CN106211640A - The manufacture method of high density interconnecting board - Google Patents
The manufacture method of high density interconnecting board Download PDFInfo
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- CN106211640A CN106211640A CN201610663014.0A CN201610663014A CN106211640A CN 106211640 A CN106211640 A CN 106211640A CN 201610663014 A CN201610663014 A CN 201610663014A CN 106211640 A CN106211640 A CN 106211640A
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- copper foil
- layer
- high density
- copper
- layer sheet
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to the manufacturing technology field of printed circuit board, particularly relating to high density interconnecting board and preparation method thereof, the manufacture method of high density interconnecting board comprises the following steps: front operation, processes polylith respectively and has the flaggy of inner line figure, by all flaggy one step presses, form multi-layer sheet；Back drill blind hole, uses the mode of back drill to get out the back drill hole of setting on multilayer boards；Heavy copper plating, carries out imposite and sinks copper, and electroplate one layer of copper on the hole wall in back drill hole multi-layer sheet；Filling holes with resin, with resin by full for the filling of back drill hole, then baking multi-layer sheet makes resin solidify, and then polishing multi-layer sheet makes described multiple-plate surfacing；Rear operation, continues processing multi-layer sheet until forming satisfactory high density interconnecting board.The method of the present invention is it can be avoided that repeatedly electroplate and subtract copper process, it is ensured that copper thickness homogeneity question, and reduces number of times and the nog plate number of times of plating, promotes the quality of the high density interconnecting board produced.
Description
Technical field
The present invention relates to the manufacturing technology field of printed circuit board, particularly relate to the manufacture method of high density interconnecting board.
Background technology
Existing high density interconnecting board, many employing random layer interconnection, as it is shown in figure 1, first make L5-during manufacturing
L6 layer blind hole, then make L4-L5 layer blind hole, make each layer blind hole successively, and some blind hole needs to carry out lamination blind hole, makes stream
Journey is tediously long；Meanwhile, during filling holes with resin, need abrasive belt grinding, after abrasive belt grinding, affect the harmomegathus of high density interconnecting board, therefore in pressure
The aligning accuracy of superposition blind hole can be affected because folded hole makes during conjunction, cause scrapping of high density interconnecting board.It addition, outer layer
(L6 layer) needs repeatedly to electroplate, because electroplating evenness problem causes outer layer during making blind hole and inner layer resin consent
(L6 layer) circuit manufacturing process etches the problems such as clean or line is little, causes high density interconnecting board to scrap equally.
Concrete, the Making programme of existing high density interconnecting board is as follows:
L5-L6 layer: sawing sheet → boring → heavy copper → electric plating of whole board (disposable plating enough holes copper) → filling holes with resin → abrasive band mill
Plate → heavy copper → plating block → inner figure → internal layer etching → internal layer AOI → brown → rear operation；
L4-L6 layer: pressing → laser drill (L4-L5 layer blind hole) → heavy copper → imposite filling perforation plating is (by full for L4-L5 layer blind
Hole is filled and led up) → subtract copper (controlling L4 and L6 layer copper thick) → inner figure → internal layer etching → internal layer AOI → brown → rear operation；
L3-L6 layer: pressing → brill filling holes with resin → heavy copper → electric plating of whole board (disposable plating enough holes copper) → filling holes with resin →
Abrasive belt grinding → inner figure → → internal layer etching internal layer AOI → brown → rear operation；
L2-L6 layer: pressing → laser drill (L2-3 layer blind hole) → heavy copper → imposite filling perforation plating is (by full for L2-L3 layer blind
Hole is filled and led up) → subtract copper (controlling L2 and L6 layer copper thick) → inner figure → internal layer etching → internal layer AOI → brown → rear operation；
L1-L6 layer: pressing → laser drill (L1-L2 layer blind hole) → heavy copper → imposite filling perforation plating is (by full for L1-L2 layer blind
Hole is filled and led up) → subtract copper (control L1 and L6 layer copper thick) → outer layer and hole → sink copper → plate electricity → outer graphics → internal layer etching → scheme
Shape plating → outer layer etching → rear operation.
