JPH05167250A - Method of manufacturing multilayer printed wiring board - Google Patents
Method of manufacturing multilayer printed wiring boardInfo
- Publication number
- JPH05167250A JPH05167250A JP33317991A JP33317991A JPH05167250A JP H05167250 A JPH05167250 A JP H05167250A JP 33317991 A JP33317991 A JP 33317991A JP 33317991 A JP33317991 A JP 33317991A JP H05167250 A JPH05167250 A JP H05167250A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- resin
- stainless steel
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、産業用および民生用な
どの各種電子機器に広く用いられている多層プリント配
線板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board which is widely used in various electronic devices for industrial use and consumer use.
【０００２】[0002]
【従来の技術】近年、パーソナルコンピュータ、ワード
プロセッサやビデオムービーカメラ、携帯電話機などの
普及に伴い、多層プリント配線板の需要はますます増加
する傾向にあるが、それら電子機器の小型・軽量化・多
機能化などの理由から多層プリント配線板へは、配線収
容性、表面実装密度を増大させるための非貫通のバイア
ホールによる電気的層間接続方法であるインタースティ
シャルバイアホール（以下、ＩＶＨと称す）が要求され
始めている。2. Description of the Related Art In recent years, with the spread of personal computers, word processors, video movie cameras, mobile phones, and the like, the demand for multilayer printed wiring boards has been increasing. An interstitial via hole (hereinafter referred to as IVH), which is a method of electrically connecting layers with non-penetrating via holes for increasing wiring accommodation and surface mounting density, for multilayer printed wiring boards for reasons such as functionalization. Are being demanded.
【０００３】以下に従来の多層プリント配線板の製造方
法について説明する。図４は従来のＩＶＨを有する多層
プリント配線板の製造における積層方法を示すものであ
る。図４（ａ），（ｂ）において、１はスルーホール１
ａおよび内層パターン１ｂが形成された外層用プリント
配線板、２はプリプレグ、３はステンレス板、４は内層
に導体パターンが形成された積層後の多層銅張積層板、
５はプリプレグに含まれる樹脂である。A conventional method for manufacturing a multilayer printed wiring board will be described below. FIG. 4 shows a stacking method in manufacturing a conventional multilayer printed wiring board having IVH. In FIGS. 4A and 4B, 1 is a through hole 1.
a and a printed wiring board for outer layer on which the inner layer pattern 1b is formed, 2 a prepreg, 3 a stainless steel plate, 4 a multilayered copper clad laminate after lamination in which a conductor pattern is formed on the inner layer,
5 is a resin contained in the prepreg.
【０００４】以上のように構成された多層プリント配線
板の製造方法について、以下に説明する。まず、両面銅
張積層板にＮＣボール盤などを用いてスルーホール形成
用の穴加工を施し、銅めっきにより両面を電気的に接続
するスルーホール１ａを形成する。このスルーホール１
ａを形成した外層用プリント配線板１の片側にエッチン
グなどの方法を用いて内層パターン１ｂを形成し、表面
を酸化処理したスルーホール１ａを有する外層用プリン
ト配線板１を得る。この外層用プリント配線板１と、ガ
ラス布にエポキシ樹脂などを含浸させ、半硬化状態にし
たプリプレグ２とステンレス板３を、図４（ａ）に示す
ようにセットする。次に、熱プレス機（図示せず）の熱
盤間にセットし、所定の圧力と温度に加圧・加湿し、外
層用プリント配線板１とプリプレグ２とを溶着・積層
し、図４（ｂ）に示すように内層に導体パターンを有す
る多層銅張積層板４を得ている。A method of manufacturing the multilayer printed wiring board having the above structure will be described below. First, the double-sided copper-clad laminate is subjected to through-hole forming using an NC drilling machine or the like, and the through-holes 1a for electrically connecting both sides are formed by copper plating. This through hole 1
An inner layer pattern 1b is formed on one side of the outer layer printed wiring board 1 on which a is formed by using a method such as etching, and the outer layer printed wiring board 1 having a through hole 1a whose surface is oxidized is obtained. The outer layer printed wiring board 1, the prepreg 2 and the stainless steel plate 3 which are semi-cured by impregnating glass cloth with epoxy resin or the like are set as shown in FIG. 4 (a). Next, it is set between hot plates of a heat press machine (not shown), pressurized and humidified to a predetermined pressure and temperature, and the outer layer printed wiring board 1 and the prepreg 2 are welded and laminated, and as shown in FIG. As shown in b), a multilayer copper clad laminate 4 having a conductor pattern on the inner layer is obtained.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記の
