CN108990322A - A kind of double-sided PCB and its manufacturing method - Google Patents
A kind of double-sided PCB and its manufacturing method Download PDFInfo
- Publication number
- CN108990322A CN108990322A CN201810933739.6A CN201810933739A CN108990322A CN 108990322 A CN108990322 A CN 108990322A CN 201810933739 A CN201810933739 A CN 201810933739A CN 108990322 A CN108990322 A CN 108990322A
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- Prior art keywords
- single circuit
- conducting channel
- circuit
- insulating layer
- drilling
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 80
- 239000010410 layer Substances 0.000 claims abstract description 318
- 238000005553 drilling Methods 0.000 claims abstract description 162
- 239000000758 substrate Substances 0.000 claims abstract description 111
- 239000004568 cement Substances 0.000 claims abstract description 27
- 239000002344 surface layer Substances 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 98
- 239000011889 copper foil Substances 0.000 claims description 90
- 239000006071 cream Substances 0.000 claims description 44
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 43
- 239000002356 single layer Substances 0.000 claims description 36
- 238000005520 cutting process Methods 0.000 claims description 34
- 238000009413 insulation Methods 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 30
- 238000005096 rolling process Methods 0.000 claims description 23
- 238000004080 punching Methods 0.000 claims description 22
- 238000007731 hot pressing Methods 0.000 claims description 21
- 230000005611 electricity Effects 0.000 claims description 20
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims 1
- 238000003786 synthesis reaction Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 7
- 239000003292 glue Substances 0.000 description 21
- 239000003822 epoxy resin Substances 0.000 description 19
- 229920000647 polyepoxide Polymers 0.000 description 19
- 239000010949 copper Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000007613 environmental effect Effects 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000005554 pickling Methods 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000001788 irregular Effects 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The embodiment of the invention discloses a kind of double-sided PCB and its manufacturing method, manufacturing method is the following steps are included: (1) production single side has the first single circuit of insulating layer；(2) the second single circuit of production single side tool insulating layer；(5) substrate is provided, the position for needing to be connected up and down on substrate carries out first time drilling operation, forms the first drilling, and fill up insulating cement in the first drilling；(6) the first single circuit and the second single circuit are placed in the upper and lower surface of substrate respectively, and the first single circuit, the second single circuit and substrate are laminated integrator by insulating cement, double-sided PCB young bird plate is obtained, the first insulating layer and second insulating layer are located at most surface layer and the bottom of double-sided PCB young bird plate.By the above-mentioned means, the embodiment of the present invention can simplify the production technology of double-sided PCB, production cost is reduced, improves production efficiency.
Description
Technical field
The present embodiments relate to field of circuit boards, more particularly to a kind of double-sided PCB and its manufacturing method.
Background technique
Traditional board lead is usually all that copper-clad plate etches route, is double-sided PCB as depicted in figs. 1 and 2
Basic technological process figure: (1) the drilling-> two-sided pressing copper foil-in (2) sealing-> (3) > (4) secondary drilling-> (5)
In hole copper facing-> (6) coat photosensitive oil-> (7) exposed photosensitive oil-> (8) development-> (9) etch-> (10) move back film->
(11) printing welding resistance oil.
Wherein, process (8) development is using sodium carbonate (Na2CO3) dissolve unexposed photosensitive route oil, and expose
Photosensitive route oil then have occurred polymerization reaction and stay on copper face, liquid medicine dissolution is not etched with the copper under protecting；Process
(9) etching is using ferric trichloride (FeCl3) hydrochloric acid (HCl) is added as etching solution, the copper on surface is aoxidized, it will be exposed
Copper removes；It is that the photosensitive route oil on copper surface will be protected to remove using sodium hydroxide (NaOH) that process (10), which moves back film,.
Acidity used in the above process and alkaline solution to human body, have sizable harm to environment, and produce effect
Rate is low, and material and cost of labor are higher.
Summary of the invention
The embodiment of the present invention is mainly solving the technical problems that provide a kind of double-sided PCB and its manufacturing method, Neng Goujian
Change the production technology of double-sided PCB, reduce production cost, improves production efficiency.
In order to solve the above technical problems, a technical solution used in the embodiment of the present invention is: providing a kind of double-sided circuit
The manufacturing method of plate, comprising the following steps:
(1) the first single circuit of production single side tool insulating layer, the manufacturing method of first single circuit include:
1.1 provide the first insulating layer, are die cut out multiple apertures on the first insulating layer；
1.2 provide the first copper foil tape, cut out the first conducting channel in the first copper foil tape upper mold；
The first copper foil tape after the first insulating layer and cross cutting after cross cutting is carried out hot pressing by 1.3, and it is single to obtain described first
Layer circuit, at least partly described first conducting channel are revealed in multiple apertures of first insulating layer；
(2) the second single circuit of production single side tool insulating layer, the manufacturing method of second single circuit include:
2.1 provide second insulating layer, are die cut out multiple apertures on the second insulating layer；
2.2 provide the second copper foil tape, cut out the second conducting channel in the second copper foil tape upper mold；
Second insulating layer after cross cutting and the second copper foil tape after cross cutting are carried out hot pressing by 2.3, and it is single to obtain described second
Layer circuit, at least partly described second conducting channel are revealed in multiple apertures of the second insulating layer；
(5) substrate is provided, the position for needing to be connected up and down on the substrate carries out first time drilling operation, forms first
Drilling, and insulating cement is filled up in first drilling；
(6) first single circuit and second single circuit are placed in the upper and lower surface of the substrate respectively,
And first single circuit, second single circuit and the substrate are laminated integrator by insulating cement, it obtains double
Face circuit board young bird plate, first insulating layer and the second insulating layer are located at the most surface layer of the double-sided PCB young bird plate
And the bottom；
(7) it is corresponded on the double-sided PCB young bird plate and carries out second of drilling operation at the position of first drilling,
The second drilling is formed, the size of second drilling is less than first drilling；
(9) furnace is crossed after injecting tin cream in second drilling, obtains the double-sided PCB, first conducting channel
It is connected between second conducting channel by the tin cream.
Optionally, after step (2), the manufacturing method further include:
(3) the third single circuit of production single side tool insulating layer, the manufacturing method of the third single circuit include:
3.1 provide third insulating layer；
3.2 provide third copper foil tape, cut out third conducting channel in the third copper foil tape upper mold；
Third copper foil tape after the third insulating layer and cross cutting is carried out hot pressing by 3.3, obtains the third single layer electricity
Road；
Step 3.1-3.3 is repeated, until the required N layer third single circuit (N >=1) is made；
In step (6), first single circuit and second single circuit are being placed in the substrate respectively
Upper and lower surface after, further includes:
The N layers of third single circuit are placed between first single circuit and second single circuit, and
The third conducting channel of each third single circuit is compared with third insulating layer described in its closer to the substrate；
Then, described be laminated first single circuit, second single circuit and the substrate by insulating cement is closed
Integrally, specifically:
First single circuit, second single circuit, the N layers of third single circuit and the substrate are passed through
Insulating cement is laminated integrator, wherein is equipped with insulation between adjacent two layers single circuit, between single circuit and the substrate
Glue-line.
