CN103582322B - Multilayer circuit board and preparation method thereof - Google Patents

Multilayer circuit board and preparation method thereof Download PDF

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Publication number
CN103582322B
CN103582322B CN201210250824.5A CN201210250824A CN103582322B CN 103582322 B CN103582322 B CN 103582322B CN 201210250824 A CN201210250824 A CN 201210250824A CN 103582322 B CN103582322 B CN 103582322B
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substrate
circuit
film
base plate
line substrate
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CN103582322A (en
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郑兆孟
覃海波
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Peng Ding Polytron Technologies Inc
Avary Holding Shenzhen Co Ltd
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Fukui Precision Component Shenzhen Co Ltd
Zhending Technology Co Ltd
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Priority to CN201210250824.5A priority Critical patent/CN103582322B/en
Priority to TW101127406A priority patent/TW201406222A/en
Publication of CN103582322A publication Critical patent/CN103582322A/en
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Abstract

A kind of manufacture method of multilayer circuit board, including: multiple copper clad laminate is provided；The copper foil layer of each copper clad laminate is made and forms conductive circuit layer, obtain multiple first line substrate；A surface laminating film in part first line substrate, forms through hole in film, forms conductive material in through hole wherein, and described conductive material mutually conducts with conductive circuit layer, obtains the second circuit base plate；Two surface laminating films of part first line substrate, form through hole in film, form conductive material in through hole wherein, and described conductive material mutually conducts with conductive circuit layer, obtains tertiary circuit substrate；One, two or three or overlapping copper foil formation the most simultaneously in overlapping tertiary circuit substrate, the second circuit base plate and first line substrate overlap substrate, and overlap substrate described in pressing or copper foil is made conductive circuit pattern again, thus obtain multilayer circuit board.The present invention also provides for a kind of multilayer circuit board using described method to prepare.

Description

Multilayer circuit board and preparation method thereof
Technical field
The present invention relates to wiring board manufacturing technology, particularly relate to a kind of multilayer circuit board and preparation method thereof.
Background technology
Along with electronic product is toward miniaturization, the development in high speed direction, wiring board also develops toward multilayer circuit board direction from one-sided circuit board, double-sided wiring board.Multilayer circuit board refers to the wiring board with multilayer conductive circuit, and it has more layout area, higher interconnection density, thus is widely used, and sees document Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density Multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425。
At present, multilayer circuit board generally uses Layer increasing method to make, i.e. the mode being layering makes.The method using traditional Layer increasing method to make multilayer circuit board includes step: the first step, make an inner plating, described inner plating includes at least one of which insulation material layer and two conductive circuit layer, and said two conductive circuit layer is conducted mutually by least one conductive hole.Second step, difference one sheet adhesive of pressing and a copper foil layer in two conductive circuit layer of inner plating, wherein, described copper foil layer is combined by the conductive circuit layer of described bonding sheet with described inner plating, copper foil layer described in selective etch, so that described copper foil layer is formed an outermost conductive circuit pattern, thus form a multilayer wiring board；3rd step, forms at least one blind hole by methods such as laser drill on described multilayer wiring board, and plating at least one blind hole described makes described copper foil layer conduct with the conductive circuit layer of described inner plating；4th step, forms at least one through hole on described multilayer wiring board, and electroplates described through hole, by two outermost conductive circuit pattern electrical connections of described multilayer wiring board, the most just to obtain a multilayer circuit board.If needing the multilayer circuit board of more number of plies, according to the method that the second to three step is similar, i.e. continue difference one copper foil of pressing in two outermost conductive circuit pattern of described Mulitilayer circuit board, copper foil layer described in selective etch, the required conductive circuit layer connected of electrical connection.So, the multilayer circuit board of more layers can be obtained.
But, in the manufacturing process of above-mentioned multilayer circuit board, the most once increase layer, being required to carry out one step press process, when making the wiring board of the more number of plies, pressing number of times is the most more, so being unfavorable for the simplification of technical process, cost of manufacture is the most of a relatively high, and make efficiency is relatively low.
Summary of the invention
In view of this, it is necessary to provide manufacture method and the thus multilayer circuit board obtained by method of a kind of multilayer circuit board, to improve the make efficiency of multilayer circuit board.
The manufacture method of a kind of multilayer circuit board, including step: providing N number of copper-clad base plate, wherein, N is the natural number more than or equal to 4, and each described copper-clad base plate includes insulating barrier and the first copper foil layer fitting in described insulating barrier opposite sides and the second copper foil layer；First copper foil layer of each described copper-clad base plate is made and forms the first conductive circuit pattern, second copper foil layer of each described copper-clad base plate is made and forms the second conductive circuit pattern, and described first conductive circuit pattern and the second conductive circuit pattern are mutually conducted by least one conductive hole, thus N number of described copper-clad base plate is made N number of first line substrate；N-2M+1 first line substrate is taken in N number of described first line substrate, wherein, M is the natural number more than or equal to 2, and N is more than 2M-1, the first conductive circuit pattern surface laminating one first film in each described first line substrate in N-2M+1 described first line substrate, described first film has at least one first through hole, the first conductive material is filled at least one first through hole described, described first conductive material mutually conducts with the first adjacent conductive circuit pattern, thus N-2M+1 first line substrate is made N-2M+1 the second circuit base plate；nullM-1 first line substrate is taken in N number of described first line substrate，Fit the second film in the first conductive circuit pattern surface in each first line substrate in M-1 described first line substrate，The second conductive circuit pattern surface laminating the 3rd film in each first line substrate in M-1 described first line substrate，Described second film has at least one second through hole，Described 3rd film has at least one third through-hole，And fill the second conductive material at least one second through hole described，Described second conductive material mutually conducts with the first adjacent conductive circuit pattern，The 3rd conductive material is filled at least one third through-hole described，Described 3rd conductive material mutually conducts with the second adjacent conductive circuit pattern，Thus M-1 described first line substrate is made M-1 tertiary circuit substrate；And remaining M the first line substrate of one step press, described N-2M+1 the second circuit base plate and described M-1 tertiary circuit substrate are to form 2N sandwich circuit board, in described 2N sandwich circuit board, by the first film between adjacent insulating barrier, second film or the 3rd film are bonded together, and, two first line substrates are positioned at the outermost both sides of described 2N sandwich circuit board, or a first line substrate and second circuit base plate are positioned at the outermost both sides of described 2N sandwich circuit board, or two the second circuit base plates are positioned at the outermost both sides of described 2N sandwich circuit board.
The manufacture method of a kind of multilayer circuit board, including step: providing N number of copper-clad base plate, wherein, N is the natural number more than or equal to 3, and each described copper-clad base plate includes insulating barrier and the first copper foil layer fitting in described insulating barrier opposite sides and the second copper foil layer；First copper foil layer of each described copper-clad base plate is made and forms the first conductive circuit pattern, second copper foil layer of each described copper-clad base plate is made and forms the second conductive circuit pattern, and described first conductive circuit pattern and the second conductive circuit pattern are mutually conducted by least one conductive hole, thus N number of described copper-clad base plate is made N number of first line substrate；N-2M first line substrate is taken in N number of described first line substrate, wherein, M is natural number, and N is more than 2M, fit the first film in the first conductive circuit pattern surface in each described first line substrate in N-2M described first line substrate, described first film has at least one first through hole, the first conductive material is filled in described first through hole, described first conductive material mutually conducts with the first adjacent conductive circuit pattern, thus N-2M described first line substrate is made N-2M the second circuit base plate；nullM first line substrate is taken in N number of described first line substrate，Fit the second film in the first conductive circuit pattern surface in each first line substrate in M described first line substrate，The second conductive circuit pattern surface laminating the 3rd film in each first line substrate in M described first line substrate，Described second film has at least one second through hole，At each described 3rd film, there is at least one third through-hole，And fill the second conductive material at least one second through hole described，Described second conductive material mutually conducts with the first adjacent conductive circuit pattern，The 3rd conductive material is filled at least one third through-hole described，Described 3rd conductive material mutually conducts with the second adjacent conductive circuit pattern，Thus M described first line substrate is made M tertiary circuit substrate；First copper foil is provided, remaining M the first line substrate of one step press, N-2M described second circuit base plate, M described tertiary circuit substrate and described first copper foil are to form 2N+1 sandwich circuit substrate, in described 2N+1 sandwich circuit substrate, by the first film between adjacent insulating barrier, second film or the 3rd film are bonded together, it is bonded together by the first film or the second film between adjacent insulating barrier and the first copper foil, and described first copper foil is positioned at described 2N+1 sandwich circuit substrate outermost side, one described first line substrate or described second circuit base plate are positioned at the outermost opposite side of described 2N+1 sandwich circuit substrate；And described first copper foil is made conductive circuit pattern via selective etch, it is thus achieved that 2N+1 sandwich circuit board.
The manufacture method of a kind of multilayer circuit board, including step: providing N number of copper-clad base plate, wherein, N is the natural number more than or equal to 3, and each described copper-clad base plate includes insulating barrier and the first copper foil layer fitting in described insulating barrier opposite sides and the second copper foil layer；First copper foil layer of each described copper-clad base plate is made and forms the first conductive circuit pattern, second copper foil layer of each described copper-clad base plate is made and forms the second conductive circuit pattern, and described first conductive circuit pattern and the second conductive circuit pattern are mutually conducted by least one conductive hole, thus N number of described copper-clad base plate is made N number of first line substrate；N-2M-1 first line substrate is taken in N number of described first line substrate, wherein, M is natural number, and N is more than 2M+1, the first conductive circuit pattern surface laminating one first film in each described first line substrate in N-2M-1 described first line substrate, described first film has at least one first through hole, the first conductive material is filled at least one first through hole described, described first conductive material mutually conducts with corresponding first conductive circuit pattern, thus N-2M-1 described first line substrate is made N-2M-1 the second circuit base plate；nullM+1 first line substrate is taken in N number of described first line substrate，Fit the second film in the first conductive circuit pattern surface in each first line substrate in first line substrate described in M+1，The second conductive circuit pattern surface laminating the 3rd film in each first line substrate in described M+1 first line substrate，Described second film has at least one second through hole，Described 3rd film has at least one third through-hole，And fill the second conductive material at least one second through hole described，Described second conductive material mutually conducts with the first adjacent conductive circuit pattern，The 3rd conductive material is filled at least one third through-hole described，Described 3rd conductive material mutually conducts with the second adjacent conductive circuit pattern，Thus M+1 described first line substrate is made M+1 tertiary circuit substrate；First copper foil and the second copper foil are provided, first copper foil described in one step press, remaining M first line substrate, N-2M-1 described second circuit base plate, M+1 described tertiary circuit substrate and described second copper foil are to form 2N+2 sandwich circuit substrate, in described 2N+2 sandwich circuit substrate, described first copper foil and described second copper foil lay respectively at the outermost both sides of described 2N+2 sandwich circuit substrate, and by the first film between adjacent insulating barrier, second film or the 3rd film are bonded together, all it is bonded together by the first film or the second film or the 3rd film between adjacent insulating barrier and the first copper foil and between adjacent insulating barrier and the second copper foil；And described first copper foil and the second copper foil are made conductive circuit pattern via selective etch respectively, to obtain 2N+2 sandwich circuit board.