従来の構成では、加圧・加温時にプリプレグから軟化溶
融した樹脂５が外層用プリント配線板１のスルーホール
１ａの部分から溶出し、積層後の多層銅張積層板４の表
面に付着したり、ステンレス板３に付着する。図４
（ｂ）に示すように、多層銅張積層板４の表面に樹脂５
が付着した場合には、後工程で多層銅張積層板４に銅め
っきを施す際に、下地と銅めっき層の間に樹脂５が介在
することとなり、多層銅張積層板４の表面での著しい凹
凸の発生、それに伴う外層パターン形成時のエッチング
工程での製造歩留りの低下、外層パターンとの接続信頼
性の低下、めっきはがれの発生などの危険性を有してい
る。また、ステンレス板３に付着した場合には、積層後
の多層銅張積層板４とステンレス板３とがスルーホール
１ａ部において部分的に接合されることとなり、解体作
業が非常に困難で多層プリント配線板の製造工程を煩雑
なものにするという問題点を有していた。However, in the above-mentioned conventional structure, the resin 5 softened and melted from the prepreg during pressurization / heating is eluted from the through hole 1a portion of the outer layer printed wiring board 1 and after lamination. Attached to the surface of the multi-layered copper clad laminate 4 or attached to the stainless steel plate 3. Figure 4
As shown in (b), resin 5 is applied to the surface of the multilayer copper-clad laminate 4.
When the multi-layered copper-clad laminate 4 adheres, the resin 5 will be present between the base and the copper-plated layer when copper-plating the multilayer copper-clad laminate 4 in a later step, and There is a risk that remarkable unevenness will occur, the production yield will decrease in the etching process when the outer layer pattern is formed, the connection reliability with the outer layer pattern will decrease, and plating peeling will occur. In addition, when it adheres to the stainless steel plate 3, the multilayered copper clad laminate 4 after lamination and the stainless steel plate 3 are partially joined at the through hole 1a portion, and the disassembling work is very difficult and the multilayer printing is performed. There is a problem that the manufacturing process of the wiring board is complicated.
【０００６】本発明は上記従来の問題点を解決するもの
で、積層の際、外層用プリント配線板のスルーホール部
分からの樹脂の溶出防止とステンレス板への樹脂付着防
止を実現する多層プリント配線板の製造方法を提供する
ことを目的とする。The present invention solves the above-mentioned conventional problems, and a multilayer printed wiring for preventing elution of resin from a through hole portion of a printed wiring board for outer layer and resin adhesion to a stainless steel plate at the time of stacking. It is an object to provide a method for manufacturing a plate.
【０００７】[0007]
【課題を解決するための手段】この目的を達成するため
に本発明の多層プリント配線板の製造方法は、スルーホ
ールおよび内層パターンが形成された複数のプリント配
線板をプリプレグを介して積層する際に、最外層のプリ
ント配線板の内層パターンを形成していない側の面に離
型性フィルムシートを介してステンレス板を配置し、プ
レスする構成を有している。In order to achieve this object, a method for manufacturing a multilayer printed wiring board according to the present invention is a method for laminating a plurality of printed wiring boards having through holes and inner layer patterns through prepregs. In addition, a stainless steel plate is arranged on the surface of the outermost printed wiring board on the side where the inner layer pattern is not formed via a release film sheet, and the structure is pressed.
【０００８】また本発明の多層プリント配線板の製造方
法は、離型性樹脂をコーティングしたステンレス板を用
いる構成を有している。Further, the method for manufacturing a multilayer printed wiring board according to the present invention has a constitution in which a stainless steel plate coated with a releasing resin is used.
【０００９】さらに本発明の多層プリント配線板の製造
方法は、液状離型性樹脂を噴霧・塗布したステンレス板
を用いる構成を有している。Further, the method for producing a multilayer printed wiring board according to the present invention has a constitution in which a stainless steel plate on which a liquid release resin is sprayed and applied is used.
