CN103037636A - Multilayer circuit board and manufacture method of multilayer circuit board - Google Patents
Multilayer circuit board and manufacture method of multilayer circuit board Download PDFInfo
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- CN103037636A CN103037636A CN2011102917789A CN201110291778A CN103037636A CN 103037636 A CN103037636 A CN 103037636A CN 2011102917789 A CN2011102917789 A CN 2011102917789A CN 201110291778 A CN201110291778 A CN 201110291778A CN 103037636 A CN103037636 A CN 103037636A
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Abstract
The invention provides a manufacture method of a multilayer circuit board. The manufacture method of the multilayer circuit board comprises the steps of providing multiple circuit boards with electroplating holes, providing multiple bonding sheets with conductive paste plug holes, alternately overlapping the multiple circuit boards and the multiple bonding sheets to form a pre-pressing circuit board with preserved layers, and pressing the pre-pressing circuit board to obtain the multiple circuit board. The invention further provides the multiple circuit board manufactured by means of the manufacture method. By means of the manufacture method of the multilayer circuit board, the manufacture time of the circuit board can be greatly shortened, the yield can be improved, blind holes and buried holes can be conveniently formed, and the manufacture cost of the circuit board can be saved.
Description
Technical field
The present invention relates to the circuit board making technology, relate in particular to the manufacture method of a kind of multilayer circuit board and multilayer circuit board.
Background technology
Along with the development of electronic product toward miniaturization, high speed direction, circuit board is also from single-sided circuit board, double-sided PCB toward the multilayer circuit board future development.Multilayer circuit board refers to have the circuit board of multilayer conductive circuit, it has more wiring area, higher interconnect density, thereby be widely used, referring to document Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992,15 (4): 418-425.
At present, the multilayer circuit board with blind hole or buried via hole adopts Layer increasing method to make usually, that is, the mode that is layering is made.The method that traditional Layer increasing method is made the multilayer circuit board with blind hole or buried via hole comprises: the first step, make an inner plating, this inner plating comprises that one deck insulating material forms at least one first through hole by boring the flow processs such as through hole and plating with at least two outermost conducting wire layers on the described inner plating at least.Second step, at the outermost conducting wire of inner plating layer difference pressing one copper foil layer, wherein said copper foil layer is combined with the outermost conducting wire of described inner plating layer by bonding sheet, the described copper foil layer of etching forms circuit, form a multi-layer sheet, at least one first through hole of this on the described inner plating becomes buried via hole at this moment; The 3rd step formed at least one blind hole with methods such as laser drill at described multiple-plate bonding lamella, electroplated the outermost conducting wire layer conducting that this at least one blind hole makes described copper foil layer and described inner plating; The 4th one at described multi-layer sheet by boring the flow processs such as through hole and plating, form at least one second through hole.So just, obtain a multi-layer sheet with blind buried via hole.If need the multi-layer sheet of more multi-layered number, according to the method in the second to three step, continue the copper foil layer surface pressing Copper Foil at described multilayer laminated boards plate, thereby obtain the more multi-layered multi-layer sheet with blind buried via hole.
Obviously, in above-mentioned multiple-plate manufacturing process with blind buried via hole, whenever once increase layer, all need to carry out the one step press process, when making the wiring board of the more number of plies, the pressing number of times is also corresponding more, be unfavorable for like this simplification of technical process, cost of manufacture is also relatively high.
Summary of the invention
In view of this, be necessary to provide a kind of mode by one step press to make the method for the multilayer circuit board with blind hole or buried via hole, and the resulting multilayer circuit board with blind hole or buried via hole of method thus.
A kind of manufacture method of multilayer circuit board, it may further comprise the steps: a plurality of wiring boards are provided, and each described wiring board all offers at least one through hole, electroplates filling perforation in each described at least one through hole; A plurality of bonding sheets are provided, all offer at least one through hole on each described bonding sheet, in each described at least one through hole, be filled with conductive paste; Described a plurality of wiring boards and described a plurality of bonding sheet be superimposed forms the pre-pressing circuit board of predetermined number of layers, so that be combined with respectively at least one described bonding sheet between adjacent two wiring boards in this pre-pressing circuit board; And pre-pressing circuit board obtained above carried out pressing, obtain multilayer circuit board.
