rigid line flaggy 2 can include being coated with individual layer or bilayer Cu faces resistance to fires grade (such as FR-4 with certain
7 grades) core plate Core 8, jointing material 3 can be prepreg Prepreg, laser 9 uncap cutting during, by
In laser 9 during uncapping, lid this body structure has certain inhomogeneities, in order to the process for preventing laser 9 from cutting is injured
The soft board circuit of internal layer, then must be designed using gear steel structure 10, for the Rigid Flex of some numbers of plies, can be selected originally
Individual layer Copper Foil core plate Core, but because the presence of the gear design of steel structure 10, then must select double-deck Copper Foil core plate core, increased
The cost of raw material；And, the uncap mode of cutting of laser needs substantial amounts of laser cutting device, and equipment cost is high.
The content of the invention
The present invention provides a kind of Rigid Flex preparation method and device, is made with solving existing Rigid Flex
Above mentioned problem in the presence of journey.
In order to solve the above problems, the invention discloses a kind of Rigid Flex preparation method, including：
The FPC of the first pre-set dimension is made using FPC base material；
Make the rigid line plate of the second pre-set dimension；
Default jointing material is punched, the jointing material with open area is obtained；
The FPC, the jointing material with open area and the rigid line plate are overlapped successively, and
The Rigid Flex with region of uncapping is pressed into pressing machine, wherein, the region of uncapping is corresponding with the open area；
The region of uncapping is punched out using the first mould, obtains Rigid Flex.
Preferably, the default jointing material of the punching, includes the step of obtain the jointing material with open area：
Default jointing material is punched using the second mould, the jointing material with open area is obtained.
Preferably, the region of uncapping is uncapped edge including the first edge and second of uncapping, described to use the first mould pair
The region of uncapping is punched out, obtain Rigid Flex the step of include：
It is punched completely using the first mould edge of being uncapped to the region first of uncapping；
Partial die cut is carried out using the first mould edge of being uncapped to the region second of uncapping, Rigid Flex is obtained.
Preferably, the region of uncapping is the rectangular area with layer structure.
Preferably, the layer structure includes the core plate of the core plate of individual layer steel structure or double-deck steel structure.
Preferably, the partial die cut includes：The region second of uncapping is punched to uncap edge preset depth location.
Preferably, first mould and/or the second mould include etching cutting die, the etching cutting die and band servo motor
Plastic former be used in conjunction so that the plastic former control etching cutting die is punched out.
Preferably, the jointing material is prepreg or the pure glue of epoxy resin.
In order to solve the above problems, the invention also discloses a kind of Rigid Flex producing device, including：
First makes module, the FPC for making the first pre-set dimension using FPC base material；
Second makes module, the rigid line plate for making the second pre-set dimension；
Jointing material is punched module, for being punched default jointing material, obtains the jointing material with open area；
Rigid Flex press module, for successively by the FPC, the jointing material with open area with
And the rigid line plate overlapping, and the Rigid Flex with region of uncapping is pressed into pressing machine, wherein, it is described to uncap
Region is corresponding with the open area；
Uncap module, for being punched out to the region of uncapping using the first mould, obtain Rigid Flex.
Preferably, the jointing material punching module includes：
Second mould is punched module, and for being punched default jointing material using the second mould, obtaining has open area
Jointing material.
Preferably, the region of uncapping is uncapped edge including the first edge and second of uncapping, and the module of uncapping includes：
Module is punched completely, for being punched completely using the first mould edge of being uncapped to the region first of uncapping；
Partial die cut module, for carrying out partial die cut using the first mould edge of being uncapped to the region second of uncapping,
Obtain Rigid Flex.
Preferably, the region of uncapping is the rectangular area with layer structure.
Preferably, the layer structure includes the core plate of the core plate of individual layer steel structure or double-deck steel structure.
Preferably, the partial die cut includes：The region second of uncapping is punched to uncap edge preset depth location.
Preferably, first mould and/or the second mould include etching cutting die, the etching cutting die and band servo motor
Plastic former be used in conjunction so that the plastic former control etching cutting die is punched out.
Preferably, the jointing material is prepreg or the pure glue of epoxy resin.
Compared with prior art, the present invention includes advantages below：
In region of uncapping be open the jointing material of Rigid Flex in advance by mould by the embodiment of the present invention, can during pressing
Directly to utilize the jointing material with open area, while after Rigid Flex pressing, will by way of mould is punched
The uncap core plate Core parts in region remove, it is not necessary to the mode uncapped using laser, it is to avoid laser is carbonized during uncapping
Product quality hidden danger caused by phenomenon.