【００１０】[0010]
【作用】この構成によって、多層銅張積層板の積層の際
の加圧・加温によりプリプレグから軟化溶融した樹脂は
最外層のプリント配線板のスルーホール部分から溶出し
ようとするが、クッション性を有する離型性フィルムシ
ートにより樹脂溶出を阻害することが可能となる。ま
た、離型性樹脂をコーティングしたステンレス板や液状
離型性樹脂を噴霧・塗布したステンレス板を用いること
により、積層後の多層銅張積層板とステンレス板とがス
ルーホール部において部分的に接合されることを阻害す
ることができる。With this configuration, the resin softened and melted from the prepreg by pressure and heating during lamination of the multilayer copper clad laminate tends to be eluted from the through hole portion of the outermost printed wiring board, but the cushioning property is improved. The release film sheet having the resin can inhibit resin elution. In addition, by using a stainless steel plate coated with a release resin or a stainless steel plate sprayed and applied with a liquid release resin, the multilayer copper clad laminate after lamination and the stainless steel plate are partially bonded at the through hole portion. Can be prevented.
【００１１】[0011]
【実施例】以下、本発明の一実施例について、図面を参
照しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【００１２】（実施例１）図１は本発明の第１の実施例
における多層プリント配線板の製造方法の概念を示すも
のである。図１（ａ），（ｂ）において、１１はスルー
ホール１１ａが設けられるとともに、内層パターン１１
ｂを片側に有する外層用プリント配線板、１２はプリプ
レグ、１３はステンレス板、１４は離型性フィルムシー
ト、１５は多層銅張積層板である。(Embodiment 1) FIG. 1 shows the concept of a method for manufacturing a multilayer printed wiring board according to a first embodiment of the present invention. In FIGS. 1A and 1B, 11 is provided with a through hole 11a and an inner layer pattern 11 is formed.
An outer layer printed wiring board having b on one side, 12 a prepreg, 13 a stainless steel plate, 14 a releasable film sheet, and 15 a multilayer copper clad laminate.
【００１３】以上のように構成された多層プリント配線
板の積層方法について、以下に説明する。まず、両面銅
張積層板にＮＣボール盤などを用いてスルーホール形成
用の穴加工を施し、銅めっきにより両面を電気的に接続
するスルーホール１１ａを形成する。このスルーホール
１１ａを形成した外層用プリント配線板１１の片側にエ
ッチングなどの方法を用いて内層パターン１１ｂを形成
し、表面を酸化処理したスルーホール１１ａを有する外
層用プリント配線板１１を得る。この外層用プリント配
線板１１と、ガラス布にエポキシ樹脂などを含浸させ、
半硬化状態にしたプリプレグ１２とステンレス板１３と
離型性フィルムシート１４を、図１（ａ）に示すように
配設する。A method for laminating the multilayer printed wiring board having the above structure will be described below. First, the double-sided copper-clad laminate is subjected to through-hole forming using an NC drilling machine or the like, and the through-holes 11a for electrically connecting both sides are formed by copper plating. An inner layer pattern 11b is formed on one side of the outer layer printed wiring board 11 in which the through holes 11a are formed by a method such as etching, and the outer layer printed wiring board 11 having the through holes 11a whose surface is oxidized is obtained. This outer layer printed wiring board 11 and glass cloth are impregnated with epoxy resin,
The semi-cured prepreg 12, the stainless steel plate 13, and the release film sheet 14 are arranged as shown in FIG.
【００１４】離型性フィルムシート１４は、ポリテトラ
フルオルエチレン、ポリクロルトリフルオルエチレン、
フッ化ビニル、三フッ化エチレン、フッ化ビニリデンや
六フッ化プロピレンなどのフッ素系や、ジメチルシオロ
キサンを開環重合させて合成し、微細シリカ、酸化チタ
ン、炭酸カルシウムなどの充填剤と過酸化ベンゾイルな
どで橋かけしたシリコン系樹脂を主成分とする厚さ２５
〜５００μｍのものを用いる。また、上記の離型性フィ
ルムシートは必要に応じてガラス布やガラス不織布など
で補強してもよい。The releasable film sheet 14 is made of polytetrafluoroethylene, polychlorotrifluoroethylene,
Synthesized by ring-opening polymerization of fluorinated compounds such as vinyl fluoride, ethylene trifluoride, vinylidene fluoride and propylene hexafluoride, and dimethyl siloxane, and mixed with fillers such as fine silica, titanium oxide and calcium carbonate. Thickness 25 mainly composed of silicone resin cross-linked with benzoyl oxide etc.