A kind of multilayer circuit board that is made by above-mentioned manufacture method, described multilayer circuit board comprises that a plurality of conducting wires layer reaches and the spaced a plurality of insulating barrier of described a plurality of conducting wires layer, described a plurality of insulating barrier is respectively arranged with at least one through hole, at least one through hole of one of them insulating barrier has the filling perforation of plating thing in two insulating barriers of arbitrary neighborhood, at least one filling through hole of another one insulating barrier has conductive paste, to realize interlayer conduction.
The circuit board of the technical program and the manufacture method of circuit board have following advantage: contain the wiring board of electroplating filling perforation and form multi-layer sheet with the bonding sheet one step press of conductive paste consent a plurality of, can not only conveniently obtain blind hole and buried via hole, the greatly Production Time of reduction circuit plate and required labour improve the productive rate of circuit board.
Description of drawings
Fig. 1 is the cutaway view of the copper-clad base plate that provides of the technical program execution mode.
Fig. 2 is the cutaway view after the copper-clad base plate perforate that provides of the technical program execution mode.
Fig. 3 is the cutaway view after the copper-clad base plate that provides of the technical program execution mode forms circuit.
Fig. 4 is the cutaway view of the first double-sided wiring board that filled conductive cream forms in the copper-clad base plate hole that provides of the technical program execution mode.
Fig. 5 is the cutaway view of the second double-sided wiring board of providing of the technical program execution mode.
Fig. 6 is the cutaway view of the 3rd double-sided wiring board that provides of the technical program execution mode.
Fig. 7 is the cutaway view of the first bonding sheet of providing of the technical program execution mode.
Fig. 8 is the cutaway view of the second bonding sheet of providing of the technical program execution mode.
Fig. 9 is the cutaway view of the pre-pressing circuit board that provides of the technical program execution mode.
Figure 10 is the cutaway view of the 6-layer circuit board that provides of the technical program execution mode.
The main element symbol description
| The first copper- |
10a |
| The first |
101a |
| The |
102a |
| The second |
103a |
| The |
104a |
| The |
105a |
| The |
106a |
| The first conducting |
107a |
| The second conducting |
108a |
| First electroplates the |
109a |
| Second electroplates the |
110a |
| The first double- |
20a |
| The |
102b |
| The |
104b |
| The |
105b |
| The |
106b |
| The 3rd conducting |
107b |
| The 4th conducting |
108b |
| The 3rd electroplates the |
109b |
| The 4th electroplates the |
110b |
| The second double-sided |
20b |
| The |
102c |
| The |
104c |
| The |
105c |
| The |
106c |
| The 5th conducting |
107c |
| The 6th conducting |
108c |
| The 5th electroplates the |
109c |
| The 6th electroplates the |
110c |
| The 3rd double- |
20c |
| The |
30a |
| The |
301a |
| Seven apertures in the |
302a |
| The |
303a |
| The |
30b |
| The |
301b |
| Octal |
302b |
| The |
303b |
| The |
304b |
| The |
305b |
| The pre-pressing multi-layer sheet | 40a |
| Bogey | 41 |
| Support base | 410 |
| Pilot pin | 411 |
| 6- |
40 |
| The first |
401 |
| |
402 |
| Buried via |
403 |
| The second |
404 |
Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Below in conjunction with drawings and Examples, the circuit board that the technical program is provided as an example of the making 6-layer circuit board example and the manufacture method of circuit board are described in further detail.
The manufacture method of described 6-layer circuit board may further comprise the steps:
The first step provides one first copper-clad base plate 10a.
See also Fig. 1, one first copper-clad base plate 10a is provided, described the first copper-clad base plate 10a is the double-sided copper-clad substrate, and it comprises the first insulating barrier 102a and is formed at respectively the first conductive layer 101a and the second conductive layer 103a on relative two surfaces of described the first insulating barrier 102a.Described the first copper-clad base plate 10a can be glass fiber fabric base clad copper base, paper substrate copper-clad base plate, composite base copper-clad base plate, aramid fiber nonwoven fabric base copper-clad base plate or synthetic fibers base copper-clad base plate etc.