Optionally, after step (3), the manufacturing method further include:
(4) the 4th single circuit of production single side tool insulating layer, the manufacturing method of the 4th single circuit include:
4.1 provide the 4th insulating layer；
4.2 provide the 4th copper foil tape, cut out the 4th conducting channel in the 4th copper foil tape upper mold；
The 4th copper foil tape after 4th insulating layer and cross cutting is carried out hot pressing by 4.3, obtains the 4th single layer electricity
Road；
Step 4.1-4.3 is repeated, until required M layer the 4th single circuit (M >=1) is made；
In step (6), the N layers of third single circuit are being placed in first single circuit and second list
After between layer circuit, further includes:
M layers of the 4th single circuit are placed between first single circuit and second single circuit, and
4th conducting channel of each 4th single circuit is compared with the 4th insulating layer described in its closer to the substrate；
Then, described by first single circuit, second single circuit, N layers of third single circuit and described
Substrate is laminated integrator by insulating cement, specifically:
By first single circuit, second single circuit, the N layers of third single circuit, M layers of the 4th list
Layer circuit and the substrate by insulating cement are laminated integrator, wherein between adjacent two layers single circuit, single circuit and institute
It states and is equipped with insulation glue-line between substrate.
In one embodiment, described that the N layers of third single circuit are placed in first single circuit and described
Between two single circuits, specifically:
The N layers of third single circuit are placed between first single circuit and the substrate, described first
Single circuit and the N layers of third single circuit form the first multilayer circuit；
It is described by M layers of the 4th single circuit be placed in first single circuit and second single circuit it
Between, specifically:
M layers of the 4th single circuit are placed between the substrate and second single circuit, described second
Single circuit and M layers of the 4th single circuit form the second multilayer circuit；
In one embodiment, second drilling is without third conducting channel in first multilayer circuit and described
The 4th conducting channel in second multilayer circuit；
After step (7), the manufacturing method further include:
(8) position for needing to be connected on first multilayer circuit carries out third time drilling operation, forms third drilling,
And the position for needing to be connected on second multilayer circuit carries out the 4th drilling operation, forms the 4th drilling；
In step (9), after injecting tin cream in second drilling, further includes:
Tin cream is injected in third drilling and in described 4th time drilling.
Optionally, in step 1.1 by the way of the rolling of rotation mold or flat plate mold punching press, in first insulation
Layer upper mold cuts out multiple apertures；
In step 1.2 by the way of the rolling of rotation mold or flat plate mold punching press, in the first copper foil tape upper mold
Cut out the first conducting channel；
In step 2.2 by the way of the rolling of rotation mold or flat plate mold punching press, in the second copper foil tape upper mold
Cut out the second conducting channel；
In step 3.2 by the way of the rolling of rotation mold or flat plate mold punching press, in the third copper foil tape upper mold
Cut out third conducting channel；
In step 4.2 by the way of the rolling of rotation mold or flat plate mold punching press, in the 4th copper foil tape upper mold
Cut out the 4th conducting channel.
The embodiment of the present invention also provides a kind of double-sided PCB, comprising: the first single circuit, the second single circuit and base
Plate, first single circuit and second single circuit are respectively arranged on the upper and lower surface of the substrate, first single layer
Insulation glue-line is equipped between circuit and the substrate, between second single circuit and the substrate；Wherein,
First single circuit includes the first conducting channel and the first insulating layer for being overlying in first conducting channel,
First conducting channel is die cut by same copper foil tape to be formed, and first insulating layer is equipped with multiple apertures, at least partly institute
The first conducting channel is stated to be revealed in multiple apertures of first insulating layer；
Second single circuit includes the second conducting channel and the second insulating layer under second conducting channel,
Second conducting channel is die cut by same copper foil tape to be formed, and the second insulating layer is equipped with multiple apertures, at least partly institute
It states the second conducting channel to be revealed in multiple apertures of the second insulating layer, first insulating layer and the second insulating layer
It is located at most surface layer and the bottom of the double-sided PCB；
The substrate is equipped with the first drilling, and the double-sided PCB is equipped with upper at the position of correspondence first drilling
Under it is perforative second drilling, it is described second drilling size be less than it is described first drilling；
It is filled with tin cream in second drilling, passes through institute between first conducting channel and second conducting channel
Tin cream conducting is stated, is filled with insulating cement between second drilling and first drilling.
Optionally, double-sided PCB further include:
N layers of third single circuit (N >=1), the N layers of third single circuit are located at first single circuit and described
Insulation glue-line is equipped between two single circuits, between adjacent two layers single circuit；
Each third single circuit includes that third conducting channel and the third being bonded with the third conducting channel are exhausted
Edge layer, the third conducting channel is die cut by same copper foil tape to be formed, and the conductive electricity of third of each third single circuit
Road is compared with third insulating layer described in its closer to the substrate；
And/or
The 4th single circuit (M >=1) of M layer, the 4th single circuit of M layer are located at first single circuit and described
Insulation glue-line is equipped between two single circuits, between adjacent two layers single circuit；
Each 4th single circuit include the 4th conducting channel and be bonded with the 4th conducting channel
Four insulating layers, the 4th conducting channel is die cut by same copper foil tape to be formed, and the 4th of each 4th single circuit leads
Circuit is compared with the 4th insulating layer described in its closer to the substrate.
Optionally, when the double-sided PCB includes the 4th single circuit of the N layers of third single circuit and M layer
When, the N layers of third single circuit is respectively positioned between first single circuit and the substrate, first single circuit and
The N layers of third single circuit forms the first multilayer circuit；
The 4th single circuit of M layer is respectively positioned between the substrate and second single circuit, second single layer
Circuit and the 4th single circuit of M layer form the second multilayer circuit.
In one embodiment, second drilling is without third conducting channel in first multilayer circuit and described
The 4th conducting channel in second multilayer circuit；
First multilayer circuit is equipped with perforative third drilling up and down, each conducting channel of first multilayer circuit
Pass through the tin cream conducting being located in third drilling；
Second multilayer circuit is equipped with perforative 4th drilling up and down, each conducting channel of second multilayer circuit
Pass through the tin cream conducting being located in the 4th drilling.
The beneficial effect of the embodiment of the present invention is: being in contrast to the prior art, the double-sided circuit of the embodiment of the present invention
Two sides include one layer of conducting channel to the substrate of plate up and down, and conducting channel is rolled using rotation mold or the side of flat plate mold punching press
Formula is die cut formation in copper foil tape, eliminates the processes such as exposure development, pickling etching, simple process and meets environmental requirement, on
Conducting between underlying conductive circuit is by the way of drilling, injection tin cream, and compared with traditional via hole plating mode, technique is more
To be simple, the production technology of two-sided single layer board can be simplified, reduce production cost, improve production efficiency.
Detailed description of the invention
Fig. 1 is the process flow chart one of the production double-sided PCB of the prior art；
Fig. 2 is the process flow chart two of the production double-sided PCB of the prior art；
Fig. 3 is the process flow chart of the production single circuit of the embodiment of the present invention；
Fig. 4 is the schematic diagram of the embodiment of the present invention to drill on substrate and fill insulating cement；
Fig. 5 is that two layers of single circuit and substrate are laminated incorporated signal by insulating cement by the embodiment of the present invention
Figure；
Fig. 6 is the schematic diagram for drilling and injecting tin cream on two-sided single layer board young bird plate of the embodiment of the present invention；
Fig. 7 is that multilayer single circuit and substrate are laminated incorporated signal by insulating cement by the embodiment of the present invention
Figure；
Fig. 8 is the schematic diagram for drilling and injecting tin cream on double-sided multi-layer circuit board young bird plate of the embodiment of the present invention；
Fig. 9 is the structural schematic diagram of the two-sided single layer board of the embodiment of the present invention；
Figure 10 is the structural schematic diagram of the double-sided multi-layer circuit board of the embodiment of the present invention.
