JPH07106765A - Multilayered adhesive sheet and manufacture of multilayered wiring board using same - Google Patents
Multilayered adhesive sheet and manufacture of multilayered wiring board using sameInfo
- Publication number
- JPH07106765A JPH07106765A JP5244730A JP24473093A JPH07106765A JP H07106765 A JPH07106765 A JP H07106765A JP 5244730 A JP5244730 A JP 5244730A JP 24473093 A JP24473093 A JP 24473093A JP H07106765 A JPH07106765 A JP H07106765A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- board
- laminated
- adhesive sheet
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 27
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 229920005989 resin Polymers 0.000 claims abstract description 65
- 239000011347 resin Substances 0.000 claims abstract description 65
- 238000007747 plating Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 13
- 238000005553 drilling Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 13
- 239000011889 copper foil Substances 0.000 abstract description 7
- 239000012790 adhesive layer Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 239000011229 interlayer Substances 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000011888 foil Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 238000003475 lamination Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000003522 acrylic cement Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、多層配線板、特にフレ
ックス・リジット配線板に用いる多層化接着シートとそ
のシートを用いた多層配線板の製造法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer wiring board, and more particularly to a multilayer adhesive sheet used for a flex-rigid wiring board and a method for producing a multilayer wiring board using the same.
【０００２】[0002]
【従来の技術】従来、フレックス・リジット配線板の製
造は、例えば図４に示すように行われる。すなわち、図
４（ａ）に示す、回路形成したフレキシブル回路板１
に、図４（ｂ）に示すように、カバーレイ２をラミネー
トし、図４（ｄ）に示す、ケーブル部となる所定の範囲
を除去した層間接着シート３を介して、図４（ｃ）に示
す、所定の範囲の外周に沿う樹脂層にスリットを入れ、
片面のみ回路形成した銅張り積層板４を、図４（ｂ）に
示すフレキシブル回路板１のカバーレイ２をラミネート
した面に重ね、加圧・加熱して積層一体化する（図４
（ｅ）に示す。）。その後、図４（ｆ）に示すように、
穴あけ、めっき、外周回路加工を行い、図４（ｇ）に示
すように、外側からケーブル部となる所定の範囲の外周
に沿う部分の銅張り積層板の樹脂層のみスリットを入
れ、図４（ｈ）に示すように、不要な銅張り積層板５を
除去し、フレックス・リジット配線板を製造している。2. Description of the Related Art Conventionally, a flex-rigid wiring board is manufactured, for example, as shown in FIG. That is, the circuit-formed flexible circuit board 1 shown in FIG.
4 (b), the cover lay 2 is laminated, and the interlayer adhesive sheet 3 shown in FIG. , Put a slit in the resin layer along the outer periphery of the predetermined range,
A copper-clad laminate 4 having a circuit formed only on one side is laminated on the surface of the flexible circuit board 1 shown in FIG. 4B on which the cover lay 2 is laminated, and pressure and heat are applied to integrate the layers (FIG. 4).
It shows in (e). ). Then, as shown in FIG.
Drilling, plating, and peripheral circuit processing are performed, and as shown in FIG. 4 (g), only the resin layer of the copper-clad laminate in the portion along the outer periphery of the predetermined range from the outside to the cable portion is slit, and as shown in FIG. As shown in h), the unnecessary copper-clad laminate 5 is removed and a flex-rigid wiring board is manufactured.
【０００３】あるいは、図５（ａ）に示す、回路を形成
したフレキシブル回路板１の表面に、図５（ｂ）に示す
ように、カバーレイ２をラミネートしたフレキシブル回
路板に、図５（ｄ）に示す、ケーブル部となる所定の範
囲を除去した層間接着シート３を介して、図５（ｃ）に
示す、あらかじめ前記所定の範囲を繰り抜き除去し、片
面のみ回路形成した銅張り積層板６を、図５（ｅ）に示
すように、フレキシブル回路板１のカバーレイ２をラミ
ネートした面に重ね、加圧・加熱して積層一体化する
（ｅ）。その後、図５（ｆ）に示すように、穴あけ、め
っき、外層回路加工を行い、不要な銅張り積層板５を除
去し、フレックス・リジット配線板を製造している。Alternatively, as shown in FIG. 5B, a flexible circuit board having a cover lay 2 laminated on the surface of the flexible circuit board 1 having a circuit shown in FIG. ), The copper-clad laminate in which the circuit is formed only on one side by removing the predetermined range in advance through the interlayer adhesive sheet 3 from which the predetermined range to be the cable part is removed, as shown in FIG. 5C. As shown in FIG. 5 (e), 6 is superposed on the surface of the flexible circuit board 1 on which the cover lay 2 is laminated, and is pressed and heated to be laminated and integrated (e). Thereafter, as shown in FIG. 5 (f), holes are formed, plating is performed, and outer layer circuits are processed to remove the unnecessary copper-clad laminate 5 to produce a flex-rigid wiring board.
