CN106793577A - The preparation method and PCB of a kind of High-Speed PCB - Google Patents
The preparation method and PCB of a kind of High-Speed PCB Download PDFInfo
- Publication number
- CN106793577A CN106793577A CN201710028825.8A CN201710028825A CN106793577A CN 106793577 A CN106793577 A CN 106793577A CN 201710028825 A CN201710028825 A CN 201710028825A CN 106793577 A CN106793577 A CN 106793577A
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Abstract
The present invention provides the preparation method and PCB of a kind of High-Speed PCB, comprises the following steps, 1) normal inner figure is laminated after making；2) copper to 6 μm 8 μm is subtracted after being laminated；3) to the overall+4.5mil erosions copper windowing in profound and subtle hole and single order blind hole area；4) laser drill completes profound and subtle hole, the processing of single order blind hole, 4) first time power auger needs the through hole of filling holes with resin；6) metallization in the first secondary aperture；7) first time through hole back drill；8) vacuum taphole；9) dry film cap bore, will be to profound and subtle hole, single order blind hole and the unilateral+5mil lids dry film of first time through hole；10) chemistry subtracts copper+ceramics nog plate and subtracts copper to 20 μm 25 μm；11) through hole of power auger second；12) metallization and POFV blocks in the second secondary aperture；13) back drill processing is carried out to the second through hole, processes connecting-type functional hole；14) outer graphics transfer and etching fine-line figure；15) welding resistance and surface treatment are completed.The present invention can realize the making of complexity High-Speed PCB high, and fabrication cycle is short, low cost.
Description
Technical field
The present invention relates to the preparation method of circuit board, more particularly to a kind of High-Speed PCB preparation method and PCB.
Background technology
With high density integrated circuit technology and the high speed development of microelectric technique, making the volume of electronic product becomes more
Gently, thinner, smaller, function highly dense, performance is more and more stronger.It is at present the high speed for reaching product, highly dense requirement, PCB design
By process combinings such as profound and subtle hole, blind hole, back drill, POFV (Plating Over Filled Via, need consent), intensive lines one
Rise, this to profound and subtle hole machined, the logical blind hole plating process capability of high thickness to diameter ratio, high thickness to diameter ratio is logical, blind hole, back drill hole, filling holes with resin
Control, circuit precision controlling ability, surface treatment compatibility etc. are proposed great challenge, existing conventional equipment and technique side
Method is difficult to the making of this High-Speed PCB, it is necessary in critical workflow using more advanced device resource (laser drill, pulse electricity
Plating, vacuum resin plug machine) and the new process of exploitation realize the making of High-Speed PCB.Prior art be difficult at a high speed
The making of PCB, quality is difficult to ensure that, and fabrication cycle is long, and cost is relatively high.
The content of the invention
In view of the above, the present invention is necessary to provide that a kind of fabrication cycle is short, low cost preparation method, High-Speed PCB
Preparation method and by PCB obtained in the preparation method.
A kind of preparation method of High-Speed PCB, comprises the following steps：
1) some core plates are laminated after inner figure making respectively, form a multi-layer sheet；
2) multiple-plate face layers of copper is subtracted into copper；
3) need the region for processing profound and subtle hole and blind hole to open a window in the face layers of copper after copper to subtracting；
4) split window shape into fenestra carry out laser drill, be obtained profound and subtle hole, ladder blind hole；
5) first time machine drilling is carried out to the multi-layer sheet after laser drill, being obtained some follow-up needs the of filling holes with resin
One through hole；
6) multi-layer sheet is carried out being metallized in the first secondary aperture, copper is covered in first through hole, while multiple-plate face layers of copper layers of copper
Thicken；
7) back drill) is carried out to the multiple-plate some first through hole after being metallized in the first secondary aperture, to process functional form
Back drill hole；
8) by vacuum taphole mode to profound and subtle hole, ladder blind hole, functional form back drill hole and first through hole carry out resin
Consent is filled；
9) copper is subtracted using dry film cap bore, chemistry and ceramic nog plate mode is subtracted copper again to multiple-plate face layers of copper；
10) second machine drilling is carried out to subtracting the multi-layer sheet after copper, to get out the second through hole of connecting-type function；
11) metallization and the hole of filling holes with resin in the second secondary aperture are carried out to multi-layer sheet has carried out block copper facing；
12) back drill processing is carried out to some second through holes, processes the via of signal transmission；
13) outer graphics transfer and etching fine-line figure are carried out to multi-layer sheet.