Specific embodiment
To facilitate the understanding of the present invention, in the following with reference to the drawings and specific embodiments, the present invention will be described in more detail.
It should be noted that be expressed " being fixed on " another element when element, it can directly on the other element or therebetween
There may be one or more elements placed in the middle.When an element is expressed " connection " another element, it, which can be, directly connects
It is connected to another element or there may be one or more elements placed in the middle therebetween.Term used in this specification is " vertical
", " horizontal ", "left", "right" and similar statement for illustrative purposes only.
Unless otherwise defined, technical and scientific term all used in this specification is led with technology of the invention is belonged to
The normally understood meaning of the technical staff in domain is identical.Used term is only in the description of the invention in this specification
The purpose of description specific embodiment is not intended to the limitation present invention.Term "and/or" used in this specification includes one
Any and all combinations of a or multiple relevant listed items.
Embodiment 1
The present embodiment provides a kind of manufacturing methods of two-sided single layer board, comprising the following steps:
110: the first single circuit of production single side tool insulating layer, the manufacturing method of the first single circuit specifically include:
111: the first insulating layer being provided, is die cut out multiple apertures on the first insulating layer.
112: the first copper foil tape being provided, cuts out the first conducting channel in the first copper foil tape upper mold.
113: the first copper foil tape after the first insulating layer and cross cutting after cross cutting being subjected to hot pressing, obtains the first single layer electricity
Road, at least partly the first conducting channel are revealed in multiple apertures of the first insulating layer.
120: the second single circuit of production single side tool insulating layer, the manufacturing method of the second single circuit specifically include:
121: second insulating layer being provided, is die cut out multiple apertures over the second dielectric.
122: the second copper foil tape being provided, cuts out the second conducting channel in the second copper foil tape upper mold.
123: the second insulating layer after cross cutting and the second copper foil tape after cross cutting being subjected to hot pressing, obtain the second single layer electricity
Road, at least partly the second conducting channel are revealed in multiple apertures of second insulating layer.
Wherein, in step 111 by the way of the rolling of rotation mold or flat plate mold punching press, mould on the first insulating layer
Multiple apertures are cut out, multiple apertures are used to that the first conducting channel of part in the first single circuit to be made to expose, and are used for
Erecting and welding electronic component, such as capacitor, resistance, diode.
It is also die cut in the first copper foil tape by the way of the rolling of rotation mold or flat plate mold punching press in step 112
First conducting channel out, the wirings of die-cuttable rules various out or irregular shape, etched without exposure development, pickling etc.
Process, simple process and meets environmental requirement, reduces production cost, improves production efficiency.
Similarly, in step 121 by the way of the rolling of rotation mold or flat plate mold punching press, over the second dielectric
Multiple apertures are die cut out, multiple apertures are for exposing the second conducting channel of part in the second single circuit, Yi Jiyong
In erecting and welding electronic component, such as capacitor, resistance, diode.In step 122 also using the rolling of rotation mold or plate
The mode of mould punching cuts out the second conducting channel, die-cuttable rules various out or irregular shapes in the second copper foil tape upper mold
Wiring.
In one embodiment, the first insulating layer and second insulating layer are the high temperature resistant PET of one side coating epoxide-resin glue
Or PI film, after the first copper foil tape after the first insulating layer and cross cutting after cross cutting is carried out hot pressing in step 113, first absolutely
The one side that edge layer is coated with epoxide-resin glue is bonded with the first conducting channel, by the second insulating layer after cross cutting in step 123
After carrying out hot pressing with the second copper foil tape after cross cutting, second insulating layer is coated with the one side and the second conductive electricity of epoxide-resin glue
Road fitting.
130: providing substrate, the position for needing to be connected up and down on substrate carries out first time drilling operation, forms first and bores
Hole, and insulating cement is filled up in the first drilling.
140: the first single circuit and the second single circuit being placed in the upper and lower surface of substrate respectively, and by the first single layer
Circuit, the second single circuit and substrate are laminated integrator by insulating cement, obtain double-sided PCB young bird plate, the first insulating layer and
Second insulating layer is located at most surface layer and the bottom of double-sided PCB young bird plate.
When it is implemented, substrate selects aluminum substrate or glass mat, insulation glue-line can use epoxy resin, or lead
The upper and lower surface that insulating cement is coated on substrate first can be formed insulation glue-line, or directly will before being pressed by hot glue
Molded insulation glue-line is placed in the upper and lower surface of substrate.
150: carrying out second of drilling operation at the position of corresponding first drilling on double-sided PCB young bird plate, form second
Drilling, the size of the second drilling is less than the first drilling.
It should be noted that the size that second drills need to be less than the first drilling, so that also there are partially exhausted in the first drilling
Edge glue.
To avoid damage to outermost insulating layer, preferably scheme, the aperture phase of the first drilling and the first insulating layer
It is corresponding, when carrying out second of drilling operation, since at the first conducting channel being revealed in the first single circuit in aperture
Drilling, until the second conducting channel in the second single circuit.Alternatively, the first drilling is corresponding with the aperture of second insulating layer,
When carrying out second of drilling operation, from the second conducting channel being revealed in aperture in the second single circuit drill,
Until the first conducting channel in the first single circuit.
160: crossing furnace after injecting tin cream in the second drilling, obtain double-sided PCB, the first conducting channel and the second conduction
It is connected between circuit by tin cream.
In the present embodiment, the conducting in double-sided PCB between upper and lower level conducting channel is using drilling, the side of injection tin cream
Formula, compared with traditional via hole plating mode, technique is more simple, further improves production efficiency.
Referring to Fig. 3, Fig. 3 is the process flow chart for making the first single circuit or the second single circuit, wherein 1 is exhausted
Edge layer, 2 be copper foil tape, firstly, being punched into multiple apertures 11,31 on insulating layer 1 is the by the way of rotation mold rolling
One rotation upper mould, 32 turn lower mould for the first round；Similarly, by the way of rotation mold rolling, in copper foil tape 2
Being die cut out conducting channel 21,22 is copper bound material (waste material), and 41 be the second rotation upper mould, and 42 be the second rotation lower mould.
Then, the copper foil tape 2 after the insulating layer 1 and cross cutting after cross cutting is subjected to hot pressing, obtains single circuit, 51 be heat
It is taken turns on pinch roller, 52 be heat pressing wheel lower whorl.
As shown in figure 4, the position for needing to be connected on substrate 6 carries out first time drilling operation, the first drilling 61 is formed, and
Insulating cement 62 is filled up in the first drilling.
As shown in figure 5, the glue-line 7 that insulate first to be placed in the upper and lower surface of substrate 6, then the first single circuit and second is single
Layer circuit is placed in the upper and lower surface of insulation glue-line 7, and the first single circuit, the second single circuit and substrate 6 are passed through insulation
Glue-line 7 presses integrally, obtains two-sided single layer board young bird plate, the first insulating layer 1A with multiple aperture 11A, with multiple
The second insulating layer 1B of aperture 11B is located at the upper and lower surface of two-sided single layer board.