Second step is offered one first 104a of hole section, one second 105a of hole section and a plurality of the first location hole 106a at described the first copper-clad base plate 10a.
See also Fig. 2, adopt the method for laser drill or machine drilling to offer one first 104a of hole section, one second 105a of hole section and a plurality of the first location hole 106a at described the first copper-clad base plate 10a.Described the first 104a of hole section and the second 105a of hole section are through hole, and it all connects described the first conductive layer 101a, the first insulating barrier 102a and the second conductive layer 103a.Described the first location hole 106a also connects described the first conductive layer 101a, the first insulating barrier 102a and the second conductive layer 103a, and described the first location hole 106a is used for the pressing process and carries out contraposition.Described the first 104a of hole section and the second 105a of hole section also can offer and be blind hole, and it penetrates described the first conductive layer 101a and the first insulating barrier 102a, do not penetrate described the second conductive layer 103a.Be appreciated that described the first copper-clad base plate 10a also can only offer one first 104a of hole section or the first three or more 104a of hole section is set or the second 105a of hole section.
In the 3rd step, described the first 104a of hole section and described the second 105a of hole section are electroplated filling perforation.
See also Fig. 3, described the first 104a of hole section and described the second 105a of hole section are electroplated filling perforation.The method of electroplating filling perforation can be for carrying out the thin copper of chemical plating one time to described the first 104a of hole section and described the second 105a of hole section first, then electroplate at described the first 104a of hole section and described the second 105a of hole section hole wall and form hole copper, make described the first conductive layer 101a and the second conductive layer 103a by the hole copper conducting of described the first 104a of hole section and described the second 105a of hole section hole wall, again described the first 104a of hole section and described the second 105a of hole section are carried out filling perforation plating at last, make described electro-coppering fill up described the first 104a of hole section and described the second 105a of hole section, copper in described the first 104a of hole section and described the second hole section 105a hole forms first and electroplates filling perforation thing 109a and the second plating filling perforation thing 110a, the effect that filling perforation is electroplated is the area of section that increases described the first 104a of hole section and described the second hole section 105a hole inner wire, makes other conductive layers in described the first conductive layer 101a and the second conductive layer 103a and the subsequent step pass through the better conducting of electro-coppering in the hole.Also can carry out the thin copper of chemical plating one time to described the first 104a of hole section and described the second 105a of hole section first, then directly described the first 104a of hole section and described the second 105a of hole section are carried out the filling perforation plating, make described electro-coppering fill up described the first 104a of hole section and described the second 105a of hole section, the copper in described the first 104a of hole section and described the second hole section 105a hole forms first and electroplates filling perforation thing 109a and the second plating filling perforation thing 110a.
In the 4th step, the first copper-clad base plate 10a after electroplating filling perforation forms circuit, forms one first double-sided wiring board 20a.
See also Fig. 4, in the present embodiment, adopt the image transfer method to form photic etched pattern at described the first conductive layer 101a and the second conductive layer 103a surface; Then, via methods such as chemical liquid etching or laser ablations described the first conductive layer 101a and the second conductive layer 103a are formed respectively the first conducting wire layer 107a and the second conducting wire layer 108a.
In the 5th step, form one second double-sided wiring board 20b.
