CN208691629U - A kind of single-sided circuit board - Google Patents
A kind of single-sided circuit board Download PDFInfo
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- CN208691629U CN208691629U CN201821336616.6U CN201821336616U CN208691629U CN 208691629 U CN208691629 U CN 208691629U CN 201821336616 U CN201821336616 U CN 201821336616U CN 208691629 U CN208691629 U CN 208691629U
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- circuit
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- circuit board
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Abstract
The utility model embodiment discloses a kind of single-sided circuit board, comprising: circuit composite layer and substrate are equipped with insulation glue-line between circuit composite layer and substrate；Wherein, circuit composite layer includes the first single circuit, first single circuit includes the first conducting channel and the first insulating layer for being overlying in the first conducting channel, first conducting channel is die cut by same copper foil tape and is formed, first insulating layer is equipped with multiple apertures, and at least partly the first conducting channel is revealed in multiple apertures；First insulating layer is located at the most surface layer of single-sided circuit board, and substrate is located at the bottom of single-sided circuit board.By the above-mentioned means, the utility model embodiment can simplify the production technology of single-sided circuit board, production cost is reduced, improves production efficiency.
Description
Technical field
The utility model embodiment is related to field of circuit boards, more particularly to a kind of single-sided circuit board.
Background technique
Traditional board lead is usually all that copper-clad plate etches route, as shown in Figure 1, for the basic of single-sided circuit board
Technological process figure: (1) press-photosensitive oil-> (3) exposed photosensitive oil-of > (2) coating > (4) development-> (5) etching->
(6) film-> (7) printing welding resistance oil is moved back.Wherein, process (4) development is using sodium carbonate (Na2CO3) by unexposed photosensitive route
Oil dissolves, and the photosensitive route oil exposed then has occurred polymerization reaction and stays on copper face, is not eclipsed with the copper under protecting
Carve liquid medicine dissolution；Process (5) etching is using ferric trichloride (FeCl3) hydrochloric acid (HCl) is added as etching solution, by the copper on surface
Oxidation, exposed copper is removed；It is the photosensitive route using sodium hydroxide (NaOH) by protection on copper surface that process (6), which moves back film,
Oil removes.
Acidity used in the above process and alkaline solution to human body, have sizable harm to environment, and produce effect
Rate is low, and material and cost of labor are higher.
Summary of the invention
The utility model embodiment can simplify single side electricity mainly solving the technical problems that provide a kind of single-sided circuit board
The production technology of road plate reduces production cost, improves production efficiency.
In order to solve the above technical problems, the technical solution that the utility model embodiment uses is: providing a kind of single side
Circuit board, comprising: circuit composite layer and substrate are equipped with insulation glue-line between the circuit composite layer and the substrate；Wherein,
The circuit composite layer includes the first single circuit, and first single circuit includes the first conducting channel and is overlying on
The first insulating layer in first conducting channel, first conducting channel is die cut by same copper foil tape to be formed, and described first
Insulating layer is equipped with multiple apertures, and at least partly described first conducting channel is revealed in the multiple aperture；
First insulating layer is located at the most surface layer of the single-sided circuit board, and the substrate is located at the single-sided circuit board
The bottom.
Optionally, the circuit composite layer further includes N the second single circuit of layer (N >=1), and second single circuit includes
Second conducting channel and the second insulating layer being overlying in second conducting channel, second conducting channel is by same copper foil tape
Cross cutting is formed；
First single circuit and the N the second single circuit of layer form the multilayer circuit of one by pressing, described
First single circuit is located on the second single circuit of the N layer, wherein first single circuit and second single layer electricity
Insulation glue-line is equipped between road, between the second single circuit of adjacent two layers；
The multilayer circuit is equipped with upper and lower perforative drilling, passes through between each conducting channel of the multilayer circuit and is located at
Tin cream conducting in the drilling.
Optionally, first insulating layer and the second insulating layer are the high temperature resistant of lower surface epoxy resin coating glue
PET or PI film.