˜500 μm is used. Further, the above-mentioned releasable film sheet may be reinforced with a glass cloth or a glass non-woven fabric, if necessary.
【００１５】ついで、熱プレス機（図示せず）の熱盤間
にセットし、圧力約２〜４×１０6Ｐａ、温度１５０〜
１８０℃の条件にて加圧・加温し、外層用プリント配線
板１１とプリプレグ１２とを溶着・積層する。積層時に
プリプレグに含浸されているエポキシ樹脂は温度上昇に
伴い、軟化・溶融し、貫通穴であるスルーホール１１ａ
内を充填しながら溶出してくるが、加圧されスルーホー
ル１１ａに密着している離型性フィルムシートにより溶
出は完全に防止することが可能である。約４０〜６０分
の積層時間終了後、熱プレス機より取り出し、図１
（ｂ）に示すような内層に導体パターンを有する多層銅
張積層板１５を得る。Then, they are set between hot plates of a hot press (not shown), and the pressure is about 2 to 4 × 10 6 Pa and the temperature is 150 to
The printed wiring board 11 for outer layer and the prepreg 12 are welded and laminated by pressurizing and heating under the condition of 180 ° C. The epoxy resin impregnated in the prepreg at the time of lamination softens and melts as the temperature rises, and the through hole 11a, which is a through hole.
Although it elutes while filling the inside, elution can be completely prevented by the release film sheet that is pressed and is in close contact with the through hole 11a. After the lamination time of about 40 to 60 minutes was completed, the laminate was taken out from the heat press machine and
A multilayer copper clad laminate 15 having a conductor pattern in the inner layer as shown in (b) is obtained.
【００１６】本実施例による多層プリント配線板の製造
方法と従来の製造方法を比較すると、従来では必ず発生
していたエポキシ樹脂の溶出およびステンレス板との溶
出樹脂による接合の発生は本実施例によれば全く発生を
認めることはできなかった。Comparing the manufacturing method of the multilayer printed wiring board according to the present embodiment with the conventional manufacturing method, it can be seen from the present embodiment that the elution of the epoxy resin and the joining with the elution resin with the stainless steel plate, which have always occurred in the past, occur. According to this, no occurrence could be recognized.
【００１７】以上のように本実施例によれば積層の際に
離型性フィルムシートをステンレス板側に設けることに
より、樹脂溶出の抑制や多層銅張積層板とステンレス板
との不要な接合の防止、さらにそれらによる多層銅張積
層板の表面研磨工程やステンレス板の表面研磨工程の削
減を実施することができる。As described above, according to this embodiment, the release film sheet is provided on the stainless steel plate side during lamination, whereby resin elution is suppressed and unnecessary joining of the multilayer copper clad laminate and the stainless steel plate is prevented. It is possible to carry out prevention and further reduce the surface polishing step of the multilayer copper clad laminate and the surface polishing step of the stainless steel plate.
【００１８】（実施例２）図２は本発明の第２の実施例
を示す多層プリント配線板の製造方法の積層工程の概念
図である。図２（ａ），（ｂ）において、図１の構成と
異なるのは離型性フィルムシート１４に代え、ステンレ
ス板１３に予め離型性樹脂１６をコーティングした点で
ある。(Embodiment 2) FIG. 2 is a conceptual diagram of a laminating step in a method for manufacturing a multilayer printed wiring board showing a second embodiment of the present invention. 2A and 2B, the difference from the configuration of FIG. 1 is that the stainless steel plate 13 is coated with a release resin 16 in advance instead of the release film sheet 14.
【００１９】上記のように構成された多層プリント配線
板の積層方法について、以下に説明する。まず、両面銅
張積層板にＮＣボール盤などを用いてスルーホール形成
用の穴加工を施し、銅めっきにより両面を電気的に接続
するスルーホール１１ａを形成する。このスルーホール
１１ａを形成した外層用プリント配線板１１の片側にエ
ッチングなどの方法を用いて内層パターン１１ｂを形成
し、表面を酸化処理したスルーホール１１ａを有する外
層用プリント配線板１１を得る。この外層用プリント配
線板１１と、ガラス布にエポキシ樹脂などを含浸させ、
半硬化状態にしたプリプレグ１２を準備する。A method of laminating the multilayer printed wiring board having the above structure will be described below. First, the double-sided copper-clad laminate is subjected to through-hole forming using an NC drilling machine or the like, and the through-holes 11a for electrically connecting both sides are formed by copper plating. An inner layer pattern 11b is formed on one side of the outer layer printed wiring board 11 in which the through holes 11a are formed by a method such as etching, and the outer layer printed wiring board 11 having the through holes 11a whose surface is oxidized is obtained. This outer layer printed wiring board 11 and glass cloth are impregnated with epoxy resin,
A prepreg 12 in a semi-cured state is prepared.