【０００４】また、この方法では必要に応じ加圧・加熱
して積層一体化し、不要な銅張り積層板５を繰り抜き除
去した部分に、剥離可能な樹脂を埋め込んだり、あるい
は離型スペーサーをはめ込んだ後、穴あけ、めっき、外
層回路加工を行い、最後に樹脂を剥離、あるいは離型ス
ペーサーを除去してフレックス・リジット配線板を製造
している。In this method, if necessary, pressure and heat are applied to laminate and integrate the layers, and the unnecessary copper-clad laminate 5 is cut out and removed, and a releasable resin is embedded or a release spacer is fitted therein. After that, drilling, plating, outer layer circuit processing are performed, and finally the resin is peeled off or the release spacer is removed to manufacture a flex-rigid wiring board.
【０００５】[0005]
【発明が解決しようとする課題】従来の技術では、回路
形成したフレキシブル回路板にラミネートするカバーレ
イに用いる接着剤は、カバーレイから露出する回路部分
に流れだす樹脂を抑制するために、樹脂流れが小さいも
のを用いなければならず、例えば回路の厚みが３５μｍ
の厚さの場合には、カバーレイラミネート後のフレキシ
ブル回路板の表面には、３０μｍ程度の回路の凹凸が発
生していた。In the prior art, the adhesive used for the cover lay to be laminated on the circuit-formed flexible circuit board has a resin flow rate in order to suppress the resin flowing out to the circuit portion exposed from the cover lay. Must be small, for example, the circuit thickness is 35 μm.
In the case of the above thickness, circuit unevenness of about 30 μm was generated on the surface of the flexible circuit board after the coverlay lamination.
【０００６】更に同様に、フレックス・リジット配線板
に使用する層間接着シートにも、ケーブル部への樹脂流
れを抑えるため、一般に樹脂流れが１〜３％と小さいも
のを用いなければならず、銅張り積層板を積層しても外
層表面にフレキシブル回路板の凹凸がそのまま発生して
いた。Similarly, for the interlayer adhesive sheet used for the flex-rigid wiring board, in order to suppress the resin flow to the cable portion, it is generally necessary to use one having a small resin flow of 1 to 3%. Even if the laminated laminates were laminated, the unevenness of the flexible circuit board was still generated on the outer layer surface.
【０００７】この凹凸のため、例えばエッチングレジス
トを形成する場合には、その凹凸によって、エッチング
レジスト用インクの塗布が困難となるなど、外層回路の
微細配線形成が困難であった。また、フレキシブル回路
板を複数積層するような高多層板では、表面の凹凸が更
に大きくなり、高多層化と微細配線形成性の両立が困難
であった。Due to the unevenness, for example, when an etching resist is formed, the unevenness makes it difficult to apply the etching resist ink, and thus it is difficult to form fine wiring of the outer layer circuit. Further, in a high multilayer board in which a plurality of flexible circuit boards are laminated, the unevenness of the surface is further increased, and it is difficult to achieve both high multilayer and fine wiring formability.
【０００８】本発明は、効率的に高密度の配線を行うこ
とができる多層配線板、特にフレックス・リジット配線
板用の接着剤と、その接着剤を用いた多層配線板の製造
法を提供することを目的とするものである。The present invention provides an adhesive for a multilayer wiring board, particularly a flex-rigid wiring board, which enables efficient high-density wiring, and a method for manufacturing the multilayer wiring board using the adhesive. That is the purpose.
【０００９】[0009]
【課題を解決するための手段】本発明の多層化接着シー
トは、加圧・加熱時の樹脂流れが１０〜５０％である樹
脂層と、加圧・加熱時の樹脂流れが１〜３％である樹脂
層との２層以上の複層からなることを特徴とする。The multilayer adhesive sheet of the present invention has a resin layer having a resin flow of 10 to 50% when pressed and heated and a resin flow of 1 to 3% when pressed and heated. It is characterized by comprising two or more multi-layers with the resin layer which is.
【００１０】このような多層化接着シートを介して、所
定の範囲に後工程で除去を容易にする加工を施した積層
板を重ね、加圧・加熱して積層一体化し、穴あけ、めっ
き、回路加工、不要な部分の積層板を除去することがで
きる。Through such a multi-layered adhesive sheet, a laminated plate which has been subjected to a process for facilitating the removal in a predetermined process is stacked in a predetermined range, and is pressed and heated to be laminated and integrated to form a hole, a plating, a circuit. It is possible to process and remove unnecessary portions of the laminated plate.
【００１１】本発明における樹脂流れは、加圧・加熱条
件が、１７０℃、３０kg/cm2、３０分のときに流れ出す
樹脂重量と、加圧・加熱前の樹脂全量重量との割合と定
義する。The resin flow in the present invention is defined as the ratio of the resin weight flowing when the pressure / heating conditions are 170 ° C., 30 kg / cm 2 and 30 minutes to the total weight of the resin before pressure / heating. .