See also Fig. 5.Method with reference to four steps of the first step to the forms one second double-sided wiring board 20b.Described the second double-sided wiring board 20b comprises the second insulating barrier 102b and is formed at respectively the 3rd conducting wire layer 107b and the 4th conducting wire layer 108b on relative two surfaces of described the second insulating barrier 102b, offer the 3rd 104b of hole section, the 4th 105b of hole section and a plurality of the second location hole 106b on described the second double-sided wiring board 20b, described the 3rd 104b of hole section, the 4th 105b of hole section and a plurality of the second location hole 106b all connect described the 3rd conducting wire layer 107b, the second insulating barrier 102b and the 4th conducting wire layer 108b.Described the 4th 105b of hole section is corresponding with described the second hole section 105a position.All fill up by electroplating filling perforation in described the 3rd 104b of hole section and the 4th 105b of hole section, copper in described the 3rd 104b of hole section and the 4th hole section 105b hole forms the 3rd and electroplates filling perforation thing 109b and the 4th plating filling perforation thing 110b, and the described the 3rd electroplates filling perforation thing 109b and the 4th electroplates filling perforation thing 110b all with described the 3rd conducting wire layer 107b and the 4th conducting wire layer 108b conducting.In addition, described the 3rd 104b of hole section and the 4th 105b of hole section also can offer and be blind hole, and it only penetrates described the 3rd conducting wire layer 107b and the second insulating barrier 102b, do not penetrate described the 4th conducting wire layer 108b.Also can only establish one the 3rd 104b of hole section on described the second double-sided wiring board 20b or three or more the 3rd 104b of hole section are set or the 4th 105b of hole section.
In the 6th step, form one the 3rd double-sided wiring board 20c.
See also Fig. 6.Method with reference to four steps of the first step to the forms one the 3rd double-sided wiring board 20c.Described the 3rd double-sided wiring board 20c comprises the 3rd insulating barrier 102c and is formed at respectively the 5th conducting wire layer 107c and the 6th conducting wire layer 108c on relative two surfaces of described the 3rd insulating barrier 102c, offer the 5th 104c of hole section on described the 3rd double-sided wiring board 20c, the 6th 105c of hole section is to reaching a plurality of the 3rd location hole 106c, described the 5th 104c of hole section connects described the 3rd insulating barrier 102c and the 6th conducting wire layer 108c and does not link to each other with circuit on the 5th conducting wire layer 107c, and described the 6th 105c of hole section and a plurality of the 3rd location hole 106c all connect described the 5th conducting wire layer 107c, the 3rd insulating barrier 102c and the 6th conducting wire layer 108c.Described the 6th 105c of hole section is corresponding with described the second hole section 105a position.All fill up formation the 5th plating filling perforation thing 109c and the 6th plating filling perforation thing 110c by electroplating filling perforation in described the 5th 104c of hole section and the 6th 105c of hole section, the described the 6th electroplates filling perforation thing 110c with described the 5th conducting wire layer 107c and the 6th conducting wire layer 108c conducting.Described a plurality of the 3rd location hole 106c is corresponding with described a plurality of the first location hole 106a positions respectively.Described the 6th 105c of hole section also can offer and be blind hole, it penetrates described the 6th conducting wire layer 108c and the 3rd insulating barrier 102c, do not penetrate described the 5th conducting wire layer 107c, can only establish one the 5th 104c of hole section on described the 3rd double-sided wiring board 20c yet or three or more the 5th 104c of hole section are set or the 6th 105c of hole section.
The 7th step provided one first bonding sheet 30a, at described the first bonding sheet 30a boring and filled conductive cream.
See also Fig. 7.One first bonding sheet 30a is provided, described the first bonding sheet 30a is prepreg, and it can be glass-fiber-fabric prepreg, paper substrate prepreg, composite base prepreg, aramid fiber nonwoven fabrics prepreg, synthetic fibers prepreg or pure resin prepreg etc.The quantity of described the first bonding sheet 30a also can for a plurality of, generally be selected according to the needs of the designs such as multi-layer sheet thickness.
Adopt the method for laser drill or machine drilling to offer a 302a of seven apertures in the human head section and a plurality of the 4th location hole 301a at described the first bonding sheet 30a.The described seven apertures in the human head 302a of section connects described the first bonding sheet 30a.The described seven apertures in the human head 302a of section is corresponding with described the second hole section 105a position.Described the 4th location hole 301a also connects described the first bonding sheet 30a, and described a plurality of the 4th location hole 301a are corresponding with described a plurality of the first location hole 106a positions respectively, is used for the pressing process and carries out contraposition.The quantity of the described seven apertures in the human head 302a of section also can be designed to a plurality of as required.