Further, due to that need not be uncapped using laser, the embodiment of the present invention for some numbers of plies Rigid Flex,
Individual layer Copper Foil core plate Core materials can be selected, the cost of raw material can be reduced.
Further, due to that need not be uncapped using laser, and mode of uncapping is punched using mould, can be saved substantial amounts of
Laser cutting device cost, mould is uncapped and uncapping for whole Rigid Flex is completed by one-step punching, is uncapped effect compared to laser
Rate is higher.
Brief description of the drawings
Fig. 1 is that correlation technique Rigid Flex structure and laser are uncapped the schematic diagram of cutting；
The step of Fig. 2 is a kind of preparation method of Rigid Flex of the embodiment of the present invention one flow chart；
Fig. 3 is a kind of FPC matrix structure schematic diagram of the embodiment of the present invention one；
Fig. 4 is that one kind of the embodiment of the present invention one fits over film schematic diagram；
Fig. 5 is a kind of core plate core structural representations of the embodiment of the present invention one；
Fig. 6 is a kind of second mould diecut adhesive material schematic diagram of the embodiment of the present invention one；
Fig. 7 is the Rigid Flex schematic diagram to be uncapped after a kind of pressing of the embodiment of the present invention one；
Fig. 8 is that a kind of rectangle of the embodiment of the present invention one is uncapped the top view in region；
Fig. 9 is a kind of structured flowchart of the producing device 200 of Rigid Flex of the embodiment of the present invention two；
Figure 10 is the structured flowchart of the producing device of another Rigid Flex of the embodiment of the present invention two；
Figure 11 is the structured flowchart of the producing device of another Rigid Flex of the embodiment of the present invention two.
Specific embodiment
It is below in conjunction with the accompanying drawings and specific real to enable the above objects, features and advantages of the present invention more obvious understandable
The present invention is further detailed explanation to apply mode.
Embodiment one
Reference picture 2, show the embodiment of the present invention one a kind of Rigid Flex preparation method the step of flow chart.
In embodiments of the present invention, it is necessary first to make Rigid Flex to be uncapped, specifically, the meaning to be uncapped is just
It is that some positions of Rigid Flex need to uncap, it is so-called to uncap, it is exactly that the outer layer core plate core of Rigid Flex part exists
Region of uncapping removes, to ensure that the Rigid Flex for removing region of uncapping has good bending performance.
In embodiments of the present invention, the step of making Rigid Flex to be uncapped can as follows 101~104
To realize, therefore the preparation method of the Rigid Flex of the embodiment of the present invention may comprise steps of：
Step 101, the FPC of the first pre-set dimension is made using FPC base material；
In embodiments of the present invention, FPC can be made by FPC base material, and reference picture 3 is shown
A kind of FPC matrix structure schematic diagram of the embodiment of the present invention one for going out, FPC base material generally can be one side
Or it is two-sided be coated with the thin slices of Cu polyimides PI 5, in implementing, FPCB (Flexible Printed can be used
Circuit Board, FPC) base material.
In one preferred embodiment of the invention, step 101 can include following sub-step：
S11, punching FPC base material obtains the FPC base material of the 3rd pre-set dimension；
In embodiments of the present invention, the whole Zhang Rou bought from each FPCB base materials producer can be punched by being punched special equipment
Property board substrate, the base material of whole is obtained into the FPC base material of the 3rd pre-set dimension according to design size punching, with
It is easy to later use.
S12, via and copper facing are drilled through by drilling machine in the FPC base material of the pre-set dimension；
In implementing, usual FPC also includes via, therefore, in embodiments of the present invention, Ke Yitong
The through hole that drilling machine drills through design size on FPC base material is crossed, while the conduction in order to realize through hole, Ke Yitong
The method for crossing electroless copper plating or Cu electroplating forms one layer of micron-sized copper in through-hole wall and via openings marginal position
Film.
In one preferred embodiment of the invention, thickness >=11 μm of the copper film.
S13, the FPC substrate surface by patterning processes in the 3rd pre-set dimension makes circuit；
In embodiments of the present invention, after the drilling of FPC base material and copper facing, can be by patterning processes soft
Property board substrate surface make required for circuit.
