CN207354694U - Double side soft circuit board and its production equipment - Google Patents
Double side soft circuit board and its production equipment Download PDFInfo
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- CN207354694U CN207354694U CN201721294683.1U CN201721294683U CN207354694U CN 207354694 U CN207354694 U CN 207354694U CN 201721294683 U CN201721294683 U CN 201721294683U CN 207354694 U CN207354694 U CN 207354694U
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Abstract
The utility model embodiment discloses a kind of Double side soft circuit board and its production equipment.A kind of Double side soft circuit board, including：First soft board, the second soft board, the middle layer insulating between the first soft board and the second soft board, and the metallic conductor of the first soft board of connection and the second soft board, the first soft board include the first circuit layer, and the second soft board includes second circuit layer；Double side soft circuit board is equipped with the through hole for running through Double side soft circuit board up and down, and the first circuit layer is connected with second circuit layer by the metallic conductor in through hole；Multiple perforates are equipped with first soft board and the second soft board, for erecting and welding electronic component.By the above-mentioned means, the utility model embodiment can simplify the production technology of Double side soft circuit board, improve production efficiency and reduce production cost.
Description
Technical field
The utility model embodiment is related to field of circuit boards, is set more particularly to a kind of Double side soft circuit board and its production
It is standby.
Background technology
Flexible circuit board (Flexible Printed Circuit board, FPC) is widely used in each electronic product
In, play installation support and electrical connection electronic component, be indispensable critical elements in electronic product.It is two-sided soft
Property circuit board area it is one times bigger than single side floppy circuit board, more suitable for use on complicated circuit.
Double side soft circuit board generally includes two layers of flexible circuit board, and the insulation between two layers of flexible circuit board
Layer, the copper that need to sink on the hole wall of insulating layer plating can just make mutual conduction between two layers of flexible circuit board, complex process, production effect
Rate is low and of high cost.
Utility model content
The utility model embodiment mainly solving the technical problems that provide a kind of Double side soft circuit board and its production set
It is standby, the production technology of Double side soft circuit board can be simplified, production efficiency is improved and reduce production cost.
In order to solve the above technical problems, the technical solution that the utility model uses is：A kind of double-surface flexible electricity is provided
Road plate, including：First soft board, the second soft board, the middle layer insulating between the first soft board and the second soft board, with
And the metallic conductor of the first soft board of connection and the second soft board, the first soft board include the first circuit layer, the second soft board bag
Include second circuit layer；
Double side soft circuit board is equipped with the through hole for running through Double side soft circuit board up and down, the first circuit layer and the second electricity
Road floor is connected by the metallic conductor in through hole；
Multiple perforates are equipped with first soft board and the second soft board, for erecting and welding electronic component.
Alternatively, the first circuit layer is to be punched the wiring formed by same copper foil tape, or is two strip copper foil tape；
Second circuit layer is to be punched the wiring formed by same copper foil tape, or is two strip copper foil tape.
Alternatively, the first soft board further includes the upper-layer insulation film being arranged on the upside of the first circuit layer；
Second soft board further includes the bottom insulating layer being arranged on the downside of second circuit layer；
Multiple perforates are arranged on upper-layer insulation film and bottom insulating layer.
Alternatively, upper-layer insulation film uses high temperature resistant PET or PI material；
Bottom insulating layer uses high temperature resistant PET or PI material.
Alternatively, metallic conductor is tin silk, tin cream, or fills the copper pipe of tin cream or tin silk.