At least there is following defect in the Making programme of existing high density interconnecting board:
One, this high density interconnecting board needs to carry out four pressings in manufacturing process, and Making programme is tediously long；
Two, outer layer (L6 layer) is through repeatedly electroplating and subtracting copper, because of electroplating evenness problem, and causes outer layer (L6 layer) circuit
Manufacturing process etches the quality problem such as clean or line is little；
Three, through repeatedly abrasive belt grinding in Making programme, impact produces plate harmomegathus, thus affects the para-position in bonding processes
Precision and laser drilling fold the borehole accuracy in hole, thus cause boring the quality problem such as inclined hole and figure off normal.
Summary of the invention
It is an object of the invention to provide the manufacture method of a kind of high density interconnecting board, it is intended to solve in prior art, system
Make the technical problem of the flow process easy existing defects of product quality that is tediously long and that produce of high density interconnecting board.
For achieving the above object, the technical scheme is that the manufacture method of a kind of high density interconnecting board, including following
Step:
S1: front operation, processes polylith respectively and has the flaggy of inner line figure, by all flaggy one step presses, shape
Become multi-layer sheet；
S2: back drill blind hole, uses the mode of back drill to get out the back drill hole of setting on described multi-layer sheet；
S3: heavy copper plating, carries out imposite and sinks copper, and electroplate one layer on the hole wall in described back drill hole described multi-layer sheet
Copper；
S4: filling holes with resin, with resin by full for the filling of described back drill hole, then toasts described multi-layer sheet and makes described resin solid
Changing, described multi-layer sheet of then polishing makes described multiple-plate surfacing；
S5: rear operation, continues to process described multi-layer sheet until forming satisfactory high density interconnecting board.
Further, described multi-layer sheet include the first Copper Foil of the most sequentially pressing, the first prepreg, relative two
Surface is respectively provided with the second Copper Foil and the first central layer of the 3rd Copper Foil, the second prepreg, relative two surfaces have the 4th Copper Foil
The second central layer, the 3rd prepreg and the 6th Copper Foil with the 5th Copper Foil.
Further, in described step S1, specifically include:
S1.1: sawing sheet, cuts described first Copper Foil, described first prepreg, described first central layer, described the second half solid
Change sheet, described second central layer, described 3rd prepreg and described 6th Copper Foil so that the size of each flaggy conforms to
Ask；
S1.2: inner figure, at described second Copper Foil, described 3rd Copper Foil, described 4th Copper Foil and described 5th bronze medal
Inner line figure is processed on paper tinsel；
S1.3: internal layer AOI, use the inner line figure that AOI device scan record appears, and by the logic with setting
The datagraphic data that judgment principle or client provide compares, to check defect point and the defective locations of figure；
S1.4: brown, carries out brown oxidation processes to described first central layer and described second central layer, at described second bronze medal
The surface of paper tinsel, described 3rd Copper Foil, described 4th Copper Foil and described 5th Copper Foil forms oxide layer；
S1.5: pressing, by described first Copper Foil, described first prepreg, described first central layer, described second semi-solid preparation
Sheet, described second central layer, described 3rd prepreg and described 6th Copper Foil sequentially lamination pressing.
Further, in described step S5, specifically include:
S5.1: outer layer is holed, holes drilled through on described multi-layer sheet；
S5.2: sink copper plate electric, carries out imposite and sinks copper described multi-layer sheet, and described multi-layer sheet carries out imposite electroplates one layer
Copper；
S5.3: outer graphics, processes outer-layer circuit figure on described first Copper Foil and described second Copper Foil；
S5.4: graphic plating, electroplates described outer-layer circuit figure；
S5.5: outer layer etches, and is etched processing to the described outer graphics completing plating.
Further, in described step S2, the quantity in described back drill hole at least one, each described back drill hole is in described
One Copper Foil is through to destination layer or each described back drill hole is through to destination layer in described 6th Copper Foil, and described destination layer is described
Second Copper Foil, the 3rd Copper Foil, the 4th Copper Foil or the 5th Copper Foil.
Further, in described step S2, the aspect ratio ＜ 1:1 in described back drill hole.
Further, in described step S4, toast described multi-layer sheet particularly as follows: described multi-layer sheet to be carried out successively following baking
Roasting step:
S4.1: precuring for the first time, is placed in described multi-layer sheet at 60～70 DEG C and carries out the baking of precuring for the first time；
S4.2: precuring for the second time, is placed at 70～80 DEG C by the described multi-layer sheet completing described first time precuring
Row second time precuring baking；
S4.3: solidification for the first time, is placed in the described multi-layer sheet completing described second time precuring at 80～90 DEG C and carries out
Solidification baking for the first time；
S4.4: second time solidification, is placed in the described multi-layer sheet completing the solidification of described first time at 120～130 DEG C and carries out
Second time solidification baking.
