CN106385761A - Manufacture method for multilayer flexible circuit board and multilayer flexible circuit board - Google Patents
Manufacture method for multilayer flexible circuit board and multilayer flexible circuit board Download PDFInfo
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- CN106385761A CN106385761A CN201611078984.0A CN201611078984A CN106385761A CN 106385761 A CN106385761 A CN 106385761A CN 201611078984 A CN201611078984 A CN 201611078984A CN 106385761 A CN106385761 A CN 106385761A
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- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 238000000034 method Methods 0.000 title claims description 24
- 238000003475 lamination Methods 0.000 claims abstract description 26
- 238000003825 pressing Methods 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 14
- 238000004026 adhesive bonding Methods 0.000 claims description 11
- 239000010410 layer Substances 0.000 abstract description 304
- 239000003292 glue Substances 0.000 abstract description 36
- 239000011229 interlayer Substances 0.000 abstract description 9
- 230000007547 defect Effects 0.000 abstract description 5
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 230000032798 delamination Effects 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 16
- 230000001070 adhesive effect Effects 0.000 description 16
- 239000000945 filler Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 230000009172 bursting Effects 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000002671 adjuvant Substances 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- -1 coverlay 112 Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 241001232787 Epiphragma Species 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000003102 growth factor Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a multilayer flexible circuit board. The multilayer flexible circuit board consists of two layers of covering films, two single-face core plates, a plurality of double-face core plates and a plurality of glue adhesive layers; the single-face core plate consists of a circuit layer and a medium layer; the double-face core plate consists of a circuit layer, a medium layer and a circuit layer which are arranged successively; the double-face core plate is arranged between two single-face core plates; the covering films are arranged on an upper outer surface and on a lower outer surface; the circuit layer of the single-face core plate is adjacent to the covering film; the medium layer is adjacent to the circuit layer of the double-face core plate; and the glue adhesive layer is arranged between two adjacent double-face core plates. The structure of the multilayer flexible circuit board is changed into a lamination mode of a core plate+pure glue+a core plate+pure glue +a core plate, which can effectively fill and avoid lamination cavities, solves defects of the original lamination layers that the lamination is not solid and cavities are left, and effectively avoids interlayer malposition, non-substantial glue filling, delamination, broken plate etc. The thicknesses of the covering film and the cover plate are the same as that in an embodiment 1.
Description
【Technical field】
The present invention relates to flex circuit application production technical field is and in particular to a kind of flex circuit application and its production method.
【Background technology】
With PCB (Printed Circuit Board, printed circuit board) to small volume, lightweight, three-dimensional install and
The direction of high connecting reliability is developed, and flexible printed-circuit board sends out Zhang Xunmeng, and starts to develop to multi-layer flexible printed board direction,
Multi-layer flexible printed board is one of main growth factor of PCB industry future.
At present, in industry the manufacture method of multi-layer flexible printed board mainly take flexible central layer+pure glue+flexibility central layer (with
As a example four laminates, by line layer L1, central layer dielectric layer 200, line layer L2, glue bonding layer 300, line layer L3, central layer dielectric layer
201, line layer L4 is sequentially laminated and forms) structure made, be illustrated in fig. 1 shown below.
1st, it is layered plate bursting, filler is unreal, poor reliability.
Pure glue thickness of adhibited layer on the market is generally relatively thin at present, about between 25-40UM, because of product thickness limitation,
For Multilayer Flexible Board, individual pure glue filling, two sides is filled out copper thickness not it is impossible to effective fill, easily cavity, lead to plate
Son is follow-up to weld layering plate bursting after higher device temperature.
2nd, interlayer dislocation, internal layer short circuit.
Because flex plate central layer is generally relatively thin, the total thickness of slab of Multilayer Flexible Board, typically in below 0.5mm, cannot use riveting during pressing
The fixing pressing of nail, major part is clung using gummed paper or is fused positioning, using traditional press and fast press pressing, pressing pressure
Greatly, at high temperature under high pressure, gummed paper cannot be effectively fixing with fusion positioning, interlayer dislocation easily extremely, leads to plank direct
Scrap.
