CN206332904U - A kind of multi-layer flexible wiring board - Google Patents
A kind of multi-layer flexible wiring board Download PDFInfo
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- CN206332904U CN206332904U CN201621298880.6U CN201621298880U CN206332904U CN 206332904 U CN206332904 U CN 206332904U CN 201621298880 U CN201621298880 U CN 201621298880U CN 206332904 U CN206332904 U CN 206332904U
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Abstract
Multi-layer flexible wiring board of the present utility model, by two layers of cover layer, two pieces of one side core plates, the two-sided core plate of polylith and glue bonding layer composition；One side core plate is made up of line layer and dielectric layer, and two-sided core plate is successively by line layer, dielectric layer and line layer composition；Two-sided core plate is located between two one side core plates；Cover layer is located at upper outer lower face surface, and the line layer of one side core plate is adjacent with cover layer, and dielectric layer is adjacent with the line layer of two-sided core plate, and glue bonding layer is located between adjacent two pieces of two-sided core plates.Multi-layer flexible wiring board of the present utility model is changed to core plate+pure glue+core plate+pure glue+core plate mode from structure and pressed, and can effectively fill point, it is to avoid lamination cavity.Solve unreal, the empty defect of original laminate filler.It is prevented effectively from interlayer dislocation, layering plate bursting unreal with filler etc. abnormal.Cover layer and cover sheet thickness in this implementation is identical with embodiment one.
Description
【Technical field】
The utility model is related to flex circuit application production technical field, and in particular to a kind of flex circuit application and its producer
Method.
【Background technology】
With PCB (Printed Circuit Board, printed circuit board) to small volume, it is lightweight, it is three-dimensional installation and
The direction of high connecting reliability is developed, flexible printed-circuit board hair Zhang Xunmeng, and starts to develop to multi-layer flexible printed board direction,
Multi-layer flexible printed board is one of main growth factor of PCB industry futures.
At present, in industry the preparation method of multi-layer flexible printed board mainly take flexible core plate+pure glue+flexibility core plate (with
Exemplified by four laminates, by line layer L1, core plate dielectric layer 200, line layer L2, glue bonding layer 300, line layer L3, core plate dielectric layer
201, line layer L4, which is sequentially laminated, to be formed) structure made, be illustrated in fig. 1 shown below.
1st, plate bursting is layered, filler is unreal, poor reliability.
Pure glue sticking thickness degree at present on the market is generally relatively thin, about between 25-40UM, because of product thickness limitation,
For Multilayer Flexible Board, individual pure glue filling, it is inadequate that copper thickness is filled out on two sides, it is impossible to effectively filling, cavity easily occurs, causes plate
Plate bursting is layered after sub follow-up welding higher device temperature.
2nd, interlayer dislocation, internal layer short circuit.
Because flex plate core plate is generally relatively thin, the total thickness of slab of Multilayer Flexible Board typically can not use riveting in below 0.5mm, pressing
The fixed pressing of nail, it is most of to cling or fuse positioning using gummed paper, pressed using traditional press and fast press, pressing pressure
Greatly, at high temperature under high pressure, gummed paper can not be fixed effectively with fusion positioning, interlayer dislocation exception is easily occurred, is caused plank direct
Scrap.
【Utility model content】
In view of this, the utility model provides a kind of improved flexibility circuit board manufacturing method of production technology and uses this method
The flex circuit application being made.
The utility model is adopted the following technical scheme that：
A kind of multi-layer flexible method for manufacturing circuit board, it is characterised in that comprise the following steps：
S21：Sawing sheet is there is provided 2 pieces of one side core plates and the two-sided core plate of N-2 blocks, wherein 2 pieces of core plates are by line layer and dielectric layer group
Into the two-sided core plate of N-2 blocks is successively by line layer, dielectric layer and line layer composition；
S22：Make the line layer of the two-sided core plate of N-2 blocks；
S23：Make N-1 blocks gemel connection layer；
S24：Above-mentioned each material is arranged according to following order：The line layer of 2 pieces of one side core plates is located at outer surface, it is two-sided
Arrangement is located between two one side core plates core plate in order successively, and gemel connection layer is located between every two pieces of adjacent core plates；
S25：Lamination pressing：The layers of material of walkthrough plate in step S24 is pressed；
S26：Make the line layer of 2 pieces of one side core plates；
S27：Make 2 pieces of cover layers；
S28：Two pieces of cover layers are respectively arranged on 2 pieces of one side core plate line layer outer surfaces by walkthrough plate；
S29：Lamination pressing：By the layers of material pressing of walkthrough plate in step S28.