【００１２】本発明における加圧・加熱時の樹脂流れが
１０〜５０％である樹脂層は、アクリル系やエポキシ系
の樹脂を用いることができ、樹脂流れを大きくするため
に、分子量の小さなものや、流れ特性を大きくするため
の樹脂等を混入することができる。また、加圧・加熱時
の樹脂流れが１〜３％である樹脂層は、アクリル系やＮ
ＢＲ系の樹脂を用いることができ、樹脂流れを小さくす
るために、分子量の大きなものや、無機充填剤のよう
に、樹脂の粘性を高める添加剤を用いることができる。
また、層間接着シートの樹脂層は２層に限定されるもの
ではなく、樹脂流れが１〜３％の樹脂層の両面に樹脂流
れ１０〜５０％の樹脂層を配した構造の３層以上も可能
である。In the present invention, the resin layer having a resin flow rate of 10 to 50% at the time of pressurization and heating can be made of an acrylic resin or an epoxy resin, and has a small molecular weight in order to increase the resin flow. Alternatively, a resin or the like for increasing the flow characteristics can be mixed. Further, the resin layer in which the resin flow at the time of pressurization / heating is 1 to 3% is an acrylic or N-based resin layer.
A BR-based resin can be used, and in order to reduce the resin flow, one having a large molecular weight or an additive such as an inorganic filler that increases the viscosity of the resin can be used.
In addition, the resin layer of the interlayer adhesive sheet is not limited to two layers, and three or more layers having a structure in which a resin layer having a resin flow of 1% to 3% and a resin layer having a resin flow of 10% to 50% are arranged on both sides are also applicable. It is possible.
【００１３】このような複層の接着シートを用いて多層
配線板を製造する方法は、例えば、図１（ａ）に示すよ
うに、両面に銅箔をラミネートしたフレキシブル基材
の、不要な銅箔をエッチング除去するエッチドフォイル
法により回路形成を行い、図１（ｂ）示すように、カバ
ーレイ２をラミネートする。図１（ｃ）に示すように、
片面銅張り積層板の一方の面に、不要な銅箔をエッチン
グ除去するエッチドフォイル法により回路形成を行い、
多層配線板としたときに不要となる、例えばフレックス
・リジット配線板におけるケーブル部となる範囲に、ル
ーター等を用いてスリット加工などのように、後に除去
を容易に行うことができるような加工を行い、図１
（ｄ）に示す、多層配線板としたときに不要となる、例
えばフレックス・リジット配線板におけるケーブル部と
なる範囲を除去した接着シートを、前記図１（ｂ）のフ
レキシブル回路板の凹凸のある側に樹脂流れが大きい樹
脂層７ａを接触するように重ね、その上に図１（ｃ）に
示すスリット加工などを行った積層板を重ね、加圧・加
熱して積層一体化し（図１（ｅ）に示す。）、図１
（ｆ）に示すように、穴あけを行い、スルーホールめっ
きを１０〜５０μｍ行い、次いで、エッチドフォイル法
により外層表面の回路形成を行い、図１（ｇ）に示すよ
うに、不要な箇所、例えばケーブル部となる範囲の外周
に沿う部分の樹脂層にルーターを用いてスリット加工し
た部分を、さらに必要な場合には、外側からもスリット
加工を行って除去し、図１（ｈ）に示すようなフレック
ス・リジット配線板を得る。A method of manufacturing a multilayer wiring board using such a multilayer adhesive sheet is, for example, as shown in FIG. 1 (a), unnecessary copper of a flexible substrate having copper foil laminated on both sides. A circuit is formed by an etched foil method in which the foil is removed by etching, and a coverlay 2 is laminated as shown in FIG. As shown in FIG. 1 (c),
On one side of the single-sided copper-clad laminate, a circuit is formed by the etched foil method of removing unnecessary copper foil by etching,
Processing that can be easily removed later, such as slitting using a router, etc., in the area that becomes unnecessary when using a multilayer wiring board, for example, in the area of the cable part of a flex-rigid wiring board Done, fig 1
The adhesive sheet shown in FIG. 1 (d), which is unnecessary when a multilayer wiring board is used, for example, the adhesive sheet from which the area of the flex-rigid wiring board to be the cable portion is removed is provided with the unevenness of the flexible circuit board of FIG. 1 (b). The resin layer 7a having a large resin flow is superposed on the side so as to come in contact with the laminated layer, and the laminated plate having slit processing shown in FIG. e)), FIG.
As shown in (f), drilling is performed, through-hole plating is performed at 10 to 50 μm, and then a circuit is formed on the outer layer surface by an etched foil method. As shown in FIG. For example, if a portion of the resin layer along the outer periphery of the area that will be the cable portion is slit using a router, if necessary, it is also slit from the outside and removed, as shown in FIG. 1 (h). Get such a flex-rigid wiring board.