As shown in fig. 6, carrying out second of drilling operation, shape at the position of corresponding first drilling 61 of double-sided PCB young bird plate
At the second drilling 12, the size of the second drilling is less than the first drilling, so that also there are SI semi-insulation glue 62 in the first drilling, the
Furnace is crossed after injecting tin cream 13 in two drillings, obtains two-sided single layer board, the first conducting channel 21A and the second conducting channel 21B
Between be connected by tin cream 13.
It should be noted that, for the spending for saving mold, being generallyd use in step 112 and 122 same in practical application
Mold is die cut the first copper foil tape and the second copper foil tape, that is, the first conducting channel is consistent with the structure of the second conducting channel.And
Step 121, the mold in step 111 can also be used and be die cut out multiple apertures over the second dielectric, therefore, the first single circuit
Structure with the second single circuit can be just the same.
Two sides are equipped with one layer of conducting channel to the substrate of the two-sided single layer board of the present embodiment up and down, and conducting channel uses
The mode of the rolling of rotation mold or flat plate mold punching press is die cut formation in copper foil tape, eliminates exposure development, pickling etching etc.
Process, simple process and meets environmental requirement, by the way of the conducting between upper and lower level conducting channel is using drilling, injecting tin cream,
Compared with traditional via hole plating mode, technique is more simple, can simplify the production technology of two-sided single layer board, reduces life
Cost is produced, production efficiency is improved.
Embodiment 2
The present embodiment provides a kind of manufacturing methods of double-sided multi-layer circuit board, comprising the following steps:
210: the first single circuit of production single side tool insulating layer, the manufacturing method of the first single circuit specifically include:
211: the first insulating layer being provided, is die cut out multiple apertures on the first insulating layer.
212: the first copper foil tape being provided, cuts out the first conducting channel in the first copper foil tape upper mold.
213: the first copper foil tape after the first insulating layer and cross cutting after cross cutting being subjected to hot pressing, obtains the first single layer electricity
Road, at least partly the first conducting channel are revealed in multiple apertures of the first insulating layer.
220: the second single circuit of production single side tool insulating layer, the manufacturing method of the second single circuit specifically include:
221: second insulating layer being provided, is die cut out multiple apertures over the second dielectric.
222: the second copper foil tape being provided, cuts out the second conducting channel in the second copper foil tape upper mold.
223: the second insulating layer after cross cutting and the second copper foil tape after cross cutting being subjected to hot pressing, obtain the second single layer electricity
Road, at least partly the second conducting channel are revealed in multiple apertures of second insulating layer.
230: the third single circuit of production single side tool insulating layer, the manufacturing method of third single circuit specifically include:
231: third insulating layer is provided.
232: third copper foil tape being provided, cuts out third conducting channel in third copper foil tape upper mold.
233: the third copper foil tape after third insulating layer and cross cutting being subjected to hot pressing, obtains third single circuit.
Step 231-233 is repeated, until required N layer third single circuit (N >=1) is made.
Optionally, the manufacturing method of double-sided multi-layer circuit board further include:
240: the 4th single circuit of production single side tool insulating layer, the manufacturing method of the 4th single circuit specifically include:
241: the 4th insulating layer is provided.
242: the 4th copper foil tape being provided, cuts out the 4th conducting channel in the 4th copper foil tape upper mold.
243: the 4th copper foil tape after the 4th insulating layer and cross cutting being subjected to hot pressing, obtains the 4th single circuit.
Step 241-243 is repeated, until required the 4th single circuit (M >=1) of M layer is made.
Wherein, in step 211 by the way of the rolling of rotation mold or flat plate mold punching press, mould on the first insulating layer
Multiple apertures are cut out, multiple apertures are used to that the first conducting channel of part in the first single circuit to be made to expose, and are used for
Erecting and welding electronic component, such as capacitor, resistance, diode.
Similarly, in step 221 by the way of the rolling of rotation mold or flat plate mold punching press, over the second dielectric
Multiple apertures are die cut out, multiple apertures are for exposing the second conducting channel of part in the second single circuit, Yi Jiyong
In erecting and welding electronic component, such as capacitor, resistance, diode.
The rolling of rotation mold or flat plate mold punching press are also all made of in step 212, step 222, step 232, step 242
Mode, cut out conducting channel in copper foil tape upper mold, simple process and meet environmental requirement, reduce production cost, improve
Production efficiency.
First insulating layer, second insulating layer, third insulating layer and the 4th insulating layer are one side coating epoxide-resin glue
The first copper foil tape after the first insulating layer and cross cutting after cross cutting is carried out hot pressing in step 213 by high temperature resistant PET or PI film
Afterwards, the one side that the first insulating layer is coated with epoxide-resin glue is bonded with the first conducting channel；In step 223, by the second insulation
After the second copper foil tape after layer and cross cutting carries out hot pressing, second insulating layer is coated with the one side and the second conduction of epoxide-resin glue
Circuit fitting；After the third copper foil tape after the third insulating layer and cross cutting after cross cutting is carried out hot pressing in step 233, third
The one side that insulating layer is coated with epoxide-resin glue is bonded with third conducting channel；In step 243, by the 4th insulating layer and cross cutting
After the 4th copper foil tape afterwards carries out hot pressing, the 4th insulating layer is coated with the one side of epoxide-resin glue and the 4th conducting channel is pasted
It closes.
250: providing substrate, the position for needing to be connected up and down on substrate carries out first time drilling operation, forms first and bores
Hole, and insulating cement is filled up in the first drilling.
260: the first single circuit and the second single circuit are placed in the upper and lower surface of substrate, N layers of third single layer respectively
Circuit is placed between the first single circuit and the second single circuit, and the third conducting channel of each third single circuit is compared with it
Third insulating layer is placed between the first single circuit and the second single circuit closer to substrate, the 4th single circuit of M layer, and every
4th conducting channel of one the 4th single circuit is compared with its 4th insulating layer closer to substrate；By the first single circuit, the second single layer
Circuit, N layers of third single circuit, the 4th single circuit of M layer and substrate are laminated integrator by insulating cement, obtain double-sided circuit
Plate young bird plate, wherein between adjacent two layers single circuit, insulation glue-line, the first insulating layer are equipped between single circuit and substrate
Most surface layer and the bottom of double-sided PCB young bird plate are located at second insulating layer.
Specifically, N layers of third single circuit can be respectively placed between the first single circuit and substrate or substrate and second
Between single circuit, when third single circuit is placed between the first single circuit and substrate, third insulating layer is upper, and
Three conducting channels are under；When third single circuit is placed between substrate and the second single circuit, third single circuit exists
On, third insulating layer is under.
The 4th single circuit of M layer can be respectively placed between the first single circuit and substrate or substrate and the second single layer electricity
Between road, when the 4th single circuit is placed between the first single circuit and substrate, the 4th insulating layer is in upper, the 4th conduction
Circuit is under；When the 4th single circuit is placed between substrate and the second single circuit, the 4th single circuit is upper, and the 4th
Insulating layer is under.
In one embodiment, N layers of third single circuit are placed between the first single circuit and substrate, the first single layer
Circuit and N layers of third single circuit form the first multilayer circuit；The 4th single circuit of M layer is placed in substrate and the second single layer
Between circuit, the second single circuit and the 4th single circuit of M layer form the second multilayer circuit.