【００２０】次に多層銅張積層板の積層に先立ち、ステ
ンレス板１３の少なくとも片側表面に、ポリテトラフル
オルエチレン、ポリクロルトリフルオルエチレン、フッ
化ビニル、三フッ化エチレン、フッ化ビニリデンや六フ
ッ化プロピレンなどのフッ素系やジメチルシオロキサン
を開環重合させて合成したシリコン系樹脂を主成分とし
た厚さ２５〜５００μｍ程度の離型性樹脂１６をコーテ
ィングしておく。Next, prior to laminating the multilayer copper clad laminate, polytetrafluoroethylene, polychlorotrifluoroethylene, vinyl fluoride, ethylene trifluoride, vinylidene fluoride or hexadecaline is formed on at least one surface of the stainless steel plate 13. A releasable resin 16 having a thickness of about 25 to 500 μm and having a silicon-based resin as a main component, which is synthesized by ring-opening polymerization of fluorine-based such as propylene fluoride or dimethylsioroxane, is coated.
【００２１】ついで、熱プレス機（図示せず）の熱盤間
に図２（ａ）に示すようにセットし、圧力約２〜４×１
０6 Ｐａ、温度１５０〜１８０℃の条件にて加圧・加温
し、外層用プリント配線板１１とプリプレグ１２とを溶
着・積層する。積層時にプリプレグに含浸されているエ
ポキシ樹脂は温度上昇に伴い、軟化・溶融し、貫通穴で
あるスルーホール１１ａ内を充填しながら溶出してくる
が、ステンレス板１３にコーティングされた離型性樹脂
１６が加圧され、スルーホール１１ａに密着している状
態となっているため、樹脂溶出を防止することが可能で
ある。約４０〜６０分の積層時間終了後、熱プレス機よ
り取り出し、図２（ｂ）に示すような内層に導体パター
ンを有する多層銅張積層板１５を得る。Then, a hot press machine (not shown) is set between the hot plates as shown in FIG. 2 (a), and the pressure is about 2 to 4 × 1.
0 6 Pa, pressure and heated at a temperature of 150 to 180 ° C., welded-laminating the outer layer printed circuit board 11 and the prepreg 12. The epoxy resin impregnated in the prepreg at the time of lamination softens and melts as the temperature rises, and elutes while filling the through hole 11a, which is a through hole, but the release resin coated on the stainless steel plate 13 Since 16 is pressed and is in close contact with the through hole 11a, it is possible to prevent resin elution. After the completion of the lamination time of about 40 to 60 minutes, the laminate was taken out from the hot press machine to obtain a multilayer copper clad laminate 15 having a conductor pattern in the inner layer as shown in FIG. 2 (b).
【００２２】本実施例による多層プリント配線板の製造
方法と従来の製造方法を比較すると、従来では必ず発生
していたエポキシ樹脂の溶出およびステンレス板との溶
出樹脂による接合の発生は本実施例によれば全く発生を
認めることはできなかった。Comparing the manufacturing method of the multilayer printed wiring board according to this embodiment with the conventional manufacturing method, it can be seen from the present embodiment that the elution of the epoxy resin and the joining with the stainless steel plate due to the elution resin, which are always generated in the past, occur. According to this, no occurrence could be recognized.
【００２３】以上のように本実施例によれば、積層の際
にステンレス板に離型性樹脂を予めコーティングしてお
くことにより、樹脂溶出の抑制や多層銅張積層板とステ
ンレス板との不要な接合の防止、さらにそれらによる多
層銅張積層板の表面研磨工程やステンレス板の表面研磨
工程の削減などの積層工程の合理化を実施することがで
きる。As described above, according to this embodiment, by pre-coating the stainless steel plate with the release resin at the time of stacking, the resin elution is suppressed and the multilayer copper clad laminate and the stainless steel plate are not necessary. It is possible to rationalize the lamination process such as prevention of unnecessary joining and reduction of the surface polishing process of the multi-layered copper clad laminate and the stainless steel plate.