【００１４】本発明に用いることのできるフレキシブル
基材は、ポリイミドフィルムあるいはポリエステルフィ
ルムベースに銅やアルミニウム等の金属箔をアクリル系
やエポキシ系の接着剤を挟んでラミネートした基材を用
いることができ、接着剤を挟まず、銅箔に直接可撓性の
樹脂層を形成した基材も使用することができる。またカ
バーレイには、ポリイミドフィルムあるいはポリエステ
ルフィルムをベースに、アクリル系やエポキシ系の接着
剤を２０〜１００μｍ塗布したものを用いることができ
る。両面銅張り積層板としては、ガラスクロスにエポキ
シ樹脂やポリイミド樹脂を含浸させ、硬化させた基材
に、厚さ１８〜７０μｍの銅箔をラミネートしたものを
用いることができる。As the flexible base material which can be used in the present invention, a base material obtained by laminating a metal foil such as copper or aluminum on a polyimide film or polyester film base with an acrylic or epoxy adhesive sandwiched can be used. It is also possible to use a base material in which a flexible resin layer is directly formed on a copper foil without sandwiching an adhesive. For the coverlay, a polyimide film or polyester film as a base to which an acrylic or epoxy adhesive is applied in a thickness of 20 to 100 μm can be used. As the double-sided copper-clad laminate, a substrate obtained by impregnating a glass cloth with an epoxy resin or a polyimide resin and curing it, and laminating a copper foil having a thickness of 18 to 70 μm can be used.
【００１５】なお、本発明に使用する積層板の種類は、
特に制限されず、図１、図２に示した片面銅張り積層板
の他に、両面銅張り積層板を用いて、一方の面は加工せ
ず、他方の面に回路形成したものや、公知のアディティ
ブ法配線板に用いられる接着層付積層板を用いてもよ
い。The types of laminated plates used in the present invention are as follows.
There is no particular limitation, and in addition to the single-sided copper-clad laminate shown in FIGS. 1 and 2, a double-sided copper-clad laminate is used, one side of which is not processed and a circuit is formed on the other side. You may use the laminated board with an adhesive layer used for the additive method wiring board of.
【００１６】[0016]
【作用】本発明によれば、凹凸のある回路形成したフレ
キシブル回路板と銅張り積層板を積層する際、樹脂流れ
の大きな樹脂層がフレキシブル回路板の凹凸に埋まり込
み、積層後には外層表面が平滑になり、樹脂流れの小さ
な層が、層間の距離を一定に保つことができ、層間の絶
縁性を確保できる。According to the present invention, when laminating a flexible circuit board having a circuit having irregularities and a copper-clad laminate, a resin layer having a large resin flow is buried in the irregularities of the flexible circuit board, and after lamination, the outer layer surface is The layer that becomes smooth and has a small resin flow can keep the distance between the layers constant, and can secure the insulation between the layers.
【００１７】[0017]
【実施例】実施例１ 工程１：図１（ａ）に示すように、フレキシブル基材と
して、厚さ２５μｍのポリイミドフィルムをベースに厚
さ３５μｍの銅箔を接着剤を挟んで両面にラミネートし
た両面ＭＣＦのＦ−３０ＶＣ２ＲＣ２１（Ｈ）（ニッカ
ン工業株式会社製、商品名）を用い、銅箔の不要な箇所
をエッチング除去して回路を形成する。 工程２：図１（ｂ）に示すように、厚さ２５μｍのポリ
イミドフィルムをベースに厚さ３５μｍの接着剤を塗布
したカバーレイＣＩＳＶ−２５３５（ニッカン工業株式
会社製、商品名）を前記フレキシブル回路板に、温度１
７０℃、圧力３０kg/cm2、時間４０分の条件でラミネー
トする。 工程３：図１（ｃ）に示すように、銅張り積層板とし
て、ガラスクロスにエポキシ樹脂を含浸させ、硬化させ
た厚さ０．６mmの基材の両面に、厚さ１８μｍの銅をラ
ミネートした両面ＭＣＬ−Ｅ−６７（日立化成工業株式
会社製、商品名）の片面をエッチングし、ケーブル部と
なる所定の範囲の外周に沿う部分の樹脂層にルーターを
用いて深さ約０．４mmのスリットを形成する。 工程４：図１（ｄ）に示すように、厚さ２５μｍの樹脂
流れの小さな変性アクリル接着剤層、及び厚さ３５μｍ
の樹脂流れの大きな変性アクリル接着剤層からなる層間
接着シートを作製し、接着剤シートをケーブル部となる
所定の範囲を除去する。このときに、樹脂流れの小さな
変性アクリル接着剤は、 ・アクリルエラストマー テイサンレジンＨＴＲ−７００（帝国化学産業株式会社
製、商品名）・・・・・・・・・・・・・・・・・・４
８．８重量部 ・アルキルフェノール樹脂 ヒタノール２４００（日立化成工業株式会社製、商品
名）・・１６．２重量部 ・エポキシ樹脂 ノボラック型臭素化エポキシ樹脂ＢＲＥＮ−Ｓ（日本化
薬株式会社製、商品名）・・・・・・・・・・・・・・
・・・・・・２１重量部 エピビス型臭素化エポキシ樹脂ＹＤＢ−４００（東都化
成株式会社製、商品名）・・・・・・・・・・・・・・
・・・・・・１４重量部 ・架橋触媒 １−シアノエチル−２−フェニルイミダゾリウムトリメ
リテート ２ＰＺ−ＣＮＳ（四国化成工業株式会社製、商品名）・
・・・１重量部 ・充填剤 三酸化アンチモンＳｂ2Ｏ3（三国製練株式会社製、商品
名）・・・１０重量部 微粉末ＳｉＯ2 エロジル２００（日本アエロジル株式会社製、商品名）
・０．６重量部 樹脂流れは３％であった。樹脂流れの大きな変性アクリ
ル接着剤は、 ・アクリルエラストマー テイサンレジンＨＴＲ−７００（帝国化学株式会社製、