Adopt the method for screen painting that conductive paste is filled into formation the first consent thing 303a among the described seven apertures in the human head 302a of section: conductive paste is provided, and described conductive paste can be copper cream, silver paste or carbon paste etc., is preferably copper cream; One web plate is provided, and the pattern of described half tone is corresponding with the described seven apertures in the human head 302a of section; Make conductive paste see through pattern fills on the half tone in the described seven apertures in the human head 302a of section, after conductive paste further solidifies, form the first consent thing 303a.
Described conductive paste can be filled in from the end opening of the described seven apertures in the human head 302a of section, also can get both ends open simultaneously or fills in successively from the 302a of seven apertures in the human head section, so that conductive paste can not have the described seven apertures in the human head 302a of section of filling up of space.
Before printing conductive cream; also can form removable diaphragm at the first bonding sheet 30a; described diaphragm leaves a through hole in the position corresponding with the described seven apertures in the human head 302a of section; see through the full plate printing conductive of half tone cream; conductive paste is printed onto on the described diaphragm; and by the through hole on the described diaphragm conductive paste is filled among the 302a of seven apertures in the human head section, then remove described diaphragm.Described diaphragm recommendation peelable glue, the diameter of described through hole recommend the diameter with the described seven apertures in the human head 302a of section identical or be slightly larger than respectively the diameter of the described seven apertures in the human head 302a of section.
The 8th step provided one second bonding sheet 30b, at described the second bonding sheet 30b boring and filled conductive cream.
See also Fig. 8, with reference to the 7th step, in the present embodiment, provide one second bonding sheet 30b, adopt the method for laser drill or machine drilling to offer a 302b of octal section, one the 9th 303b of hole section and a plurality of the 5th location hole 301b at described the second bonding sheet 30b.The described octal 302b of section and the 9th 303b of hole section connect described the second bonding sheet 30b.The described octal 302b of section is corresponding with described the 5th hole section 104c position, and described the 9th 303b of hole section is corresponding with described the second hole section 105a position.Described the 5th location hole 301b also connects described the second bonding sheet 30b, and described a plurality of the 5th location hole 301b are corresponding with described a plurality of the first location hole 106a positions respectively, is used for the pressing process and carries out contraposition.The quantity of described the second bonding sheet 30b also can for a plurality of, generally be selected according to the needs of the designs such as multi-layer sheet thickness.Certainly, described the second bonding sheet 30b also can only arrange the described octal 302b of section, or the three or more octal 302b of section or the 9th 303b of hole section are set.
Adopt the method for screen painting that conductive paste is filled into formation the second consent thing 304b and the 3rd consent thing 305b among the described octal 302b of section and the 9th 303b of hole section.
In the 9th step, superimposed above-mentioned the first to the 3rd double- sided wiring board 20a, 20b, 20c and the first and second bonding sheet 30a, 30b form pre-pressing multi-layer sheet 40a.
See also Fig. 9, above-mentioned wiring board and bonding sheet are carried out superimposed, described lamination process needs a bogey 41, and described bogey 41 comprises a planar support substrate 410 and perpendicular to a plurality of pilot pins 411 of substrate.Concrete lamination process comprises: the surface that described the 3rd double-sided wiring board 20c is arranged on support base 410, and so that described a plurality of the 3rd location hole 106c is sheathed on respectively a plurality of pilot pins 411, described like this 3rd double-sided wiring board 20c can be positioned on the surface of support base 410, and the Surface Contact of described the 3rd double-sided wiring board 20c and support base 410; Then, superimposed the second bonding sheet 30b successively on described the 3rd double-sided wiring board 20c, the second double-sided wiring board 20b, the first bonding sheet 30a and the first double-sided wiring board 20a, make described the 5th location hole 301b, the second location hole 106b, the 4th location hole 301a and the first location hole 106a are sheathed on pilot pin 411 successively, at this moment, described the second 105a of hole section, the 302a of seven apertures in the human head section, the 4th 105b of hole section, the 9th 303b of hole section and the 6th 105c of hole section align at the bearing of trend that is parallel to described pilot pin, described the 5th 104c of hole section is corresponding with the described octal 302b of section, forms pre-pressing multi-layer sheet 40a.
The tenth step, above-mentioned pre-pressing multi-layer sheet 40a is carried out pressing, form 6-layer circuit board 40.