A kind of manufacture method of multilayer circuit board, including step: provide N+1 copper-clad base plate, wherein, N is the natural number more than or equal to 1, and each described copper-clad base plate includes insulating barrier and the first copper foil layer fitting in described insulating barrier opposite sides and the second copper foil layer；First copper foil layer of each described copper-clad base plate is made and forms the first conductive circuit pattern, second copper foil layer of each described copper-clad base plate is made and forms the second conductive circuit pattern, and described first conductive circuit pattern and the second conductive circuit pattern are mutually conducted by least one conductive hole, thus N+1 described copper-clad base plate is made N+1 first line substrate；N number of first line substrate is taken in N+1 described first line substrate, fit the first film in the first conductive circuit pattern surface in each described first line substrate in N number of described first line substrate, described first film has at least one first through hole, the first conductive material is filled at least one first through hole described, described first conductive material mutually conducts with the first adjacent conductive circuit pattern, thus N number of described first line substrate is made N number of second circuit base plate；N number of described second circuit base plate of one step press and a remaining first line substrate are to form 2N+2 sandwich circuit board, in described 2N+2 sandwich circuit board, the first film in each described second circuit base plate, is bonded together by the first film between adjacent insulating barrier closer to described first line substrate compared with the second conductive circuit pattern.
A kind of multilayer circuit board, use manufacturing method of multi-layer circuit board as above to make to be formed, described multilayer circuit board includes multilayer dielectric layer, multifilm and multilayer conductive circuit figure, the opposite sides of every layer insulating is each provided with one layer of described conductive circuit pattern, and the conductive circuit pattern of every layer insulating both sides is conducted by least one conductive hole being arranged in this insulating barrier, the opposite sides of every layer of film is each provided with one layer of described conductive circuit pattern, and the conductive circuit pattern of the opposite sides of every layer of film is conducted by the conductive material being arranged in this film, conductive material in this film is formed by printing conductive paste.
The manufacturing method of multi-layer circuit board that the technical program provides, makes multiple circuit base plate simultaneously, then forms film by the way of laminating on one or two surface of partial line base board, and form through hole in film and be formed with conductive material.So, as required, stack Copper Foil, be fitted with film and the circuit base plate of conductive material or stack the circuit base plate not being fitted with film the most simultaneously, thus just can get multilayer circuit board by one step press.Owing to multiple circuit base plates can make simultaneously, such that it is able to shorten the time that wiring board makes.Owing to each circuit base plate individually makes, compared to the mode of successively superposition in prior art, it is possible to increase the yield that wiring board makes.
Accompanying drawing explanation
Fig. 1 is the generalized section of the copper-clad base plate that the technical program first embodiment provides.
Fig. 2 is the generalized section of the first line substrate formed after formation conductive hole, the first conductive circuit pattern and the second conductive circuit pattern on the copper-clad base plate in FIG that the technical program first embodiment provides.
Fig. 3 is to overlap the first film and mould release membrance in the first conductive circuit pattern of the first line substrate in fig. 2 that the technical program first embodiment provides; second conductive circuit pattern is fitted the generalized section after protecting film, and first line substrate, the first film, mould release membrance and protecting film described in pre-pressing.
Fig. 4 is to form the first blind hole on the first film in figure 3 that the technical program first embodiment provides, and the generalized section of the second circuit base plate formed after forming the first conductive material in the first blind hole.
Fig. 5 is the generalized section of the tertiary circuit substrate that the technical program first embodiment provides.
Fig. 6 is the overall generalized section formed after one the first copper foil of pressing, tertiary circuit substrate, first line substrate, another tertiary circuit substrate, second circuit base plate and second copper foil that the technical program first embodiment provides.
Fig. 7 is that being made by the first copper foil in Fig. 6 of the technical program first embodiment offer forms the 3rd conductive circuit pattern, and the second copper foil is made the generalized section after forming the 4th conductive circuit pattern.
Fig. 8 is to form the first welding resisting layer in the 3rd conductive circuit pattern in the figure 7 that the technical program first embodiment provides, the generalized section of ten sandwich circuit boards formed after forming the second welding resisting layer in the 4th conductive circuit pattern.
Fig. 9 is the N=7 that the technical program provides, the structural representation of 14 sandwich circuit boards obtained by a kind of stack manner of the second embodiment during M=3.
Figure 10 is the N=7 that the technical program provides, the structural representation of 14 sandwich circuit boards obtained by a kind of stack manner of the 3rd embodiment during M=3.
Figure 11 is the N=6 that the technical program provides, the structural representation of the 13 sandwich circuit substrates obtained by a kind of stack manner of the 4th embodiment during M=3.
Figure 12 is the N=6 that the technical program provides, the structural representation of the 13 sandwich circuit substrates obtained by a kind of stack manner of the 5th embodiment during M=2.
Figure 13 is the N=7 that the technical program provides, the structural representation of the 16 sandwich circuit substrates obtained by a kind of stack manner of sixth embodiment during M=3.
Figure 14 is the N=7 that the technical program provides, the structural representation of the 16 sandwich circuit substrates obtained by a kind of stack manner of the 7th embodiment during M=2.
The structural representation of eight sandwich circuit boards that stacking obtains when Figure 15 is the N=3 of the technical program offer.
Main element symbol description
Copper-clad base plate 10
Insulating barrier 11
First copper foil layer 12
Second copper foil layer 13
Conductive hole 14
First conductive circuit pattern 15
Second conductive circuit pattern 16
First line substrate 110
First film 17
Mould release membrance 18
Protecting film 19
First through hole 20
First conductive material 21
Second circuit base plate 120
Second film 22
3rd film 23
Second through hole 24
Third through-hole 25
Second conductive material 26
3rd conductive material 27
Tertiary circuit substrate 130
First copper foil 28
Second copper foil 29
3rd conductive circuit pattern 30
4th conductive circuit pattern 31
First welding resisting layer 32
Second welding resisting layer 33
Ten sandwich circuit boards 100
14 sandwich circuit boards 200、210
13 sandwich circuit boards 220、230
16 sandwich circuit substrates 240、250
Eight sandwich circuit boards 260
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Below in conjunction with accompanying drawing and multiple embodiment, multilayer circuit board that the technical program provides and preparation method thereof is described in further detail.
The manufacture method of ten sandwich circuit boards that the technical program first embodiment provides comprises the following steps:
The first step, refers to Fig. 1, it is provided that four copper-clad base plates 10.Each copper-clad base plate 10 all includes an insulating barrier 11 and is bonded in the first copper foil layer 12 and the second copper foil layer 13 of insulating barrier 11 opposite sides.
Described copper-clad base plate 10 can be glass fiber fabric base clad copper base, paper substrate copper-clad base plate, composite base copper-clad base plate, aramid fiber nonwoven fabric base copper-clad base plate or synthetic fibers base copper-clad base plate etc..It is of course also possible to select two, three, five or more described copper-clad base plate 10 according to the needs of the wiring board number of plies formed.
Second step, refer to Fig. 2, each described copper-clad base plate 10 is formed at least one first conductive hole 14, each described first copper foil layer 12 is made formation the first conductive circuit pattern 15, each second copper foil layer 13 is made formation the second conductive circuit pattern 16, first conductive circuit pattern 15 and the second conductive circuit pattern 16 are mutually conducted by least one first conductive hole 14 described, thus obtain four first line substrates 110.
The formation of described first conductive hole 14 can be adopted with the following method: first, the mode using machine drilling forms through hole on described copper-clad base plate 10, the most through described first copper foil layer 12 of described through hole, insulating barrier 11 and the second copper foil layer 13, and described through hole is carried out de-smear process；Then, use the mode of plating described through hole internal electroplated such as copper, the metal such as silver-colored or golden, thus obtain described first conductive hole 14.Preferably, at the internal electroplated copper of described through hole.It is highly preferred that when electroplating, described through hole is filled up completely with by plating process for filling hole.It is of course also possible to first at the hole wall plated metal of described through hole, to form described first conductive hole 14, the most again potting resin in described through hole；Or after forming described through hole, in described through hole, fill conductive paste, solidify described conductive paste and form described first conductive hole 14.
Those skilled in the art it is also understood that, the mode that can also first use laser ablation forms blind hole on described copper-clad base plate 10, through described first copper foil layer 12 of described blind hole and insulating barrier 11, then, use plating process for filling hole to fill plated metal in the inside of described blind hole, thus obtain described first conductive hole 14；The mode that can also use open copper window first etches open copper window in the position forming described first conductive hole 14 of described first copper foil layer 12, use the most again the mode of laser ablation on described insulating barrier 11 ablation thus form blind hole, then, use plating process for filling hole to fill plated metal in the inside of described blind hole, thus obtain described first conductive hole 14.
First conductive circuit pattern 15 and the second conductive circuit pattern 16 can be made by image transfer technique and etch process and be formed.
In present embodiment, the first conductive circuit pattern 15 and the second conductive circuit pattern 16 on four described first line substrates 110 are set according to the wiring board being actually subjected to prepare, the first conductive circuit pattern 15 in each copper-clad base plate 10 is arranged with the second conductive circuit pattern 16 can be identical, it is also possible to different.
3rd step, refers to Fig. 3-4, and a described first line substrate 110 in four described first line substrates 110 is made second circuit base plate 120.The manufacture method of described second circuit base plate 120 may comprise steps of:
First, the first conductive circuit pattern 15 of described first line substrate 110 overlaps the first film 17 and mould release membrance 18 successively, protecting film 19 of fitting in the second conductive circuit pattern 16 of described first line substrate 110.Secondly; first line substrate the 110, first film 17 described in pre-pressing and mould release membrance 18 and protecting film 19; make described first film 17 be bonded together with described first line substrate 110, also make described protecting film 19 be bonded in described second conductive circuit pattern 16 simultaneously.Remove described mould release membrance 18.Then, described first film 17 is formed at least one first through hole 20, described first through described first film 17 of through hole 20, and makes part the first conductive circuit pattern 15 expose bottom described first through hole 20.Furthermore, in described first through hole 20, form the first conductive material 21, thus described first conductive material 21 mutually conduct with described first conductive circuit pattern 15.Finally, remove described protecting film 19, obtain described second circuit base plate 120.
In the present embodiment, described first film 17 is semi-solid preparation film, and it can be glass-fiber-fabric prepreg, paper substrate prepreg, composite base prepreg, aramid fiber non-woven fabrics prepreg, synthetic fibers prepreg or virgin resin prepreg etc..
Wherein, the effect of pre-pressing is to heat described first film 17, makes described first film 17 produce certain viscosity, thus is bonded together with described first line substrate 110.The time that temperature, the pressure of pressing needs and the pressing that the time of the temperature of pre-pressing, the pressure of pre-pressing and the pre-pressing of described first film 17 all needs much smaller than the pressing of described first film 17 needs, therefore, described first film 17 after pre-pressing still remains its semi-solid preparation character.In the present embodiment, the temperature range of the pre-pressing of described first film 17 is 60-110 DEG C, the time range of pre-pressing is the 10-60 second, the pressure limit of pre-pressing is 5-15kg/cm2, the pressing-in temp scope of corresponding described first film 17 is 180-250 DEG C, the time range of pressing is 60-120 minute, and the pressure limit of pressing is 200-300 kg/cm2.Preferably, the temperature of the pre-pressing of described first film 17 is 80 DEG C, and the time of pre-pressing is 30 seconds, and the pressure of pre-pressing is 10kg/cm2, and the temperature of pressing is 210 DEG C, and the time of pressing is 80 minutes, and the pressure of pressing is 250kg/cm2.