商品名）・・・・・・・・・・・・・・・・・・３８．
５重量部 ・アルキルフェノール樹脂 ヒタノール２４００（日立化成工業株式会社製、商品
名）・・１６．５重量部 ・エポキシ樹脂 ノボラック型臭素化エポキシ樹脂 ＢＲＥＮ−Ｓ（日本化薬株式会社製、商品名）・・・・
・・４５重量部 ・架橋触媒 １−シアノエチル−２−フェニルイミダゾリウムトリメ
リテートキュアゾール ２ＰＺ−ＣＮＳ（四国化成工業株式会社製、商品名）・
・・・２重量部 この樹脂流れは２０％であった。 工程５：図１（ｅ）に示すように、前記フレキシブル回
路板、銅張り積層板、層間接着シートをルーター加工し
た面を内側にして、ピンラミネーション方式により、温
度１７０℃、圧力３０kg/cm2、時間６０分の条件で一体
化する。 工程６：図１（ｆ）に示すように、上記一体化した基板
にＮＣ穴あけ機を用いて穴径０．３〜５．０ｍｍの穴あ
けを行い、上記基板をピロリン酸銅めっき液に約５時間
浸漬し、スルーホール部及び表面に約３５μｍのめっき
を形成し、上記基板の外層のうち、不要な銅をエッチン
グ除去し、回路を形成する。 工程７：図１（ｇ）に示すように、上記基板のケーブル
部となる所定の範囲の外周に沿う部分の銅張り積層板の
樹脂層にルーターを用いて、深さ約０．４mmのスリット
を形成し、図１（ｈ）に示すように、ケーブル部の不要
部の銅張り積層板を除去しフレックス・リジット配線板
を得る。EXAMPLES Example 1 Step 1: As shown in FIG. 1A, a polyimide film having a thickness of 25 μm was used as a flexible substrate, and a copper foil having a thickness of 35 μm was laminated on both sides with an adhesive agent sandwiched therebetween. Using F-30VC2RC21 (H) (manufactured by Nikkan Kogyo Co., Ltd.) having double-sided MCF, unnecessary portions of the copper foil are removed by etching to form a circuit. Step 2: As shown in FIG. 1 (b), a coverlay CISV-2535 (manufactured by Nikkan Kogyo Co., Ltd., trade name) in which a 25 μm thick polyimide film is used as a base and a 35 μm thick adhesive is applied to the flexible circuit Plate, temperature 1
Laminate under the conditions of 70 ° C., pressure of 30 kg / cm 2 and time of 40 minutes. Step 3: As shown in FIG. 1 (c), as a copper-clad laminate, glass cloth is impregnated with epoxy resin and cured, and both surfaces of a 0.6 mm-thick base material are laminated with 18 μm-thick copper. One side of the double-sided MCL-E-67 (trade name, manufactured by Hitachi Chemical Co., Ltd.) is etched, and a depth of about 0.4 mm is obtained by using a router on a resin layer in a portion along the outer periphery of a predetermined range to be a cable portion. To form the slit. Step 4: As shown in FIG. 1D, a modified acrylic adhesive layer with a small resin flow having a thickness of 25 μm and a thickness of 35 μm
An interlayer adhesive sheet made of the modified acrylic adhesive layer having a large resin flow is prepared, and the adhesive sheet is removed from a predetermined area to be a cable portion. At this time, the modified acrylic adhesive with a small resin flow is: Acrylic elastomer Teisan Resin HTR-700 (trade name, manufactured by Teikoku Chemical Industry Co., Ltd.)・ 4
8.8 parts by weight Alkylphenol resin Hitanol 2400 (manufactured by Hitachi Chemical Co., Ltd., product name) 16.2 parts by weight Epoxy resin Novolac type brominated epoxy resin BREN-S (product of Nippon Kayaku Co., Ltd., trade name) ) ...
・ ・ ・ ・ 21 parts by weight Epibis type brominated epoxy resin YDB-400 (trade name, manufactured by Tohto Kasei Co., Ltd.)
・ ・ ・ ・ 14 parts by weight ・ Crosslinking catalyst 1-cyanoethyl-2-phenylimidazolium trimellitate 2PZ-CNS (trade name, manufactured by Shikoku Chemicals Co., Ltd.) ・
・ ・ ・ 1 part by weight ・ Filler Antimony trioxide Sb 2 O 3 (manufactured by Mikuni Seiren Co., Ltd., product name) ・ ・ ・ 10 parts by weight Fine powder SiO 2 Erosil 200 (manufactured by Nippon Aerosil Co., Ltd., product name)
-0.6 parts by weight Resin flow was 3%. Modified acrylic adhesives with a large resin flow are: Acrylic elastomer Teisan resin HTR-700 (manufactured by Teikoku Kagaku Co., Ltd.,
Product name) ... 38.