In embodiments of the present invention, step S13 can be realized in the following way：
S131, in the special anti-etching dry film of FPC substrate surface laminating；
In embodiments of the present invention, it is possible to use special laminator is against corrosion in one layer of FPC substrate surface covering
Dry film is carved, the dry film has following property：The light irradiation after-hardening of certain wavelength is received, the dry film after hardening is not etched with Cu
Solution reaction and weakly alkaline solution react, for example, sodium carbonate liquor, but still reacted with strong base solution, for example, NaOH is molten
Liquid；Not receiving the dry film after the light irradiation of certain wavelength can react with weakly alkaline solution, therefore, it can using this characteristic
Solution corrosion is not etched by for circuit figure and protection circuit.
S132, the default line pattern film is covered on the dry film surface for posting；
In embodiments of the present invention, the line pattern film is for selecting dry film exposure area, including transmission region
And light tight region, therefore can select whether correspondence position dry film is shone by light by the transmission region and light tight region
Penetrate.
S133, is exposed using the light of certain wavelength to the dry film of the covering film；
In embodiments of the present invention, after dry film covers the film, can be put into special exposure machine, the special exposure machine
Certain wavelength is provided, the light of intensity is exposed to it, through the transmission region of the film, irradiate dry film makes dry film hard to light
Change, the non-penetrating region of light, dry film remains in that original state.
S134, forms the dry film consistent with line pattern and protects pattern in FPC substrate surface；
In embodiments of the present invention, after dry film exposes, the characteristic after being exposed using foregoing dry film can will be unexposed
Dry film and weakly alkaline solution react, the dry film that removing is not exposed, so as to be formed and and circuit in FPC substrate surface
The consistent dry film protection pattern of figure, it is for protecting Cu faces not by the corrosion of etchant that the dry film protects pattern.
S135, removal is not by the Cu of dry film protection pattern protection；
In embodiments of the present invention, after forming dry film protection pattern, in order to circuit is completed, to not protected by dry film
The Cu of pattern needs removal, it is possible to use Cu etchants occur chemical reaction and remove it with Cu.
S136, removal dry film protection pattern, forms line pattern.
In embodiments of the present invention, after removal protection pattern, pattern can will be protected to remove by strong base solution, with ready-made
Complete line pattern.
So far, the FPC substrate surface completed in the 3rd pre-set dimension makes the process of circuit.
It should be noted that the method that film is exposed, develops, etching, moved back above by the negative film film realizes that circuit made
Journey is only a kind of example, is also feasible using other method, and for example the positive film exposes, develops, etches, moves back film；Full addition
Method；Semi-additive process, the embodiment of the present invention is not restricted to this.
S14, one layer of cover layer is covered in the circuit surface, obtains the FPC of first pre-set dimension；
In embodiments of the present invention, in order to protect the line pattern of the formation, the embodiment of the present invention one shown in reference picture 4
One kind fit over film schematic diagram, can also generally be fitted one layer of cover layer 6 in patterned surface, the cover layer be typically one layer
Micron-sized Kapton, after cover layer of having fitted, should have the FPC base material of line pattern more complete
It is whole, FPC 1 can be called.
It should be noted that said process is accomplished that the manufacturing process of individual layer or Double-layer flexible circuit board, for multilayer
The manufacturing process of FPC, it is also possible to made with reference to the above method, only the manufacturing process volume of multi-layer flexible circuit board
The outer individual layer for also needing to make or Double-layer flexible circuit board realize sandwich construction, specific compression method sheet by pressing
Inventive embodiments are not described in detail here, and are referred to subsequent step of the present invention 104, it is also possible to using other pressures commonly used in the art
Conjunction method, the embodiment of the present invention is not restricted to this.
Step 102, makes the rigid line plate of the second pre-set dimension；
In embodiments of the present invention, rigid line plate can be completed by core plate core, and core plate core is multilayer
Main material in the production of rigid line plate, a kind of core plate core structural representations of the embodiment of the present invention one shown in reference picture 5
Figure, core plate core 8 includes being coated with the composite of one layer or two-layer Cu of certain resistance to combustion grade, such as conventional individual layer Cu
Resistance to combustion grade FR-4 the epoxy resin boards of FR-4 7, in implementing, can be carried from Panasonic, Deng Ge manufacturers of SHENGYI SCI.TECH
The core plate core materials of the various models for supplying.
In embodiments of the present invention, the method that the rigid line plate of pre-set dimension is made especially by core plate core materials can
So that with reference to step 101, therefore not to repeat here for the embodiment of the present invention.