In the present embodiment; described mould release membrance 18 is for stepping pulling-on piece (mylar); it is used for protecting described first film 17, and when preventing pre-pressing, described first film 17 is bonding with object in contact (steel plate used by such as pre-pressing or tool for stitching) and cannot separate.Described mould release membrance 18 can also be that other are such as separated type materials such as polyethylene mould release membrance or polypropylene mould release membrances.
Described protecting film 19 is used for protecting described second conductive circuit pattern 16, to prevent described second conductive circuit pattern 16 from oxidation and damage occurring in the step of follow-up pre-pressing or making the first conductive hole.In the present embodiment, described protecting film 19 includes mylar and the low-viscosity glue-line fitting on mylar.Certainly, mylar can also be that other are such as the macromolecule membrane such as polyethylene film, polypropylene screen, it is only necessary to has preferable thermostability.
In the present embodiment, described first through hole 20 uses the mode of laser drill to be formed.Additionally, because laser drilling process is to form hole by the first film 17 described in high-octane laser ablation, some residues can be produced during ablation, therefore, preferably, after laser drilling described first through hole 20 is carried out de-smear process, except residue can be selected for plasma removing glue residues processing technique or chemical desmear technique etc..
In the present embodiment, the mode of type metal conductive paste is used to fill the first conductive material 21 in the first through hole 20.Described metallic conduction cream can be conductive copper cream, conduction silver paste, conduction tin cream etc., preferably conductive copper cream.Specifically, first, metallic conduction cream is filled in the first through hole 20 by the way of silk screen printing；Then, conductive metal paste is toasted so that described conductive metal paste solidifies, and forms the first conductive material 21.The temperature that the temperature of conductive metal paste baking is solidified less than described first film 17, thus do not affect the semi-solid preparation character of described first film 17.
Additionally, before overlapping described first film 17 and mould release membrance 18, it is preferable that first described first conductive circuit pattern 15 can be carried out surface coarsening process, as brown processes, to strengthen the adhesion between described first film 17 and described first conductive circuit pattern 15.
It is of course also possible to according to formed the wiring board number of plies need make multiple described second circuit base plate 120.
4th step, refers to Fig. 5, and two described first line substrates 110 in four described first line substrates 110 are made two tertiary circuit substrates 130.The manufacture method of each described tertiary circuit substrate 130 may each comprise following steps:
First, the first conductive circuit pattern 15 of described first line substrate 110 overlaps the second film 22 and mould release membrance, the second conductive circuit pattern 16 of described first line substrate 110 overlaps the 3rd film 23 and mould release membrance.Secondly, first line substrate the 110, second film 22 and the 3rd film 23 described in pre-pressing, make described second film 22, described first line substrate 110 and described 3rd film 23 be bonded together.Then, the mould release membrance of described first line substrate 110 both sides is removed.Furthermore, described second film 22 is formed at least one second through hole 24, described second through described second film 22 of through hole 24, and make part the first conductive circuit pattern 15 expose bottom described second through hole 24, described 3rd film 23 forms at least one third through-hole 25, through described 3rd film 23 of described third through-hole 25, and make part the second conductive circuit pattern 16 expose bottom described third through-hole 25.Finally, the second conductive material 26 is formed in described second through hole 24, and in described third through-hole 25, form the 3rd conductive material 27, thus described second conductive material 26 mutually conducts with described first conductive circuit pattern 15, described 3rd conductive material 27 mutually conducts with described second conductive circuit pattern 16, obtains described tertiary circuit substrate 130.
In the present embodiment, described second through hole 24 of two tertiary circuit substrates 130 and arrange position and the quantity of third through-hole 25 are set according to the wiring board being actually subjected to prepare, the second through hole 24 in each tertiary circuit substrate 130 and third through-hole 25 arranges position and quantity can be the same or different.
It addition, this step is similar with above-mentioned 3rd step, the material of mould release membrance and effect and the material of the mould release membrance 18 in the 3rd step and act on the most identical in this step, the condition of pre-pressing and act on also with the condition of the pre-pressing in the 3rd step and act on identical.The generation type of described second through hole 24 and third through-hole 25 can also be identical with the generation type of the first through hole 20 in the 3rd step.The mode forming the second conductive material 26 and the 3rd conductive material 27 in described second through hole 24 and third through-hole 25 can also be identical with the mode forming the first conductive material 21 in the first through hole 20 in the 3rd step.Additionally, preferably, the most described second through hole 24 and third through-hole 25 are carried out de-smear process, to remove the residue in described second through hole 24 and third through-hole 25, except residue treatment can select plasma removing glue residues processing technique or chemical desmear to process technique etc..Preferably, before overlapping described second film 22 and the 3rd film 23, also described first conductive circuit pattern 15 and the second conductive circuit pattern 16 are carried out surface coarsening process.
It is of course also possible to need to be formed without described tertiary circuit substrate 130 according to the wiring board number of plies formed, or make the described tertiary circuit substrate 130 forming one or more.
5th step, refer to Fig. 6, first copper foil 28 and the second copper foil 29 is provided, stacks gradually and described in one step press, 130, described first line substrate 110 of the described tertiary circuit substrate of the second copper foil 29, another described second circuit base plate 120 of described tertiary circuit substrate 130, and described first copper foil 28 become an entirety.In described entirety, described first copper foil 28 and the second copper foil 29 are respectively the outermost layer conductive layer of described overall both sides, and be bonded together by the second film 22 or the 3rd film 23 between adjacent insulating barrier 11, it is bonded together by the first film 17 or the second film 22 or the 3rd film between adjacent insulating barrier 11 and Copper Foil.Specifically, described second copper foil 29 is the most bonding with the second film 22 of a described tertiary circuit substrate 130, described first line substrate 110 directly bonds with the 3rd film 23 of the tertiary circuit substrate 130 directly bondd with described second copper foil 29, another one tertiary circuit substrate 130 is between described first line substrate 110 and the first copper foil 28, and directly bond with described first line substrate 110, described second circuit base plate 120 is between described second copper foil 29 tertiary circuit substrate 130 and the first copper foil 28 farther out, described first copper foil 28 is bonding with the first film 17 of described second circuit base plate 120.
When aliging and stacking described second copper foil 130, described first line substrate 110 of 29, described tertiary circuit substrate, another described 130, described second circuit base plate 120 of tertiary circuit substrate and described first copper foil 28, should ensure that the accurate para-position between 130, described first line substrate 110 of described tertiary circuit substrate, another described second circuit base plate 120 of described tertiary circuit substrate 130,.When practical operation, during stacking, 130, described first line substrate 110 of described tertiary circuit substrate, another described second circuit base plate 120 of described tertiary circuit substrate 130, can will be respectively provided with registration holes, use the tool with the alignment pin corresponding with registration holes to carry out para-position.
nullIn the present embodiment，Owing to relative two surfaces of each described tertiary circuit substrate 130 are respectively provided with the second film 22 and the 3rd film 23，The surface adjacent with described second copper foil 29 of described second circuit base plate 120 has the first film 17，Because the heating of semi-solid preparation material has certain mobility，After bonding processes，One described tertiary circuit substrate 130、One described first line substrate 110、Another described tertiary circuit substrate 130 and each described first conductive circuit pattern 15 of described second circuit base plate 120、Second conductive circuit pattern 16 is all corresponding embeds each first film 17、In the insulating barrier that second film 22 and the 3rd film 23 are formed，Described second copper foil 29 glues with the second film 22 phase of a described tertiary circuit substrate 130，Described first copper foil 28 glues with the first film 17 phase of described second circuit base plate 120，So that each layer is combined closely.
6th step, refers to Fig. 7, and the second copper foil 29 makes formation the 3rd conductive circuit pattern 30, and the first copper foil 28 makes formation the 4th conductive circuit pattern 31.
Described 3rd conductive circuit pattern 30 and the 4th conductive circuit pattern 31 can be formed by image transfer technique and etch process.
7th step, refers to Fig. 8, forms the first welding resisting layer 32 on the surface of described 3rd conductive circuit pattern 30, forms the second welding resisting layer 33 on the surface of described 4th conductive circuit pattern 31, obtains ten sandwich circuit boards 100.
First welding resisting layer 32 and the second welding resisting layer 33 can be formed by the way of solder-mask printing ink.First welding resisting layer 32 is for protection the 3rd conductive circuit pattern 30, and the second welding resisting layer 33 is for protection the 4th conductive circuit pattern 31.
It is understood that the manufacture method of the wiring board of the technical program offer can also be applied to the making of the multilayer circuit board of other numbers of plies.Wherein, when making multilayer circuit board, one can be chosen in described first line substrate the 110, second circuit base plate 120 and tertiary circuit substrate 130 these three circuit base plate, two or three be combined, the quantity of every kind can be one or more, certainly, described first copper foil 28 can also be selected again or select first copper foil 28 and the second copper foil 29 to be combined simultaneously, being specifically referred to following method and carry out:
Method one: the method is used for forming 2N sandwich circuit board, N is the natural number more than or equal to 4.Particularly as follows: first, it is the natural number more than or equal to 2 by M first line substrate 110(M, and N is more than 2M-1), M-1 tertiary circuit substrate 130, (N-2M+1) individual second circuit base plate 120 aligns and is overlapped into an overlapping substrate, and make two first line substrates 110 lay respectively at the outermost both sides of described overlapping substrate, or make a first line substrate 110 and second circuit base plate 120 lay respectively at the outermost both sides of described overlapping substrate, or two the second circuit base plates 120 lay respectively at the outermost both sides of described overlapping substrate, and between adjacent insulating barrier 11, have the first film 17, second film 22 or the 3rd film 23；Secondly, after overlapping substrate described in disposable pressing, 2N sandwich circuit board is obtained.In described 2N sandwich circuit board, two first line substrates 110 lay respectively at the outermost both sides of described 2N sandwich circuit board, or a first line substrate 110 and second circuit base plate 120 lay respectively at the outermost both sides of described 2N sandwich circuit board, or two the second circuit base plates 120 are laid respectively at and are bonded together by first film the 17, second film 22 or the 3rd film 23 between the outermost both sides of described 2N sandwich circuit board, and adjacent insulating barrier 11.The folding method of described overlapping substrate is specifically referred to below embodiment:
Second embodiment: in the present embodiment, M is the natural number more than or equal to 2, and N is more than 2M-1) described overlapping substrate can be formed by the following method: first, using a first line substrate 110 in M first line substrate 110 as outermost wire base board；Secondly, in remaining M-1 first line substrate 110 and M-1 tertiary circuit substrate 130, one tertiary circuit substrate 130 and a first line substrate 110 are stacked and form first stackable unit only having two circuit base plates, thus obtains M-1 the first stackable unit；Then, being stacked by N-2M+1 the second circuit base plate 120 and form second stackable unit only having the second circuit base plate 120, described second stackable unit can include one or more second circuit base plate 120；Finally, M-1 described first stackable unit is stacked on the first line substrate 110 of outermost wire base board with described second stackable unit, and make the first line substrate 110 in the most corresponding first stackable unit of the tertiary circuit substrate 130 in each first stackable unit near the first line substrate 110 as outermost wire base board, the second conductive circuit pattern 16 making more corresponding second circuit base plate 120 of the first film 17 of each described second circuit base plate 120 in described second stackable unit is close to the first line substrate 110 as outermost wire base board, thus obtain described stacking substrates.