It is preferred that, it is additionally included in the following steps added before step S24：
S210：Two cover plates are made, cover plate has same hole position with above-mentioned core plate；Two cover plates are respectively arranged on one side core
Plate line layer outer surface；
S211：It is laminated riveted：Add rivet in rivet hole；
Be additionally included in added between step S25 and S26 the step of taking cover plate.
It is preferred that, the thickness of the cover layer is 15-70UM.
It is preferred that, the cover sheet thickness is 0.2-1.0mm.
The utility model also provides a kind of multi-layer flexible circuit being made using above-mentioned multi-layer flexible method for manufacturing circuit board
Plate, it is by two layers of cover layer, two pieces of one side core plates, the two-sided core plate of polylith and glue bonding layer composition；One side core plate by line layer and
Dielectric layer is constituted, and two-sided core plate is successively by line layer, dielectric layer and line layer composition；Two-sided core plate located at two one side core plates it
Between；Cover layer is located at upper outer lower face surface, and the line layer of one side core plate is adjacent with cover layer, the line layer of dielectric layer and two-sided core plate
Adjacent, glue bonding layer is located between adjacent two pieces of two-sided core plates.
It is preferred that, the covering film thickness is 15-70UM.
Advantageous Effects of the present utility model are：
Multiple flexible core plate pressings are changed to compared with original core plate+pure glue+core plate lamination, multilayer of the present utility model is scratched
Property wiring board core plate+pure glue+core plate+pure glue+core plate mode be changed to from structure press, first intermediate layer flexibility core plate is made
Circuit layer pattern, then two flexible core plates of outer layer are etched into one side, centre is closed by pure glue laminated, now, two core plates of outer layer
Without inner figure, interlayer dislocation is not resulted in yet even if pressing displacement.In addition internal layer needs pure glue sticking layer one side filler, can have
Effect filling point, it is to avoid lamination cavity.Solve unreal, the empty defect of original laminate filler.It is prevented effectively from interlayer wrong
Position and unreal, the layering plate bursting of filler etc. are abnormal.Cover layer and cover sheet thickness in this implementation is identical with embodiment one.
【Brief description of the drawings】
Fig. 1 four layers of flexibility circuit plate structure schematic diagrams of the prior art；
Four layers of flex circuit application first in Fig. 2 embodiments one make view；
Four layers of flex circuit application second in Fig. 3 embodiments one make view；
Four layers of flexibility circuit plate structure schematic diagram in Fig. 4 embodiments two.
【Embodiment】
In order that the technical scheme and technique effect of this patent are clearer, with reference to the accompanying drawings and examples to this patent
Embodiment be described in detail.
Embodiment one：
Multi-layer flexible method for manufacturing circuit board in such as Fig. 2 and Fig. 3, the present embodiment, by taking four layers of flex circuit application as an example, bag
Include following steps：
S11：There is provided two pieces of core plates for sawing sheet；
Two pieces of core plates are respectively the first core plate and the second core plate.First core plate is from outside to inside by line layer L11, dielectric layer
121, line layer L12 are constituted.Second core plate is from inside to outside by line layer L13, dielectric layer 122, line layer L14 compositions.Line layer
L11 and line layer L14 is outer layer core plate line pattern face, and line layer L12 and line layer L13 are core material line pattern face.