【００２４】（実施例３）図３は本発明の第３の実施例
を示す多層プリント配線板の製造方法の概念図である。
図３において、図１の構成と異なるのは離型性フィルム
シート１４に代え、ステンレス板１３に予め液状離型性
樹脂１７を噴霧・形成した点である。(Embodiment 3) FIG. 3 is a conceptual diagram of a method for manufacturing a multilayer printed wiring board showing a third embodiment of the present invention.
In FIG. 3, the difference from the configuration of FIG. 1 is that instead of the release film sheet 14, the liquid release resin 17 is sprayed and formed on the stainless steel plate 13 in advance.
【００２５】上記のように構成された多層プリント配線
板の積層方法について、以下に説明する。まず、両面銅
張積層板にＮＣボール盤などを用いてスルーホール形成
用の穴加工を施し、銅めっきにより両面を電気的に接続
するスルーホール１１ａを形成する。このスルーホール
１１ａを形成した外層用プリント配線板１１の片側にエ
ッチングなどの方法を用いて内層パターン１１ｂを形成
し、表面を酸化処理したスルーホール１１ａを有する外
層用プリント配線板１１を得る。この外層用プリント配
線板１１と、ガラス布にエポキシ樹脂などを含浸させ、
半硬化状態にしたプリプレグ１２を準備する。A method of laminating the multilayer printed wiring board having the above structure will be described below. First, the double-sided copper-clad laminate is subjected to through-hole forming using an NC drilling machine or the like, and the through-holes 11a for electrically connecting both sides are formed by copper plating. An inner layer pattern 11b is formed on one side of the outer layer printed wiring board 11 in which the through holes 11a are formed by a method such as etching, and the outer layer printed wiring board 11 having the through holes 11a whose surface is oxidized is obtained. This outer layer printed wiring board 11 and glass cloth are impregnated with epoxy resin,
A prepreg 12 in a semi-cured state is prepared.
【００２６】次に多層銅張積層板の積層に先立ち、ステ
ンレス板１３の少なくとも片側表面に、ジメチルシオロ
キサンを開環重合させて重合度を小さく合成したシリコ
ン系樹脂を主成分とした液状離型性樹脂１７を噴霧・形
成しておく。Prior to laminating the multi-layered copper-clad laminate, a liquid separation containing a silicon-based resin as a main component, which was synthesized by ring-opening polymerization of dimethylshioroxane on at least one surface of the stainless steel plate 13 to reduce the degree of polymerization, was performed. The moldable resin 17 is sprayed and formed.
【００２７】ついで、熱プレス機（図示せず）の熱盤間
に図３（ａ）に示すようにセットし、圧力約２〜４×１
０6 Ｐａ、温度１５０〜１８０℃の条件にて加圧・加温
し、外層用プリント配線板１１とプリプレグ１２とを溶
着・積層する。積層時にプリプレグに含浸されているエ
ポキシ樹脂は温度上昇に伴い、軟化・溶融し、貫通穴で
あるスルーホール１１ａ内を充填しながら溶出してくる
が、ステンレス板１３に噴霧・形成された離型性樹脂３
８ａおよび３８ｂにより、樹脂溶出を防止することが可
能となる。約４０〜６０分の積層時間終了後、熱プレス
機より取り出し、図３（ｂ）に示すような内層に導体パ
ターンを有する多層銅張積層板１５を得る。Then, a hot press machine (not shown) is set between the hot plates as shown in FIG. 3 (a), and the pressure is about 2 to 4 × 1.
0 6 Pa, pressure and heated at a temperature of 150 to 180 ° C., welded-laminating the outer layer printed circuit board 11 and the prepreg 12. The epoxy resin impregnated in the prepreg at the time of lamination softens and melts as the temperature rises, and elutes while filling the through hole 11a, which is a through hole, but is sprayed and formed on the stainless steel plate 13 to form a mold release. Resin 3
8a and 38b make it possible to prevent resin elution. After the completion of the lamination time of about 40 to 60 minutes, the laminate is taken out from the hot press machine to obtain a multilayer copper clad laminate 15 having a conductor pattern in the inner layer as shown in FIG. 3 (b).