The utility model embodiment also provides a kind of production equipment of Double side soft circuit board, including：
First web feed roller, for conveying upper-layer insulation film；
First stamping die, it is multiple for being punched on upper-layer insulation film positioned at the lower station of the first web feed roller
Perforate；
Second web feed roller, for conveying the first copper foil tape；
Second stamping die, positioned at the lower station of the second web feed roller, for being punched into first in the first copper foil tape
Circuit layer；
First hot pressing die, positioned at the lower station of the first stamping die and the second stamping die, for after punching
Layer insulating, and the first circuit layer carry out hot pressing, obtain the first soft board；
3rd web feed roller, for layer insulating in conveying；
Second hot pressing die, positioned at the first hot pressing die and the lower station of the 3rd web feed roller, for soft to first
Plate and middle layer insulating carry out hot pressing；
4th web feed roller, for conveying the second copper foil tape；
3rd stamping die, positioned at the lower station of the 4th web feed roller, for being punched into second in the second copper foil tape
Circuit layer；
3rd hot pressing die, positioned at the second hot pressing die and the lower station of the 3rd stamping die, for after hot pressing
One soft board and middle layer insulating, and second circuit layer carry out hot pressing；
5th web feed roller, for conveying bottom insulating layer；
4th stamping die, it is multiple for being punched on bottom insulating layer positioned at the lower station of the 5th web feed roller
Perforate；
4th hot pressing die, positioned at the 3rd hot pressing die and the lower station of the 4th stamping die, for after hot pressing
One soft board, middle layer insulating and second circuit layer, and bottom insulating layer carry out hot pressing, obtain Double side soft circuit board base
Plate；
5th stamping die, positioned at the lower station of the 4th hot pressing die, for being punched on Double side soft circuit board substrate
Go out to run through up and down the through hole of Double side soft circuit board substrate, wherein through hole is at least partly at the same time positioned at the first circuit layer and the
On two circuit layers.
Alternatively, which further includes：
First waste material wind-up roll, positioned at the lower station of the second stamping die, for winding the second stamping die punching first
The the first copper bound material produced after copper foil tape；And/or
Second waste material wind-up roll, positioned at the lower station of the 3rd stamping die, for winding the 3rd stamping die punching second
The the second copper bound material produced after copper foil tape.
Alternatively, the first stamping die is rotation roll die or tablet stamping die；
Second stamping die is rotation roll die or tablet stamping die；
3rd stamping die is rotation roll die or tablet stamping die；
4th stamping die is rotation roll die or tablet stamping die；
5th stamping die is rotation roll die or tablet stamping die；
Alternatively, the first gripping roll is equipped between the first web feed roller and the first stamping die, for making upper strata insulate
Layer is tightened before punching；And/or
The second gripping roll is equipped between second web feed roller and the second stamping die, for being punched the first copper foil tape
Before tighten；And/or
The 3rd gripping roll is equipped between second stamping die and the first hot pressing die, for making the first circuit layer before hot pressing
Tighten；And/or
The 4th gripping roll is equipped between 3rd web feed roller and the second hot pressing die, for making middle layer insulating in hot pressing
Before tighten；And/or
The 5th gripping roll is equipped between 4th web feed roller and the 3rd stamping die, for being punched the second copper foil tape
Before tighten；And/or
The 6th gripping roll is equipped between 3rd stamping die and the 3rd hot pressing die, for making second circuit layer before hot pressing
Tighten；And/or
The 7th gripping roll is equipped between 5th web feed roller and the 4th stamping die, for being punched bottom insulating layer
Before tighten；And/or
The 8th gripping roll is equipped between 4th stamping die and the 4th hot pressing die, for making the bottom insulating layer after punching
Tightened before hot pressing.
The beneficial effect of the utility model embodiment is：The situation of the prior art is different from, the utility model embodiment
Double side soft circuit board includes the first soft board, the second soft board, and the metal of the first soft board of connection and the second soft board
Conductor, wherein, Double side soft circuit board be equipped with up and down run through Double side soft circuit board through hole, the first of the first soft board
The second circuit layer of circuit layer and the second soft board is connected by the metallic conductor in through hole, using aforesaid way, energy
Enough simplify the production technology of Double side soft circuit board, improve production efficiency and reduce production cost.