270: carrying out second of drilling operation at the position of corresponding first drilling on double-sided PCB young bird plate, form second
Drilling, the size of the second drilling is less than the first drilling.
290: crossing furnace after injecting tin cream in the second drilling, obtain double-sided PCB, each conducting channel of double-sided PCB
Between pass through tin cream be connected.
To avoid damage to outermost insulating layer, preferably scheme, the aperture phase of the first drilling and the first insulating layer
It is corresponding, when carrying out second of drilling operation, since at the first conducting channel being revealed in the first single circuit in aperture
Drilling, until the second conducting channel in the second single circuit.Alternatively, the first drilling is corresponding with the aperture of second insulating layer,
When carrying out second of drilling operation, from the second conducting channel being revealed in aperture in the second single circuit drill,
Until the first conducting channel in the first single circuit.
Conducting connection between multilayer conductive circuit is by the way of drilling, injection tin cream, with traditional via hole plating side
Formula is compared, and technique is more simple, further improves production efficiency.
In another embodiment, when the second drilling is without the third conducting channel and the second multilayer in the first multilayer circuit
When four conducting channel in circuit, then between step 270 and step 290, further includes:
280: the position for needing to be connected on the first multilayer circuit carries out third time drilling operation, forms third drilling, with
And the position for needing to be connected on the second multilayer circuit carries out the 4th drilling operation, the 4th drilling.
Similarly, to avoid damage to outermost insulating layer, third drilling is corresponding with the aperture of the first insulating layer, into
When row third time drilling operation, from the first conducting channel being revealed in aperture in the first single circuit drill, until
Third conducting channel in the last layer third single circuit；4th drilling is corresponding with the aperture of second insulating layer, is carrying out
When the 4th drilling operation, from the second conducting channel being revealed in aperture in the second single circuit drill, until most
The 4th conducting channel in the 4th single circuit of later layer.
In step 290, it specifically includes: crossing furnace after injecting tin cream in the second drilling, third drilling and the 4th drilling, obtain
To double-sided PCB, be connected between the first conducting channel and the second conducting channel by the tin cream being located in the second drilling, first
It is connected between each conducting channel of multilayer circuit by the tin cream being located in third drilling, each conduction of the second multilayer circuit
It is connected between circuit by the tin cream being located in the 4th drilling.
It should be noted that, for the spending for saving mold, being generallyd use in step 212 and 232 same in practical application
Mold is die cut the first copper foil tape and third copper foil tape, that is, the first conducting channel is consistent with the structure of third conducting channel.And
Step 231, the mold that can also be used in step 211 cuts out multiple apertures in third insulating layer upper mold, therefore, the first single circuit
Structure with third single circuit can be just the same.
Same mold is also generallyd use in step 222 and 242 to be die cut the second copper foil tape and the 4th copper foil tape, that is, the
Two conducting channels are consistent with the structure of the 4th conducting channel.And in step 241, the mold in step 221 can also be used the 4th
Insulating layer upper mold cuts out multiple apertures, and therefore, the structure of the second single circuit and the 4th single circuit can be just the same.
Certainly, the first conducting channel, the second conducting channel, third conducting channel, the structure of the 4th conducting channel can also be with
Unanimously, further, the first single circuit, the second single circuit, third single circuit, the structure of the 4th single circuit can also be with
It is just the same.
Preferably scheme, the number of plies of upper and lower level conducting channel is identical in double-sided PCB.
Referring to Fig. 7, Fig. 7 is that multilayer single circuit and substrate 6 are pressed integral schematic diagram by the glue-line 7 that insulate,
Double-sided multi-layer circuit board young bird plate in the present embodiment includes 6 layers of single circuit, and the structure of the 3 layers of single circuit in upper layer is consistent, i.e., and the
One single circuit is consistent with the structure of third single circuit, and each single circuit includes the insulating layer 1A with multiple aperture 11A
It is die cut and is formed by same copper foil tape with conducting channel 21A, conducting channel 21A.
The structure of 3 layers of single circuit of lower layer is consistent, i.e., the second single circuit is consistent with the structure of the 4th single circuit, each
Single circuit includes insulating layer 1B and conducting channel 21B with multiple aperture 11B, and conducting channel 21B is by same copper foil tape mould
It cuts to be formed.
3 layers of 3 layers of upper layer single circuit, lower layer single circuit are placed in the upper and lower surface of substrate 6, adjacent two layers single layer electricity
It is equipped with insulation glue-line 7 between road, between single circuit and substrate 6, and 6 layers of single circuit and substrate 6 are passed through into insulation glue-line 7
Pressing is integral, obtains double-sided multi-layer circuit board young bird plate, wherein the insulating layer (1A, 1B) point with multiple apertures (11A, 11B)
Not Wei Yu double-sided multi-layer circuit board young bird plate most surface layer and the bottom.
Fig. 8 is the schematic diagram for drilling and injecting tin cream on double-sided multi-layer circuit board young bird plate, young in double-sided multi-layer circuit board
Carries out second of drilling operation at the position of corresponding first drilling of plate, form the second drilling 12, the second size to drill is less than the
One drilling is crossed furnace after injecting tin cream 13 in the second drilling, is obtained two-sided so that also there are SI semi-insulation glue 62 in the first drilling
Multilayer circuit board is connected by tin cream 13 between each conducting channel (21A, 21B) of double-sided PCB.
The substrate of the double-sided multi-layer circuit board of the present embodiment is equipped with one or more layers conducting channel in two sides up and down, and every layer is led
Circuit using rotation mold rolling or flat plate mold punching press by the way of in copper foil tape be die cut formed, eliminate exposure development,
The processes such as pickling etching, simple process and meet environmental requirement, and the conducting between each conducting channel is using drilling, injection tin cream
Mode, compared with traditional via hole plating mode, technique is more simple, can simplify the production technology of two-sided single layer board,
Production cost is reduced, production efficiency is improved.
Embodiment 3
The present embodiment provides a kind of two-sided single layer boards, as shown in Figure 9, comprising: the first single circuit 10, the second single layer
Circuit 20 and substrate 30, the first single circuit 10 and the second single circuit 20 are respectively arranged on the upper and lower surface of substrate 30, and first is single
Insulation glue-line 40 is equipped between layer circuit 10 and substrate 30, between the second single circuit 20 and substrate 30.
Wherein, the first single circuit 10 include the first conducting channel 102 and be overlying in the first conducting channel 102 first absolutely
Edge layer 101, the first conducting channel 102 is die cut by same copper foil tape to be formed, and the first insulating layer 101 is equipped with multiple apertures 1010,
At least partly the first conducting channel 102 is revealed in multiple apertures 1010 of the first insulating layer 101.
Second single circuit 20 includes the second conducting channel 202 and the second insulating layer under the second conducting channel 202
201, the second conducting channel 202 is die cut by same copper foil tape to be formed, and second insulating layer 201 is equipped with multiple apertures 2010, at least
The second conducting channel of part 202 is revealed in multiple apertures 2010 of second insulating layer 201, and the first insulating layer 101 and second is exhausted
Edge layer 201 is located at most surface layer and the bottom of double-sided PCB.