【Content of the invention】
In view of this, the present invention provides a kind of production technology improved flexibility circuit board manufacturing method and is made with the method
Flex circuit application.
The present invention adopts the following technical scheme that：
A kind of multi-layer flexible method for manufacturing circuit board is it is characterised in that comprise the steps：
S21：Sawing sheet, provides 2 pieces of one side central layers and the two-sided central layer of N-2 block, and wherein 2 pieces central layers are made up of line layer and dielectric layer,
All successively by line layer, dielectric layer and line layer form the two-sided central layer of N-2 block；
S22：Make the line layer of the two-sided central layer of N-2 block；
S23：Make N-1 block gemel connection layer；
S24：Above-mentioned each material is arranged according to following order：By the line layer of 2 pieces of one side central layers located at outer surface, two-sided central layer
Arrange successively in order between two one side central layers, gemel connection layer is between every two pieces of adjacent central layers；
S25：Lamination pressing：The layers of material of walkthrough plate in step S24 is pressed；
S26：Make the line layer of 2 pieces of one side central layers；
S27：Make 2 pieces of coverlays；
S28：Walkthrough plate, this two pieces of coverlays are respectively arranged on 2 pieces of one side central layer line layer outer surfaces；
S29：Lamination pressing：Layers of material pressing by walkthrough plate in step S28.
Preferably, the following steps added before being additionally included in step S24：
S210：Make two cover plates, cover plate and above-mentioned central layer have same hole position；Two cover plates are respectively arranged on one side central layer line
Road floor outer surface；
S211：Lamination riveted：Rivet is added in rivet hole；
It is additionally included in the step taking cover plate add between step S25 and S26.
Preferably, the thickness of described coverlay is 15-70UM.
Preferably, described cover sheet thickness is 0.2 1.0mm.
The present invention also provides a kind of multi-layer flexible wiring board made using above-mentioned multi-layer flexible method for manufacturing circuit board, it
By two-layer coverlay, two pieces of one side central layers, the two-sided central layer of polylith and glue bonding layer composition；One side central layer is by line layer and dielectric layer
Composition, successively by line layer, dielectric layer and line layer form two-sided central layer；Two-sided central layer is between two one side central layers；Cover
, located at upper outer lower face surface, the line layer of one side central layer is adjacent with coverlay, and dielectric layer is adjacent with the line layer of two-sided central layer, glue for film
Tack coat is between adjacent two pieces of two-sided central layers.
Preferably, described covering film thickness is 15-70UM.
The method have the benefit that：
It is changed to multiple flexible central layer pressings, the multi-layer flexible line of the present invention compared with original central layer+pure glue+central layer lamination
Road plate is changed to central layer+pure glue+central layer+pure glue+central layer mode from structure and presses, and first intermediate layer flexibility central layer is made circuit
Layer pattern, then two flexible central layers of outer layer are etched into one side, centre is closed by pure glue laminated, and now, two central layers of outer layer are no interior
Layer pattern, even if pressing displacement does not result in interlayer dislocation yet.In addition internal layer needs pure glue adhesive linkage one side filler, can effectively fill out
Fully, it is to avoid lamination cavity.Solve unreal, the empty defect of original laminate filler.Be prevented effectively from interlayer dislocation with
Filler is unreal, it is abnormal to be layered plate bursting etc..Coverlay in this enforcement and cover sheet thickness with identical in embodiment one.
【Brief description】
Fig. 1 four layers of flexibility circuit plate structure schematic diagram of the prior art；
Four layers of flex circuit application first in Fig. 2 embodiment one make view；
Four layers of flex circuit application second in Fig. 3 embodiment one make view；
Four layers of flexibility circuit plate structure schematic diagram in Fig. 4 embodiment two.