5 parts by weight-Alkylphenol resin Hitanol 2400 (manufactured by Hitachi Chemical Co., Ltd., trade name)-16.5 parts by weight-Epoxy resin Novolac-type brominated epoxy resin BREN-S (manufactured by Nippon Kayaku Co., Ltd.)- ...
・ ・ 45 parts by weight ・ Crosslinking catalyst 1-Cyanoethyl-2-phenylimidazolium trimellitate cure sol 2PZ-CNS (manufactured by Shikoku Chemicals Co., Ltd.)
... 2 parts by weight This resin flow was 20%. Step 5: As shown in FIG. 1 (e), the flexible circuit board, the copper-clad laminate, and the interlayer adhesive sheet with the router-processed surface inside are subjected to a pin lamination method at a temperature of 170 ° C. and a pressure of 30 kg / cm 2 , And integrated under the condition of time of 60 minutes. Step 6: As shown in FIG. 1 (f), a hole diameter of 0.3 to 5.0 mm was drilled in the integrated substrate using an NC drilling machine, and the substrate was immersed in a copper pyrophosphate plating solution for about 5 minutes. After immersion for a period of time, a plating of about 35 μm is formed on the through holes and the surface, and unnecessary copper in the outer layer of the substrate is removed by etching to form a circuit. Step 7: As shown in FIG. 1 (g), a router is used in the resin layer of the copper-clad laminate at a portion along the outer periphery of a predetermined range to be the cable portion of the board, and a slit having a depth of about 0.4 mm is formed. Then, as shown in FIG. 1 (h), the copper-clad laminate in the unnecessary portion of the cable portion is removed to obtain a flex-rigid wiring board.
【００１８】実施例２ 工程１〜工程５までは、図２（ａ）〜（ｅ）に示すよう
に、実施例１と同様に行う。 工程６：図２（ｆ）に示すように、上記一体化した基板
のケーブル部分に、樹脂ＳＥＲ−４９０Ｗ（山栄化学株
式会社製、商品名）を充填し、温度１３０℃、時間６０
分で乾燥硬化させる。 工程７：図２（ｇ）に示すように、上記基板のケーブル
部となる所定の範囲の外周に沿う部分の銅張り積層板の
樹脂層にルーターを用いて、深さ約０．４mmのスリット
を形成し、図２（ｈ）に示すように、上記基板のケーブ
ル部の樹脂を苛性ソーダにより溶解除去し、フレックス
・リジット配線板を得る。Example 2 Steps 1 to 5 are performed in the same manner as in Example 1 as shown in FIGS. 2 (a) to 2 (e). Step 6: As shown in FIG. 2 (f), resin SER-490W (manufactured by Sanei Chemical Co., Ltd., trade name) is filled in the cable portion of the integrated substrate, and the temperature is 130 ° C. and the time is 60.
Dry and cure in minutes. Step 7: As shown in FIG. 2 (g), a router is used for the resin layer of the copper-clad laminate at a portion along the outer periphery of a predetermined range to be the cable portion of the board, and a slit having a depth of about 0.4 mm is formed. Then, as shown in FIG. 2 (h), the resin in the cable portion of the substrate is dissolved and removed with caustic soda to obtain a flex-rigid wiring board.
【００１９】実施例３ 工程１〜３は、図３（ａ）〜（ｃ）に示すように、実施
例１の工程３に代えて、銅張り積層板として、ガラスク
ロスにエポキシ樹脂を含浸させ、硬化させた厚さ０．６
mmの基材の両面に、厚さ１８μｍの銅をラミネートした
両面ＭＣＬ−Ｅ−６７（日立化成工業株式会社製、商品
名）の片面をエッチングし、回路を形成し、フレキシブ
ル回路板を複数枚作成した以外は、実施例１の工程１、
２及び４と同様に行った。 工程４：図３（ｄ）に示すように、前記フレキシブル回
路板、層間接着シートをピンラミネーション方式により
温度１７０℃、圧力３０kg/cm2、時間６０分の条件で一
体化する。 工程５：図３（ｅ）に示すように、上記一体化した基板
を、ピロリン酸銅めっき液に約５時間浸漬し、スルーホ
ール部及び表面に約３５μｍのめっきを形成し、上記基
板の外層のうち、不要な銅をエッチング除去し、回路を
形成し、多層フレキシブル配線板を得る。Example 3 In steps 1 to 3, as shown in FIGS. 3 (a) to 3 (c), instead of step 3 in example 1, a glass cloth was impregnated with an epoxy resin as a copper-clad laminate. , Cured thickness 0.6
One side of double-sided MCL-E-67 (trade name, manufactured by Hitachi Chemical Co., Ltd.) in which 18 μm-thick copper is laminated on both sides of mm base material is etched to form a circuit, and a plurality of flexible circuit boards are formed. Except that it was created, the process 1 of Example 1,
The same procedure as 2 and 4 was performed. Step 4: As shown in FIG. 3D, the flexible circuit board and the interlayer adhesive sheet are integrated by a pin lamination method at a temperature of 170 ° C., a pressure of 30 kg / cm 2 , and a time of 60 minutes. Step 5: As shown in FIG. 3 (e), the integrated substrate is immersed in a copper pyrophosphate plating solution for about 5 hours to form a plating of about 35 μm on the through holes and the surface, and the outer layer of the substrate. Of these, unnecessary copper is removed by etching to form a circuit to obtain a multilayer flexible wiring board.