Substrate 30 is equipped with the first drilling (not shown), and double-sided PCB is equipped at the position of corresponding first drilling
Perforative second drilling 50 up and down, the size of the second drilling 50 is less than the first drilling.It is filled with tin cream 60 in second drilling 50, is adopted
Make to be connected between the first conducting channel 102 of upper and lower level and the second conducting channel 202 with tin cream 60；Second drilling 50 and first is bored
It is filled with insulating cement 70 between hole, substrate 30 and the first conducting channel 102, the second conducting channel 202 is prevented to be connected.
Multiple apertures 1010 are used to that the first conducting channel of part 102 in the first single circuit 10 to be made to expose, and
For erecting and welding electronic component, such as capacitor, resistance, diode.
Similarly, multiple apertures 2010 are for exposing the second conducting channel of part 202 in the first single circuit 20
Come, and is used for erecting and welding electronic component, such as capacitor, resistance, diode.
To avoid damage to outermost insulating layer, preferably scheme, the aperture of the first drilling and the first insulating layer 101
1010 is corresponding, and in the drilling of formation second 50, can be revealed in aperture 1010 from the first single circuit 10 first is led
Start to drill at circuit 102, until the second conducting channel 202 in the second single circuit 20；Alternatively, the first drilling and second
The aperture 2010 of insulating layer 201 is corresponding, in the drilling of formation second 50, can be revealed in aperture from the second single circuit 20
Start to drill at the second conducting channel 202 in 2010, until the first conducting channel 102 in the first single circuit 10.
In one embodiment, the first insulating layer 101 and second insulating layer 201 are the resistance to height of one side coating epoxide-resin glue
Warm PET or PI film, the one side that the first insulating layer 101 is coated with epoxide-resin glue are bonded with the first conducting channel 102, the second insulation
The one side that layer 201 is coated with epoxide-resin glue is bonded with the second conducting channel 202.
In one embodiment, insulation glue-line 40 can use epoxy resin, can also use heat-conducting glue, and substrate 30 is aluminium base
Plate or glass mat.
First conducting channel 102 and the second conducting channel 202 can be the wiring of various rules or irregular shape, tool
Body, the mode that the rolling of rotation mold or flat plate mold punching press can be used is die cut to be formed, without works such as exposure development, pickling etchings
Sequence, simple process and meets environmental requirement, reduces production cost, improves production efficiency.
Being connected by the way of drilling, injection tin cream between the first conducting channel 102 and the second conducting channel 202, with
Traditional via hole plating mode is compared, and technique is more simple, further improves production efficiency.
It should be noted that, for the spending for saving mold, generalling use same mold to copper foil tape mould in practical application
It cuts, to obtain the first conducting channel 102 and the second conducting channel 202, that is, the first conducting channel 102 and the second conducting channel 202
Structure it is consistent.Further, can also be used same mold be die cut out in the first insulating layer 101 and second insulating layer 201 it is multiple
Aperture, that is, the first insulating layer 101 and the structure of second insulating layer 201 can also as, therefore, the first single circuit 10 and
The structure of two single circuits 20 can be just the same.
Embodiment 4
The present embodiment provides a kind of double-sided multi-layer circuit boards, as shown in Figure 10, comprising: the first single circuit 110, second is single
Layer circuit 120, N layers of third single circuit 130 (N >=1) and substrate 300, the first single circuit 110 and the second single circuit 120
Insulation glue-line 200, the second single layer electricity are equipped between the upper and lower surface of substrate 300, the first single circuit 110 and substrate 300
It is equipped with insulation glue-line 200 between road 120 and substrate 300, insulation glue-line 200 also is provided between adjacent two layers single circuit, i.e., the
Between one single circuit 110 and third single circuit 130, between adjacent two layers third single circuit 130, third single circuit
130 and second are equipped with insulation glue-line 200 between single circuit 120.
The first insulating layer that first single circuit 110 conducting channel 112 and be overlying in the first conducting channel 112 including first
111, the first conducting channel 112 is die cut by same copper foil tape to be formed, and the first insulating layer 111 is equipped with multiple apertures 1110, at least
The first conducting channel of part 112 is revealed in multiple apertures 1110 of the first insulating layer 111.
Second single circuit 120 includes the second conducting channel 122 and the second insulating layer under the second conducting channel 122
121, the second conducting channel 122 is die cut by same copper foil tape to be formed, and second insulating layer 121 is equipped with multiple apertures 1210, at least
The second conducting channel of part 122 is revealed in multiple apertures 1210 of second insulating layer 121, and the first insulating layer 111 and second is exhausted
Edge layer 121 is located at most surface layer and the bottom of double-sided PCB.
N layers of third single circuit 130 are between the first single circuit 110 and the second single circuit 120, each third list
Layer circuit 130 includes third conducting channel 132 and the third insulating layer 131 being bonded with third conducting channel 132, the conductive electricity of third
Road 132 is die cut by same copper foil tape and is formed, and the third conducting channel 132 of each third single circuit 130 insulate compared with its third
Layer 131 is closer to substrate 300.
Specifically, N layers of third single circuit 130 can be located separately between the first single circuit 110 and substrate 300 or base
Between plate 300 and the second single circuit 120, when third single circuit 130 be placed in the first single circuit 110 and substrate 300 it
Between when, third insulating layer 131 is upper, and third conducting channel 132 is under；When third single circuit 130 is placed in 300 He of substrate
When between the second single circuit 120, third single circuit 132 is upper, and third insulating layer 131 is under.
Optionally, double-sided PCB does not also include the 4th single circuit 140 (M >=1) of M layer, the 4th single circuit 140 of M layer
Between the first single circuit 110 and the second single circuit 130, similarly, it also is provided between adjacent two layers single circuit absolutely
Edge glue-line 200.Every one the 4th single circuit 140 include the 4th conducting channel 142 and be bonded with the 4th conducting channel 140 the 4th
Insulating layer 141, the 4th conducting channel 142 is die cut by same copper foil tape to be formed, and the 4th of every one the 4th single circuit 140 is conductive
Circuit 142 is compared with its 4th insulating layer 141 closer to substrate 300.
Specifically, the 4th single circuit 140 of M layer can be located separately between the first single circuit 110 and substrate 300 or base
Between plate 300 and the second single circuit 120, when the 4th single circuit 140 be placed in the first single circuit 110 and substrate 300 it
Between when, the 4th insulating layer 142 is upper, and the 4th conducting channel 141 is under；When the 4th single circuit 140 is placed in 300 He of substrate
When between the second single circuit 120, the 4th single circuit 142 is upper, and the 4th insulating layer 141 is under.
In one embodiment, N layers of third single circuit 130 are respectively positioned between the first single circuit 110 and substrate 300, the
One single circuit 110 and N layers of third single circuit 130 form the first multilayer circuit；The 4th single circuit 140 of M layer is respectively positioned on base
Between plate 300 and the second single circuit 120, the second single circuit 120 and the 4th single circuit 140 of M layer form the second multilayer electricity
Road.
Substrate 300 is equipped with the first drilling (not shown), and double-sided PCB is set at the position of corresponding first drilling
There is perforative second drilling 400 up and down, the size of the second drilling 400 is less than the first drilling.Tin cream is filled in second drilling 400
500, make to be connected between each conducting channel in double-sided PCB using tin cream 500；It is filled out between second drilling 400 and the first drilling
Filled with insulating cement 600, substrate 300 is prevented to be connected with each conducting channel.