Certainly, the stack manner of M-1 described first stackable unit second stackable unit described with has multiple, is specifically as follows: described second stackable unit may be located at adjacent described first stackable unit and described as the first line substrate 110 of outermost wire base board between；Described second stackable unit can also be between two adjacent described first stackable unit；Described second stackable unit can also be positioned on the distance first line substrate 110 as farthest the first stackable unit of the first line substrate 110 of outermost wire base board.
When carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, it is only necessary to the quantity of described first stackable unit is increased or decreased in described overlapping substrate；Or in described overlapping substrate, the quantity of described second stackable unit is increased or decreased；Or the quantity of described second circuit base plate 120 being increased or decreased in described overlapping substrate in described second stackable unit.
It will be appreciated by those skilled in the art that, when carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, one or more second circuit base plate 120 of superposition on the first line substrate 110 as outermost wire base board overlapping substrate of described multilayer circuit board can also be formed at the present embodiment, thus obtain a new multilayer circuit board, in described new multilayer circuit board, one first line substrate 110 and the outermost wire base board of second circuit base plate 120 respectively described new multilayer circuit board both sides, or two the second circuit base plates 120 are respectively the outermost wire base board of described new multilayer circuit board both sides.
Refer to Fig. 9, below with N=7, as a example by the structure of 14 sandwich circuit boards 200 obtained by a kind of stack manner of the second embodiment during M=3, the present embodiment is illustrated.Described 14 sandwich circuit boards 200 are by aliging 110, two tertiary circuit substrates 130 of three first line substrates and two the second circuit base plates 120 and be overlapped into an overlapping substrate, and overlap formation after substrate described in one step press.In described 14 sandwich circuit boards 200, two first line substrates 110 lay respectively at the outermost both sides of described 14 sandwich circuit boards 200, and are bonded together by first film the 17, second film 22 or the 3rd film 23 between adjacent insulating barrier 11.Concrete, the overlapping substrate of described 14 sandwich circuit boards 200 can be formed by the following method: first, using a first line substrate 110 as the outermost wire base board of described overlapping substrate, in remaining two first line substrates 110 and two tertiary circuit substrates 130, one first line substrate 110 and a tertiary circuit substrate 130 are stacked one the first stackable unit of formation, thus obtain two the first stackable unit, and two one the second circuit base plate 120 is stacked one the second stackable unit of formation；Secondly, described in described second stackable unit one the second circuit base plate 120 is directly affixed with the first line substrate 110 as outermost wire base board, two the first stackable unit stack gradually on the second circuit base plate 120 that distance is farthest as the first line substrate 110 of outermost wire base board, make the first line substrate 110 in the most corresponding first stackable unit of the tertiary circuit substrate 130 in each first stackable unit near the first line substrate 110 as outermost wire base board, second conductive circuit pattern 16 of the most corresponding second circuit base plate 120 of the first film 17 of each described second circuit base plate 120 is close to the first line substrate 110 as outermost wire base board, thus obtain described overlapping substrate.
3rd embodiment: in the present embodiment, M is the natural number more than or equal to 2, and N=3M-2) described overlapping substrate can be formed by the following method: first, using a first line substrate 110 in M first line substrate 110 as outermost wire base board；Secondly, in remaining M-1 first line substrate 110, M-1 the second circuit base plate 120 and M-1 tertiary circuit substrate 130,110, second circuit base plate 120 of one first line substrate and a tertiary circuit substrate 130 are stacked and form the 3rd stackable unit only having three circuit base plates, thus obtains (M-1) individual 3rd stackable unit；Finally, M-1 described 3rd stackable unit is stacked on the first line substrate 110 of outermost wire base board, and make the close first line substrate 110 as outermost wire base board of first line substrate 110 in the most corresponding 3rd stackable unit of tertiary circuit substrate 130 in each 3rd stackable unit, thus obtain described overlapping substrate.
Certainly, the stack manner of three circuit base plates in described 3rd stackable unit has multiple, it is specifically as follows: in each 3rd stackable unit, described tertiary circuit substrate 130 is arranged between adjacent first line substrate 110 and the second circuit base plate 120, now, in the overlapping substrate formed, the tertiary circuit substrate 130 in the second more corresponding 3rd stackable unit of circuit base plate 120 in each 3rd stackable unit is near the first line substrate 110 as outermost wire base board；Or in each 3rd stackable unit, described first line substrate 110 is arranged between adjacent tertiary circuit substrate 130 and the second circuit base plate 120, now, in the overlapping substrate formed, the second circuit base plate 120 in more corresponding 3rd stackable unit of tertiary circuit substrate 130 in each 3rd stackable unit is near the first line substrate 110 as outermost wire base board；Or in each 3rd stackable unit, the second circuit base plate 120 in described 3rd stackable unit is arranged between adjacent tertiary circuit substrate 130 and first line substrate 110, now, in the overlapping substrate formed, described first line substrate 110 is directly affixed with described first film 17, and the second circuit base plate 120 in more corresponding 3rd stackable unit of tertiary circuit substrate 130 in each 3rd stackable unit is near the first line substrate 110 as outermost wire base board.
When carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, it is only necessary to the quantity of described threeth stackable unit is increased or decreased in described overlapping substrate.
It will be appreciated by those skilled in the art that, when carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, one or more the second stackable unit as described in the second embodiment can also be increased in described overlapping substrate, the quantity of described second circuit base plate 120 in described second stackable unit can be one or more, described second stackable unit may be located at adjacent described 3rd stackable unit and described as the first line substrate 110 of outermost wire base board between, can also be between two adjacent described 3rd stackable unit, distance can also be stacked in as in farthest the 3rd stackable unit of the first line substrate 110 of outermost wire base board.Those skilled in the art are further appreciated that when carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, it is also possible to increase one or more the first stackable unit as described in the second embodiment in described overlapping substrate.Those skilled in the art are further appreciated that when carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, it is also possible to increase the first stackable unit and the second stackable unit as described in the second embodiment in described overlapping substrate simultaneously.
Additionally, those skilled in the art it is also understood that, when carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, one or more second circuit base plate 120 of superposition on the first line substrate 110 as outermost wire base board of the overlapping substrate of the multilayer circuit board that can also be formed on the first line substrate 110 as outermost wire base board of the overlapping substrate of the described multilayer circuit board that the present embodiment is formed or after the present embodiment carries out above-mentioned increasing layer, thus obtain a new multilayer circuit board, in described new multilayer circuit board, one first line substrate 110 and the outermost wire base board of second circuit base plate 120 respectively described new multilayer circuit board both sides, or two the second circuit base plates 120 are respectively the outermost wire base board of described new multilayer circuit board both sides.
Refer to Figure 10, below with N=7, as a example by the structure of 14 sandwich circuit boards 210 obtained by a kind of stack manner of the 3rd embodiment during M=3, the present embodiment is illustrated.Described 14 sandwich circuit boards 210 are by aliging 110, two tertiary circuit substrates 130 of three first line substrates and two the second circuit base plates 120 and be overlapped into an overlapping substrate, and overlap formation after substrate described in one step press.In described 14 sandwich circuit boards 210, one first line substrate 110 and second circuit base plate 120 lay respectively at the outermost both sides of described 14 sandwich circuit boards 210, and are bonded together by first film the 17, second film 22 or the 3rd film 23 between adjacent insulating barrier 11.Concrete, the overlapping substrate of described 14 sandwich circuit boards 210 can be formed by the following method: by second circuit base plate 120, one tertiary circuit substrate 130 and a first line substrate 110 stack gradually into the 3rd stackable unit only having three circuit base plates, make the first line substrate 110 in described 3rd stackable unit between adjacent tertiary circuit substrate 130 and the second circuit base plate 120, two described 3rd stackable unit cycle arrangement are also stacked in as on the first line substrate 110 of outermost wire base board, and make the second circuit base plate 120 in more corresponding 3rd stackable unit of tertiary circuit substrate 130 in each 3rd stackable unit near the first line substrate 110 as outermost wire base board, thus obtain described overlapping substrate.
Method two: the method is used for forming 2N+1 sandwich circuit board, N is the natural number more than or equal to 3.Particularly as follows: first, it is natural number by M first line substrate 110(M, and N is more than 2M), M tertiary circuit substrate 130, N-2M the second circuit base plate 120 and first copper foil 28 align and are overlapped into an overlapping substrate, and make described first copper foil 28 be positioned at the outermost side of described overlapping substrate, described first line substrate 110 or described second circuit base plate 120 are positioned at the outermost opposite side of described overlapping substrate, and between adjacent insulating barrier 11, have the first film 17, second film 22 or the 3rd film 23, the first film 17 or the second film 22 is had between adjacent insulating barrier 11 and the first copper foil 28；Secondly, 2N+1 sandwich circuit substrate is obtained after overlapping substrate described in disposable pressing, in described 2N+1 sandwich circuit substrate, described first copper foil 28 is positioned at the outermost side of described 2N+1 sandwich circuit substrate, described first line substrate 110 or described second circuit base plate 120 are positioned at the outermost opposite side of described 2N+1 sandwich circuit substrate, and be bonded together by first film the 17, second film 22 or the 3rd film 23 between adjacent insulating barrier 11, it is bonded together by the first film 17 or the second film 22 between adjacent insulating barrier 11 and the first copper foil 28；Finally, more described first copper foil 28 of above-mentioned 2N+1 sandwich circuit substrate is formed conductive circuit pattern through selective etch, i.e. obtain 2N+1 sandwich circuit board.The folding method of described overlapping substrate is specifically referred to below embodiment:
4th embodiment: in the present embodiment, M is the natural number more than or equal to 1, and N is more than 2M, described overlapping substrate can be formed by the following method: first, one tertiary circuit substrate 130 and a first line substrate 110 are stacked and form first stackable unit only having two circuit base plates, thus obtains M the first stackable unit；Secondly, N-2M described second circuit base plate 120 is stacked one the second stackable unit of formation；Finally, M described first stackable unit is stacked on described first copper foil 28 with described second stackable unit, and make the first line substrate 110 in the most corresponding first stackable unit of the tertiary circuit substrate 130 in each first stackable unit near described first copper foil 28, second conductive circuit pattern 16 of more corresponding second circuit base plate 120 of the first film 17 of each described second circuit base plate 120 in described second stackable unit is close to described first copper foil 28, thus obtains described overlapping substrate.
Certainly, the stack manner of M described first stackable unit second stackable unit described with has multiple, is specifically as follows: described second stackable unit may be located between adjacent described first stackable unit and described first copper foil 28；Described second stackable unit can also be between two adjacent described first stackable unit；Described second stackable unit can also be stacked on the first line substrate 110 of farthest the first stackable unit of described first copper foil 28.
When carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, it is only necessary to the quantity of described first stackable unit is increased or decreased in described overlapping substrate；Or in described overlapping substrate, the quantity of described second stackable unit is increased or decreased；Or the quantity of described second circuit base plate 120 being increased or decreased in described overlapping substrate in described second stackable unit.