S12：Make line layer L12 and L13.The step includes following several steps again：
S121：Interior photoimaging：L12 and L13 line patterns are made according to the figure film；
S122：Internal layer is etched：Line layer L12 and L13 are made using method for chemially etching；
S123：Internal layer is examined：Examine line layer L12 and L13 whether qualified；
S13：Make cover layer 112.The step includes the supporting several steps of sawing sheet → cutting → auxiliary material.
S14：Cover layer 112 and line layer L12 or L13 are pressed.
S15：Make glue sticking layer 131.The step includes the supporting several steps of sawing sheet → cutting → auxiliary material.
S16：Two cover plates 14 are made, cover plate 14 and two pieces of core plates have same hole position.
S17：Above-mentioned each material is arranged according to following order from top to bottom：Cover plate 14, line layer L11, dielectric layer
121, line layer L12, cover layer 112, glue sticking layer 131, line layer L13, dielectric layer 122, line layer L14, cover plate 14 or
Cover plate 14, line layer L11, dielectric layer 121, line layer L12, glue sticking layer 131, cover layer 112, line layer L13, dielectric layer
122, line layer L14, cover plate 14.
S18：It is laminated riveted：Add rivet 15 in rivet hole；
S19：Lamination pressing, the layers of material of walkthrough plate in step S17 is pressed；
S110：Two cover plates 14 are taken, such as Fig. 3；
S111：Make line layer L11 and L14.It comprises the following steps：
S1111：Drilling：Various types of holes, such as electroplating hole, non-electrical plated hole are got out on the material that step S19 is obtained；
S1112：Heavy copper：On the non-conductive hole wall base material drilled, the very thin chemistry of last layer is chemically deposited
Copper, using the substrate electroplated as step S1113；
S1113：Panel plating：The electro-coppering in plate face and hole wall；
S1114：Outer photoimaging：Outer-layer circuit layer L11 and L14 is made according to the figure film；
S1115：Image is electroplated：One layer of plating reaches the copper of requirement thickness on the exposed copper sheet of line pattern or on hole wall
Layer；
S1116：Outer layer is etched：Using chemical reaction method by the layers of copper etching away at logicalnot circuit position；
S1117：Outer layer etching is examined：Examine the line layer L11, L14 that make whether qualified.
S112：Cover layer 111 and 113, the same S13 of its step are made, and cover layer 111 will be covered on line layer L11
Epiphragma 113 is pressed located at line layer L14 laminateds.
The step of machining process after pressing is in the prior art, it will not be repeated here.
Four layers of flexibility circuit board manufacturing method in the present embodiment, using thickness for 15-70UM cover layer fill L12 or
Pressed again with glue sticking layer 131 after person's L13 sandwich circuits, efficiently solve pure glue sticking layer thickness low LCL, it is impossible to effectively fill out completely
The defect of circuit is filled, is first filled using cover layer with any one layer of L12 or L13 sandwich circuits, fills and leads up a sandwich circuit, another layer
Filling then is gone using glue, now, the thickness of glue can effectively be filled up completely with line layer, again can be Nian Jie with cover layer well, keep away
Exempt from the problems such as unreal filler, lamination cavity, layering plate bursting, be effectively guaranteed the reliability of plank.
Pressed using cover plate 14 plus rivet 15, in bonding processes, rivet 15 effectively makes each layer core of plank by rivet hole
Plate is fixed, it is to avoid plank is shifted under the bonding processes high pressure, is efficiently solved lamination pressing slide plate, interlayer dislocation and is asked
Topic；Simultaneously thickeied using cover plate 14, can avoid because flex circuit application is thin, and can not riveted defect, solve thin plate riveted
The exception of dislocation；And cover plate of the thickness between 0.2-1.0mm can make, and range of choice is big.
Such as Fig. 3, four layers of flex circuit application being made using above-mentioned four layers of flexibility circuit board manufacturing method, from top to bottom successively
By cover layer 111, line layer L11, dielectric layer 121, line layer L12, cover layer 112, glue sticking layer 131, line layer L13, Jie
Matter layer 122, line layer L14 and the lamination of cover layer 113 are formed or from top to bottom successively by cover layer 111, line layer L11, medium
Layer 121, line layer L12, glue sticking layer 131, cover layer 112, line layer L13, dielectric layer 122, line layer L14 and cover layer
113 laminations are formed.