Further, in described step S4.1, the baking time of described first time precuring is 10～20min；
In described step S4.2, the baking time of described second time precuring is 20～30min；
In described step S4.3, the baking time of solidification of described first time is 30～40min；
In described step S4.4, the baking time of described second time solidification is 40～50min.
Beneficial effects of the present invention: the manufacture method of the high density interconnecting board of the present invention, forms internal layer circuit figure by polylith
The direct one step press of flaggy of shape, one block of multi-layer sheet of molding, successively pressing design compared to existing technology, decrease production work
Sequence, optimizes production procedure；And use the mode of back drill, the position that multi-layer sheet sets is got out back drill hole, back drill process
In control each back drill degree of depth and back drill aperture according to the actual requirements, to meet throwing power such that it is able to avoid in prior art
Successively laser drilling need repeatedly electroplate and subtract copper process, it is ensured that copper thickness homogeneity question, and then avoid because circuit system
The quality problem such as occur during work that etching is clean or line is little；It addition, the copper thickness of the hole wall in plating back drill hole can pass through
Heavy copper and plating, to meet the requirement of client, then use filling holes with resin that back drill stopple is full, it is not necessary to the back drill to plating
The resin position copper facing block in hole, reduces number of times and the nog plate number of times of plating, such that it is able to avoid multi-layer sheet harmomegathus, it is to avoid multilamellar
Plate occurs that the aligning accuracy in bonding processes and laser drilling fold the borehole accuracy in hole, it is to avoid multi-layer sheet occurs boring inclined hole and figure is inclined
The quality problem such as position, promote the quality of the high density interconnecting board produced.
The present invention another solution is that high density interconnecting board, according to the manufacture method of above-mentioned high density interconnecting board
Make and obtain.
The high density interconnecting board of the present invention, it is possible to ensure copper thickness homogeneity question, and then avoid because of circuit manufacturing process
Middle occur that etching is clean or the quality problem such as line is little；Furthermore it is possible to avoid multi-layer sheet harmomegathus, it is to avoid pressing occurs in multi-layer sheet
Aligning accuracy in journey and laser drilling fold the borehole accuracy in hole, it is to avoid multi-layer sheet occurs that boring the quality such as inclined hole and figure off normal asks
Topic, promotes the quality of high density interconnecting board.
Accompanying drawing explanation
Fig. 1 is the structural representation of the high density interconnecting board of the manufacture method production of the high density interconnecting board of prior art.
The structure of the high density interconnecting board that the manufacture method of the high density interconnecting board that Fig. 2 provides for the embodiment of the present invention produces
Schematic diagram.
The manufacture method flow chart of the high density interconnecting board that Fig. 3 provides for the embodiment of the present invention.
The flow chart of the front operation of the manufacture method of the high density interconnecting board that Fig. 4 provides for the embodiment of the present invention.
The flow chart of the rear operation of the manufacture method of the high density interconnecting board that Fig. 5 provides for the embodiment of the present invention.
The flow process of the baking multi-layer sheet operation of the manufacture method of the high density interconnecting board that Fig. 6 provides for the embodiment of the present invention
Figure.
Reference includes:
11 first Copper Foil 12 second Copper Foil 13 the 3rd Copper Foils
14 the 4th Copper Foil 15 the 5th Copper Foil 16 the 6th Copper Foils
20 first central layer 30 second central layer 40 first prepregs
50 second prepreg 60 the 3rd prepregs.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, the most from start to finish
Same or similar label represents same or similar element or has the element of same or like function.Below with reference to attached
The embodiment that Fig. 2～6 describes is exemplary, it is intended to is used for explaining the present invention, and is not considered as limiting the invention.