Refer to Figure 11, below with N=6, as a example by the structure of the 13 sandwich circuit substrates 220 obtained by a kind of stack manner of the 4th embodiment during M=3, the present embodiment is illustrated.Described 13 sandwich circuit substrates 220 are by being formed after 130, two the second circuit base plates 120 of 110, two tertiary circuit substrates of two first line substrates and first copper foil 28 being alignd and be overlapped into an overlapping substrate, and overlapping substrate described in one step press.In described 13 sandwich circuit substrates 220, described first copper foil 28 is positioned at the outermost side of described 13 sandwich circuit substrates 220, described second circuit base plate 120 is the outermost opposite side of described 13 sandwich circuit substrates 220, and be bonded together by first film the 17, second film 22 or the 3rd film 23 between adjacent insulating barrier 11, it is bonded together by the 3rd film 23 between adjacent insulating barrier 11 and the first copper foil 28.Concrete, the overlapping substrate of described 13 sandwich circuit substrates 220 can be formed by the following method: a first line substrate 110 and a tertiary circuit substrate 130 are stacked one the first stackable unit of formation, thus obtain two the first stackable unit, two the second circuit base plates 120 are stacked one the second stackable unit of formation；Two described first stackable unit are stacked gradually on described first copper foil, make the first line substrate 110 in the most corresponding first stackable unit of the tertiary circuit substrate 130 in each first stackable unit near the first copper foil 28, described second stackable unit is stacked on the first line substrate 110 of farthest the first stackable unit of described first copper foil 28, and make the second conductive circuit pattern 16 of more corresponding second circuit base plate 120 of the first film 17 of each described second circuit base plate 120 be close to described first copper foil 28, thus obtain described overlapping substrate.
5th embodiment: in the present embodiment, M is the natural number more than or equal to 1, and N=3M, described overlapping substrate can be formed by the following method: 110, second circuit base plate 120 of a first line substrate and a tertiary circuit substrate 130 are stacked into the 3rd stackable unit only having three circuit base plates, thus form M the 3rd stackable unit；M described 3rd stackable unit is stacked on described first copper foil 28, and, make the first line substrate 110 in the most corresponding 3rd stackable unit of tertiary circuit substrate 130 in each 3rd stackable unit near described first copper foil 28, thus obtain described stacking substrates.
Certainly, the stack manner of three circuit base plates in described 3rd stackable unit has multiple, it is specifically as follows: in each 3rd stackable unit, described tertiary circuit substrate 130 is arranged between adjacent first line substrate 110 and the second circuit base plate 120, now, in the overlapping substrate formed, the tertiary circuit substrate 130 in the second more corresponding 3rd stackable unit of circuit base plate 120 in each 3rd stackable unit is near described first copper foil 28；Or in each 3rd stackable unit, described first line substrate 110 is arranged between adjacent tertiary circuit substrate 130 and the second circuit base plate 120, now, in the overlapping substrate formed, the second circuit base plate 120 in more corresponding 3rd stackable unit of tertiary circuit substrate 130 in each 3rd stackable unit is near described first copper foil 28；Or in each 3rd Superposition unit, second circuit base plate 120 is arranged between adjacent tertiary circuit substrate 130 and first line substrate 110, now, in the overlapping substrate formed, described first line substrate 110 is directly affixed with described first film 17, and the second circuit base plate in more corresponding 3rd stackable unit of tertiary circuit substrate 130 in each 3rd stackable unit is near described first copper foil 28.
When carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, it is only necessary to the quantity of described threeth stackable unit is increased or decreased in described overlapping substrate.
It will be appreciated by those skilled in the art that, when carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, one or more the second stackable unit as described in the second embodiment can also be increased in described overlapping substrate, the quantity of described second circuit base plate 120 in described second stackable unit can be one or more, wherein, described second stackable unit may be located between adjacent described 3rd stackable unit and described first copper foil 28, can also be between two adjacent described 3rd stackable unit, can also be stacked in the 3rd stackable unit that described first copper foil 28 is farthest.Those skilled in the art are further appreciated that when carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, it is also possible to increase one or more the first stackable unit as described in the second embodiment in described overlapping substrate.Those skilled in the art are further appreciated that when carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, it is also possible to increase the first stackable unit and the second stackable unit as described in the second embodiment in described overlapping substrate simultaneously.
Refer to Figure 12, below with N=6, as a example by the structure of the 13 sandwich circuit substrates 230 obtained by a kind of stack manner of the 5th embodiment during M=2, the present embodiment is illustrated.Described 13 sandwich circuit substrates 230 are by being formed after 130, two the second circuit base plates 120 of 110, two tertiary circuit substrates of two first line substrates and first copper foil 28 being alignd and be overlapped into an overlapping substrate, and overlapping substrate described in one step press.In described 13 sandwich circuit substrates 230, described first copper foil 28 is positioned at the outermost side of described 13 sandwich circuit substrates 230, one first line substrate 110 is the outermost opposite side of described 13 sandwich circuit boards 230, and be bonded together by first film the 17, second film 22 or the 3rd film 23 between adjacent insulating barrier 11, it is bonded together by the first film 17 between adjacent insulating barrier 11 and the first copper foil 28.Concrete, the overlapping substrate of described 13 sandwich circuit substrates 230 can be formed by the following method: by second circuit base plate 120, one tertiary circuit substrate 130 and a first line substrate 110 stack gradually into the 3rd stackable unit only having three circuit base plates, make the tertiary circuit substrate 130 in described 3rd stackable unit between first line substrate 110 and the second circuit base plate 120, by two described 3rd stackable unit cycle arrangement and be stacked on described first copper foil 28, and make the tertiary circuit substrate 130 in the second more corresponding 3rd stackable unit of circuit base plate 120 in each 3rd stackable unit near described first copper foil 28, thus obtain described overlapping substrate.
Method three: the method is used for forming 2N+2 sandwich circuit board, N is the natural number more than or equal to 4.Particularly as follows: first, it is natural number by M first line substrate 110(M, and N is more than 2M+1), M+1 tertiary circuit substrate 130, N-2M-1 the second circuit base plate 120, one the first copper foil 28 and second copper foil 29 align and are overlapped into an overlapping substrate, and make described first copper foil 28 and the second copper foil 29 lay respectively at the outermost both sides layer conductive layer of described overlapping substrate, and between adjacent insulating barrier 11, have the first film 17, second film 22 or the 3rd film 23, the first film 17 or the second film 22 or the 3rd film is all had between adjacent insulating barrier 11 and the first copper foil 28 and between adjacent insulating barrier 11 and the second copper foil 29；Secondly, 2N+2 sandwich circuit substrate is obtained after overlapping substrate described in disposable pressing, in described 2N+2 sandwich circuit substrate, described first copper foil 28 and described second copper foil 29 lay respectively at the outermost both sides of described 2N+2 sandwich circuit substrate, and be bonded together by first film the 17, second film 22 or the 3rd film 23 between adjacent insulating barrier 11, all it is bonded together by the first film 17 or the second film 22 or the 3rd film 23 between adjacent insulating barrier 11 and the first copper foil 28 and between adjacent insulating barrier 11 and the second copper foil 29；Finally, described first copper foil 28 and second copper foil 29 of above-mentioned 2N+2 sandwich circuit substrate are formed conductive circuit pattern via selective etch respectively, i.e. obtains 2N+2 sandwich circuit board.The folding method of described overlapping substrate is specifically referred to below embodiment:
Sixth embodiment: in the present embodiment, M is the natural number more than or equal to 1, and N is more than 2M+1, described overlapping substrate can be formed by the following method: first, one tertiary circuit substrate 130 and a first line substrate 110 are stacked into first stackable unit only having two circuit base plates, thus form M the first stackable unit；Secondly, N-2M-1 described second circuit base plate 120 is stacked one the second stackable unit of formation；Finally, by a remaining tertiary circuit substrate 130, M described first stackable unit and described second stackable unit are stacked between described first copper foil 28 and the second copper foil 29, so that a described remaining tertiary circuit substrate 130 is directly affixed with described second copper foil 29, the first line substrate 110 in the most corresponding first stackable unit of tertiary circuit substrate 130 in each first stackable unit is near described first copper foil 28, second conductive circuit pattern 16 of more corresponding second circuit base plate 120 of the first film 17 of each described second circuit base plate 120 is close to described first copper foil 28, thus obtain described overlapping substrate.
Certainly, the stack manner of M described first stackable unit second stackable unit described with has multiple, is specifically as follows: described second stackable unit may be located between adjacent described first stackable unit and described first copper foil 28；Described second stackable unit can also be between two adjacent described first stackable unit；Described second stackable unit can also be positioned on the first line substrate 110 of farthest the first stackable unit of described first copper foil 28.
When carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, it is only necessary to the quantity of described first stackable unit is increased or decreased in described overlapping substrate；Or in described overlapping substrate, the quantity of described second stackable unit is increased or decreased；Or the quantity of described second circuit base plate 120 being increased or decreased in described overlapping substrate in described second stackable unit.
Refer to Figure 13, below with N=7, as a example by the structure of the 16 sandwich circuit substrates 240 obtained by a kind of stack manner of sixth embodiment during M=3, the present embodiment is illustrated.Described 16 sandwich circuit substrates 240 are by aliging 110, three tertiary circuit substrates of two first line substrates, 120, first copper foil 28 of 130, two the second circuit base plates and second copper foil 29 and be overlapped into an overlapping substrate, and overlap formation after substrate described in one step press.In described 16 sandwich circuit substrates 240, described first copper foil 28 and the second copper foil 29 lay respectively at the outermost both sides of described 16 sandwich circuit substrates, and be bonded together by first film the 17, second film 22 or the 3rd film 23 between adjacent insulating barrier 11, all it is bonded together by the first film 17 or the second film 22 or the 3rd film 23 between adjacent insulating barrier 11 and the first copper foil 28 and adjacent insulating barrier 11 and the second copper foil 29.Concrete, the overlapping substrate of described 16 sandwich circuit substrates 240 can be formed by the following method: a first line substrate 110 and a tertiary circuit substrate 130 are stacked one the first stackable unit of formation, thus obtaining two the first stackable unit, two one the second circuit base plate 120 stacking forms second stackable unit；nullBy 130 and M described first stackable unit of a remaining tertiary circuit substrate、One described second stackable unit is stacked between described first copper foil 28 and the second copper foil 29，And make a described remaining tertiary circuit substrate 130 directly be affixed with described second copper foil 29，Described second circuit base plate 120 in described second stackable unit is directly affixed with described first copper foil 28，And the second conductive circuit pattern 16 of more corresponding second circuit base plate 120 of the first film 17 of each described second circuit base plate 120 is close to described first copper foil，Two the first stackable unit stack gradually on second circuit base plate 120 farthest apart from described first copper foil 28，And the first line substrate 110 in the most corresponding first stackable unit of tertiary circuit substrate 130 in each first stackable unit is near the first copper foil 28，Thus obtain described overlapping substrate.