See also Figure 10.Utilize pressing machine that above-mentioned superimposed resulting pre-pressing multi-layer sheet 40a is carried out one step press, thereby obtain 6-layer circuit board 40.
Prefabricating plate 40a resulting 6-layer circuit board 40 after pressing comprises the first to the 6th conducting wire layer 107a of being arranged in order, 108a, 107b, 108b, 107c, 108c and with the first to the 6th conducting wire layer 107a, 108a, 107b, 108b, 107c, the first to the 5th insulating barrier 102a of 108c space, 30a, 102b, 30b, 102c.Described the first conducting wire layer 107a and the second conducting wire layer 108a electroplate filling perforation thing 109a conducting by described first, and described first electroplate filling perforation thing 109a not with other conducting wire layer conducting, described the first 104a of hole section has formed the first blind hole 401.Described second electroplates filling perforation thing 110a, the first consent thing 303a, the 4th plating filling perforation thing 110b, the 3rd consent thing 305b and the 6th plating filling perforation thing 110c with described the first conducting wire layer 107a, the second conducting wire layer 108a, the 3rd conducting wire layer 107b, the 4th conducting wire layer 108b, the 5th conducting wire layer 107c and the 6th conducting wire layer 108c conducting, and described the second 105a of hole section, the 302a of seven apertures in the human head section, the 4th 105b of hole section, the 9th 303b of hole section and the 6th 105c of hole section conducting form a via 402.Described the 3rd conducting wire layer 107b and the 4th conducting wire layer 108b electroplate filling perforation thing 109b conducting by the described the 3rd, and the described the 3rd electroplate filling perforation thing 109b not with other conducting wire layer conducting, described the 3rd 104b of hole section has formed buried via hole 403.Described the 5th 104c of hole section does not link to each other with described the 5th conducting wire layer 107c, described the 5th plating filling perforation thing 109c and the second consent thing 304b are with described the 4th conducting wire layer 108b and the 6th conducting wire layer 108c conducting, and described the 5th 104c of hole section and the 302b of octal section conducting form the second blind hole 404.Be appreciated that, the position of blind hole, buried via hole and through hole in the above-mentioned 6-layer circuit board 40 can arrange according to the needs of concrete 6-layer circuit board 40, the conducting wire layer of described blind hole, buried via hole and the conducting of through hole institute also can arrange as required, realizes each layer interconnection, is not limited to present embodiment.
In the present embodiment, the first bonding sheet 30a and the second bonding sheet 30b all adopt the semi-solid preparation film, in the pressing process, because the semi-solid preparation material has certain flowability, all embed through described the second conducting wire layer 108a of pressing process, the 3rd conducting wire layer 107b, the 4th conducting wire layer 108b and the 5th conducting wire layer 107c in the insulating barrier of the first bonding sheet 30a and the second bonding sheet 30b formation, thereby each layer combined closely.
When making the multilayer circuit board of other number of plies, the quantity that only need increase or reduce above-mentioned double face copper and bonding sheet with reference to the manufacture method of foregoing circuit plate gets final product.In addition, one or more in the double face copper in the above-mentioned manufacturing method of multi-layer circuit board also can replace with multi-layer sheet, form at last the more multilayer circuit board of the number of plies, are not limited to present embodiment.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (10)
1. the manufacture method of a multilayer circuit board, it may further comprise the steps:
A plurality of wiring boards are provided, and each described wiring board all offers at least one through hole, electroplates filling perforation in each described at least one through hole;
A plurality of bonding sheet bonding sheets are provided, all offer at least one through hole on each described bonding sheet, in each described at least one through hole, be filled with conductive paste;
Described a plurality of wiring boards and described a plurality of bonding sheet be superimposed forms the pre-pressing circuit board of predetermined number of layers, so that be combined with respectively at least one described bonding sheet between adjacent two wiring boards in this pre-pressing circuit board; And
Pre-pressing circuit board obtained above is carried out pressing, obtain multilayer circuit board.