Step 103, is punched default jointing material, obtains the jointing material with open area；
In embodiments of the present invention, jointing material is for connection to flexibility well prepared in advance in step 101 and step 102
Wiring board and rigid line plate, because Rigid Flex has region of uncapping, the jointing material in correspondence position region needs to open
Mouthful, in order to improve the bending performance of Rigid Flex.
In embodiments of the present invention, jointing material can be prepreg Prepreg or wiring board bonding
The pure glue of sheet.
Wherein, prepreg Prepreg is one of the main material in the production of multilayer rigid line plate, mainly by resin and
Reinforcing material is constituted, and reinforcing material is divided into the several types such as glass-fiber-fabric, paper substrate, composite again, and makes multilayer board institute
The prepreg for using is mostly to do reinforcing material using glass-fiber-fabric.Treated glass-fiber-fabric, resin adhesive liquid on dipping, then pass through
The sheeting referred to as prepreg that heat treatment (preliminary drying) makes resin enter B-stage (semi-cured state) and is made, generally makes
With needing to be preserved in freezer before, when in use through press hot pressing, what prepreg was contained under conditions of being heated due to itself
The effect of volatile matter (equivalent to diluent) can gradually soften until becoming liquid completely, the resin for gradually melting can be in contact with it
The material such as epoxy resin, polyimides, Cu produce good adhesion so that prepreg can make as binding material
With.Due to the effect of curing agent for containing, in a heated condition, the solid-state that resin can eventually become stabilization connects prepreg
The material for connecing firmly is combined together, and the pure glue of bonding sheet can be from the pure glue of epoxy resin.
In a kind of preferred embodiment of the embodiment of the present invention, in order that jointing material punching is more regular, reference picture 6 shows
The embodiment of the present invention one a kind of second mould diecut adhesive material schematic diagram, it is possible to use the second mould 11 be punched the bonding
Material, second mould 11 reserves at opening jointing material 3, namely region 12 (also crying blanking area) correspondence position of uncapping is complete
Full cut-out, obtains the jointing material with open area, is easy to subsequently use.
Meanwhile, in order to improve die cutting accuracy, in a kind of preferred embodiment of the embodiment of the present invention, etching knife can be selected
Mould is less than ± 0.5 μm as the second mould, the height tolerance of the etching cutting die.
In a kind of preferred embodiment of the embodiment of the present invention, can also be by by the plastic former with servo motor and the erosion
Icking tool mould is used in conjunction, and the plastic former with servo motor automatically controls the punching depth of etching cutting die, in order to etch the automatic of cutting die
Punching, improve production efficiency.
Step 104, successively by the FPC, the jointing material with open area and the rigid line plate
Overlapping, and the Rigid Flex with region of uncapping is pressed into pressing machine, wherein, region and the open region of uncapping
Domain correspondence；
In embodiments of the present invention, the first pre-set dimension produced by step 101, step 102, step 103 it is soft
Property wiring board, the jointing material with open area, after the rigid line plate of the second pre-set dimension, in addition it is also necessary to by these materials
Overlap successively, and the structure after overlapping is put into pressing machine the Rigid Flex for being pressed into and having region of uncapping.
As a kind of example, a kind of soft or hard combination with region of uncapping of the embodiment of the present invention two shown in reference picture 7
Plate schematic diagram, by the FPC of the first pre-set dimension, the jointing material with open area, the second pre-set dimension rigidity
Structure after circuit board pressing can be with as shown in figure 8, wherein 12 be region of uncapping.
In one preferred embodiment of the invention, in order that pressing after Rigid Flex to be uncapped more closely with
And it is smooth, it is possible to use the laminating machine laminating pressing of pressing better performances.
Step 105, is punched out using the first mould to the region of uncapping, and obtains Rigid Flex.
In embodiments of the present invention, the region of uncapping of Rigid Flex to be uncapped that can be using the first mould to obtaining
It is punched out, it will not be necessary to which the part removes, obtains Rigid Flex.