The circuit board of more numbers of plies is such as made, for example the flex circuit application of six layers, eight layers etc. more numbers of plies, only need to be adjacent
Cover layer of the addition thickness in the range of 15-70UM just can obtain satisfactory many with glue bonding layer pressing between two pieces of core plates
Layer flex circuit application.Preparation method is identical with four layers of flexibility circuit board manufacturing method, first makes internal wiring layer, then makes interior
Cover layer and glue bonding layer between portion's line layer, make outside line layer and cover layer, after being finally laminated again after lamination.
Four layers of flexibility circuit board manufacturing method in the present embodiment apply also for making the flex circuit application of more numbers of plies.With
The multi-layer flexible wiring board that this method is made is by the two-sided core plate of N blocks, (N+1) layer cover layer, and (N-1) layer glue bonding layer composition；
Two-sided core plate is successively by line layer, dielectric layer and line layer composition；Cover layer outer lower face surface and adjacent on the flex circuit application
Between two pieces of two-sided core plates, glue bonding layer is between the cover layer and line layer of adjacent two pieces of core plates；N≥2.
Embodiment two：
Multi-layer flexible method for manufacturing circuit board in such as Fig. 4, the present embodiment still exemplified by four layers, comprises the following steps：
S21：There is provided three pieces of core plates for sawing sheet；
Three pieces of core plates are respectively the 3rd core plate, the 4th core plate and the 5th core plate.3rd core plate is from outside to inside by line layer
L21, dielectric layer 221 is constituted；4th core plate is successively by line layer L22, dielectric layer 222 and line layer L23 compositions；5th core plate from
It is interior to being made up of outside dielectric layer 223 and line layer L24.
S22：Make line layer L22, line layer L23；Step is identical with the S12 in embodiment one；
S23：Glue sticking layer 231 and 232 is made, glue sticking layer making step is identical with the S15 in embodiment one；
S24：Walkthrough plate：Above-mentioned each material is arranged according to following order from top to bottom：Line layer L21, dielectric layer
221, glue sticking layer 231, line layer L22, dielectric layer 222, line layer L23, dielectric layer 223, glue sticking layer 232, dielectric layer
224, L24 layers of line layer；
S25：Lamination pressing：By the layers of material pressing of walkthrough plate in step S24；
S26：Line layer L21 and L24 are made, its making step is identical with the S111 in embodiment one；
S27：The S13 made in cover layer 211 and 212, its step be the same as Example one is identical；
S28：Walkthrough plate：Above-mentioned each material is arranged according to following order from top to bottom：Cover layer 211, line layer
L21, dielectric layer 221, glue sticking layer 231, line layer L22, dielectric layer 222, line layer L23, dielectric layer 223, glue sticking layer
232, L24 layers of line layer and cover layer 212；
S29：Lamination pressing：By the layers of material pressing of walkthrough plate in step S28.
Multi-layer flexible method for manufacturing circuit board in the present embodiment, can also add following steps before step S24：
S210：Two cover plates are made, cover plate and three pieces of core plates have same hole position.Two cover plates are respectively arranged on line layer
L21 is upper and line layer L24 under.
S211：It is laminated riveted：Add rivet in rivet hole；
So the step of addition takes cover plate is needed after step S25.
Multi-layer flexible method for manufacturing circuit board in the present embodiment solves interlayer problem of misalignment, secondary outer-layer circuit layer L21
It is photosphere with L24, without circuit.Two layers of line layer L21 of outermost layer and L24 be according to internal layer circuit layer L22, line layer L23's
Target position layer is positioned, and is big copper sheet before external layer lamination, can be according to internal layer circuit layer L22, line layer L23 target after pressing
Position layer is positioned, and outer layer can change with one after target position layer harmomegathus change, effectively solve displacement and layer inclined problem caused by harmomegathus.