As shown in figures 2-3, the manufacture method of a kind of high density interconnecting board that the embodiment of the present invention provides, including following step
Rapid:
S1: front operation, processes polylith respectively and has the flaggy of inner line figure, by all flaggy one step presses, shape
Become multi-layer sheet；
S2: back drill blind hole, uses the mode of back drill to get out the back drill hole of setting on described multi-layer sheet；
S3: heavy copper plating, carries out imposite and sinks copper, and electroplate one layer on the hole wall in described back drill hole described multi-layer sheet
Copper；
S4: filling holes with resin, with resin by full for the filling of described back drill hole, then toasts described multi-layer sheet and makes described resin solid
Changing, described multi-layer sheet of then polishing makes described multiple-plate surfacing；
S5: rear operation, continues to process described multi-layer sheet until forming satisfactory high density interconnecting board.
Concrete, the manufacture method of the high density interconnecting board of the embodiment of the present invention, polylith is formed inner line figure
The direct one step press of flaggy, one block of multi-layer sheet of molding, successively pressing design compared to existing technology, decrease production process, excellent
Change production procedure；And use the mode of back drill, the position that multi-layer sheet sets is got out back drill hole, basis during back drill
Actual demand controls each back drill degree of depth and back drill aperture, to meet throwing power such that it is able to avoid of the prior art successively
Laser drilling needs repeatedly electroplate and subtract copper process, it is ensured that copper thickness homogeneity question, and then avoids because of circuit manufacturing process
Middle occur that etching is clean or the quality problem such as line is little；It addition, the copper thickness of the hole wall in plating back drill hole can by heavy copper and
Electroplate to meet the requirement of client, then use filling holes with resin that back drill stopple is full, it is not necessary to the tree in the back drill hole to plating
The copper facing block of fat position, reduces number of times and the nog plate number of times of plating, such that it is able to avoid multi-layer sheet harmomegathus, it is to avoid multi-layer sheet occurs
Aligning accuracy in bonding processes and laser drilling fold the borehole accuracy in hole, it is to avoid multi-layer sheet occurs boring the product such as inclined hole and figure off normal
Geological Problems, promotes the quality of the high density interconnecting board produced.
It addition, use the structure design of one step press, can directly select the copper on the central layer of suitable thickness and central layer
Suitable thickness also selected by paper tinsel, so there is no need to the later stage and carries out copper facing and thicken, still can will be thicker by the way of back drill
Copper Foil drill, do not have laser drilling and bore and do not wear the situation of thick Copper Foil and occur.
In the present embodiment, further, described multi-layer sheet include the first Copper Foil 11 of the most sequentially pressing, the first half
Cured sheets 40, relative two surfaces be respectively provided with the second Copper Foil 12 and first central layer the 20, second prepreg 50 of the 3rd Copper Foil 13,
Relative two surfaces have the second central layer the 30, the 3rd prepreg 60 and the 6th Copper Foil of the 4th Copper Foil 14 and the 5th Copper Foil 15
16.Concrete, the multi-layer sheet in the present embodiment uses two pieces of central layers and two blocks of outer Copper Foils to constitute, between the most adjacent Copper Foil
Connected by prepreg pressing, so disposable pressing can form multi-layer sheet.
Need it is further noted that in the present embodiment and non-limiting multi-layer sheet only includes the first Copper Foil 11, the first half solid
Change sheet 40, relative two surfaces are respectively provided with the second Copper Foil 12 and first central layer the 20, second prepreg 50 of the 3rd Copper Foil 13, phase
Two surfaces are had the second central layer the 30, the 3rd prepreg 60 and the 6th Copper Foil 16 groups of the 4th Copper Foil 14 and the 5th Copper Foil 15
Becoming, it can also increase central layer and Copper Foil and be arranged at pressing between central layer with Copper Foil by prepreg and be connected, according to
Need to make the multi-layer sheet of the corresponding Copper Foil number of plies.