In one preferred embodiment of the invention, region of uncapping can be set to be uncapped including the first edge and second of uncapping
Edge, first uncaps edge and the second edge of uncapping is constituted and uncapped region, and different punching sides are taken to different edges of uncapping
Formula, in order to mould be punched, wherein, first uncap the corresponding position in edge can be correspondence Rigid Flex scrap area,
Second uncap edge can be correspondence Rigid Flex bending the soft or hard junction in region, therefore, step 105 can be by such as lower section
Formula is realized：It is punched completely using the first mould edge of being uncapped to the region first of uncapping, using the first mould to described
The edge of uncapping of region second of uncapping carries out partial die cut, wherein, punching can refer to uncapping whole Rigid Flex completely
The edge of uncapping of region first cuts off completely, and partial die cut can refer to be punched to the region second of uncapping to uncap edge preset depth
Position.After so punching, the region of uncapping of Rigid Flex is in semi-connection state, and technical staff is easy to uncap
The waste material being punched in region is removed, and obtains Rigid Flex.
In one preferred embodiment of the invention, in order to uncap conveniently, the present invention as shown in Figure 8 can be set and is implemented
A kind of rectangle of example one is uncapped the top view in region, wherein, 13 is that the rectangle is uncapped and the first of region uncapped edge, and 14 is the square
Shape is uncapped and the second of region is uncapped edge, when being punched out using aforesaid way, the rectangle is uncapped and the first of region is uncapped
Edge is punched completely, and the second of region edge of uncapping of being uncapped to the rectangle is punched to second and uncaps edge preset depth location.
In one preferred embodiment of the invention, reference picture 7, because region of uncapping has layer structure, i.e. nonflexible line
The corresponding parts of core plate Core 8 of road plate, the predetermined depth position could be arranged to the 1/2~2/3 of layer structure thickness.
Meanwhile, in order to improve die cutting accuracy, in a kind of preferred embodiment of the embodiment of the present invention, etching knife can be selected
Mould is less than ± 0.5 μm as die cutting die, the height tolerance of the etching cutting die.
In a kind of preferred embodiment of the embodiment of the present invention, can also be by by the plastic former with servo motor and the erosion
Icking tool mould is used in conjunction, and the plastic former with servo motor automatically controls the punching depth of etching cutting die, in order to etch the automatic of cutting die
Punching, improve production efficiency.
It should be noted that above-mentioned first die cutting die can be identical with the second die cutting die, it is also possible to different, this area
Technical staff can voluntarily select according to actual conditions, as long as above-mentioned steps can be realized.
In region of uncapping be open the jointing material of Rigid Flex in advance by mould by the embodiment of the present invention, can during pressing
Directly to utilize the jointing material with open area, while after Rigid Flex pressing, will by way of mould is punched
The uncap core plate Core parts in region remove, it is not necessary to the mode uncapped using laser, it is to avoid laser is carbonized during uncapping
Product quality hidden danger caused by phenomenon.
Further, due to that need not be uncapped using laser, the embodiment of the present invention for some numbers of plies Rigid Flex,
Individual layer Copper Foil core plate Core materials can be selected, the cost of raw material can be reduced.
Further, due to that need not be uncapped using laser, and mode of uncapping is punched using mould, can be saved substantial amounts of
Laser cutting device cost, mould is uncapped and uncapping for whole Rigid Flex is completed by one-step punching, is uncapped effect compared to laser
Rate is higher.
Embodiment two
Reference picture 9, shows a kind of structured flowchart of the producing device 200 of Rigid Flex of the embodiment of the present invention two.
The producing device 200 can include：
First makes module 201, the FPC for making the first pre-set dimension using FPC base material；
Second makes module 202, the rigid line plate for making the second pre-set dimension；
Jointing material is punched module 203, for being punched default jointing material, obtains the bonding material with open area
Material；
Rigid Flex presses module 204, for successively by the FPC, the jointing material with open area
And the rigid line plate overlapping, and the Rigid Flex with region of uncapping is pressed into pressing machine, wherein described open
Cover area is corresponding with the open area；
Module of uncapping 205, for being punched out to the region of uncapping using the first mould, obtains Rigid Flex.
Another structured flowchart of the producing device of the Rigid Flex of the embodiment of the present invention two shown in reference picture 10,
In a preferred embodiment of the present invention, the jointing material punching module 203 can include：
Second mould is punched module 2031, and for being punched default jointing material using the second mould, obtaining has opening
The jointing material in region.