【００２０】このようにして得られたフレックス・リジ
ット配線板及び多層フレキシブル配線板は外層表面が平
滑となり、外層の回路もライン／スペース＝０．１mm／
０．１mmでも精度より形成することができた。In the flex-rigid wiring board and the multilayer flexible wiring board thus obtained, the outer layer surface is smooth, and the outer layer circuit also has a line / space of 0.1 mm /
Even 0.1 mm could be formed with high accuracy.
【００２１】[0021]
【発明の効果】本発明による多層配線板は、以下の効果
があった。 １）従来のように、外層表面に凹凸がなく平滑なため、
外層の微細配線形成が可能となった。 ２）凹凸のあるフレキシブル回路板を多層しても外層表
面は平滑となり、ボイドの発生もなく、高多層化と微細
配線形成の両方から高密度化が可能となった。The multilayer wiring board according to the present invention has the following effects. 1) As in the conventional case, the outer layer surface is smooth without unevenness,
It became possible to form fine wiring in the outer layer. 2) Even if a flexible circuit board having irregularities is formed in multiple layers, the outer layer surface is smooth, voids do not occur, and it is possible to achieve high density in terms of both increasing the number of layers and forming fine wiring.
【図１】（ａ）〜（ｈ）は、本発明の一実施例を示す各
工程における断面図である。1A to 1H are cross-sectional views in each step showing an embodiment of the present invention.
【図２】（ａ）〜（ｈ）は、本発明の他の実施例を示す
各工程における断面図である。2A to 2H are cross-sectional views in each step showing another embodiment of the present invention.
【図３】（ａ）〜（ｅ）は、本発明の更に他の実施例を
示す各工程における断面図である。3 (a) to 3 (e) are sectional views in each step showing still another embodiment of the present invention.
【図４】（ａ）〜（ｈ）は、従来例を示す各工程におけ
る断面図である。4A to 4H are cross-sectional views in each step showing a conventional example.
【図５】（ａ）〜（ｆ）は、他の従来例を示す各工程に
おける断面図である。5A to 5F are cross-sectional views in each step showing another conventional example.
１．フレキシブル回路板 ２．カバーレイ ４．銅張り積層板 ５．銅張り積層板 ６．銅張り積層板 ８．層間接着シート 1. Flexible circuit board 2. Coverlay 4. Copper-clad laminate 5. Copper-clad laminate 6. Copper-clad laminate 8. Interlayer adhesive sheet
フロントページの続き (72)発明者 吉田 正俊 茨城県下館市大字小川1500番地 日立化成 エレクトロニクス株式会社内 (72)発明者 高橋 宏 栃木県芳賀郡二宮町久下田413 日立エー アイシー株式会社二宮工場内Front page continued (72) Inventor Masatoshi Yoshida 1500 Ogawa, Shimodate-shi, Ibaraki Hitachi Chemical Electronics Co., Ltd.
Claims (2)
０〜５０％である樹脂層と、加圧・加熱時の樹脂流れが
１〜３％である樹脂層との２層以上の複層からなること
を特徴とする多層化接着シート。1. The resin flow at the time of pressurization / heating is at least 1.
A multi-layered adhesive sheet comprising two or more multi-layers of a resin layer having 0 to 50% and a resin layer having a resin flow of 1 to 3% when pressurized and heated.
フレキシブル回路板に、加圧・加熱時の樹脂流れが１０
〜５０％である樹脂層、及び加圧・加熱時の樹脂流れが
１〜３％である樹脂層の複層からなる多層化接着シート
を介して、所定の範囲に後工程で除去を容易にする加工
を施した積層板を重ね、加圧・加熱して積層一体化し、
穴あけ、めっき、回路加工、不要な部分の積層板を除去
することを特徴とする多層配線板の製造法。2. A flexible circuit board on which a circuit is formed and a cover lay is laminated, and a resin flow at the time of pressurization and heating is 10 times.