2. the manufacture method of multilayer circuit board as claimed in claim 1 is characterized in that, provides the step of a plurality of wiring boards to comprise:
A plurality of copper-clad base plates are provided;
Offer described at least one through hole at each copper-clad base plate;
To carrying out electroless copper in each described at least one through hole;
To electroplating filling perforation in each described at least one through hole behind the electroless copper;
Copper-clad base plate after electroplating filling perforation forms circuit.
3. the manufacture method of multilayer circuit board as claimed in claim 1 is characterized in that, at least one in described a plurality of wiring boards is multilayer circuit board or double-sided wiring board.
4. the manufacture method of multilayer circuit board as claimed in claim 1 is characterized in that, described bonding sheet is prepreg.
5. the manufacture method of multilayer circuit board as claimed in claim 1, it is characterized in that, the fill method of the conductive paste in the described bonding sheet at least one through hole is: a web plate is provided, the position of the through hole on the pattern on the described web plate and the described bonding sheet is corresponding, and conductive paste is filled in the through hole of described bonding sheet by the pattern printing on the described web plate.
6. the manufacture method of multilayer circuit board as claimed in claim 1, it is characterized in that, the fill method of the conductive paste in the described bonding sheet at least one through hole is: form a diaphragm at described bonding sheet, the diaphragm of described bonding sheet is offered corresponding filler opening with the through hole of described bonding sheet; Half tone corresponding to described bonding sheet is provided, conductive paste is filled in the through hole of described bonding sheet by the filler opening on half tone and the described diaphragm successively; Remove described diaphragm.
7. the manufacture method of multilayer circuit board as claimed in claim 1 is characterized in that, described conductive paste is copper cream, silver paste or carbon paste.
8. multilayer circuit board that is made by each described manufacture method of claim 1 to 7, it is characterized in that, described multilayer circuit board comprises that a plurality of conducting wires layer reaches and the spaced a plurality of insulating barrier of described a plurality of conducting wires layer, each insulating barrier all offers at least one through hole, at least one through hole of one of them insulating barrier has the filling perforation of plating thing in two insulating barriers of arbitrary neighborhood, at least one filling through hole of another one insulating barrier has conductive paste, to realize the interlayer conduction of a plurality of conducting wires layer.
9. multilayer circuit board as claimed in claim 9 is characterized in that, described conductive paste is copper cream, silver paste or carbon paste.
10. multilayer circuit board as claimed in claim 9 is characterized in that, all has the filling perforation of plating thing at least one through hole of the insulating barrier of described multilayer circuit board outermost both sides.
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| CN2011102917789A CN103037636A (en) | 2011-09-30 | 2011-09-30 | Multilayer circuit board and manufacture method of multilayer circuit board |
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| CN2011102917789A CN103037636A (en) | 2011-09-30 | 2011-09-30 | Multilayer circuit board and manufacture method of multilayer circuit board |
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| CN104470201A (en) * | 2014-12-23 | 2015-03-25 | 上海斐讯数据通信技术有限公司 | Design method for protection between upper layer and lower layer of blind buried hole circuit board |
| CN105555040A (en) * | 2016-02-03 | 2016-05-04 | 江门崇达电路技术有限公司 | Method for fabricating PCB capable of improving positional accuracy between outer pattern and drilled holes |
| CN105826294A (en) * | 2016-03-31 | 2016-08-03 | 龙南骏亚电子科技有限公司 | Six-layer integrated circuit board and technical method thereof |