7th embodiment: in the present embodiment, M is the natural number more than or equal to 1, and N=3M+1, described overlapping substrate can be formed by the following method: first, 110, second circuit base plate 120 of one first line substrate and a tertiary circuit substrate 130 are stacked into the 3rd stackable unit only having three circuit base plates, thus form M the 3rd stackable unit；Secondly, by a remaining tertiary circuit substrate 130, M described 3rd stackable unit is stacked between described first copper foil 28 and the second copper foil 29, and make a described remaining tertiary circuit substrate 130 directly be affixed with described second copper foil 29, M described 3rd stackable unit is stacked between described first copper foil 28 and a described remaining tertiary circuit substrate 130, and make, the first line substrate 110 in the most corresponding 3rd stackable unit of tertiary circuit substrate 130 in each 3rd stackable unit is near described first copper foil 28, thus obtain described stacking substrates.
Certainly, the stack manner of three circuit base plates in described 3rd stackable unit has multiple, it is specifically as follows: in each described 3rd stackable unit, described tertiary circuit substrate 130 is arranged between adjacent first line substrate 110 and the second circuit base plate 120, now, in the overlapping substrate formed, the tertiary circuit substrate 130 in the second more corresponding 3rd stackable unit of circuit base plate 120 in each 3rd stackable unit is near described first copper foil 28；Or in each described 3rd stackable unit, described first line substrate 110 is arranged between adjacent tertiary circuit substrate 130 and the second circuit base plate 120, now, in the overlapping substrate formed, the second circuit base plate 120 in more corresponding 3rd stackable unit of tertiary circuit substrate 130 in each 3rd stackable unit is near described first copper foil 28；Or in each described 3rd stackable unit, second circuit base plate 120 is arranged between adjacent tertiary circuit substrate 130 and first line substrate 110, now, in the overlapping substrate formed, more corresponding second circuit base plate 120 of tertiary circuit substrate 130 in each 3rd stackable unit is near described first copper foil 28.
When carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, it is only necessary to the quantity of described threeth stackable unit is increased or decreased in described overlapping substrate.
nullIt will be appreciated by those skilled in the art that，When carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer，One or more the second stackable unit as described in the second embodiment can also be increased in described overlapping substrate，The quantity of described second circuit base plate 120 of described second stackable unit can be one or more，Described second stackable unit may be located between adjacent described 3rd stackable unit and described first copper foil 28，Described second stackable unit can also be between two adjacent described 3rd stackable unit，Described second stackable unit can also be between threeth stackable unit farthest apart from described first copper foil 28 and a described remaining tertiary circuit substrate 130，Described second stackable unit can also be between described second copper foil 29 and a described remaining described tertiary circuit substrate 130.Those skilled in the art are further appreciated that when carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, it is also possible to increase in one or more the first stackable unit as described in the second embodiment in described overlapping substrate.Those skilled in the art are further appreciated that when carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, it is also possible to increase in the first stackable unit as described in the second embodiment in described overlapping substrate and the second stackable unit simultaneously.
Refer to Figure 14, below with N=7, as a example by the structure of the 16 sandwich circuit substrates 250 obtained by a kind of stack manner of the 7th embodiment during M=2, the present embodiment is illustrated.Described 16 sandwich circuit substrates 250 are by aliging 110, three tertiary circuit substrates of two first line substrates, 120, first copper foil 28 of 130, two the second circuit base plates and second copper foil 29 and be overlapped into an overlapping substrate, and overlap formation after substrate described in one step press.In described 16 sandwich circuit substrates 250, described first copper foil 28 and the second copper foil 29 lay respectively at the outermost both sides of described 16 sandwich circuit substrates, and be bonded together by first film the 17, second film 22 or the 3rd film 23 between adjacent insulating barrier 11, all it is bonded together by the second film 22 or the 3rd film between adjacent insulating barrier 11 and the first copper foil 28 and between adjacent insulating barrier 11 and the second copper foil 29.Concrete, the overlapping substrate of described 16 sandwich circuit substrates 250 can be formed by the following method: 120, tertiary circuit substrate 130 of second circuit base plate and a first line substrate 110 are stacked gradually into the 3rd stackable unit only having three circuit base plates, making in each described 3rd stackable unit, described first line substrate 110 is between adjacent described second circuit base plate 120 and tertiary circuit substrate 130；By a remaining tertiary circuit substrate 130, two described first stackable unit are stacked between described first copper foil 28 and the second copper foil 29, a described remaining tertiary circuit substrate 130 is made directly to be affixed with described second copper foil 29, make two described 3rd stackable unit cycle arrangement and be stacked between described first copper foil 28 and a described remaining tertiary circuit substrate 130, and make the second circuit base plate 120 in more corresponding 3rd stackable unit of tertiary circuit substrate 130 in each 3rd stackable unit near described first copper foil 28, thus obtain described overlapping substrate.
Method three: the method is used for forming 2N+2 sandwich circuit board, N is the natural number more than or equal to 1.Particularly as follows: N number of 120, first line substrate 110 of second circuit base plate is alignd and is overlapped into an overlapping substrate, make the first film 17 of each described second circuit base plate 120 compared with the second conductive circuit pattern 16 all closer to described first line substrate 110, after overlapping substrate described in disposable pressing, obtain 2N+2 sandwich circuit substrate, i.e. obtain 2N+2 sandwich circuit board.In described 2N+2 sandwich circuit board, it is bonded together by the first film 17 between adjacent insulating barrier 11.
Certainly, N number of described second circuit base plate 120 has multiple with the stack manner of a first line substrate 110, be specifically as follows: described first line substrate 110 is arranged between adjacent two the second circuit base plate 120, and the first film 17 of each described second circuit base plate 120 compared with the second conductive circuit pattern 16 all closer to described first line substrate 110；Or using described first line substrate 110 as the outermost wire base board of described overlapping substrate, N number of described second circuit base plate 120 stacks gradually in the side of described first line substrate 110.
When carrying out the multilayer circuit board in the present embodiment increasing layer or subtracting layer, it is only necessary to the quantity of described second circuit base plate 120 is increased or decreased in described overlapping substrate.
8th embodiment, refers to Figure 15, as a example by the structure of eight sandwich circuit boards 260 obtained by this method three when N=3 below illustrates the present embodiment.Described eight sandwich circuit boards 260 can be formed by the following method: first, one first line substrate 110 is alignd with three the second circuit base plates 120 and is overlapped into an overlapping substrate, make described first line substrate 110 be positioned at the outermost side of described overlapping substrate, and the first film 17 of each described second circuit base plate 120 compared with the second conductive circuit pattern 16 all closer to described first line substrate 110；Secondly, overlap substrate described in one step press, described eight sandwich circuit boards 260 can be obtained.
Certainly, it is possible to be not limited to the arrangement of said method one to method three.
It is understandable that, the overlapping substrate that said method one to method three is formed is after carrying out one step press and Copper Foil is formed conductive circuit pattern (if having this step), it is also possible to the conductive circuit pattern surface exposed from both sides after being included in pressing forms the step of welding resisting layer.
The manufacturing method of multi-layer circuit board that the technical program provides, makes multiple circuit base plate simultaneously, then forms film by the way of laminating on one or two surface of partial line base board, and form through hole in film and be formed with conductive material.So, as required, stack Copper Foil, be fitted with film and the circuit base plate of conductive material and be not fitted with the circuit base plate of film, thus just can get multilayer circuit board by one step press.Owing to multiple circuit base plates can make simultaneously, such that it is able to shorten the time that wiring board makes.Owing to each circuit base plate individually makes, compared to the mode of successively superposition in prior art, it is possible to increase the yield that wiring board makes.
It is understood that for the person of ordinary skill of the art, can conceive according to the technology of the present invention and make other various corresponding changes and deformation, and all these change all should belong to the protection domain of the claims in the present invention with deformation.

Claims (24)

1. a manufacture method for multilayer circuit board, including step:
Thering is provided N number of copper-clad base plate, wherein, N is the natural number more than or equal to 4, each described in cover cuprio Plate includes insulating barrier and the first copper foil layer fitting in described insulating barrier opposite sides and the second copper foil layer；
First copper foil layer of each described copper-clad base plate is made and forms the first conductive circuit pattern, by each described Second copper foil layer of copper-clad base plate makes and forms the second conductive circuit pattern, and described first conducting wire figure Shape and the second conductive circuit pattern are mutually conducted by least one conductive hole, thus cover described in N number of Copper base makes N number of first line substrate；
In N number of described first line substrate, take N-2M+1 first line substrate, wherein, M for more than or Natural number equal to 2, and N is more than 2M-1, every in N-2M+1 described first line substrate The first conductive circuit pattern surface laminating one first film in individual described first line substrate, described first Film has at least one first through hole, fills the first conduction material at least one first through hole described Material, described first conductive material mutually conducts with the first adjacent conductive circuit pattern, thus will N-2M+1 the second circuit base plate made by N-2M+1 first line substrate；
M-1 first line substrate is taken, at M-1 described First Line in N number of described first line substrate Fit the second film in the first conductive circuit pattern surface in each first line substrate in base board, The second conductive circuit pattern table in each first line substrate in M-1 described first line substrate Face laminating the 3rd film, described second film has at least one second through hole, and described 3rd film has At least one third through-hole, and fill the second conductive material at least one second through hole described, described Second conductive material mutually conducts with the first adjacent conductive circuit pattern, described at least one the 3rd The 3rd conductive material, described 3rd conductive material and the second adjacent conductive circuit pattern phase is filled in through hole Transconductance leads to, thus M-1 described first line substrate is made M-1 tertiary circuit substrate；With And
Remaining M the first line substrate of one step press, described N-2M+1 the second circuit base plate and described M-1 tertiary circuit substrate is to form 2N sandwich circuit board, in described 2N sandwich circuit board, adjacent It is bonded together by the first film, the second film or the 3rd film between insulating barrier, and, two First line substrate is positioned at the outermost both sides of described 2N sandwich circuit board, or a first line substrate and One the second circuit base plate is positioned at the outermost both sides of described 2N sandwich circuit board, or two the second circuit bases Plate is positioned at the outermost both sides of described 2N sandwich circuit board.
2. the manufacture method of multilayer circuit board as claimed in claim 1, it is characterised in that remaining in pressing M first line substrate, described N-2M+1 the second circuit base plate and described M-1 tertiary circuit base Plate, before forming 2N sandwich circuit board, aligns and stacks described remaining M first line substrate, institute State N-2M+1 the second circuit base plate and described M-1 tertiary circuit substrate to form overlapping substrate, institute The forming method stating overlapping substrate includes step:
Using a first line substrate in M first line substrate as the outermost wire of described overlapping substrate Base board；In remaining M-1 first line substrate and M-1 tertiary circuit substrate, by one Individual tertiary circuit substrate and first line substrate stacking form one and only have the of two circuit base plates One stackable unit, thus obtain M-1 the first stackable unit；
N-2M+1 described second circuit base plate stacking is formed second stackable unit；
M-1 described first stackable unit is stacked in as outermost wire with described second stackable unit On the first line substrate of base board, and make the tertiary circuit substrate the most relatively phase in each first stackable unit First line substrate in the first stackable unit answered is near the first line as outermost wire base board Substrate, the first film making each described second circuit base plate in described second stackable unit is more corresponding Second conductive circuit pattern of the second circuit base plate is close to the first line as outermost wire base board Substrate, thus obtain described overlapping substrate.