Be changed to multiple flexible core plates pressings compared with original core plate+pure glue+core plate lamination, the present embodiment from structure more
It is changed to core plate+pure glue+core plate+pure glue+core plate mode to press, intermediate layer flexibility core plate is first made L22/L23 layer patterns, then
The flexible core plates of outer layer two are etched into one side, and centre is closed by pure glue laminated, now, two core plates of outer layer without inner figure, even if
Pressing displacement does not result in interlayer dislocation yet.In addition internal layer needs pure glue sticking layer one side filler, can effectively fill point, it is to avoid
Lamination cavity.Solve unreal, the empty defect of original laminate filler.Be prevented effectively from interlayer dislocation with filler it is unreal, point
Layer plate bursting etc. is abnormal.Cover layer and cover sheet thickness in this implementation is identical with embodiment one.
Such as Fig. 4, four layers of flex circuit application being made using above-mentioned four layers of flexibility circuit board manufacturing method, under upper successively
By cover layer 211, line layer L21, dielectric layer 221, glue sticking layer 231, line layer L22, dielectric layer 222, line layer L23, glue
Adhesive linkage 232, dielectric layer 223, line layer L24 and the lamination of cover layer 212 are formed.
When making the flex circuit application of more numbers of plies, it can refer to and follow first making pair in four layers of flexibility circuit board manufacturing method
Face core plate line layer and glue bonding layer, the rear principle for making cover layer and one side core plate line layer, its specific steps is herein no longer
Repeat.
Four layers of flexibility circuit board manufacturing method apply also for making the flex circuit application of more numbers of plies.It is made of this method
Multi-layer flexible wiring board by two layers of cover layer, two pieces of one side core plates, the two-sided core plate of polylith and glue bonding layer composition；One side core plate
It is made up of line layer and dielectric layer, two-sided core plate is successively by line layer, dielectric layer and line layer composition；Two-sided core plate is single located at two
Between the core plate of face；Cover layer is located at upper outer lower face surface, and the line layer of one side core plate is adjacent with cover layer, dielectric layer and two-sided core plate
Line layer it is adjacent, glue bonding layer be located at adjacent two pieces of two-sided core plates between.
The preferred embodiment of this patent is the foregoing is only, this patent is not limited to, for the skill of this area
For art personnel, this patent can have various modifications and variations.It is all within the spirit and principle of this patent, that is made any repaiies
Change, equivalent, improvement etc., should be included within the protection domain of this patent.
Claims (2)
1. a kind of multi-layer flexible wiring board, it is characterised in that：By two layers of cover layer, two pieces of one side core plates, the two-sided core plate of polylith and
Glue bonding layer is constituted；One side core plate is made up of line layer and dielectric layer, and two-sided core plate is successively by line layer, dielectric layer and line layer
Composition；Two-sided core plate is located between two one side core plates；Cover layer is located at upper outer lower face surface, the line layer and cover layer of one side core plate
Adjacent, dielectric layer is adjacent with the line layer of two-sided core plate, and glue bonding layer is located between adjacent two pieces of two-sided core plates.
2. multi-layer flexible wiring board as claimed in claim 1, it is characterised in that：The covering film thickness is 15-70UM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621298880.6U CN206332904U (en) | 2016-11-29 | 2016-11-29 | A kind of multi-layer flexible wiring board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621298880.6U CN206332904U (en) | 2016-11-29 | 2016-11-29 | A kind of multi-layer flexible wiring board |
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| CN206332904U true CN206332904U (en) | 2017-07-14 |
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| CN201621298880.6U Active CN206332904U (en) | 2016-11-29 | 2016-11-29 | A kind of multi-layer flexible wiring board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106385761A (en) * | 2016-11-29 | 2017-02-08 | 珠海杰赛科技有限公司 | Manufacture method for multilayer flexible circuit board and multilayer flexible circuit board |
-
2016
- 2016-11-29 CN CN201621298880.6U patent/CN206332904U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106385761A (en) * | 2016-11-29 | 2017-02-08 | 珠海杰赛科技有限公司 | Manufacture method for multilayer flexible circuit board and multilayer flexible circuit board |
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