Another structured flowchart of the producing device of the Rigid Flex of the embodiment of the present invention two shown in reference picture 11,
In a preferred embodiment of the present invention, the region of uncapping is uncapped edge including the first edge and second of uncapping, described to uncap
Module 205 can include：
Module 2051 is punched completely, for being rushed completely using the first mould edge of being uncapped to the region first of uncapping
Cut；
Partial die cut module 2052, for carrying out part punching using the first mould edge of being uncapped to the region second of uncapping
Cut, obtain Rigid Flex.In one preferred embodiment of the invention, the region of uncapping can be with layer structure
Rectangular area.
In one preferred embodiment of the invention, the layer structure can include the core plate or bilayer of individual layer steel structure
The core plate of steel structure.
In one preferred embodiment of the invention, the partial die cut can include：It is punched to the region the of uncapping
Two edge preset depth locations.
In one preferred embodiment of the invention, first mould and/or the second mould can include etching cutting die,
The etching cutting die is used in conjunction with the plastic former with servo motor so that the plastic former control etching cutting die is punched out.
In one preferred embodiment of the invention, the jointing material can be prepreg or the pure glue of epoxy resin.
For foregoing each method embodiment, in order to be briefly described, therefore it is all expressed as a series of combination of actions, but
It is that those skilled in the art should know, the present invention is not limited by described sequence of movement, because according to the present invention, certain
A little steps can sequentially or simultaneously be carried out using other.Secondly, those skilled in the art should also know, be retouched in specification
The embodiment stated belongs to preferred embodiment, necessary to involved action and the module not necessarily present invention.
Each embodiment in this specification is described by the way of progressive, what each embodiment was stressed be with
The difference of other embodiment, between each embodiment identical similar part mutually referring to.
Finally, in addition it is also necessary to explanation, herein, such as first and second or the like relational terms be used merely to by
One entity or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or operation
Between there is any this actual relation or order.And, term " including ", "comprising" or its any other variant meaning
Covering including for nonexcludability, so that process, method, commodity or equipment including a series of key elements not only include that
A little key elements, but also other key elements including being not expressly set out, or also include for this process, method, commodity or
The intrinsic key element of equipment.In the absence of more restrictions, the key element limited by sentence "including a ...", does not arrange
Except also there is other identical element in the process including the key element, method, commodity or equipment.
Above to a kind of Rigid Flex preparation method provided by the present invention and device, it is described in detail, this
Apply specific case in text to be set forth principle of the invention and implementation method, the explanation of above example is only intended to
Help understands the method for the present invention and its core concept；Simultaneously for those of ordinary skill in the art, according to think of of the invention
Think, will change in specific embodiments and applications, in sum, it is right that this specification content should not be construed as
Limitation of the invention.
Claims (16)
1. a kind of preparation method of Rigid Flex, it is characterised in that including：
The FPC of the first pre-set dimension is made using FPC base material；
Make the rigid line plate of the second pre-set dimension；
Default jointing material is punched, the jointing material with open area is obtained；
The FPC, the jointing material with open area and the rigid line plate are overlapped successively, and in pressure
The Rigid Flex with region of uncapping is pressed into conjunction machine, wherein, the region of uncapping is corresponding with the open area；
The region of uncapping is punched out using the first mould, obtains Rigid Flex.
2. preparation method according to claim 1, it is characterised in that the default jointing material of punching, is had
The step of jointing material of open area, includes：
Default jointing material is punched using the second mould, the jointing material with open area is obtained.
3. preparation method according to claim 1 and 2, it is characterised in that uncapped edge including first in the region of uncapping
Uncapped edge with second, it is described the region of uncapping is punched out using the first mould, wrap the step of obtain Rigid Flex
Include：
It is punched completely using the first mould edge of being uncapped to the region first of uncapping；
Partial die cut is carried out using the first mould edge of being uncapped to the region second of uncapping, Rigid Flex is obtained.
4. preparation method according to claim 3, it is characterised in that the region of uncapping is the rectangle with layer structure
Region.
5. preparation method according to claim 4, it is characterised in that the layer structure includes the core plate of individual layer steel structure
Or the core plate of double-deck steel structure.
6. preparation method according to claim 4, it is characterised in that the partial die cut includes：It is punched to described uncapping
Region second is uncapped edge preset depth location.
7. preparation method according to claim 2, it is characterised in that first mould and/or the second mould include erosion
Icking tool mould, the etching cutting die is used in conjunction with the plastic former with servo motor so that the plastic former control etching cutting die enters
Row punching.
8. preparation method according to claim 1 and 2, it is characterised in that the jointing material is prepreg or epoxy
The pure glue of resin.