3. the manufacture method of multilayer circuit board as claimed in claim 2, it is characterised in that by M-1 Described first stackable unit and described second stackable unit are stacked in first as outermost wire base board In step on circuit base plate, described second stackable unit is positioned at adjacent described first stackable unit and institute Between stating as the first line substrate of outermost wire base board, or described second stackable unit is positioned at phase Between two adjacent described first stackable unit, or described second stackable unit is stacked in distance as On the first line substrate of the first stackable unit that the first line substrate of outer-layer circuit substrate is farthest.
4. the manufacture method of multilayer circuit board as claimed in claim 1, it is characterised in that N=3M-2, in pressure Close remaining M first line substrate, described N-2M+1 the second circuit base plate and described M-1 the 3rd Circuit base plate, before forming 2N sandwich circuit board, aligns and stacks described remaining M First Line roadbed Plate, described N-2M+1 the second circuit base plate and described M-1 tertiary circuit substrate are to form overlapping base Plate, the forming method of described overlapping substrate includes step:
Using a first line substrate in M first line substrate as outermost wire base board；
In remaining M-1 first line substrate, M-1 the second circuit base plate, M-1 tertiary circuit substrate, One first line substrate, second circuit base plate and a tertiary circuit substrate stacking are formed one Only have the 3rd stackable unit of three circuit base plates, thus obtain M-1 the 3rd stackable unit；
M-1 described 3rd stackable unit is stacked on the first line substrate of outermost wire base board, And make in the 3rd stackable unit that the tertiary circuit substrate in each 3rd stackable unit is the most corresponding One circuit base plate is near the first line substrate as outermost wire base board, thus obtains described overlapping base Plate.
5. the manufacture method of multilayer circuit board as claimed in claim 4, it is characterised in that at described 3rd heap In folded unit, described tertiary circuit substrate be arranged at adjacent first line substrate and the second circuit base plate it Between, or described first line substrate be arranged at adjacent tertiary circuit substrate and the second circuit base plate it Between, or described second circuit base plate be arranged at adjacent tertiary circuit substrate and first line substrate it Between.
6. the manufacture method of multilayer circuit board as claimed in claim 1, it is characterised in that by N-2M+1 Individual first line substrate is made N-2M+1 the second circuit base plate and is included step:
In each first conductive circuit pattern in N-2M+1 described first line substrate, overlapping is described successively First film and a mould release membrance, each second conduction in N-2M+1 described first line substrate One protecting film of line pattern surface laminating；
First line substrate, the first film, mould release membrance and protecting film described in pre-pressing, make described first film with Described first line substrate bonding together, makes described protecting film be bonded in described second conductive circuit pattern On；
Remove described mould release membrance；
In described first film, at least one first through hole described, part first is formed by laser drilling process Conductive circuit pattern is exposed from least one first through hole described；
In at least one first through hole described, the first conductive material is formed by the way of printing conductive paste；And Remove described protecting film.
7. the manufacture method of multilayer circuit board as claimed in claim 1, it is characterised in that by M-1 the One circuit base plate is made M-1 tertiary circuit substrate and is included step:
Described the is overlapped successively in each first conductive circuit pattern in M-1 described first line substrate Two films and a mould release membrance, each second conducting wire figure in M-1 described first line substrate One the 3rd film of shape surface laminating and another mould release membrance；
Described in pre-pressing, first line substrate, the second film, the 3rd film and two mould release membrances, make described second Film and the 3rd film are bonded in the both sides of described first line substrate；
Remove said two mould release membrance；
In described second film, at least one second through hole described, part first is formed by laser drilling process Conductive circuit pattern is exposed from least one second through hole described, by laser drilling process described Forming at least one third through-hole described in three films, part the second conductive circuit pattern is from described at least one Individual third through-hole exposes；And
By the way of printing conductive paste, at least one second through hole described, form the second conductive material, pass through The mode of printing conductive paste forms the 3rd conductive material at least one third through-hole described.
8. a manufacture method for multilayer circuit board, including step:
Thering is provided N number of copper-clad base plate, wherein, N is the natural number more than or equal to 3, each described in cover cuprio Plate includes insulating barrier and the first copper foil layer fitting in described insulating barrier opposite sides and the second copper foil layer；
First copper foil layer of each described copper-clad base plate is made and forms the first conductive circuit pattern, by each described Second copper foil layer of copper-clad base plate makes and forms the second conductive circuit pattern, and described first conducting wire figure Shape and the second conductive circuit pattern are mutually conducted by least one conductive hole, thus cover described in N number of Copper base makes N number of first line substrate；
Taking N-2M first line substrate in N number of described first line substrate, wherein, M is natural number, And N is more than 2M, in each described first line substrate in N-2M described first line substrate The first conductive circuit pattern surface fit the first film, described first film has at least one and first leads to Hole, fills the first conductive material, described first conductive material and adjacent first in described first through hole Conductive circuit pattern mutually conducts, thus N-2M described first line substrate is made N-2M Second circuit base plate；
M first line substrate is taken, at M described First Line roadbed in N number of described first line substrate Fit the second film in the first conductive circuit pattern surface in each first line substrate in plate, at M The second conductive circuit pattern surface laminating in each first line substrate in described first line substrate 3rd film, described second film has at least one second through hole, has at each described 3rd film At least one third through-hole, and fill the second conductive material at least one second through hole described, described Second conductive material mutually conducts with the first adjacent conductive circuit pattern, described at least one the 3rd The 3rd conductive material, described 3rd conductive material and the second adjacent conductive circuit pattern phase is filled in through hole Transconductance leads to, thus M described first line substrate is made M tertiary circuit substrate；
There is provided the first copper foil, remaining M the first line substrate of one step press, N-2M described second line Base board, M described tertiary circuit substrate and described first copper foil are to form 2N+1 layer line roadbed Plate, in described 2N+1 sandwich circuit substrate, by the first film, the second glue between adjacent insulating barrier Sheet or the 3rd film are bonded together, by the first film between adjacent insulating barrier and the first copper foil Or the second film is bonded together, and described first copper foil is positioned at described 2N+1 sandwich circuit substrate Outer side, a described first line substrate or described second circuit base plate are positioned at described 2N+1 The outermost opposite side of sandwich circuit substrate；And
Described first copper foil is made conductive circuit pattern via selective etch, it is thus achieved that 2N+1 sandwich circuit board.
9. the manufacture method of multilayer circuit board as claimed in claim 8, it is characterised in that remain at one step press M remaining first line substrate, N-2M described second circuit base plate, M described tertiary circuit base Plate and described first copper foil, before forming 2N+1 sandwich circuit substrate, align and stack described residue M first line substrate, N-2M described second circuit base plate, M described tertiary circuit substrate And described first copper foil is to form overlapping substrate, the forming method of described overlapping substrate includes step: In remaining M first line substrate and M tertiary circuit substrate, by a tertiary circuit base Plate and a first line substrate stacking form first stackable unit only having two circuit base plates, from And obtain M the first stackable unit；
N-2M described second circuit base plate stacking is formed second stackable unit；
M described first stackable unit is stacked in described first copper foil with described second stackable unit On, and make in the most corresponding first stackable unit of the tertiary circuit substrate in each first stackable unit First line substrate, near described first copper foil, makes each described second in described second stackable unit Second conductive circuit pattern of more corresponding second circuit base plate of the first film of circuit base plate is close to institute State the first copper foil, thus obtain described overlapping substrate.
10. the manufacture method of a multilayer circuit board as claimed in claim 9, it is characterised in that by M Individual described first stackable unit and described second stackable unit are stacked in the step on described first copper foil In, described second stackable unit be positioned at adjacent described first stackable unit and described first copper foil it Between, or described second stackable unit is between two adjacent described first stackable unit, or institute State the second stackable unit and be stacked in the First Line apart from farthest the first stackable unit of described first copper foil On base board.
The manufacture method of 11. multilayer circuit boards as claimed in claim 8, it is characterised in that N=3M, one Remaining M the first line substrate of secondary pressing, N-2M described second circuit base plate, M the individual described 3rd Circuit base plate and described first copper foil, before forming 2N+1 sandwich circuit substrate, align and stack described Remaining M first line substrate, N-2M described second circuit base plate, M described tertiary circuit base Plate and described first copper foil are to form overlapping substrate, and the forming method of described overlapping substrate includes step Rapid:
In remaining M first line substrate, M the second circuit base plate and M tertiary circuit substrate, One first line substrate, second circuit base plate and a tertiary circuit substrate stacking are formed one Only have the 3rd stackable unit of three circuit base plates, thus obtain M the 3rd stackable unit；
M described 3rd stackable unit is stacked on described first copper foil, and makes each 3rd stackable unit In the most corresponding 3rd stackable unit of tertiary circuit substrate in first line substrate near described One copper foil, thus obtain described overlapping substrate.
The manufacture method of 12. multilayer circuit boards as claimed in claim 11, it is characterised in that the described 3rd In stackable unit, described tertiary circuit substrate is arranged at adjacent first line substrate and the second circuit base plate Between, or described first line substrate be arranged at adjacent tertiary circuit substrate and the second circuit base plate it Between, or described second circuit base plate be arranged at adjacent tertiary circuit substrate and first line substrate it Between.
The manufacture method of 13. multilayer circuit boards as claimed in claim 8, it is characterised in that by N-2M the One circuit base plate is made N-2M the second circuit base plate and is included step:
Described the is overlapped successively in each first conductive circuit pattern in N-2M described first line substrate One film and a mould release membrance, each second conducting wire in N-2M described first line substrate Patterned surface one protecting film of laminating；
First line substrate, the first film, mould release membrance and protecting film described in pre-pressing, make described first film with Described first line substrate bonding together, makes described protecting film be bonded in described second conductive circuit pattern On；
Remove described mould release membrance；
In described first film, at least one first through hole described, part first is formed by laser drilling process Conductive circuit pattern is exposed from least one first through hole described；
In at least one first through hole described, the first conductive material is formed by the way of printing conductive paste；And Remove described protecting film.
The manufacture method of 14. multilayer circuit boards as claimed in claim 8, it is characterised in that by M first Circuit base plate is made M tertiary circuit substrate and is included step:
Described second is overlapped successively in each first conductive circuit pattern in M described first line substrate Film and a mould release membrance, each second conductive circuit pattern in M described first line substrate One the 3rd film of surface laminating and another mould release membrance；
Described in pre-pressing, first line substrate, the second film, the 3rd film and two mould release membrances, make described second Film and the 3rd film are bonded in the both sides of described first line substrate；
Remove said two mould release membrance；
In described second film, at least one second through hole described, part first is formed by laser drilling process Conductive circuit pattern is exposed from least one second through hole described, by laser drilling process described Forming at least one third through-hole described in three films, part the second conductive circuit pattern is from described at least one Individual third through-hole exposes；And
By the way of printing conductive paste, at least one second through hole described, form the second conductive material, pass through The mode of printing conductive paste forms the 3rd conductive material at least one third through-hole described.