Brief description of the drawings
, below will be in the utility model embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
Required attached drawing is briefly described.It should be evident that drawings described below is only the one of the utility model
A little embodiments, for those of ordinary skill in the art, without creative efforts, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is the sectional view of the Double side soft circuit board of the utility model embodiment；
Fig. 2 is the Structure explosion diagram of the Double side soft circuit board of the utility model embodiment；
Fig. 3 is the schematic diagram of the production equipment of the Double side soft circuit board of the utility model embodiment；
Fig. 4 is the sectional view of the Double side soft circuit board substrate after the punching of the utility model embodiment.
Embodiment
For the ease of understanding the utility model, below in conjunction with the accompanying drawings and specific embodiment, the utility model is carried out more detailed
Thin explanation.It should be noted that when element is expressed " being fixed on " another element, it can be directly in another element
Above or therebetween there may be one or more elements placed in the middle.When an element is expressed " connection " another element, it can
To be directly to another element or there may be one or more elements placed in the middle therebetween.This specification is used
Term " vertical ", " horizontal ", "left", "right" and similar statement for illustrative purposes only.
Unless otherwise defined, the skill of technical and scientific term all used in this specification with belonging to the utility model
The normally understood implication of technical staff in art field is identical.In the art used in the description of the utility model in this specification
Language is intended merely to the purpose of description specific embodiment, is not intended to limitation the utility model.Term used in this specification
"and/or" includes the arbitrary and all combination of one or more relevant Listed Items.
Referring to Fig. 1, Fig. 1 is the sectional view for the Double side soft circuit board that the utility model embodiment provides, such as Fig. 1 institutes
Show, Double side soft circuit board includes the first soft board 100, the second soft board 200, soft positioned at the first soft board 100 and second
Middle layer insulating 300 between plate 200, and the metallic conductor 400 of the first soft board 100 of connection and the second soft board 200, its
In, the first soft board 100 includes the first circuit layer 110, and the second soft board 200 includes second circuit layer 210.
Double side soft circuit board is equipped with the through hole 500 up and down on Double side soft circuit board, the first circuit layer 110
Connected with second circuit layer 210 by the metallic conductor 400 in through hole 500.Aforesaid way and heavy copper in the prior art
The mode of plating is compared, and is reduced the process ruggedness for making the first circuit layer 110 be connected with second circuit layer 210, is simplified two-sided
The production technology of flexible circuit board, so as to improve production efficiency and reduce production cost.And the entire production line is using continuous
Work pattern, can web-like Double side soft circuit board of the processing length more than hundred meters.
In certain embodiments, metallic conductor 400 is tin silk, tin cream, or fills the copper pipe of tin cream or tin silk, above-mentioned
Material is the good conductor of electricity.
Also referring to Fig. 2, Fig. 2 is the Structure explosion diagram of the Double side soft circuit board, and the first soft board 100, which further includes, to be set
The upper-layer insulation film 120 in the upside of the first circuit layer 110 is put, upper-layer insulation film 120 is equipped with multiple perforates 121, for installing
Welding electronic component, such as capacitance, resistance, diode.
Second soft board 200 further includes the bottom insulating layer 220 for being arranged on the downside of second circuit layer 210, similarly, bottom
Insulating layer 220 is equipped with multiple perforates 221, for erecting and welding electronic component.
Alternatively, upper-layer insulation film 120 uses high temperature resistant PET or PI material, and bottom insulating layer 220 is using high temperature resistant PET
Or PI materials.
Alternatively, the first circuit layer 110 is that the various rules formed or irregular shape cloth are punched by same copper foil tape
Line, or be two strip copper foil tape；Second circuit layer 210 is that the various rules or irregular shape formed are punched by same copper foil tape
Shape connects up, or is two strip copper foil tape, in order to make it easy to understand, the circuit of the first circuit layer 110 and second circuit layer 210 in figure
Structure is only to illustrate, and actual circuit can be arbitrary structures.By the above-mentioned means, the Double side soft circuit board of the present embodiment need not
The techniques such as pickling etching, via plating, technique is simple, meets environmental requirement.