To avoid damage to outermost insulating layer, preferably scheme, the aperture of the first drilling and the first insulating layer 111
1110 is corresponding, formation second drilling 400 when, can be revealed in from the first single circuit 110 in aperture 1110 first
Start to drill at conducting channel 112, until the second conducting channel 122 in the second single circuit 120；Alternatively, first drilling and
The aperture 1210 of second insulating layer 121 is corresponding, in the drilling of formation second 400, can appear from the second single circuit 120
Start to drill at the second conducting channel 122 in aperture 1210, until the first conducting channel in the first single circuit 110
112。
In another embodiment, when the second drilling 400 is without the third conducting channel 132 and the in the first multilayer circuit
When four conducting channel 142 in two multilayer circuits, the first multilayer circuit is equipped with perforative third drilling up and down, the first multilayer
It is connected between each conducting channel of circuit by the tin cream being located in third drilling；Second multilayer circuit is equipped with perforative up and down
4th drills, and passes through the tin cream being located in the 4th drilling between each conducting channel of the second multilayer circuit and is connected.
Similarly, to avoid damage to outermost insulating layer, third drilling and the aperture 1110 of the first insulating layer 111 are opposite
It answers, when forming third drilling, is opened from the first conducting channel 112 being revealed in aperture 1110 in the first single circuit 110
Begin to drill, until the third conducting channel 132 in the last layer third single circuit 130；4th drilling and second insulating layer 121
Aperture 1210 it is corresponding, formed the 4th drilling when, first be revealed in aperture 1210 from the second single circuit 120 is led
Start to drill at circuit 122, until the third conducting channel 142 in the 4th single circuit 140 of the last layer.
In one embodiment, the first insulating layer 111, second insulating layer 121, the first insulating layer 131 and the 4th insulating layer 141
Be high temperature resistant PET or the PI film of one side coating epoxide-resin glue, the first insulating layer 111 be coated with the one side of epoxide-resin glue with
The fitting of first conducting channel 112, the one side that second insulating layer 121 is coated with epoxide-resin glue are bonded with the second conducting channel 122,
The one side that third insulating layer 131 is coated with epoxide-resin glue is bonded with third conducting channel 132, and the 4th insulating layer 141 is coated with
The one side of epoxide-resin glue is bonded with the 4th conducting channel 142.
In one embodiment, insulation glue-line 200 can use epoxy resin, can also use heat-conducting glue, and substrate 300 is aluminium
Substrate or glass mat.
First conducting channel 112, the second conducting channel 122, third conducting channel 132, the 4th conducting channel 142 can be each
Specifically the mode mould of the rolling of rotation mold or flat plate mold punching press can be used in the wiring of kind rule or irregular shape
It cuts to be formed, the processes such as etches without exposure development, pickling, simple process and meet environmental requirement, reduce production cost, improve
Production efficiency.
Each conducting channel of conducting, the first multilayer circuit between first conducting channel 111 and the second conducting channel 121 it
Between conducting, the second multilayer circuit each conducting channel between the conducting mode that is all made of drilling, injects tin cream, and it is traditional
Via hole plating mode is compared, and technique is more simple, further improves production efficiency.
It should be noted that, for the spending for saving mold, generalling use same mold to copper foil tape mould in practical application
It cuts, to obtain the first conducting channel 112 and third conducting channel 132, that is, the first conducting channel 112 and third conducting channel 132
Structure it is consistent.Similarly, multiple apertures, therefore, the first single circuit 110 and the can also be equipped on third insulating layer 131
The structure of three single circuits 130 can be just the same.
Also it generallys use same mold to be die cut copper foil tape, to obtain the second conducting channel 122 and the 4th conducting channel
142, that is, the second conducting channel 122 is consistent with the structure of the 4th conducting channel 142.It similarly, can also on the 4th insulating layer 141
To be equipped with multiple apertures, therefore, the structure of the second single circuit 120 and the 4th single circuit 150 can be just the same.
Certainly, the first conducting channel 111, the second conducting channel 121, third conducting channel 131, the 4th conducting channel 141
Structure can also be consistent, further, the first single circuit 110, the second single circuit 120, third single circuit 130,
The structure of four single circuits 140 can also be just the same.
Preferably scheme, the number of plies of upper and lower level conducting channel is identical in double-sided PCB.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the present invention, all to be said using the present invention
Equivalent structure or equivalent flow shift made by bright book and accompanying drawing content is applied directly or indirectly in other relevant technology necks
Domain similarly includes within the scope of the present invention.
Claims (10)
1. a kind of manufacturing method of double-sided PCB, which comprises the following steps:
(1) the first single circuit of production single side tool insulating layer, the manufacturing method of first single circuit include:
1.1 provide the first insulating layer, are die cut out multiple apertures on the first insulating layer；
1.2 provide the first copper foil tape, cut out the first conducting channel in the first copper foil tape upper mold；
The first copper foil tape after the first insulating layer and cross cutting after cross cutting is carried out hot pressing by 1.3, obtains the first single layer electricity
Road, at least partly described first conducting channel are revealed in multiple apertures of first insulating layer；
(2) the second single circuit of production single side tool insulating layer, the manufacturing method of second single circuit include:
2.1 provide second insulating layer, are die cut out multiple apertures on the second insulating layer；
2.2 provide the second copper foil tape, cut out the second conducting channel in the second copper foil tape upper mold；
Second insulating layer after cross cutting and the second copper foil tape after cross cutting are carried out hot pressing by 2.3, obtain the second single layer electricity
Road, at least partly described second conducting channel are revealed in multiple apertures of the second insulating layer；
(5) substrate is provided, the position for needing to be connected up and down on the substrate carries out first time drilling operation, forms first and bores
Hole, and insulating cement is filled up in first drilling；
(6) first single circuit and second single circuit are placed in the upper and lower surface of the substrate respectively, and will
First single circuit, second single circuit and the substrate are laminated integrator by insulating cement, obtain two-sided electricity
Road plate young bird plate, first insulating layer and the second insulating layer are located at the most surface layer and most of the double-sided PCB young bird plate
Bottom；
(7) it is corresponded on the double-sided PCB young bird plate and carries out second of drilling operation at the position of first drilling, formed
Second drilling, the size of second drilling are less than first drilling；
(9) furnace is crossed after injecting tin cream in second drilling, obtains the double-sided PCB, first conducting channel and institute
It states and is connected between the second conducting channel by the tin cream.
2. the manufacturing method according to claim 1, which is characterized in that after step (2), the manufacturing method is also wrapped
It includes:
(3) the third single circuit of production single side tool insulating layer, the manufacturing method of the third single circuit include:
3.1 provide third insulating layer；
3.2 provide third copper foil tape, cut out third conducting channel in the third copper foil tape upper mold；
Third copper foil tape after the third insulating layer and cross cutting is carried out hot pressing by 3.3, obtains the third single circuit；
Step 3.1-3.3 is repeated, until the required N layer third single circuit (N >=1) is made；
In step (6), first single circuit and second single circuit are being placed in the upper of the substrate respectively
After lower surface, further includes:
The N layers of third single circuit are placed between first single circuit and second single circuit, and each
The third conducting channel of the third single circuit is compared with third insulating layer described in its closer to the substrate；
Then, described that first single circuit, second single circuit and the substrate are passed through into insulating cement lamination synthesis one
Body, specifically:
First single circuit, second single circuit, the N layers of third single circuit and the substrate are passed through into insulation
Glue-line pressing is integral, wherein is equipped with insulating cement between adjacent two layers single circuit, between single circuit and the substrate
Layer.