The manufacture method of 15. 1 kinds of multilayer circuit boards, including step:
Thering is provided N number of copper-clad base plate, wherein, N is the natural number more than or equal to 3, each described in cover cuprio Plate includes insulating barrier and the first copper foil layer fitting in described insulating barrier opposite sides and the second copper foil layer；
First copper foil layer of each described copper-clad base plate is made and forms the first conductive circuit pattern, by each described Second copper foil layer of copper-clad base plate makes and forms the second conductive circuit pattern, and described first conducting wire figure Shape and the second conductive circuit pattern are mutually conducted by least one conductive hole, thus cover described in N number of Copper base makes N number of first line substrate；
Taking N-2M-1 first line substrate in N number of described first line substrate, wherein, M is natural number, And N is more than 2M+1, each described First Line roadbed in N-2M-1 described first line substrate The first conductive circuit pattern surface laminating one first film in plate, described first film has at least one First through hole, fills the first conductive material, described first conduction material at least one first through hole described Material mutually conducts with corresponding first conductive circuit pattern, thus by N-2M-1 described first line N-2M-1 the second circuit base plate made by substrate；
M+1 first line substrate is taken, at described in M+1 First Line in N number of described first line substrate Fit the second film in the first conductive circuit pattern surface in each first line substrate in base board, The second conductive circuit pattern table in each first line substrate in described M+1 first line substrate Face laminating the 3rd film, described second film has at least one second through hole, and described 3rd film has At least one third through-hole, and fill the second conductive material at least one second through hole described, described Second conductive material mutually conducts with the first adjacent conductive circuit pattern, described at least one the 3rd The 3rd conductive material, described 3rd conductive material and the second adjacent conductive circuit pattern phase is filled in through hole Transconductance leads to, thus M+1 described first line substrate is made M+1 tertiary circuit substrate；
There is provided the first copper foil and the second copper foil, the first copper foil described in one step press, remaining M the One circuit base plate, N-2M-1 described second circuit base plate, a M+1 described tertiary circuit substrate and Described second copper foil is to form 2N+2 sandwich circuit substrate, in described 2N+2 sandwich circuit substrate, institute State the first copper foil and described second copper foil lays respectively at the outermost two of described 2N+2 sandwich circuit substrate It is bonded together by the first film, the second film or the 3rd film between side, and adjacent insulating barrier, All pass through between adjacent insulating barrier and the first copper foil and between adjacent insulating barrier and the second copper foil First film or the second film or the 3rd film are bonded together；And
Described first copper foil and the second copper foil are made conductive circuit pattern via selective etch respectively, with Obtain 2N+2 sandwich circuit board.
The manufacture method of 16. multilayer circuit boards as claimed in claim 15, it is characterised in that at one step press Individual described second circuit base plate of described first copper foil, remaining M first line substrate, N-2M-1, M+1 described tertiary circuit substrate and described second copper foil with formed 2N+2 sandwich circuit substrate it Before, align and stack described first copper foil, remaining M first line substrate, N-2M-1 institute State the second circuit base plate, M+1 described tertiary circuit substrate and described second copper foil to form overlapping Substrate, the forming method of described overlapping substrate includes step:
In remaining M first line substrate and M tertiary circuit substrate, by a tertiary circuit base Plate and a first line substrate stacking form first stackable unit only having two circuit base plates, from And obtain M the first stackable unit；
N-2M-1 described second circuit base plate stacking is formed second stackable unit；
By described to a remaining tertiary circuit substrate, M described first stackable unit and one the second stacking Element stack is between described first copper foil and described second copper foil, and makes described remaining one Three circuit base plates are directly affixed with described second copper foil, make the tertiary circuit in each first stackable unit First line substrate in the most corresponding first stackable unit of substrate, near described first copper foil, makes institute State more corresponding second circuit of the first film of each described second circuit base plate in the second stackable unit Second conductive circuit pattern of substrate is close to described first copper foil, thus obtains described overlapping substrate.
The manufacture method of 17. multilayer circuit boards as claimed in claim 16, it is characterised in that by remaining One tertiary circuit substrate, M described first stackable unit, described second stackable unit are stacked in In step between described first copper foil and described second copper foil, described second stackable unit is positioned at phase Between adjacent described first stackable unit and described first copper foil, or described second stackable unit is positioned at Between two adjacent described first stackable unit, or described second stackable unit is stacked in apart from described On the first line substrate of the first stackable unit that the first copper foil is farthest.
The manufacture method of 18. multilayer circuit boards as claimed in claim 15, it is characterised in that N=3M+1, First copper foil, remaining M first line substrate, N-2M-1 described second line described in one step press Base board, M+1 described tertiary circuit substrate and described second copper foil are to form 2N+2 layer line roadbed Before plate, align and stack described first copper foil, remaining M first line substrate, N-2M-1 Individual described second circuit base plate, M+1 described tertiary circuit substrate and described second copper foil are to be formed Overlapping substrate, the forming method of described overlapping substrate includes step:
In remaining M first line substrate, M the second circuit base plate and M tertiary circuit substrate, will One first line substrate, second circuit base plate and a tertiary circuit substrate stacking only form one There is the 3rd stackable unit of three circuit base plates, thus obtain M the 3rd stackable unit；
A remaining tertiary circuit substrate and M described 3rd stackable unit are stacked in described first bronze medal Between paillon foil and the second copper foil, and make a described remaining tertiary circuit substrate and described second Copper Foil Sheet is directly affixed, and M described 3rd stackable unit is stacked in described first copper foil and described remaining Between individual tertiary circuit substrate, make the tertiary circuit substrate in each 3rd stackable unit the most corresponding First line substrate in three stackable unit is near described first copper foil, thus obtains described overlapping base Plate.
The manufacture method of 19. multilayer circuit boards as claimed in claim 18, it is characterised in that the described 3rd In stackable unit, described tertiary circuit substrate is arranged at adjacent first line substrate and the second circuit base plate Between, or described first line substrate be arranged at adjacent tertiary circuit substrate and the second circuit base plate it Between, or described second circuit base plate be arranged at adjacent tertiary circuit substrate and first line substrate it Between.
The manufacture method of 20. multilayer circuit boards as claimed in claim 15, it is characterised in that by N-2M-1 Individual first line substrate is made N-2M-1 the second circuit base plate and is included step:
In each first conductive circuit pattern in N-2M-1 described first line substrate, overlapping is described successively First film and a mould release membrance, each second conduction in N-2M-1 described first line substrate One protecting film of line pattern surface laminating；
First line substrate, the first film, mould release membrance and protecting film described in pre-pressing, make described first film with Described first line substrate bonding together, makes described protecting film be bonded in described second conductive circuit pattern Upper:
Remove described mould release membrance；
In described first film, at least one first through hole described, part first is formed by laser drilling process Conductive circuit pattern is exposed from least one first through hole described；
In at least one first through hole described, the first conductive material is formed by the way of printing conductive paste；And Remove described protecting film.
The manufacture method of 21. multilayer circuit boards as claimed in claim 15, it is characterised in that by M+1 the One circuit base plate is made M+1 tertiary circuit substrate and is included step:
Described the is overlapped successively in each first conductive circuit pattern in M+1 described first line substrate Two films and a mould release membrance, each second conducting wire in M+1 described first line substrate Patterned surface one the 3rd film of laminating and another mould release membrance；
Described in pre-pressing, first line substrate, the second film, the 3rd film and two mould release membrances, make described second Film and the 3rd film are bonded in the both sides of described first line substrate；
Remove described mould release membrance；
In described second film, at least one second through hole described, part first is formed by laser drilling process Conductive circuit pattern is exposed from least one second through hole described, by laser drilling process described Forming at least one third through-hole described in three films, part the second conductive circuit pattern is from described at least one Individual third through-hole exposes；And
By the way of printing conductive paste, at least one second through hole described, form the second conductive material, pass through The mode of printing conductive paste forms the 3rd conductive material at least one third through-hole described.
The manufacture method of 22. 1 kinds of multilayer circuit boards, including step:
Thering is provided N+1 copper-clad base plate, wherein, N is the natural number more than or equal to 1, each described in cover copper Substrate includes insulating barrier and the first copper foil layer fitting in described insulating barrier opposite sides and the second copper foil layer； First copper foil layer of each described copper-clad base plate is made and forms the first conductive circuit pattern, by each described Second copper foil layer of copper-clad base plate makes and forms the second conductive circuit pattern, and described first conducting wire figure Shape and the second conductive circuit pattern are mutually conducted by least one conductive hole, thus described by N+1 Copper-clad base plate makes N+1 first line substrate；
N number of first line substrate is taken, in N number of described first line in N+1 described first line substrate Fit the first film in the first conductive circuit pattern surface in each described first line substrate in substrate, Described first film has at least one first through hole, fills first at least one first through hole described Conductive material, described first conductive material mutually conducts with the first adjacent conductive circuit pattern, thus N number of described first line substrate is made N number of second circuit base plate；
N number of described second circuit base plate of one step press and a remaining first line substrate are to form 2N+2 layer Wiring board, in described 2N+2 sandwich circuit board, the first film in each described second circuit base plate is relatively Second conductive circuit pattern is closer to described first line substrate, by the first glue between adjacent insulating barrier Sheet is bonded together.
The manufacture method of 23. multilayer circuit boards as claimed in claim 22, it is characterised in that by N number of first Circuit base plate is made N number of second circuit base plate and is included step:
First conductive circuit pattern of each described first line substrate in N number of described first line substrate On overlap described first film and a mould release membrance successively, each in N number of described first line substrate Second one protecting film of conductive circuit pattern surface laminating of described first line substrate；
First line substrate, the first film, mould release membrance and protecting film described in pre-pressing, make described first film with Described first line substrate bonding together, makes described protecting film be bonded in described second conductive circuit pattern On；
Remove described mould release membrance；
In described first film, at least one first through hole described, part first is formed by laser drilling process Conductive circuit pattern is exposed from least one first through hole described；
In at least one first through hole described, the first conductive material is formed by the way of printing conductive paste；And Remove described protecting film.
24. 1 kinds of multilayer circuit boards, it is characterised in that described multilayer circuit board uses such as claim 1 to 23 According to any one of the manufacture method of multilayer circuit board make, described multilayer circuit board includes multilayer insulation Layer, multifilm and multilayer conductive circuit figure, the opposite sides of every layer insulating is each provided with one layer of institute State conductive circuit pattern, and the conductive circuit pattern of every layer insulating both sides is by being arranged in this insulating barrier At least one conductive hole conduct, the opposite sides of every layer of film is each provided with one layer of described conducting wire Figure, and the conductive circuit pattern of the opposite sides of every layer of film is by the conduction material being arranged in this film Material conducts, and the conductive material in this film is formed by printing conductive paste.
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CN105530762B (en) * 2014-09-29 2018-08-07 深南电路有限公司 Resistance welding processing method and circuit board
CN107148171B (en) * 2017-06-27 2019-06-18 北大方正集团有限公司 The compression method of multilayer circuit board
CN108112178A (en) * 2017-12-25 2018-06-01 广州兴森快捷电路科技有限公司 Circuit board fabrication method
CN109922612A (en) * 2019-03-22 2019-06-21 深圳明阳电路科技股份有限公司 A kind of HDI board manufacturing method and HDI plate
CN112566390B (en) * 2019-09-10 2022-04-15 宏启胜精密电子(秦皇岛)有限公司 Multilayer flexible circuit board and preparation method thereof
WO2021081867A1 (en) * 2019-10-31 2021-05-06 鹏鼎控股(深圳)股份有限公司 Thin circuit board and manufacturing method therefor

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