The prior art is different from, the Double side soft circuit board of the present embodiment includes the first soft board, the second soft board, and
The metallic conductor of the first soft board and the second soft board is connected, wherein, Double side soft circuit board is equipped with up and down through two-sided soft
The through hole of property circuit board, the first circuit layer of the first soft board and the second circuit layer of the second soft board pass through positioned at through hole
In metallic conductor connection, using aforesaid way, the production technology of Double side soft circuit board can be simplified, improve production efficiency and
Reduce production cost.
The utility model embodiment also provides a kind of production equipment of Double side soft circuit board, referring to Fig. 3, the production is set
It is standby to include：
First web feed roller 10, for conveying upper-layer insulation film 1；
First stamping die 100, positioned at the lower station of the first web feed roller 10, for being punched on upper-layer insulation film 1
Go out multiple perforates 11；
Second web feed roller 20, for conveying the first copper foil tape 2；
Second stamping die 200, positioned at the lower station of the second web feed roller 20, for being punched in the first copper foil tape 2
Go out the first circuit layer 21, wherein, the first circuit layer 21 can be rule wiring, or any irregular wiring.
First hot pressing die 1000, including wheel and the first heat pressing wheel lower whorl on the first heat pressing wheel, positioned at the first stamping die
100 and second stamping die 200 lower station, for carrying out heat to the upper-layer insulation film 1 after punching, and the first circuit layer 21
Pressing, obtains the first soft board；
3rd web feed roller 30, for layer insulating in conveying 3；
Second hot pressing die 2000, including wheel and the second heat pressing wheel lower whorl on the second heat pressing wheel, positioned at the first hot pressing die
1000 and the 3rd web feed roller 30 lower station, for carrying out hot pressing to the first soft board and middle layer insulating 3；
4th web feed roller 40, for conveying the second copper foil tape 4；
3rd stamping die 300, positioned at the lower station of the 4th web feed roller 40, for being punched in the second copper foil tape 4
Go out second circuit layer 41, wherein, second circuit layer 41 can be rule wiring, or any irregular wiring.
Wheel and the 3rd heat pressing wheel lower whorl on 3rd hot pressing die 3000, including the 3rd heat pressing wheel, positioned at the second hot pressing die
2000 and the 3rd stamping die 300 lower station, for the first soft board and middle layer insulating 3 after hot pressing, and second
Circuit layer 41 carries out hot pressing；
5th web feed roller 50, for conveying bottom insulating layer 5；
4th stamping die 400, positioned at the lower station of the 5th web feed roller 50, for being punched on bottom insulating layer 5
Go out multiple perforates 51；
Wheel and the 4th heat pressing wheel lower whorl on 4th hot pressing die 4000, including the 4th heat pressing wheel, positioned at the 3rd hot pressing die
3000 and the 4th stamping die 400 lower station, for the first soft board after hot pressing, middle layer insulating 3 and second circuit
Layer 41, and bottom insulating layer 5 carry out hot pressing, obtain Double side soft circuit board substrate；
5th stamping die 500, positioned at the lower station of the 4th hot pressing die 400, in Double side soft circuit board substrate
On be punched into the through hole 600 for running through Double side soft circuit board substrate up and down, wherein through hole 6000 is at least partly located at the same time
On first circuit layer 21 and second circuit layer 41.
The sectional view of Double side soft circuit board substrate is as shown in figure 4, in through hole after 500 punching press of the 5th stamping die
Tin cream is filled at 600, Double side soft circuit board is can obtain after crossing stove.
The present embodiment is punched into by using the second stamping die 200 and the 3rd stamping die 300 in same copper foil tape
Circuit layer, eliminates the processes such as pickling etching, via plating, technique is simple, meets environmental requirement；First circuit layer 21 and second
Circuit layer 41 can be by filling metallic conductor (such as tin silk, tin cream, or the copper of filling tin cream or tin silk at through hole 600
Pipe) mode connect, with heavy copper plating mode compared with, process ruggedness is reduced, so as to improve production efficiency and reduce
Production cost.