| CN106211640A (en) * | 2016-08-12 | 2016-12-07 | 江门崇达电路技术有限公司 | The manufacture method of high density interconnecting board |
| CN107995803A (en) * | 2017-12-28 | 2018-05-04 | 赣州市深联电路有限公司 | A kind of random layer interconnected printed circuit board production method |
| CN109287063A (en) * | 2018-11-24 | 2019-01-29 | 开平依利安达电子第三有限公司 | A kind of double-sided multi-layer pcb board and its technique |
| CN105934084B (en) * | 2016-06-28 | 2019-06-07 | 电子科技大学 | A kind of printed circuit board and its full addition production method |
| CN111542178A (en) * | 2020-05-13 | 2020-08-14 | 上海泽丰半导体科技有限公司 | Manufacturing process of multilayer circuit board and multilayer circuit board |
| CN112449514A (en) * | 2019-08-31 | 2021-03-05 | 鹏鼎控股(深圳)股份有限公司 | Multilayer circuit board and manufacturing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1396797A (en) * | 2001-07-10 | 2003-02-12 | 株式会社藤仓 | Multilayer terminal plate assembly, multilayer terminal plate assembly unit and its manufacturing method |
| US20040194303A1 (en) * | 2003-04-02 | 2004-10-07 | Samsung Electro-Mechanics Co., Ltd. | Method of fabricating multi-layered printed circuit board |
| US20050085065A1 (en) * | 2003-10-20 | 2005-04-21 | Samsung Electro-Mechanics Co., Ltd. | Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same |
| CN101069459A (en) * | 2005-11-07 | 2007-11-07 | 松下电器产业株式会社 | Multilayer printed wiring board and process for producing the same |
-
2011
- 2011-09-30 CN CN2011102917789A patent/CN103037636A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1396797A (en) * | 2001-07-10 | 2003-02-12 | 株式会社藤仓 | Multilayer terminal plate assembly, multilayer terminal plate assembly unit and its manufacturing method |
| US20040194303A1 (en) * | 2003-04-02 | 2004-10-07 | Samsung Electro-Mechanics Co., Ltd. | Method of fabricating multi-layered printed circuit board |
| US20050085065A1 (en) * | 2003-10-20 | 2005-04-21 | Samsung Electro-Mechanics Co., Ltd. | Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same |
| CN101069459A (en) * | 2005-11-07 | 2007-11-07 | 松下电器产业株式会社 | Multilayer printed wiring board and process for producing the same |
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| CN104349610B (en) * | 2013-07-24 | 2018-03-27 | 北大方正集团有限公司 | The manufacture method and printed circuit board of printed circuit board daughter board and printed circuit board |
| CN104470201A (en) * | 2014-12-23 | 2015-03-25 | 上海斐讯数据通信技术有限公司 | Design method for protection between upper layer and lower layer of blind buried hole circuit board |
| CN105555040B (en) * | 2016-02-03 | 2019-02-12 | 江门崇达电路技术有限公司 | A kind of production method for the PCB that outer graphics and bore position precision can be improved |
| CN105555040A (en) * | 2016-02-03 | 2016-05-04 | 江门崇达电路技术有限公司 | Method for fabricating PCB capable of improving positional accuracy between outer pattern and drilled holes |
| CN105826294A (en) * | 2016-03-31 | 2016-08-03 | 龙南骏亚电子科技有限公司 | Six-layer integrated circuit board and technical method thereof |
| CN105934084B (en) * | 2016-06-28 | 2019-06-07 | 电子科技大学 | A kind of printed circuit board and its full addition production method |
| CN106211640A (en) * | 2016-08-12 | 2016-12-07 | 江门崇达电路技术有限公司 | The manufacture method of high density interconnecting board |
| CN107995803A (en) * | 2017-12-28 | 2018-05-04 | 赣州市深联电路有限公司 | A kind of random layer interconnected printed circuit board production method |
| CN109287063A (en) * | 2018-11-24 | 2019-01-29 | 开平依利安达电子第三有限公司 | A kind of double-sided multi-layer pcb board and its technique |
| CN112449514A (en) * | 2019-08-31 | 2021-03-05 | 鹏鼎控股(深圳)股份有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN111542178A (en) * | 2020-05-13 | 2020-08-14 | 上海泽丰半导体科技有限公司 | Manufacturing process of multilayer circuit board and multilayer circuit board |
| CN111542178B (en) * | 2020-05-13 | 2021-07-16 | 上海泽丰半导体科技有限公司 | Manufacturing process of multilayer circuit board and multilayer circuit board |
| CN117896918A (en) * | 2024-03-13 | 2024-04-16 | 江门市和美精艺电子有限公司 | Manufacturing method of four-layer HDI packaging substrate |
| CN117896918B (en) * | 2024-03-13 | 2024-06-11 | 江门市和美精艺电子有限公司 | Manufacturing method of four-layer HDI packaging substrate |
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Application publication date: 20130410 |