【Specific embodiment】
In order that the technical scheme of this patent and technique effect are clearer, with reference to the accompanying drawings and examples to this patent
Specific embodiment be described in detail.
Embodiment one：
As Fig. 2 and Fig. 3, the multi-layer flexible method for manufacturing circuit board in the present embodiment, wrap taking four layers of flex circuit application as a example
Include following steps：
S11：Sawing sheet, provides two pieces of central layers；
Two pieces of central layers are respectively the first central layer and the second central layer.First central layer is from outside to inside by line layer L11, dielectric layer 121, line
Road floor L12 forms.From inside to outside by line layer L13, dielectric layer 122, line layer L14 forms second central layer.Line layer L11 and line
Road floor L14 is outer layer central layer line pattern face, and line layer L12 and line layer L13 is core material line pattern face.
S12：Make line layer L12 and L13.This step includes several steps as follows again：
S121：Interior photoimaging：Make L12 and L13 line pattern according to the figure film；
S122：Internal layer etches：Line layer L12 and L13 is made using method for chemially etching；
S123：Internal layer is checked：Whether line layer L12 and L13 be qualified for inspection；
S13：Make coverlay 112.This step includes the supporting several steps of sawing sheet → cutting → adjuvant.
S14：By coverlay 112 and line layer L12 or L13 pressing.
S15：Make glue adhesive linkage 131.This step includes the supporting several steps of sawing sheet → cutting → adjuvant.
S16：Make two cover plates 14, cover plate 14 and two pieces of central layers have same hole position.
S17：Above-mentioned each material is arranged according to following order from top to bottom：Cover plate 14, line layer L11, dielectric layer
121, line layer L12, coverlay 112, glue adhesive linkage 131, line layer L13, dielectric layer 122, line layer L14, cover plate 14 or
Cover plate 14, line layer L11, dielectric layer 121, line layer L12, glue adhesive linkage 131, coverlay 112, line layer L13, dielectric layer
122, line layer L14, cover plate 14.
S18：Lamination riveted：Rivet 15 is added in rivet hole；
S19：Lamination pressing, the layers of material of walkthrough plate in step S17 is pressed；
S110：Take two cover plates 14, such as Fig. 3；
S111：Make line layer L11 and L14.It comprises the steps：
S1111：Boring：Various types of holes, such as electroplating hole, non-electrical plated hole are got out on the material that step S19 obtains；
S1112：Heavy copper：On the non-conductive hole wall base material of boring, the chemically very thin chemistry of deposition last layer
Copper, using the substrate electroplated as step S1113；
S1113：Panel plating：Electro-coppering in plate face with hole wall；
S1114：Outer photoimaging：Make outer-layer circuit layer L11 and L14 according to the figure film；
S1115：Image is electroplated：On the exposed copper sheet of line pattern or on hole wall, one layer of plating reaches the copper of requirement thickness
Layer；
S1116：Outer layer etches：Using chemical reaction method by the layers of copper etching away at logicalnot circuit position；
S1117：Outer layer etching inspection：Whether the line layer L11 that inspection makes, L14 are qualified.
S112：Make coverlay 111 and 113, the same S13 of its step, and by coverlay 111 on line layer L11, will cover
Epiphragma 113 presses located at line layer L14 laminated.
Machining process after pressing is step of the prior art, will not be described here.
Four layers of flexibility circuit board manufacturing method in the present embodiment, using thickness for 15-70UM coverlay filling L12 or
Press with glue adhesive linkage 131 again after person's L13 sandwich circuit, efficiently solve pure glue thickness of adhibited layer not it is impossible to effectively fill out completely
Fill the defect of circuit, using coverlay first one layer filling any with L12 or L13 sandwich circuit, so that a sandwich circuit is filled and led up, another layer
Then go to fill using glue, now, the thickness of glue effectively can be filled up completely with line layer, and can be bonding with coverlay well, keep away
Exempted from filler unreal, lamination cavity, layering plate bursting the problems such as, be effectively guaranteed the reliability of plank.