Moreover, this production equipment uses streamlined operation mode, by setting one with moving in the other end of the production equipment
The substrate wind-up roll of power apparatus connection, substrate wind-up roll constantly wind the double-surface flexible electricity after punching under the drive of power set
Road plate substrate so that the first web feed roller 10, the second web feed roller 20, the 3rd web feed roller 30, the 4th web feed
Roller 40, the 5th web feed roller 50 can continue the material strip that conveying is fixed on its roller, ensure that Double side soft circuit board substrate
Continuous production, finally can obtain web-like Double side soft circuit board of the processing length more than hundred meters.
The production equipment further includes some required driving devices, is such as used for the upper mold for driving the first stamping die 100
Move or push driving device, for drive the first hot pressing die 1000 the first heat pressing wheel on take turns rotating driving device, use
In first rotating driving device of heat pressing wheel lower whorl for driving the first hot pressing die 1000 etc., it is readily appreciated that in this technology personnel
In the range of, details are not described herein.
In certain embodiments, which further includes the first waste material wind-up roll 60, positioned at the second stamping die 200
Lower station, the first copper bound material 22 produced after the first copper foil tape 2 is punched for winding the second stamping die 200；Further include second
Waste material wind-up roll 70, positioned at the lower station of the 3rd stamping die 300, the second copper foil is punched for winding the 3rd stamping die 300
With the second copper bound material 42 produced after 4.
Alternatively, the first stamping die 100 is rotation roll die or tablet stamping die；Second stamping die 200 is
Rotate roll die or tablet stamping die；3rd stamping die 300 is rotation roll die or tablet stamping die；4th punching
Compression mould 400 is rotation roll die or tablet stamping die；5th stamping die is rotation roll die or tablet stamping die
Tool.When stamping die is rotates roll die, it includes rotating upper mould and rotates lower mould；When stamping die is flat
During plate stamping die, it includes flat plate mold upper mold and flat plate mold lower die.
Alternatively, the first gripping roll 11 is equipped between the first web feed roller 10 and the first stamping die 100, for making
Layer insulating 1 is tightened before punching, and the first gripping roll 11 can be one or more.
Alternatively, the second gripping roll 12 is equipped between the second web feed roller 20 and the second stamping die 200, for making
One copper foil tape 2 is tightened before punching, and the second gripping roll 12 can be one or more.
Alternatively, the 3rd gripping roll 13 is equipped between the second stamping die 200 and the first hot pressing die 1000, for making
One circuit layer 21 is tightened before hot pressing, and the 3rd gripping roll 13 can be one or more.
Alternatively, the 4th gripping roll 14 is equipped between the 3rd web feed roller 30 and the second hot pressing die 2000, for making
Middle layer insulating 3 is tightened before hot pressing, and the 4th gripping roll 14 can be one or more.
Alternatively, the 5th gripping roll 15 is equipped between the 4th web feed roller 40 and the 3rd stamping die 300, for making
Two copper foil tape 4 are tightened before punching, and the 5th gripping roll 15 can be one or more.
Alternatively, the 6th gripping roll 16 is equipped between the 3rd stamping die 300 and the 3rd hot pressing die 3000, for making
Two circuit layers 41 are tightened before hot pressing, and the 6th gripping roll 16 can be one or more.
Alternatively, the 7th gripping roll 17 is equipped between the 5th web feed roller 50 and the 4th stamping die 400, for making bottom
Layer insulating 5 is tightened before punching, and the 7th gripping roll 17 can be one or more.
Alternatively, the 8th gripping roll 18 is equipped between the 4th stamping die 400 and the 4th hot pressing die 4000, for making punching
Bottom insulating layer 5 after cutting is tightened before hot pressing, and the 8th gripping roll 18 can be one or more.