Optionally, the substrate is aluminum substrate or glass mat.
Optionally, first conducting channel is identical with the structure of second conducting channel.
In one embodiment, first single circuit is identical with the structure of second single circuit.
Optionally, the drilling is corresponding with the aperture on first insulating layer.
The beneficial effect of the utility model embodiment is: it is in contrast to the prior art, the utility model embodiment
The conducting channel of single-sided circuit board is die cut by copper foil tape to be formed, eliminate exposure development, pickling etching etc. processes, simple process and
Meet environmental requirement, the production technology of single-sided circuit board can be simplified, reduce production cost, improves production efficiency.
Detailed description of the invention
Fig. 1 is the process flow chart of the production single-sided circuit board of the prior art；
Fig. 2 is the process flow chart of the production single circuit of the utility model embodiment；
Fig. 3 is that single circuit and substrate are laminated incorporated schematic diagram by insulating cement by the utility model embodiment；
Fig. 4 is the process flow chart of the production circuit composite layer of the utility model embodiment；
Fig. 5 is that circuit composite layer and substrate are laminated incorporated signal by insulating cement by the utility model embodiment
Figure；
Fig. 6 is the structural schematic diagram of the single-surface single-layer circuit board of the utility model embodiment；
Fig. 7 is the structural schematic diagram of the single-side multi-layer circuit board of the utility model embodiment.
Specific embodiment
For the ease of understanding the utility model, in the following with reference to the drawings and specific embodiments, the utility model is carried out more detailed
Thin explanation.It should be noted that it can be directly in another element when element is expressed " being fixed on " another element
Upper or placed in the middle there may be one or more therebetween elements.When an element is expressed " connection " another element, it can
To be directly to another element or elements placed in the middle there may be one or more therebetween.This specification is used
Term "vertical", "horizontal", "left" and "right" and similar statement for illustrative purposes only.
Unless otherwise defined, technical and scientific term all used in this specification and the skill for belonging to the utility model
The normally understood meaning of the technical staff in art field is identical.Art used in the description of the utility model in this specification
Language, which is only for the purpose of describing specific embodiments, is not intended to limitation the utility model.Term used in this specification
"and/or" includes any and all combinations of one or more related listed items.
Embodiment 1
The present embodiment provides a kind of manufacturing methods of single-surface single-layer circuit board, comprising the following steps:
110: the single circuit of production single side tool insulating layer, the manufacturing method of the single circuit specifically include:
111: insulating layer being provided, is die cut out multiple apertures on the insulating layer.
112: copper foil tape being provided, cuts out conducting channel in copper foil tape upper mold.
113: the copper foil tape after the insulating layer and cross cutting after cross cutting being subjected to hot pressing, obtains single circuit, at least partly
Conducting channel is revealed in multiple apertures.
Wherein, it is die cut out on the insulating layer by the way of the rolling of rotation mold or flat plate mold punching press in step 111
Multiple apertures, multiple apertures are used to that the partially electronically conductive circuit in single circuit to be made to expose, and are used for erecting and welding electronics
Component, such as capacitor, resistance, diode.
It also cuts out and leads in copper foil tape upper mold by the way of the rolling of rotation mold or flat plate mold punching press in step 112
Circuit, the wirings of die-cuttable rules various out or irregular shape, without the processes such as exposure development, pickling etching, work
Skill is simple and meets environmental requirement, reduces production cost, improves production efficiency.
In one embodiment, insulating layer is high temperature resistant PET or the PI film of one side coating epoxide-resin glue, in step 113
After copper foil tape after insulating layer and cross cutting after cross cutting is carried out hot pressing, insulating layer is coated with the one side of epoxide-resin glue and leads
Circuit fitting.
120: substrate is provided.
130: single circuit and substrate being laminated integrator by insulating cement, obtain single-surface single-layer circuit board, insulating layer
The upper and lower surface of single-surface single-layer circuit board is located at substrate, the first insulating layer is set to the most table of single-surface single-layer circuit board
Layer, substrate are set to the bottom of single-surface single-layer circuit board.