Pressed using cover plate 14 plus rivet 15, in bonding processes, rivet 15 effectively makes plank each layer core by rivet hole
Plate is fixed, it is to avoid plank displacement under the bonding processes high pressure, efficiently solves lamination pressing slide plate, interlayer dislocation is asked
Topic；Thickeied using cover plate 14 simultaneously, can avoid because flex circuit application thin, and cannot riveted defect, solve thin plate riveted
The exception of dislocation；And cover plate between 0.2 1.0mm for the thickness all can make, and the range of choice is big.
As Fig. 3, the four layers of flex circuit application made using above-mentioned four layers of flexibility circuit board manufacturing method, from top to bottom successively
By coverlay 111, line layer L11, dielectric layer 121, line layer L12, coverlay 112, glue adhesive linkage 131, line layer L13, it is situated between
Matter layer 122, line layer L14 and coverlay 113 lamination form or from top to bottom successively by coverlay 111, line layer L11, medium
Layer 121, line layer L12, glue adhesive linkage 131, coverlay 112, line layer L13, dielectric layer 122, line layer L14 and coverlay
113 laminations form.
As made the circuit board of more numbers of plies, the flex circuit application of such as six layers, eight layers etc. more numbers of plies, only need to be adjacent
Add between two pieces of central layers the pressing of coverlay in the range of 15-70UM for the thickness and glue bonding layer just can get satisfactory many
Layer flex circuit application.Manufacture method is identical with four layers of flexibility circuit board manufacturing method, first makes internal wiring layer, then makes interior
Coverlay between portion's line layer and glue bonding layer, make outside line layer and coverlay again after lamination, after being finally laminated.
Four layers of flexibility circuit board manufacturing method in the present embodiment apply also for making the flex circuit application of more numbers of plies.With
The multi-layer flexible wiring board that the method is made is by the two-sided central layer of N block, (N+1) layer coverlay, and (N-1) layer glue bonding layer composition；
Successively by line layer, dielectric layer and line layer form two-sided central layer；Coverlay outer lower face surface and adjacent on flex circuit application
Between two pieces of two-sided central layers, glue bonding layer is between the coverlay and line layer of adjacent two pieces of central layers；N≥2.
Embodiment two：
As Fig. 4, the multi-layer flexible method for manufacturing circuit board in the present embodiment, still taking four layers as a example, comprises the steps：
S21：Sawing sheet, provides three pieces of central layers；
Three pieces of central layers are respectively the 3rd central layer, the 4th central layer and the 5th central layer.3rd central layer is from outside to inside by line layer
L21, dielectric layer 221 forms；Successively by line layer L22, dielectric layer 222 and line layer L23 form 4th central layer；5th central layer from
Interior to being made up of dielectric layer 223 and line layer L24 outward.
S22：Make line layer L22, line layer L23；Step is identical with the S12 in embodiment one；
S23：Make glue adhesive linkage 231 and 232, glue adhesive linkage making step is identical with the S15 in embodiment one；
S24：Walkthrough plate：Above-mentioned each material is arranged according to following order from top to bottom：Line layer L21, dielectric layer
221, glue adhesive linkage 231, line layer L22, dielectric layer 222, line layer L23, dielectric layer 223, glue adhesive linkage 232, dielectric layer
224, line layer L24 layer；
S25：Lamination pressing：Layers of material pressing by walkthrough plate in step S24；
S26：Make line layer L21 and L24, its making step is identical with the S111 in embodiment one；
S27：Make coverlay 211 and 212, its step is identical with the S13 in embodiment one；
S28：Walkthrough plate：Above-mentioned each material is arranged according to following order from top to bottom：Coverlay 211, line layer
L21, dielectric layer 221, glue adhesive linkage 231, line layer L22, dielectric layer 222, line layer L23, dielectric layer 223, glue adhesive linkage
232, line layer L24 layer and coverlay 212；
S29：Lamination pressing：Layers of material pressing by walkthrough plate in step S28.