Further, step 1) in, the core plate has substrate layer and is formed in the bottom layers of copper of substrate layer bottom surface, and core plate exists
Before pressing, signal transmission line, screen layer and vacancy section are formed in the bottom layers of copper of some core plates, vacancy section is for laser or machine
Tool is drilled through.
Further, step 2) in subtract copper thickness to 6 μm -8 μm.
Further, step 3) in, during opening, the diameter dimension 4.5mil wider than blind hole diameter size of fenestra.
Further, step 4) in, after profound and subtle hole is for the substrate layer of core plate on laser ablation, and by substrate layer bottom surface
The vacancy section of bottom layers of copper, to the bottom layers of copper of lower section core plate at formed.
Further, step 8) in, vertical vacuum taphole machine is by low-expansion thermosetting resin to profound and subtle hole, blind
Hole, back drill hole and through hole carry out consent, and consent is needed from CS, SS two sides plug, one side of the first time consent more than the back drill hole count
First fill in, then fill in one side in addition in turn；Consent depression may not exceed 75 μm after plug socket resin solidification, will subsequently carry out POFV blocks
Copper facing, as pad.
Further, step 9) in, the default thickness of plate face is polished by abrasive belt grinding first, plate face cull is gone
Except clean.
Further, step 9) in, the size of dry film capping exceeds orifice edge 5mil.
Further, step 9) in, dry film capping subtracts copper behind hole by chemistry, and face copper copper thickness is reduced into 20 μm -25 μm.
Further, step 9) in, after chemistry subtracts copper, then the prominent copper at dry film cap bore is subtracted by abrasive belt grinding
Copper is polished.
The preparation method of the High-Speed PCB provided compared to prior art, the present invention, by taking one step press mode and depth
Micropore, replaces traditional gradually lamination, and the making of profound and subtle hole and single order blind hole is completed using blind hole erosion copper mode laser,
The hole of the POFV for needing filling holes with resin is got out again, after completing once to electroplate, by telltale hole (diameter by way of back drill
Back drill, the unnecessary residual copper of removal influence signal transmission 0.25mm) are carried out, then resin will be stoppered in hole using vacuum taphole machine, made
Plate face is polished with abrasive belt grinding machine, then carry out subtracting copper after port lid is lived using dry film, polished by abrasive belt grinding machine again after subtracting copper
Plate face, then by second drilling (crimping hole), second plating completes metallization and POFV block copper facing, outer graphics in hole
Transfer and the new manufacturing process of etching fine-line complete the making of High-Speed PCB, fabrication cycle is short, low cost.
Brief description of the drawings
Described above is only the general introduction of technical solution of the present invention, in order to illustrate more clearly of technical scheme, under
Face will be briefly described to the accompanying drawing to be used needed for embodiment or description of the prior art, and the accompanying drawing in description is only right
Should in specific embodiment of the invention, to those skilled in the art, on the premise of not paying creative work,
Other accompanying drawings can also be obtained when needing according to these accompanying drawings.