When it is implemented, substrate selects aluminum substrate or glass mat, insulation glue-line can use epoxy resin, can also be with
Using heat-conducting glue, before being pressed, the upper surface that insulating cement is coated on substrate first can be formed into insulation glue-line, Huo Zhezhi
Connect the upper surface that molded insulation glue-line is placed in substrate.
Referring to Fig. 2, Fig. 2 is the process flow chart for making single circuit, wherein 1 is insulating layer, and 2 be copper foil tape, first
First, by the way of rotation mold rolling, it is to turn upper mould the first round that multiple apertures 11,31 are punched on insulating layer 1,32
Turn lower mould for the first round；Similarly, by the way of rotation mold rolling, conducting channel 21 is cut out in 2 upper mold of copper foil tape,
22 be copper bound material (waste material), and 41 be the second rotation upper mould, and 42 be the second rotation lower mould.
Then, the copper foil tape 2 after the insulating layer 1 and cross cutting after cross cutting is subjected to hot pressing, obtains single circuit, 51 be heat
It is taken turns on pinch roller, 52 be heat pressing wheel lower whorl.
As shown in figure 3, the glue-line 6 that insulate first to be placed in the upper surface of substrate 7, then single circuit and substrate 7 are pressed into
One, obtains single-surface single-layer circuit board, the insulating layer 1 with multiple apertures 11 is located at the most surface layer of single-surface single-layer circuit board, base
Plate 7 is located at the bottom of single-surface single-layer circuit board.
The manufacturing method of the single-surface single-layer circuit board of the present embodiment includes being die cut and pressing twice twice, by using rotation
The mode of mold rolling or flat plate mold punching press, cuts out conducting channel in copper foil tape upper mold, eliminates exposure development, pickling etching
Etc. processes, simple process and meet environmental requirement, the production technology of single-surface single-layer circuit board can be simplified, reduce production cost,
Improve production efficiency.
Embodiment 2
The present embodiment provides a kind of manufacturing methods of single-side multi-layer circuit board, comprising the following steps:
210: the circuit composite layer of production single side tool insulating layer, which includes the first single circuit and N layers of (N
>=1) the second single circuit.
The manufacturing method of circuit composite layer specifically includes:
211: the first insulating layer being provided, is die cut out multiple apertures on the first insulating layer.
212: the first copper foil tape being provided, cuts out the first conducting channel in the first copper foil tape upper mold.
213: the first copper foil tape after the first insulating layer and cross cutting after cross cutting being subjected to hot pressing, obtains the first single layer electricity
Road, at least partly the first conducting channel are revealed in multiple apertures.
214: second insulating layer is provided.
215: the second copper foil tape being provided, cuts out the second conducting channel in the second copper foil tape upper mold.
216: the second copper foil tape after second insulating layer and cross cutting being subjected to hot pressing, obtains the second single circuit.
Step 214-216 is repeated, until required N the second single circuit of layer is made.
217: the first single circuit and the second single circuit of N layer being laminated integrator by insulating cement, obtain multilayer electricity
Road, the first single circuit are located on N the second single circuit of layer, wherein between the first single circuit and the second single circuit, phase
Insulation glue-line is equipped between adjacent two layers of second single circuits.
218: the position for needing to be connected on multilayer circuit carries out drilling operation, forms drilling.
219: furnace is crossed after injecting tin cream in the borehole, so as to be connected between each conducting channel of multilayer circuit, to be formed
Circuit composite layer.
Wherein, in step 211 by the way of the rolling of rotation mold or flat plate mold punching press, mould on the first insulating layer
Multiple apertures are cut out, multiple apertures are used to that the partially electronically conductive circuit in the first single circuit to be made to expose, and for installing
Welding electronic component, such as capacitor, resistance, diode.