Through a multi-layered adhesive sheet consisting of a resin layer of up to 50% and a resin layer with a resin flow of 1 to 3% during pressurization / heating, removal in a predetermined range is facilitated in a later step. Laminate the laminated plates that have been subjected to processing, pressurize and heat to integrate the layers,
A method for manufacturing a multilayer wiring board, which comprises drilling, plating, circuit processing, and removing unnecessary parts of the laminated board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5244730A JPH07106765A (en) | 1993-09-30 | 1993-09-30 | Multilayered adhesive sheet and manufacture of multilayered wiring board using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5244730A JPH07106765A (en) | 1993-09-30 | 1993-09-30 | Multilayered adhesive sheet and manufacture of multilayered wiring board using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07106765A true JPH07106765A (en) | 1995-04-21 |
Family
ID=17123045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5244730A Pending JPH07106765A (en) | 1993-09-30 | 1993-09-30 | Multilayered adhesive sheet and manufacture of multilayered wiring board using same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07106765A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1056266A (en) * | 1996-08-12 | 1998-02-24 | Sony Corp | Production of composite wiring board |
| WO2001059023A1 (en) * | 2000-02-08 | 2001-08-16 | Ajinomoto Co., Inc. | Adhesive film and method for manufacturing multilayer printed wiring board |
| JP2005014380A (en) * | 2003-06-25 | 2005-01-20 | Somar Corp | Multi-layer adhesive sheet, material for forming heat exchanger, and heat exchanger |
| JP2006012987A (en) * | 2004-06-23 | 2006-01-12 | Fujikura Ltd | Manufacturing method of printed-wiring board |
| JP2006294955A (en) * | 2005-04-13 | 2006-10-26 | Cmk Corp | Rigid flex multilayer printed-wiring board and its manufacturing method |
| JP2007129153A (en) * | 2005-11-07 | 2007-05-24 | Cmk Corp | Rigid-flex multilayer printed wiring board |
| JP2007287963A (en) * | 2006-04-18 | 2007-11-01 | Nippon Mektron Ltd | Hybrid multilayer circuit board and its manufacturing method |
| JP2008103503A (en) * | 2006-10-18 | 2008-05-01 | Shinwa Frontech Corp | Manufacturing method of circuit board |
| JP2009256587A (en) * | 2008-03-26 | 2009-11-05 | Hitachi Chem Co Ltd | Adhesive for sealing semiconductor, film-like adhesive for sealing semiconductor, manufacturing method for semiconductor apparatus, and semiconductor apparatus |
| CN102548258A (en) * | 2011-12-28 | 2012-07-04 | 东莞生益电子有限公司 | Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom |
| US8674502B2 (en) | 2010-07-16 | 2014-03-18 | Hitachi Chemical Company, Ltd. | Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device |
| CN106385761A (en) * | 2016-11-29 | 2017-02-08 | 珠海杰赛科技有限公司 | Manufacture method for multilayer flexible circuit board and multilayer flexible circuit board |
-
1993
- 1993-09-30 JP JP5244730A patent/JPH07106765A/en active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1056266A (en) * | 1996-08-12 | 1998-02-24 | Sony Corp | Production of composite wiring board |
| WO2001059023A1 (en) * | 2000-02-08 | 2001-08-16 | Ajinomoto Co., Inc. | Adhesive film and method for manufacturing multilayer printed wiring board |
| JP2005014380A (en) * | 2003-06-25 | 2005-01-20 | Somar Corp | Multi-layer adhesive sheet, material for forming heat exchanger, and heat exchanger |
| JP2006012987A (en) * | 2004-06-23 | 2006-01-12 | Fujikura Ltd | Manufacturing method of printed-wiring board |
| JP2006294955A (en) * | 2005-04-13 | 2006-10-26 | Cmk Corp | Rigid flex multilayer printed-wiring board and its manufacturing method |
| JP2007129153A (en) * | 2005-11-07 | 2007-05-24 | Cmk Corp | Rigid-flex multilayer printed wiring board |
| JP2007287963A (en) * | 2006-04-18 | 2007-11-01 | Nippon Mektron Ltd | Hybrid multilayer circuit board and its manufacturing method |
| DE102007049939B4 (en) * | 2006-10-18 | 2017-08-31 | Yazaki Corporation | Method for producing a printed circuit board |
| JP2008103503A (en) * | 2006-10-18 | 2008-05-01 | Shinwa Frontech Corp | Manufacturing method of circuit board |
| US8110118B2 (en) | 2006-10-18 | 2012-02-07 | Yazaki Corporation | Method of manufacturing circuit board |
| JP2009256587A (en) * | 2008-03-26 | 2009-11-05 | Hitachi Chem Co Ltd | Adhesive for sealing semiconductor, film-like adhesive for sealing semiconductor, manufacturing method for semiconductor apparatus, and semiconductor apparatus |
| US8674502B2 (en) | 2010-07-16 | 2014-03-18 | Hitachi Chemical Company, Ltd. | Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device |
| US9123734B2 (en) | 2010-07-16 | 2015-09-01 | Hitachi Chemical Company, Ltd. | Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device |
| CN102548258B (en) * | 2011-12-28 | 2014-11-05 | 东莞生益电子有限公司 | Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom |
| CN102548258A (en) * | 2011-12-28 | 2012-07-04 | 东莞生益电子有限公司 | Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom |
| CN106385761A (en) * | 2016-11-29 | 2017-02-08 | 珠海杰赛科技有限公司 | Manufacture method for multilayer flexible circuit board and multilayer flexible circuit board |
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