【００２８】本実施例による多層プリント配線板の製造
方法と従来の製造方法を比較すると、従来では必ず発生
していたエポキシ樹脂の溶出およびステンレス板との溶
出樹脂による接合の発生は本実施例によれば全く発生を
認めることはできなかった。Comparing the manufacturing method of the multilayer printed wiring board according to this embodiment with the conventional manufacturing method, it can be seen in the present embodiment that the elution of the epoxy resin and the joining with the elution resin with the stainless steel plate, which always occur in the prior art, occur. According to this, no occurrence could be recognized.
【００２９】以上のように本実施例によれば、積層の際
にステンレス板に液状離型性樹脂を予め噴霧・形成して
おくことにより、樹脂溶出の抑制や多層銅張積層板とス
テンレス板との不要な接合の防止、さらにそれらによる
多層銅張積層板の表面研磨工程の削減などの積層工程の
合理化を実施することができる。As described above, according to the present embodiment, by preliminarily spraying and forming the liquid release resin on the stainless steel plate during lamination, the resin elution is suppressed and the multilayer copper clad laminate and the stainless steel plate are formed. It is possible to rationalize the laminating process such as prevention of unnecessary joining with and the reduction of the surface polishing process of the multi-layered copper-clad laminate.
【００３０】なお、本発明の実施例において、多層銅張
積層板の内層パターン数を２層としたが、内層パターン
数は４層以上としてもよいことは言うまでもない。In the embodiment of the present invention, the number of inner layer patterns of the multilayer copper clad laminate is two, but it goes without saying that the number of inner layer patterns may be four or more.
【００３１】[0031]
【発明の効果】以上のように本発明は、積層する際に、
ステンレス板と外層用プリント配線板の非内層パターン
形成面の間に離形性フィルムシートを配置すること、離
型性樹脂をコーティングしたステンレス板を用いること
や液状離型性樹脂を噴霧・塗布したステンレス板を用い
ることにより、外層用プリント配線板のスルーホールか
らの樹脂の溶出による多層銅張積層板表面への樹脂付
着、ステンレス板への樹脂付着を容易に抑制することが
可能となり、多層プリント配線板の品質向上、信頼性向
上、歩留り向上、作業性の合理化をきわめて容易に実現
できる。As described above, according to the present invention, when laminating
Placing a releasable film sheet between the non-inner layer pattern forming surface of the stainless steel plate and the printed wiring board for the outer layer, using a stainless steel plate coated with a releasable resin, or spraying and applying a liquid releasable resin By using a stainless steel plate, it is possible to easily suppress resin adhesion to the surface of the multilayer copper clad laminate and resin adhesion to the stainless steel plate due to elution of resin from the through holes of the printed wiring board for outer layers, and thus the multilayer printing It is very easy to improve the quality of wiring boards, improve reliability, improve yield, and rationalize workability.
【図１】（ａ），（ｂ）は本発明の第１の実施例におけ
る多層プリント配線板の製造方法の概念を示す断面図1A and 1B are cross-sectional views showing the concept of a method for manufacturing a multilayer printed wiring board according to a first embodiment of the present invention.
【図２】（ａ），（ｂ）は本発明の第２の実施例におけ
る多層プリント配線板の製造方法の概念を示す断面図2A and 2B are cross-sectional views showing the concept of a method for manufacturing a multilayer printed wiring board according to a second embodiment of the present invention.
【図３】（ａ），（ｂ）は本発明の第３の実施例におけ
る多層プリント配線板の製造方法の概念を示す断面図3A and 3B are cross-sectional views showing the concept of a method for manufacturing a multilayer printed wiring board according to a third embodiment of the present invention.
【図４】（ａ），（ｂ）は従来の多層プリント配線板の
製造方法の概念を示す断面図4A and 4B are sectional views showing the concept of a conventional method for manufacturing a multilayer printed wiring board.