As shown in Figure 4, in the present embodiment, further, in described step S1, specifically include:
S1.1: sawing sheet, cut described first Copper Foil 11, described first prepreg 40, described first central layer 20, described
Two prepregs 50, described second central layer 30, described 3rd prepreg 60 and described 6th Copper Foil 16 so that each flaggy
Be of the required size；The demand of the high density interconnecting board produced as required, first sets the size of high density interconnecting board, so
Afterwards according to the size of this setting cut first Copper Foil the 11, first prepreg the 40, first central layer the 20, second prepreg 50,
Second central layer the 30, the 3rd prepreg 60 and the 6th Copper Foil 16；
S1.2: inner figure, at described second Copper Foil 12, described 3rd Copper Foil 13, described 4th Copper Foil 14 and described
Inner line figure is processed on 5th Copper Foil 15；According to the demand of client, at the second Copper Foil the 12, the 3rd Copper Foil the 13, the 4th bronze medal
On the surface of paper tinsel 14 and the 5th Copper Foil 15 by patch dry film, expose, the operation sequence such as development forms inner line figure；
S1.3: internal layer AOI, use the inner line figure that AOI device scan record appears, and by the logic with setting
The datagraphic data that judgment principle or client provide compares, to check defect point and the defective locations of figure；Warp
Cross and inner line figure is checked, cause product rejection to guarantee inner line figure to avoid the occurrence of graphic defects；
S1.4: brown, carries out brown oxidation processes, described second to described first central layer 20 and described second central layer 30
The surface of Copper Foil 12, described 3rd Copper Foil 13, described 4th Copper Foil 14 and described 5th Copper Foil 15 forms oxide layer；To first
Central layer 20 and the second central layer 30 carry out brown oxidation processes, form oxidation protection on the surface of the first central layer 20 and the second central layer 30
Layer；
S1.5: pressing, by described first Copper Foil 11, described first prepreg 40, described first central layer 20, described second
Prepreg 50, described second central layer 30, described 3rd prepreg 60 and described 6th Copper Foil 16 sequentially lamination pressing；?
After, by complete preamble work described first Copper Foil 11, described first prepreg 40, described first central layer 20, described second
Prepreg 50, described second central layer 30, described 3rd prepreg 60 and described 6th Copper Foil 16 carry out pressing, and formation is many
Laminate.
As it is shown in figure 5, in the present embodiment, further, in described step S5, specifically include:
S5.1: outer layer is holed, holes drilled through on described multi-layer sheet；The through hole being drilled with on multi-layer sheet, the effect of this through hole is
By follow-up manufacturing procedure, the first Copper Foil 11 can be electrically connected with the 6th Copper Foil 16；
S5.2: sink copper plate electric, carries out imposite and sinks copper described multi-layer sheet, and described multi-layer sheet carries out imposite electroplates one layer
Copper；Sink copper by imposite, one layer of thin copper can be formed on the inner walls of the via, carry out imposite on multiple-plate surface and electroplate one layer
Copper, in order to multi-layer sheet is carried out the making of outer-layer circuit figure；
S5.3: outer graphics, processes outer-layer circuit figure on described first Copper Foil 11 and described second Copper Foil 12；
On multiple-plate surface by patch dry film, expose, the working procedure processing of development etc. goes out outer-layer circuit figure；
S5.4: graphic plating, electroplates described outer-layer circuit figure；Through outer-layer circuit figure is electroplated,
May insure that outer-layer circuit figure has enough copper thick, with the demand of satisfied conduction；
S5.5: outer layer etches, and is etched processing to the described outer graphics completing plating；Through the erosion to outer-layer circuit
Carve, form the line pattern finally met.
In the present embodiment, further, in described step S2, the quantity in described back drill hole at least one, each described back of the body
Hole and be through to destination layer or each described back drill hole is through to destination layer in described 6th Copper Foil 16 in described first Copper Foil 11,
Described destination layer is described second Copper Foil the 12, the 3rd Copper Foil the 13, the 4th Copper Foil 14 or the 5th Copper Foil 15.Concrete, as required,
Can arrange multiple back drill hole, back drill hole can be to be through to the second Copper Foil 12 from the first Copper Foil 11, or from the first Copper Foil 11
It is through to the 3rd Copper Foil 13, or is through to the 4th Copper Foil 14 from the first Copper Foil 11, or be through to the 5th from the first Copper Foil 11
Copper Foil 15；Back drill hole can be to be through to the 5th Copper Foil 15 from the 6th Copper Foil 16, or is through to the 4th bronze medal from the 6th Copper Foil 16
Paper tinsel 14, or it is through to the 3rd Copper Foil 13 from the 6th Copper Foil 16, or it is through to the second Copper Foil 12 etc. from the 6th Copper Foil 16.
In the present embodiment, further, in described step S2, the aspect ratio ＜ 1:1 in described back drill hole.Indulging back drill hole
Horizontal back drill hole can be completed plating than may insure that less than 1:1 of setting, so can be internally formed same layer in back drill hole
Turn on each need connection Copper Foil, reasonable in design, practical.Concrete, the aspect ratio in back drill hole can be 0.5:1
Or 0.6:1 or 0.7:1 or 0.8:1 or 0.9:1.