In step 212 and 215 also by the way of the rolling of rotation mold or flat plate mold punching press, in the first copper foil tape mould
The first conducting channel is cut out, cuts out the second conducting channel, die-cuttable rules various out or irregular shapes in the second copper foil tape upper mold
The wiring of shape the processes such as etches without exposure development, pickling, simple process and meets environmental requirement, reduce and be produced into
This, improves production efficiency.
First insulating layer and second insulating layer are high temperature resistant PET or the PI film of one side coating epoxide-resin glue, in step
After the first copper foil tape after the first insulating layer and cross cutting after cross cutting is carried out hot pressing in 213, the first insulating layer is coated with ring
The one side of oxygen resin glue is bonded with the first conducting channel；In the step 216, by the second copper foil tape after second insulating layer and cross cutting
After carrying out hot pressing, the one side that second insulating layer is coated with epoxide-resin glue is bonded with the second conducting channel.
It in step 218, is the insulating layer for avoiding damage to most surface, preferably scheme, drills and the first insulating layer
Aperture it is corresponding, when carrying out drilling operation, opened from the first conducting channel being revealed in aperture in the first single circuit
Begin to drill, until the second conducting channel in the second single circuit of the last layer.Leading between each conducting channel of multilayer circuit
Lead to by the way of drilling, injection tin cream, compared with traditional via hole plating mode, technique is more simple, further improves
Production efficiency.
It should be noted that, for the spending for saving mold, being generallyd use in step 212 and 215 same in practical application
Mold is die cut the first copper foil tape and the second copper foil tape, that is, the first conducting channel is consistent with the structure of the second conducting channel.And
Step 214, the mold in step 211 can also be used and be die cut out multiple apertures over the second dielectric, therefore, the first single circuit
Structure with the second single circuit can be just the same.
When the structure of the first single circuit and the second single circuit is just the same, which actually includes (N
+ 1) layer single circuit.
220: substrate is provided.
230: circuit composite layer and substrate are laminated integrator by insulating cement, obtain single-side multi-layer circuit board, first
Insulating layer is set to the most surface layer of single-side multi-layer circuit board, and substrate is set in the bottom of single-side multi-layer circuit board.
When it is implemented, substrate selects aluminum substrate or glass mat, insulation glue-line can use epoxy resin, can also be with
Using heat-conducting glue, before being pressed, the upper surface that insulating cement is coated on substrate first can be formed into insulation glue-line, Huo Zhezhi
Connect the upper surface that molded insulation glue-line is placed in substrate.
Referring to Fig. 4, Fig. 4 is the process flow chart for making circuit composite layer, which includes 3 layers of single layer electricity
The structure on road, every layer of single circuit is consistent, and each single circuit includes insulating layer 1 and conducting channel with multiple apertures 11
21, conducting channel 21 is die cut by same copper foil tape and is formed.
3 layers of single circuit are pressed integrally by the glue-line 6 that insulate, obtain multilayer circuit, wherein adjacent two layers single layer electricity
Insulation glue-line 6 is equipped between road.The position for needing to be connected on multilayer circuit carries out drilling operation, forms drilling, specifically, from
Start to drill at the conducting channel being revealed in first layer single circuit in aperture 11, until leading in the last layer single circuit
Circuit.Then furnace is crossed after injecting tin cream 8 in the borehole, so as to be connected between each conducting channel 21 of multilayer circuit.
As shown in figure 5, the glue-line 6 that insulate first to be placed in the upper surface of substrate 7, then circuit composite layer and substrate 7 are pressed
Integrally, single-side multi-layer circuit board is obtained, the insulating layer 1 with multiple apertures 11 is located at the most surface layer of single-side multi-layer circuit board,
Substrate 7 is located at the bottom of single-side multi-layer circuit board.
The single-side multi-layer circuit board of the present embodiment includes multilayer circuit, and the conducting channel in each layer of circuit is all made of rotation
The mode of mold rolling or flat plate mold punching press is die cut formation in copper foil tape, eliminates the processes such as exposure development, pickling etching,
Simple process and meet environmental requirement, by the way of the conducting between each conducting channel of multilayer circuit is using drilling, injecting tin cream,
Compared with traditional via hole plating mode, technique is more simple, can simplify the production technology of single-side multi-layer circuit board, reduces life
Cost is produced, production efficiency is improved.