Multi-layer flexible method for manufacturing circuit board in the present embodiment, can also add following steps before step S24：
S210：Make two cover plates, cover plate and three pieces of central layers have same hole position.Two cover plates are respectively arranged on line layer
L21 is upper and line layer L24 under.
S211：Lamination riveted：Rivet is added in rivet hole；
So need to add the step taking cover plate after step S25.
Multi-layer flexible method for manufacturing circuit board in the present embodiment solves interlayer problem of misalignment, secondary outer-layer circuit layer L21
It is photosphere with L24, do not have circuit.Outermost layer two-layer line layer L21 and L24 is according to internal layer circuit layer L22, line layer L23's
Target position layer, to position, is big copper sheet before external layer lamination, can be according to internal layer circuit layer L22, the target of line layer L23 after pressing
Positioning, after the change of target position layer harmomegathus, outer layer can one change position layer, effectively solving displacement inclined problem with the layer that harmomegathus leads to.
Be changed to multiple flexible central layers pressings compared with original central layer+pure glue+central layer lamination, the present embodiment from structure more
It is changed to central layer+pure glue+central layer+pure glue+central layer mode to press, first intermediate layer flexibility central layer is made L22/L23 layer pattern, then
The flexible central layer of outer layer two is etched into one side, and centre is closed by pure glue laminated, now, two central layer no inner figures of outer layer, even if
Pressing displacement does not result in interlayer dislocation yet.In addition internal layer needs pure glue adhesive linkage one side filler, can effectively fill point, it is to avoid
Lamination cavity.Solve unreal, the empty defect of original laminate filler.Be prevented effectively from interlayer dislocation with filler unreal, point
Layer plate bursting etc. is abnormal.Coverlay in this enforcement and cover sheet thickness with identical in embodiment one.
As Fig. 4, the four layers of flex circuit application made using above-mentioned four layers of flexibility circuit board manufacturing method, under upper successively
By coverlay 211, line layer L21, dielectric layer 221, glue adhesive linkage 231, line layer L22, dielectric layer 222, line layer L23, glue
Adhesive linkage 232, dielectric layer 223, line layer L24 and coverlay 212 lamination form.
Make more numbers of plies flex circuit application when, can refer to follow in four layers of flexibility circuit board manufacturing method first make double
Face central layer line layer and glue bonding layer, make the principle of coverlay and one side central layer line layer, its concrete steps here is no longer afterwards
Repeat.
This four layers of flexibility circuit board manufacturing methods apply also for making the flex circuit application of more numbers of plies.Made with the method
Multi-layer flexible wiring board by two-layer coverlay, two pieces of one side central layers, the two-sided central layer of polylith and glue bonding layer composition；One side central layer
It is made up of line layer and dielectric layer, successively by line layer, dielectric layer and line layer form two-sided central layer；Two-sided central layer is single located at two
Between the central layer of face；, located at upper outer lower face surface, the line layer of one side central layer is adjacent with coverlay for coverlay, dielectric layer and two-sided central layer
Line layer adjacent, glue bonding layer is between adjacent two pieces of two-sided central layers.
The foregoing is only the preferred embodiment of this patent, be not limited to this patent, for the skill of this area
For art personnel, this patent can have various modifications and variations.Within all spirit in this patent and principle, that is made any repaiies
Change, equivalent, improvement etc., should be included within the protection domain of this patent.