As shown in Figure 6, in the present embodiment, further, in described step S4, toast described multi-layer sheet particularly as follows: by institute
State multi-layer sheet and carry out following baking procedure successively:
S4.1: precuring for the first time, is placed in described multi-layer sheet at 60～70 DEG C and carries out the baking of precuring for the first time；The most right
The resin of the filling in back drill hole carries out the baking of precuring for the first time, so can promote the viscosity to resin；Concrete, first
The temperature of secondary precuring baking can be 60 DEG C, 65 DEG C or 70 DEG C；
S4.2: precuring for the second time, is placed at 70～80 DEG C by the described multi-layer sheet completing described first time precuring
Row second time precuring baking；Then the resin to the filling in back drill hole carries out second time precuring baking, so can add
The viscosity of strong resin；Concrete, the temperature of the baking of precuring for the second time can be 70 DEG C, 75 DEG C or 80 DEG C；
S4.3: solidification for the first time, is placed in the described multi-layer sheet completing described second time precuring at 80～90 DEG C and carries out
Solidification baking for the first time；Then the resin to the filling in back drill hole carries out solidifying baking for the first time, gradually makes resin solidify；
Concrete, the temperature of solidification baking for the first time can be 80 DEG C, 85 DEG C or 90 DEG C；
S4.4: second time solidification, is placed in the described multi-layer sheet completing the solidification of described first time at 120～130 DEG C and carries out
Second time solidification baking；Baking is solidified so that resin solidifies finally by the resin of the filling in back drill hole being carried out second time；
Concrete, the temperature of second time solidification baking can be 120 DEG C, 125 DEG C or 130 DEG C.
In the present embodiment, further, in described step S4.1, the baking time of described first time precuring be 10～
20min；Concrete, the baking time of precuring for the first time can be 10min, 15min or 20min；
In described step S4.2, the baking time of described second time precuring is 20～30min；Concrete, for the second time
The baking time of precuring can be 20min, 25min or 30min；
In described step S4.3, the baking time of solidification of described first time is 30～40min；Concrete, first is pre-solid
The baking time changed can be 30min, 35min or 40min；
In described step S4.4, the baking time of described second time solidification is 40～50min；Concrete, second time is solid
The baking time changed can be 40min, 45min or 50min.
Toasting for the first time precuring baking of 10～20min and second precuring of 20～30min through early stage, can
To guarantee effectively to promote the viscosity of resin；Carry out the most again the later stage 30～40min first time solidification baking and 40～50min
Second time solidification baking such that it is able to guaranteeing that resin solidifies sealing in back drill hole, life-time service does not comes off.
As in figure 2 it is shown, the embodiment of the present invention also provides for a kind of high density interconnecting board, this high density interconnecting board is by according to above-mentioned
High density interconnecting board manufacture method make and obtain.Concrete, the manufacture method through above-mentioned high density interconnecting board makes
Obtained by high density interconnecting board, it is possible to ensure copper thickness homogeneity question, and then avoid because circuit manufacturing process in occur etching
The quality problem such as unclean or line is little；Furthermore it is possible to avoid multi-layer sheet harmomegathus, it is to avoid the para-position in bonding processes occurs in multi-layer sheet
Precision and laser drilling fold the borehole accuracy in hole, it is to avoid multi-layer sheet occurs boring the quality problem such as inclined hole and figure off normal, promotes highly dense
The quality of degree interconnection plate.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all think ofs in the present invention
Want with principle within any amendment, equivalent or the improvement etc. made, should be included within the scope of the present invention.
Claims (9)
1. the manufacture method of a high density interconnecting board, it is characterised in that comprise the following steps:
S1: front operation, processes polylith respectively and has the flaggy of inner line figure, and by all flaggy one step presses, formation is many
Laminate；
S2: back drill blind hole, uses the mode of back drill to get out the back drill hole of setting on described multi-layer sheet；
S3: heavy copper plating, carries out imposite and sinks copper, and electroplate one layer of copper on the hole wall in described back drill hole described multi-layer sheet；
S4: filling holes with resin, with resin by full for the filling of described back drill hole, then toasts described multi-layer sheet and described resin is solidified,
Then described multi-layer sheet of polishing makes described multiple-plate surfacing；
S5: rear operation, continues to process described multi-layer sheet until forming satisfactory high density interconnecting board.