The prior art is different from, the production equipment of the multi-layer soft circuit board of the present embodiment passes through the second stamping die 200
The first circuit layer 21 is punched into the first copper foil tape 2, is punched into the second copper foil tape 4 by the 3rd stamping die 300
Two circuit layers 41, and be punched into by the 5th stamping die 500 on Double side soft circuit board substrate up and down through two-sided soft
Property circuit board substrate through hole 600, the production technology of Double side soft circuit board can be simplified, production efficiency is improved and reduce life
Produce cost.
It should be noted that the preferable implementation of the utility model is given in the specification and its attached drawing of the utility model
Example, still, the utility model can be realized by many different forms, however it is not limited to the described implementation of this specification
Example, these embodiments are not as the extra limitation to the utility model content, there is provided the purpose of these embodiments is made to this reality
With the understanding more thorough and comprehensive of new disclosure.Also, above-mentioned each technical characteristic continues to be mutually combined, formed not upper
The various embodiments that face is enumerated, are accordingly to be regarded as the scope of the utility model specification record；Further, to ordinary skill
For personnel, it can according to the above description be improved or be converted, and all these modifications and variations should all belong to this practicality newly
The protection domain of type appended claims.
Claims (9)
- A kind of 1. Double side soft circuit board, it is characterised in that including：First soft board, the second soft board are soft positioned at described first Property plate and second soft board between middle layer insulating, and connect first soft board and second soft board Metallic conductor, first soft board include the first circuit layer, and second soft board includes second circuit layer；The Double side soft circuit board is equipped with the through hole for running through the Double side soft circuit board up and down, first circuit layer Connected with the second circuit layer by the metallic conductor in the through hole；Multiple perforates are equipped with first soft board and second soft board, for erecting and welding electronic component.
- 2. Double side soft circuit board according to claim 1, it is characterised in thatFirst circuit layer is to be punched the wiring formed by same copper foil tape, or is two strip copper foil tape；The second circuit layer is to be punched the wiring formed by same copper foil tape, or is two strip copper foil tape.
- 3. Double side soft circuit board according to claim 1, it is characterised in thatFirst soft board further includes the upper-layer insulation film being arranged on the upside of first circuit layer；Second soft board further includes the bottom insulating layer being arranged on the downside of the second circuit layer；The multiple perforate is arranged on the upper-layer insulation film and the bottom insulating layer.
- 4. Double side soft circuit board according to claim 3, it is characterised in thatThe upper-layer insulation film uses high temperature resistant PET or P I materials；The bottom insulating layer uses high temperature resistant PET or P I materials.
- 5. according to claim 1-4 any one of them Double side soft circuit boards, it is characterised in thatThe metallic conductor is tin silk, tin cream, or the copper pipe of filling tin cream or tin silk.
- A kind of 6. production equipment of Double side soft circuit board, it is characterised in that including：First web feed roller, for conveying upper-layer insulation film；First stamping die, positioned at the lower station of the first web feed roller, for being punched on the upper-layer insulation film Multiple perforates；Second web feed roller, for conveying the first copper foil tape；Second stamping die, positioned at the lower station of the second web feed roller, for being punched into first copper foil tape First circuit layer；First hot pressing die, positioned at the lower station of first stamping die and second stamping die, after to punching Upper-layer insulation film, and first circuit layer carry out hot pressing, obtain the first soft board；3rd web feed roller, for layer insulating in conveying；Second hot pressing die, positioned at first hot pressing die and the lower station of the 3rd web feed roller, for described First soft board and the middle layer insulating carry out hot pressing；4th web feed roller, for conveying the second copper foil tape；3rd stamping die, positioned at the lower station of the 4th web feed roller, for being punched into second copper foil tape Second circuit layer；3rd hot pressing die, positioned at second hot pressing die and the lower station of the 3rd stamping die, after to hot pressing The first soft board and middle layer insulating, and the second circuit layer carry out hot pressing；5th web feed roller, for conveying bottom insulating layer；4th stamping die, positioned at the lower station of the 5th web feed roller, for being punched on the bottom insulating layer Multiple perforates；4th hot pressing die, positioned at the 3rd hot pressing die and the lower station of the 4th stamping die, after to hot pressing The first soft board, middle layer insulating and second circuit layer, and the bottom insulating layer carry out hot pressing, obtain double-surface flexible Circuit board substrate；5th stamping die, positioned at the lower station of the 4th hot pressing die, in the Double side soft circuit board substrate The through hole for running through the Double side soft circuit board substrate up and down is punched into, wherein the through hole is at least partly located at institute at the same time State on the first circuit layer and the second circuit layer.