Claims (6)
1. a kind of multi-layer flexible method for manufacturing circuit board is it is characterised in that comprise the steps：
S21：Sawing sheet, provides 2 pieces of one side central layers and the two-sided central layer of N-2 block, and wherein 2 pieces central layers are made up of line layer and dielectric layer,
All successively by line layer, dielectric layer and line layer form the two-sided central layer of N-2 block；
S22：Make the line layer of the two-sided central layer of N-2 block；
S23：Make N-1 block gemel connection layer；
S24：Above-mentioned each material is arranged according to following order：By the line layer of 2 pieces of one side central layers located at outer surface, two-sided central layer
Arrange successively in order between two one side central layers, gemel connection layer is between every two pieces of adjacent central layers；
S25：Lamination pressing：The layers of material of walkthrough plate in step S24 is pressed；
S26：Make the line layer of 2 pieces of one side central layers；
S27：Make 2 pieces of coverlays；
S28：Walkthrough plate, this two pieces of coverlays are respectively arranged on 2 pieces of one side central layer line layer outer surfaces；
S29：Lamination pressing：Layers of material pressing by walkthrough plate in step S28.
2. multi-layer flexible method for manufacturing circuit board as claimed in claim 1 is it is characterised in that add before being additionally included in step S24
Plus following steps：
S210：Make two cover plates, cover plate and above-mentioned central layer have same hole position；Two cover plates are respectively arranged on one side central layer line
Road floor outer surface；
S211：Lamination riveted：Rivet is added in rivet hole；
It is additionally included in the step taking cover plate add between step S25 and S26.
3. multi-layer flexible method for manufacturing circuit board as claimed in claim 1 or 2 it is characterised in that：The thickness of described coverlay
For 15-70UM.
4. multi-layer flexible method for manufacturing circuit board as claimed in claim 1 or 2 it is characterised in that：Described cover sheet thickness is
0.2—1.0mm.
5. the multi-layer flexible wiring board made using described multi-layer flexible method for manufacturing circuit board arbitrary in claim 1 to 4,
It is characterized in that：By two-layer coverlay, two pieces of one side central layers, the two-sided central layer of polylith and glue bonding layer composition；One side central layer is by line
Road floor and dielectric layer composition, successively by line layer, dielectric layer and line layer form two-sided central layer；Two-sided central layer is located at two one side cores
Between plate；, located at upper outer lower face surface, the line layer of one side central layer is adjacent with coverlay for coverlay, the line of dielectric layer and two-sided central layer
Road floor is adjacent, and glue bonding layer is between adjacent two pieces of two-sided central layers.
6. multi-layer flexible wiring board as claimed in claim 5 it is characterised in that：Described covering film thickness is 15-70UM.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611078984.0A CN106385761A (en) | 2016-11-29 | 2016-11-29 | Manufacture method for multilayer flexible circuit board and multilayer flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611078984.0A CN106385761A (en) | 2016-11-29 | 2016-11-29 | Manufacture method for multilayer flexible circuit board and multilayer flexible circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312684A (en) * | 2020-09-28 | 2021-02-02 | 惠州市金百泽电路科技有限公司 | Method for controlling deviation of laminated layers of multilayer FPC board |
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| CN101203095A (en) * | 2006-12-13 | 2008-06-18 | 富葵精密组件(深圳)有限公司 | Method for preparation of multi-layer flexible circuit board |
| CN102056425A (en) * | 2010-12-23 | 2011-05-11 | 北大方正集团有限公司 | Method for manufacturing multilayer printed circuit board (PCB) |
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| CN105163525A (en) * | 2015-08-19 | 2015-12-16 | 深圳市迅捷兴电路技术有限公司 | Method for fabricating inner-layer ultra-thick copper circuit board |
| CN105228379A (en) * | 2015-10-26 | 2016-01-06 | 江苏弘信华印电路科技有限公司 | A kind of four layers of smooth copper face laminating method of rigid-flex combined board |
| CN205546197U (en) * | 2016-01-31 | 2016-08-31 | 深圳市博敏兴电子有限公司 | High thick copper circuit board of multilayer |
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| CN112312684A (en) * | 2020-09-28 | 2021-02-02 | 惠州市金百泽电路科技有限公司 | Method for controlling deviation of laminated layers of multilayer FPC board |
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