Embodiment 3
The present embodiment provides a kind of single-surface single-layer circuit boards, as shown in Figure 6, comprising: single circuit 10 and substrate 30, single layer
Insulation glue-line 20 is equipped between circuit 10 and substrate 30；Wherein, single circuit 10 includes conducting channel 102 and is overlying on conducting channel
Insulating layer 101 on 102, conducting channel 102 are die cut by same copper foil tape and are formed, and insulating layer 101 is equipped with multiple apertures 1010,
At least partly conducting channel 102 is revealed in multiple apertures 1010；Insulating layer 101 is located at the most surface layer of single-surface single-layer circuit board,
Substrate 30 is located at the bottom of single-surface single-layer circuit board.
Multiple apertures 1010 are used to that the partially electronically conductive circuit 102 in single circuit 10 to be made to expose, and for installing
Welding electronic component, such as capacitor, resistance, diode.
Conducting channel 102 can be the wiring of various rules or irregular shape, specifically, rotation mold rolling can be used
Pressure or the mode of flat plate mold punching press are die cut to be formed, and the processes such as etch without exposure development, pickling, simple process and meet environmental protection
It is required that reducing production cost, production efficiency is improved.
In one embodiment, insulating layer 101 is high temperature resistant PET or the PI film of lower surface epoxy resin coating glue, substrate 30
For aluminum substrate or glass mat.
Embodiment 4
The present embodiment provides a kind of single-side multi-layer circuit boards, as shown in fig. 7, comprises: circuit composite layer 100 and substrate 300,
Insulation glue-line 200 is equipped between circuit composite layer 100 and substrate 300；Wherein, circuit composite layer 100 includes the first single circuit
110 and N layer the second single circuit 120 (N >=1).
The first insulating layer that first single circuit 110 conducting channel 112 and be overlying in the first conducting channel 111 including first
111, the first conducting channel 112 is die cut by same copper foil tape to be formed, and the first insulating layer 111 is equipped with multiple apertures 1110, at least
The first conducting channel of part 112 is revealed in the multiple aperture 1110；First insulating layer 111 is located at single-side multi-layer circuit board
Most surface layer, substrate 300 are located at the bottom of single-side multi-layer circuit board.
Multiple apertures 1110 are used to that the first conducting channel of part 112 in the first single circuit 110 to be made to expose, and
For erecting and welding electronic component, such as capacitor, resistance, diode.
The second insulating layer that second single circuit 120 conducting channel 122 and be overlying in the second conducting channel 122 including second
121, the second conducting channel 122 is die cut by same copper foil tape to be formed.
First single circuit 110 and the second single circuit of N layer 120 form the multilayer circuit of one by pressing, and first is single
Layer circuit 110 is located on the second single circuit of N layer 120, wherein the first single circuit 110 and the second single circuit 120 it
Between, insulation glue-line 200 is equipped between the second single circuit of adjacent two layers 120.
It is equipped with perforative drilling 130 up and down on multilayer circuit, passes through the tin cream 140 in drilling between multilayer circuit
Conducting.
Preferably scheme, for the insulating layer for avoiding damage to most surface, drilling 130 and opening on the first insulating layer 111
Hole 1110 is corresponding, when carrying out drilling operation, the conductive electricity of first be revealed in from the first single circuit 110 in aperture 1110
Start to drill at road 112, until the second conducting channel 122 in the second single circuit of the last layer 120.
First conducting channel 112 and the second conducting channel 122 can be the wiring of various rules or irregular shape, tool
Body, the mode that the rolling of rotation mold or flat plate mold punching press can be used is die cut to be formed, etched without exposure development, pickling etc.
Process, simple process and meets environmental requirement, reduces production cost, improves production efficiency.