Fig. 1 is the schematic flow sheet of the preparation method of High-Speed PCB of the present invention；
Fig. 2 is the structural representation of the force fit plate formed after core plate after inner figure of the present invention makes is laminated；
Fig. 3 is that force fit plate subtracts copper and to the structural representation after blind hole area erosion copper windowing on surface；
Fig. 4 is that fenestra of the force fit plate after windowing carries out the structure after laser drill completes profound and subtle hole, the processing of single order blind hole
Schematic diagram；
Fig. 5 is the structural representation after force fit plate of the force fit plate after profound and subtle hole, the processing of single order blind hole completes machine drilling；
Fig. 6 is that force fit plate carries out the structural representation after metallization in first time hole after machine drilling；
Fig. 7 is that force fit plate is removed unnecessary hole copper and incited somebody to action by vacuum taphole after metallization in the first secondary aperture by back drill
Profound and subtle hole and VIA holes carry out the structural representation after consent；
Fig. 8 carries out subtracting the structural representation after copper to select dry film after force fit plate consent；
Fig. 9 is structural representation of the force fit plate after aperture bump is removed using ceramic nog plate after subtracting copper；
Figure 10 is structural representation of the force fit plate after second drilling is carried out after removing aperture bump；
Figure 11 is the structural representation that carries out second secondary aperture in metallization after of the force fit plate after secondary drilling；
Figure 12 is to carry out outer graphics transfer and etched figure, welding resistance and surface after force fit plate metallizes in the second secondary aperture
Structural representation after treatment.
Specific embodiment
In order to elaborate the technical scheme that the present invention is taken to reach predetermined technique purpose, below in conjunction with this hair
Accompanying drawing in bright embodiment, is clearly and completely described, it is clear that described to the technical scheme in the embodiment of the present invention
Embodiment is only section Example of the invention, rather than whole embodiments, also, before creative work is not paid
Put, the technological means or technical characteristic in embodiments of the invention can be replaced, below with reference to the accompanying drawings and in conjunction with the embodiments
To describe the present invention in detail.
Fig. 1 is referred to, a kind of preparation method of High-Speed PCB realizes the making of High-Speed PCB using brand-new process route.
Specific make step is as follows：
1) some core plates are laminated after inner figure making respectively, form a multi-layer sheet；Refer to Fig. 2, multi-layer sheet
10 press formation by some core plates 11, and face layers of copper 111, the thickness of face layers of copper 111 are formed with the upper and lower surface of multi-layer sheet 10
Standard configuration is 17 μm of -34 μm of Copper Foils, because mobility is poor during high speed sheet material pressing plate easily being wrinkled using 17 μm of Copper Foils, to improve this
The problem embodiment of the present invention carries out pressing plate using 34 μm of Copper Foils.Each core plate 11 has substrate layer 113 and is formed in substrate layer 113
The bottom layers of copper 115 of bottom surface, is connected between core plate 11 by prepreg 12 two-by-two, and prepreg 12 is connected to the base material of core plate 11
Between 113 top surface of layer and the bottom layers of copper 115 of the bottom surface of another core plate 11, the centre position of multi-layer sheet 10 that face layers of copper 111 is relatively laminated
The thickness of bottom layers of copper 115 is thick, and face layers of copper 111 can be carried out copper facing and formed on the surface of multi-layer sheet 10 after laminating.Further, core
Plate 11 is formed with vacancy section 1151 before pressing in the bottom layers of copper 115 of some core plates 11, there is not copper vacancy section 1151 and is available for swashing
Light is passed through.
2) multiple-plate face layers of copper is subtracted into copper；Face copper layer thickness is reduced to 6 μm -8 μm, by subtracting copper, so as in subsequent openings
After interior metallization, the face layers of copper after copper will be subtracted and thickeied, so that the thickness of face layers of copper can maintain appropriate copper thickness, so as to follow-up outer
Layer fine-line etching makes, because copper thinner, the better control of circuit etching precision of thickness, otherwise exists without subtracting the face layers of copper after copper
In subsequent openings after metallization, face copper layer thickness further thickeies, and is unfavorable for circuit etching precision controlling.Subtract the mode useization of copper
Subtract copper, i.e., reacted with copper by the liquid medicine that sulfuric acid is combined with hydrogen peroxide, and copper purpose is subtracted so as to reach.