The manufacture method of high density interconnecting board the most according to claim 1, it is characterised in that described multi-layer sheet includes from upper
Under to, the first Copper Foil of sequentially pressing, the first prepreg, relative two surfaces are respectively provided with the of the second Copper Foil and the 3rd Copper Foil
One central layer, the second prepreg, relative two surfaces have the 4th Copper Foil and the second central layer of the 5th Copper Foil, the 3rd prepreg with
And the 6th Copper Foil.
The manufacture method of high density interconnecting board the most according to claim 2, it is characterised in that in described step S1, specifically
Including:
S1.1: sawing sheet, cuts described first Copper Foil, described first prepreg, described first central layer, described second semi-solid preparation
Sheet, described second central layer, described 3rd prepreg and described 6th Copper Foil so that being of the required size of each flaggy；
S1.2: inner figure, on described second Copper Foil, described 3rd Copper Foil, described 4th Copper Foil and described 5th Copper Foil
Process inner line figure；
S1.3: internal layer AOI, use the inner line figure that AOI device scan record appears, and by the logical judgment with setting
The datagraphic data that principle or client provide compares, to check defect point and the defective locations of figure；
S1.4: brown, carries out brown oxidation processes to described first central layer and described second central layer, in described second Copper Foil, institute
The surface stating the 3rd Copper Foil, described 4th Copper Foil and described 5th Copper Foil forms oxide layer；
S1.5: pressing, by described first Copper Foil, described first prepreg, described first central layer, described second prepreg,
Described second central layer, described 3rd prepreg and described 6th Copper Foil sequentially lamination pressing.
The manufacture method of high density interconnecting board the most according to claim 2, it is characterised in that in described step S5, specifically
Including:
S5.1: outer layer is holed, holes drilled through on described multi-layer sheet；
S5.2: sink copper plate electric, carries out imposite and sinks copper described multi-layer sheet, and described multi-layer sheet carries out imposite one layer of copper of plating；
S5.3: outer graphics, processes outer-layer circuit figure on described first Copper Foil and described second Copper Foil；
S5.4: graphic plating, electroplates described outer-layer circuit figure；
S5.5: outer layer etches, and is etched processing to the described outer graphics completing plating.
The manufacture method of high density interconnecting board the most according to claim 2, it is characterised in that in described step S2, described
The quantity in back drill hole at least one, each described back drill hole is through to destination layer or each described back drill hole in described first Copper Foil
Being through to destination layer in described 6th Copper Foil, described destination layer is described second Copper Foil, the 3rd Copper Foil, the 4th Copper Foil or the 5th bronze medal
Paper tinsel.
6. according to the manufacture method of the high density interconnecting board described in any one of Claims 1 to 5, it is characterised in that described step
In S2, the aspect ratio ＜ 1:1 in described back drill hole.
7. according to the manufacture method of the high density interconnecting board described in any one of Claims 1 to 5, it is characterised in that described step
In S4, toast described multi-layer sheet particularly as follows: described multi-layer sheet to be carried out successively following baking procedure:
S4.1: precuring for the first time, is placed in described multi-layer sheet at 60～70 DEG C and carries out the baking of precuring for the first time；
S4.2: precuring for the second time, is placed in the described multi-layer sheet completing described first time precuring at 70～80 DEG C and carries out
Secondary precuring is toasted；
S4.3: solidification for the first time, is placed in the described multi-layer sheet completing described second time precuring at 80～90 DEG C and carries out first
Secondary solidification baking；
S4.4: second time solidification, is placed in the described multi-layer sheet completing the solidification of described first time at 120～130 DEG C and carries out second
Secondary solidification baking.
The manufacture method of high density interconnecting board the most according to claim 7, it is characterised in that
In described step S4.1, the baking time of described first time precuring is 10～20min；
In described step S4.2, the baking time of described second time precuring is 20～30min；
In described step S4.3, the baking time of solidification of described first time is 30～40min；
In described step S4.4, the baking time of described second time solidification is 40～50min.
9. high density interconnecting board, it is characterised in that according to the making of the high density interconnecting board described in any one of claim 1～9
Method makes and obtains.
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| CN201610663014.0A CN106211640A (en) | 2016-08-12 | 2016-08-12 | The manufacture method of high density interconnecting board |
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