It is and traditional by the way of conducting between each conducting channel 112,122 of multilayer circuit is using drilling, injecting tin cream
Via hole plating mode is compared, and technique is more simple, further improves production efficiency.
First insulating layer and second insulating layer are high temperature resistant PET or the PI film of lower surface epoxy resin coating glue.
It should be noted that, for the spending for saving mold, generalling use same mold to the first copper foil tape in practical application
It is die cut with the second copper foil tape, that is, the first conducting channel 112 is consistent with the structure of the second conducting channel 122.Similarly, second absolutely
Multiple apertures can also be equipped in edge layer 121, therefore, the structure of the first single circuit 110 and the second single circuit 120 can be complete
It is complete the same.When the structure of the first single circuit 110 and the second single circuit 120 is just the same, the circuit composite layer is actually
Including (N+1) layer single circuit.
In one embodiment, substrate 300 is aluminum substrate or glass mat.
The above description is only the embodiments of the present invention, is not intended to limit the scope of the utility model, all utilizations
Equivalent structure or equivalent flow shift made by the utility model specification and accompanying drawing content, is applied directly or indirectly in other
Relevant technical field similarly includes within the protection scope of the present utility model.
Claims (7)
1. a kind of single-sided circuit board characterized by comprising circuit composite layer and substrate, the circuit composite layer and the base
Insulation glue-line is equipped between plate；Wherein,
The circuit composite layer includes the first single circuit, and first single circuit includes the first conducting channel and is overlying on described
The first insulating layer in first conducting channel, first conducting channel is die cut by same copper foil tape to be formed, first insulation
Layer is equipped with multiple apertures, and at least partly described first conducting channel is revealed in the multiple aperture；
First insulating layer is located at the most surface layer of the single-sided circuit board, and the substrate is located at the most bottom of the single-sided circuit board
Layer.
2. single-sided circuit board according to claim 1, which is characterized in that
The circuit composite layer further includes N the second single circuit of layer (N >=1), and second single circuit includes the second conductive electricity
Road and the second insulating layer being overlying in second conducting channel, second conducting channel is die cut by same copper foil tape to be formed；
First single circuit and the N the second single circuit of layer, which pass through to press, forms integrated multilayer circuit, and described first
Single circuit is located on the second single circuit of the N layer, wherein first single circuit and second single circuit it
Between, between the second single circuit of adjacent two layers be equipped with insulation glue-line；
The multilayer circuit is equipped with upper and lower perforative drilling, described by being located between each conducting channel of the multilayer circuit
Tin cream conducting in drilling.
3. single-sided circuit board according to claim 2, which is characterized in that
First insulating layer and the second insulating layer are high temperature resistant PET or the PI film of lower surface epoxy resin coating glue.
4. single-sided circuit board according to claim 2, which is characterized in that
The substrate is aluminum substrate or glass mat.
5. single-sided circuit board according to claim 2, which is characterized in that
First conducting channel is identical with the structure of second conducting channel.
6. single-sided circuit board according to claim 5, which is characterized in that
First single circuit is identical with the structure of second single circuit.
7. single-sided circuit board according to claim 2, which is characterized in that
The drilling is corresponding with the aperture on first insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821336616.6U CN208691629U (en) | 2018-08-16 | 2018-08-16 | A kind of single-sided circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821336616.6U CN208691629U (en) | 2018-08-16 | 2018-08-16 | A kind of single-sided circuit board |
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| Publication Number | Publication Date |
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| CN208691629U true CN208691629U (en) | 2019-04-02 |
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ID=65885995
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901139A (en) * | 2018-08-16 | 2018-11-27 | 鹤山市得润电子科技有限公司 | A kind of single-sided circuit board and its manufacturing method |
-
2018
- 2018-08-16 CN CN201821336616.6U patent/CN208691629U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901139A (en) * | 2018-08-16 | 2018-11-27 | 鹤山市得润电子科技有限公司 | A kind of single-sided circuit board and its manufacturing method |
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