3) need the region for processing profound and subtle hole and blind hole to open a window in the face layers of copper after copper to subtracting.Fig. 3 is referred to, many
Some fenestras 21 are opened up after being etched in the face layers of copper 111 of the top layer of laminate 10, the present embodiment is illustrated as at two.Opening 21
When, the purpose that face copper opens a window, than blind hole integral diameter size 4.5mil wide or so, is to reduce laser by the diameter dimension of fenestra 21
The difficulty of ablation Copper Foil, because of metal copper face, in laser ablation, copper face is reflective, and absorption heat is relatively low, therefore laser is difficult to ablation, leads to
The production efficiency that machinery windowing improves profound and subtle hole and blind hole is crossed, the purpose of overall+4.5mil windowings is to reduce blind hole windowing and swash
The contraposition deviation influence of light ablation.
4) split window shape into fenestra carry out laser drill, be obtained profound and subtle hole, single order blind hole.Fig. 4 is referred to, to fenestra 21
Laser machined, prepared profound and subtle hole 22, single order blind hole 23, wherein, profound and subtle hole 22 is the first core plate 11 of laser ablation top
After substrate layer 113, and by the vacancy section 1151 of the bottom surface bottom layers of copper of 11 substrate layer of the first core plate 113, by under vacancy section 1151
The ablation of substrate layer 113 of the prepreg 12 and the second core plate 11 connected with prepreg 12 of side, to the second core plate 11
At bottom layers of copper 115, profound and subtle hole 22 is thusly-formed；It is appreciated that the need for profound and subtle hole 22 can be according to depth be bored, in profound and subtle hole ablation
Vacancy section 1151 is formed on direction in the bottom layers of copper 115 of corresponding core plate, then can meet the depth requirements in profound and subtle hole；In ladder
Profound and subtle hole 22 can make as needed, the first less deep hole of ablation diameter, then concentric progressively ablation diameter gradually increase and
Gradually become shallower as some sections of hole depth, in this way, can ablation stepped profound and subtle hole is obtained.Single order blind hole (the non-shape of blind hole in the present embodiment
Into some sections, the diameter everywhere of hole section is identical), it is that laser is directly ablated at the bottom layers of copper 115 of top layer core plate through fenestra 21
Formed.
5) first time machine drilling is carried out to the multi-layer sheet after laser drill, being obtained some follow-up needs the of filling holes with resin
One through hole (POFV).Fig. 5 is referred to, machine drilling is carried out to multi-layer sheet 10, obtain some first through hole 24.Machine drilling is
By Digit Control Machine Tool, drilled at pre-designed place using drill, it is therefore an objective to so that leading to after machine drilling between each sandwich circuit
Turned on after metallization in via.
6) multi-layer sheet is carried out being metallized in the first secondary aperture, to be covered with the first metal layer in first through hole, while multilayer
Plate subtracts the face layers of copper after copper and thickeies.Fig. 6 is referred to, metalized is carried out to multi-layer sheet, metallization mode can select plating, such as
This, in the profound and subtle hole 22 of multi-layer sheet 10, the first metal layer 31, the first metal is formed with single order blind hole 23 and first through hole 24
Layer 31 can be not quite similar in the thickness of each hole attachment, and profound and subtle hole 22, single order blind hole 23 is relatively thin, and adheres to thicker in face layers of copper 111.
In first secondary aperture after metallization, multi-layer sheet thickeies through the face layers of copper 111 after over-subtraction thickness, and the thickness for reaching does not interfere with follow-up
The making of outer layer fine-line.Outer layer copper is thicker, and chemistry erosion amount of copper is bigger, and side etching quantity is also bigger, the benefit of such circuit
Repay bigger, fine-line is just difficult to make, so reducing the making that face copper meets fine-line with less etch quantity.