１１ 外層用プリント配線板 １１ａ スルーホール １１ｂ 内層パターン １２ プリプレグ １３ ステンレス板 １４ 離型性フィルムシート １５ 多層銅張積層板 １６ 離型性樹脂 １７ 液状離型性樹脂 11 Printed Wiring Board for Outer Layer 11a Through Hole 11b Inner Layer Pattern 12 Prepreg 13 Stainless Steel Plate 14 Releasable Film Sheet 15 Multilayer Copper Clad Laminate 16 Releasing Resin 17 Liquid Releasing Resin
Claims (5)
れた複数のプリント配線板をプリプレグを介して積層す
る際に、最外層のプリント配線板の内層パターンを形成
していない側の面に離型性フィルムシートを介してステ
ンレス板を配置し、プレスすることを特徴とする多層プ
リント配線板の製造方法。1. When a plurality of printed wiring boards having through holes and inner layer patterns are laminated via a prepreg, releasability is provided on the surface of the outermost printed wiring board on which the inner layer pattern is not formed. A method for manufacturing a multilayer printed wiring board, comprising disposing a stainless plate via a film sheet and pressing.
系樹脂を主成分とするものからなる請求項１記載の多層
プリント配線板の製造方法。2. The method for producing a multilayer printed wiring board according to claim 1, wherein the release film is made of a fluorine-based or silicon-based resin as a main component.
板を用いることを特徴とする請求項１記載の多層プリン
ト配線板の製造方法。3. The method for producing a multilayer printed wiring board according to claim 1, wherein a stainless plate coated with a releasing resin is used.
ス板を用いることを特徴とする請求項１記載の多層プリ
ント配線板の製造方法。4. A method for manufacturing a multilayer printed wiring board according to claim 1, wherein a stainless steel plate sprayed and coated with a liquid release resin is used.
系樹脂を用いる請求項３または４記載の多層プリント配
線板の製造方法。5. The method for manufacturing a multilayer printed wiring board according to claim 3, wherein a fluorine-based resin or a silicon-based resin is used as the release resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33317991A JP3102109B2 (en) | 1991-12-17 | 1991-12-17 | Manufacturing method of multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33317991A JP3102109B2 (en) | 1991-12-17 | 1991-12-17 | Manufacturing method of multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05167250A true JPH05167250A (en) | 1993-07-02 |
| JP3102109B2 JP3102109B2 (en) | 2000-10-23 |
Family
ID=18263189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33317991A Expired - Fee Related JP3102109B2 (en) | 1991-12-17 | 1991-12-17 | Manufacturing method of multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3102109B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1179972A2 (en) * | 2000-08-09 | 2002-02-13 | Japan Radio Co., Ltd | Hole filling method for a printed wiring board |
| JP2002217537A (en) * | 2001-01-18 | 2002-08-02 | Matsushita Electric Works Ltd | Method for manufacturing multilayer wiring board |
| JP2003229659A (en) * | 2002-02-05 | 2003-08-15 | Murata Mfg Co Ltd | Method for producing electronic component |
| JP2012114153A (en) * | 2010-11-22 | 2012-06-14 | Nippon Mektron Ltd | Method of manufacturing multilayer printed wiring board |
| KR102241371B1 (en) * | 2019-12-13 | 2021-04-16 | 주식회사 티엘비 | Manufacturing Method for Forming Embedded Trace Substrate by Using Direct Printing of Circuits |
-
1991
- 1991-12-17 JP JP33317991A patent/JP3102109B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1179972A2 (en) * | 2000-08-09 | 2002-02-13 | Japan Radio Co., Ltd | Hole filling method for a printed wiring board |
| US6564451B2 (en) | 2000-08-09 | 2003-05-20 | Japan Radio Co., Ltd. | Hole filling method for a printed wiring board |
| EP1179972A3 (en) * | 2000-08-09 | 2003-12-03 | Japan Radio Co., Ltd | Hole filling method for a printed wiring board |
| KR100747324B1 (en) * | 2000-08-09 | 2007-08-07 | 니혼무센 가부시키가이샤 | Hole filling method for a printed wiring board |
| JP2002217537A (en) * | 2001-01-18 | 2002-08-02 | Matsushita Electric Works Ltd | Method for manufacturing multilayer wiring board |
| JP2003229659A (en) * | 2002-02-05 | 2003-08-15 | Murata Mfg Co Ltd | Method for producing electronic component |
| JP2012114153A (en) * | 2010-11-22 | 2012-06-14 | Nippon Mektron Ltd | Method of manufacturing multilayer printed wiring board |
| KR102241371B1 (en) * | 2019-12-13 | 2021-04-16 | 주식회사 티엘비 | Manufacturing Method for Forming Embedded Trace Substrate by Using Direct Printing of Circuits |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3102109B2 (en) | 2000-10-23 |
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