3. manufacturing method according to claim 2, which is characterized in that after step (3), the manufacturing method is also wrapped
It includes:
(4) the 4th single circuit of production single side tool insulating layer, the manufacturing method of the 4th single circuit include:
4.1 provide the 4th insulating layer；
4.2 provide the 4th copper foil tape, cut out the 4th conducting channel in the 4th copper foil tape upper mold；
The 4th copper foil tape after 4th insulating layer and cross cutting is carried out hot pressing by 4.3, obtains the 4th single circuit；
Step 4.1-4.3 is repeated, until required M layer the 4th single circuit (M >=1) is made；
In step (6), the N layers of third single circuit are being placed in first single circuit and second single layer electricity
After between road, further includes:
M layers of the 4th single circuit are placed between first single circuit and second single circuit, and each
4th conducting channel of the 4th single circuit is compared with the 4th insulating layer described in its closer to the substrate；
Then, described by first single circuit, second single circuit, the N layers of third single circuit and the substrate
It is laminated integrator by insulating cement, specifically:
By first single circuit, second single circuit, the N layers of third single circuit, M layers of the 4th single layer electricity
Road and the substrate are laminated integrator by insulating cement, wherein between adjacent two layers single circuit, single circuit and the base
Insulation glue-line is equipped between plate.
4. manufacturing method according to claim 3, which is characterized in that
It is described that the N layers of third single circuit are placed between first single circuit and second single circuit, tool
Body are as follows:
The N layers of third single circuit are placed between first single circuit and the substrate, first single layer
Circuit and the N layers of third single circuit form the first multilayer circuit；
It is described that M layers of the 4th single circuit are placed between first single circuit and second single circuit, tool
Body are as follows:
M layers of the 4th single circuit are placed between the substrate and second single circuit, second single layer
Circuit and M layers of the 4th single circuit form the second multilayer circuit.
5. manufacturing method according to claim 4, which is characterized in that second drilling is without the first multilayer electricity
The 4th conducting channel in third conducting channel and second multilayer circuit in road；
After step (7), the manufacturing method further include:
(8) position for needing to be connected on first multilayer circuit carries out third time drilling operation, forms third drilling, and
The position for needing to be connected on second multilayer circuit carries out the 4th drilling operation, forms the 4th drilling；
In step (9), after injecting tin cream in second drilling, further includes:
Tin cream is injected in third drilling and in described 4th time drilling.
6. according to the described in any item methods of claim 3-5, which is characterized in that
In step 1.1 by the way of the rolling of rotation mold or flat plate mold punching press, it is die cut out on the first insulating layer
Multiple apertures；
In step 1.2 by the way of the rolling of rotation mold or flat plate mold punching press, cut out in the first copper foil tape upper mold
First conducting channel；
In step 2.2 by the way of the rolling of rotation mold or flat plate mold punching press, cut out in the second copper foil tape upper mold
Second conducting channel；
In step 3.2 by the way of the rolling of rotation mold or flat plate mold punching press, cut out in the third copper foil tape upper mold
Third conducting channel；
In step 4.2 by the way of the rolling of rotation mold or flat plate mold punching press, cut out in the 4th copper foil tape upper mold
4th conducting channel.
7. a kind of double-sided PCB characterized by comprising the first single circuit, the second single circuit and substrate, described first
Single circuit and second single circuit are respectively arranged on the upper and lower surface of the substrate, first single circuit and the base
Insulation glue-line is equipped between plate, between second single circuit and the substrate；Wherein,
First single circuit includes the first conducting channel and the first insulating layer for being overlying in first conducting channel, described
First conducting channel is die cut by same copper foil tape and is formed, and first insulating layer is equipped with multiple apertures, and at least partly described the
One conducting channel is revealed in multiple apertures of first insulating layer；
Second single circuit includes the second conducting channel and the second insulating layer under second conducting channel, described
Second conducting channel is die cut by same copper foil tape and is formed, and the second insulating layer is equipped with multiple apertures, and at least partly described the
Two conducting channels are revealed in multiple apertures of the second insulating layer, first insulating layer and second insulating layer difference
Positioned at the most surface layer of the double-sided PCB and the bottom；
The substrate is equipped with the first drilling, and the double-sided PCB is equipped at the position of correspondence first drilling and passes through up and down
The second drilling worn, the size of second drilling are less than first drilling；
It is filled with tin cream in second drilling, passes through the tin between first conducting channel and second conducting channel
Cream conducting is filled with insulating cement between second drilling and first drilling.
8. double-sided PCB according to claim 7, which is characterized in that further include:
N layers of third single circuit (N >=1), the N layers of third single circuit are located at first single circuit and second list
Insulation glue-line is equipped between layer circuit, between adjacent two layers single circuit；
Each third single circuit includes third conducting channel and the third insulating layer that is bonded with the third conducting channel,
The third conducting channel is die cut by same copper foil tape to be formed, and the third conducting channel of each third single circuit is compared with it
The third insulating layer is closer to the substrate；
And/or
The 4th single circuit (M >=1) of M layer, the 4th single circuit of M layer are located at first single circuit and second list
Insulation glue-line is equipped between layer circuit, between adjacent two layers single circuit；
Each 4th single circuit include the 4th conducting channel and be bonded with the 4th conducting channel the 4th absolutely
Edge layer, the 4th conducting channel is die cut by same copper foil tape to be formed, and the 4th conductive electricity of each 4th single circuit
Road is compared with the 4th insulating layer described in its closer to the substrate.
9. double-sided PCB according to claim 8, which is characterized in that
When the double-sided PCB includes the N layers of third single circuit and the M four single circuit of layer, the N layer
Three single circuits are respectively positioned between first single circuit and the substrate, first single circuit and the N layers of third
Single circuit forms the first multilayer circuit；
The 4th single circuit of M layer is respectively positioned between the substrate and second single circuit, second single circuit
The second multilayer circuit is formed with the 4th single circuit of M layer.
10. double-sided PCB according to claim 9, which is characterized in that
Second drilling is without in the third conducting channel and second multilayer circuit in first multilayer circuit
4th conducting channel；
First multilayer circuit is equipped with perforative third drilling, each conducting channel of first multilayer circuit up and down and passes through
Tin cream conducting in third drilling；
Second multilayer circuit is equipped with perforative 4th drilling, each conducting channel of second multilayer circuit up and down and passes through
Tin cream conducting in the 4th drilling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810933739.6A CN108990322A (en) | 2018-08-16 | 2018-08-16 | A kind of double-sided PCB and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810933739.6A CN108990322A (en) | 2018-08-16 | 2018-08-16 | A kind of double-sided PCB and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108990322A true CN108990322A (en) | 2018-12-11 |
Family
ID=64552848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810933739.6A Pending CN108990322A (en) | 2018-08-16 | 2018-08-16 | A kind of double-sided PCB and its manufacturing method |
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| CN (1) | CN108990322A (en) |
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| CN110355932A (en) * | 2019-06-21 | 2019-10-22 | 西安交通大学 | A kind of preparation facilities and method of multi-layer dielectric material |
| CN110519941A (en) * | 2019-07-09 | 2019-11-29 | 安徽捷鑫光电科技有限公司 | A kind of processing method in flexibility led circuit board function hole |
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