9. a kind of producing device of Rigid Flex, it is characterised in that including：
First makes module, the FPC for making the first pre-set dimension using FPC base material；
Second makes module, the rigid line plate for making the second pre-set dimension；
Jointing material is punched module, for being punched default jointing material, obtains the jointing material with open area；
Rigid Flex presses module, for successively by the FPC, the jointing material with open area and institute
Rigid line plate overlapping is stated, and the Rigid Flex with region of uncapping is pressed into pressing machine, wherein, the region of uncapping
It is corresponding with the open area；
Uncap module, for being punched out to the region of uncapping using the first mould, obtain Rigid Flex.
10. producing device according to claim 9, it is characterised in that the jointing material punching module includes：
Second mould is punched module, for being punched default jointing material using the second mould, obtains viscous with open area
Condensation material.
11. producing device according to claim 9 or 10, it is characterised in that uncapped side including first in the region of uncapping
Edge and second is uncapped edge, and the module of uncapping includes：
Module is punched completely, for being punched completely using the first mould edge of being uncapped to the region first of uncapping；
Partial die cut module, for carrying out partial die cut using the first mould edge of being uncapped to the region second of uncapping, obtains
Rigid Flex.
12. producing devices according to claim 11, it is characterised in that the region of uncapping is the square with layer structure
Shape region.
13. producing devices according to claim 11, it is characterised in that the layer structure includes the core of individual layer steel structure
The core plate of plate or double-deck steel structure.
14. producing devices according to claim 12, it is characterised in that the partial die cut includes：It is punched to described opening
Cover area second is uncapped edge preset depth location.
15. producing devices according to claim 10, it is characterised in that first mould and/or the second mould include
Etching cutting die, the etching cutting die is used in conjunction with the plastic former with servo motor so that the plastic former controls the etching cutting die
It is punched out.
16. producing device according to claim 9 or 10, it is characterised in that the jointing material is prepreg or ring
The pure glue of oxygen tree fat.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710134697.5A CN106879195A (en) | 2017-03-08 | 2017-03-08 | A kind of Rigid Flex preparation method and device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710134697.5A CN106879195A (en) | 2017-03-08 | 2017-03-08 | A kind of Rigid Flex preparation method and device |
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| CN201710134697.5A Pending CN106879195A (en) | 2017-03-08 | 2017-03-08 | A kind of Rigid Flex preparation method and device |
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| CN109760122A (en) * | 2018-12-24 | 2019-05-17 | 江苏弘信华印电路科技有限公司 | A kind of half cutting method of mold for taking off lid for rigid-flex combined board |
| CN110536567A (en) * | 2018-05-25 | 2019-12-03 | 庆鼎精密电子（淮安）有限公司 | The production method of rigid-flexible circuit board |
| CN110839316A (en) * | 2019-11-25 | 2020-02-25 | 深圳市景旺电子股份有限公司 | Three-layer layered soft board and manufacturing method thereof |
| CN112654178A (en) * | 2020-11-09 | 2021-04-13 | 广东科翔电子科技股份有限公司 | Process method of embedded pad type rigid-flex printed circuit board |
| CN112786561A (en) * | 2019-11-08 | 2021-05-11 | 奥特斯奥地利科技与系统技术有限公司 | Component carrier and method for producing the same |
| CN112888200A (en) * | 2021-01-21 | 2021-06-01 | 盐城维信电子有限公司 | Flexible circuit board processing method |
| CN114302565A (en) * | 2022-01-05 | 2022-04-08 | 安捷利电子科技（苏州）有限公司 | FPC with steps and preparation method thereof |
| CN114302577A (en) * | 2021-12-06 | 2022-04-08 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of soft and hard combined circuit board cover uncovering area |
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| CN110536567A (en) * | 2018-05-25 | 2019-12-03 | 庆鼎精密电子（淮安）有限公司 | The production method of rigid-flexible circuit board |
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| CN112888200A (en) * | 2021-01-21 | 2021-06-01 | 盐城维信电子有限公司 | Flexible circuit board processing method |
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| CN114302577A (en) * | 2021-12-06 | 2022-04-08 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of soft and hard combined circuit board cover uncovering area |
| CN114302577B (en) * | 2021-12-06 | 2023-07-14 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of soft and hard combined circuit board uncovering area |
| CN114302565A (en) * | 2022-01-05 | 2022-04-08 | 安捷利电子科技（苏州）有限公司 | FPC with steps and preparation method thereof |
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