- 7. production equipment according to claim 6, it is characterised in that further include：First waste material wind-up roll, positioned at the lower station of second stamping die, for winding the second stamping die punching The the first copper bound material produced after first copper foil tape；And/orSecond waste material wind-up roll, positioned at the lower station of the 3rd stamping die, for winding the 3rd stamping die punching The the second copper bound material produced after second copper foil tape.
- 8. production equipment according to claim 6, it is characterised in thatFirst stamping die is rotation roll die or tablet stamping die；Second stamping die is rotation roll die or tablet stamping die；3rd stamping die is rotation roll die or tablet stamping die；4th stamping die is rotation roll die or tablet stamping die；5th stamping die is rotation roll die or tablet stamping die.
- 9. production equipment according to claim 6, it is characterised in thatThe first gripping roll is equipped between the first web feed roller and first stamping die, for making the upper strata insulate Layer is tightened before punching；And/orThe second gripping roll is equipped between the second web feed roller and second stamping die, for making first copper foil Band is tightened before punching；And/orThe 3rd gripping roll is equipped between second stamping die and first hot pressing die, for making first circuit layer Tightened before hot pressing；And/orThe 4th gripping roll is equipped between the 3rd web feed roller and second hot pressing die, for making the middle level insulate Layer is tightened before hot pressing；And/orThe 5th gripping roll is equipped between the 4th web feed roller and the 3rd stamping die, for making second copper foil Band is tightened before punching；And/orThe 6th gripping roll is equipped between 3rd stamping die and the 3rd hot pressing die, for making the second circuit layer Tightened before hot pressing；And/orThe 7th gripping roll is equipped between the 5th web feed roller and the 4th stamping die, for making the bottom insulate Layer is tightened before punching；And/orThe 8th gripping roll is equipped between 4th stamping die and the 4th hot pressing die, for making the bottom after punching exhausted Edge layer is tightened before hot pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721294683.1U CN207354694U (en) | 2017-09-30 | 2017-09-30 | Double side soft circuit board and its production equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721294683.1U CN207354694U (en) | 2017-09-30 | 2017-09-30 | Double side soft circuit board and its production equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207354694U true CN207354694U (en) | 2018-05-11 |
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ID=62357427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721294683.1U Active CN207354694U (en) | 2017-09-30 | 2017-09-30 | Double side soft circuit board and its production equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207354694U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990322A (en) * | 2018-08-16 | 2018-12-11 | 鹤山市得润电子科技有限公司 | A kind of double-sided PCB and its manufacturing method |
| CN113478572A (en) * | 2021-07-14 | 2021-10-08 | 江西华视光电有限公司 | COF double-cavity automatic punching structure |
-
2017
- 2017-09-30 CN CN201721294683.1U patent/CN207354694U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990322A (en) * | 2018-08-16 | 2018-12-11 | 鹤山市得润电子科技有限公司 | A kind of double-sided PCB and its manufacturing method |
| CN113478572A (en) * | 2021-07-14 | 2021-10-08 | 江西华视光电有限公司 | COF double-cavity automatic punching structure |
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