7) the multiple-plate some first through hole after metallization in the first secondary aperture are carried out with back drill, it is many in removal first through hole
Remaining hole copper, and machine functional form back drill hole 32.Fig. 7 is referred to, in order to reduce in transmission line in signal transmission line
Middle Stubs (unnecessary coating line length) to high-speed signal transmission produce injury, make distorted signals (i.e. and formed one section filtering
Or concussion section), via back drill is accordingly carried out on multi-layer sheet.Drilled such as at the corresponding through hole 24 of top surface of multi-layer sheet 10, bored
The diameter in hole is big compared with through hole, and drill default depth, then metal level 31 is reserved between each core plate of the bottom of multi-layer sheet 10 turns on；
It is also possible to the predetermined depth that drilled at the corresponding through hole 24 in multiple-plate bottom surface, then in each core plate at the top of multi-layer sheet 10
Between reserve metal level 31 turn on；Or drilled default depth in the through hole 24 of the top surface of multi-layer sheet 10, and accordingly in multilayer
The bottom surface of plate 10 drills default depth in same through hole 24 to top surface, and drills do not connect twice, then accordingly in non-connectivity part
Metal level 31 is reserved between corresponding each core plate positioned at multiple-plate middle part to turn on.
8) by vacuum taphole mode to some profound and subtle holes, single order blind hole, functional form back of the body drilling hole and first through hole are entered
Row filling holes with resin is filled.Resin is clamp-oned by low-expansion thermosetting resin by pipeline using vertical vacuum taphole machine is taken out
Complete to be vacuum formed in the profound and subtle hole of negative pressure, blind hole, back drill hole and through hole, consent is needed from CS, SS two sides plug, first time consent
One side more than back drill hole count is first filled in, then fills in one side in addition in turn；Consent depression may not exceed 75 μm after plug socket resin solidification,
POFV block copper facing will be subsequently carried out, as pad.
9) subtract the ceramic nog plate mode of copper combination using dry film cap bore chemical etching to subtract multiple-plate face layers of copper again
Copper.After being metallized in the first secondary aperture, face copper layer thickness reaches 50 μm or so, copper is subtracted again face layers of copper is reduced into 20 μ by 50 μm
m-25μm.Due to multi-layer sheet, to have opened up profound and subtle hole, single order blind hole, functional form back drill hole and first through hole etc. various types of
Hole, copper can not be directly subtracted when copper is subtracted by the way of nog plate, in order to avoid damage aperture coated copper (wrap).Fig. 8 is referred to, first
It is by abrasive belt grinding flat surface grinding layers of copper plate face to default thickness, the removal of plate face cull is clean, then select dry film 50
Aperture is covered, the size of the capping of dry film 50 exceeds orifice edge substantially 5mil or so, then by the face copper of multi-layer sheet 10
Layer is etched and subtracts copper, if lid dry film does not carry out whole plate directly and subtracts copper, the coated copper in aperture can be stung eating away, so existed by liquid medicine
During finished product welding component, it is easily broken off causing open circuit under the high temperature conditions.Stop after being etched to preset thickness, then by dry film
50 remove, and so the periphery in aperture is formed with projection, are then abraded the bump in aperture using ceramic nog plate, after etching
Face layers of copper flush (referring to Fig. 9).If directly using abrasive belt grinding, one is that abrasive belt grinding whole plate removal amount of copper is less,
Each nog plate removes 2 μm or so, and to reach removal amount of copper needs mill more than 10 times, not only inefficiency, high cost, and easily by plate
Mill deformation；Etching subtracts copper to be chemically reacted with copper with hydrogen peroxide by sulfuric acid, and the purpose of copper is subtracted so as to reach, and is subtracted amount of copper and is led to
Multi-layer sheet is crossed to stop the reaction time (i.e. the limp speed of equipment) in equipment to control.
10) second machine drilling is carried out to subtracting the multi-layer sheet after copper, to get out the second through hole of connecting-type function；Please join
Figure 10 is read, after copper is subtracted again, multi-layer sheet 10 carries out second machine drilling, get out the second through hole of connecting-type function, such as used
In crimping hole 34 with the grafting such as electric elements.Second through hole of connecting-type function is extremely strict to aperture tolerance, tolerance
Generally within ± 50 μm, if being got out in first time, needed in vacuum resin consent using selective consent,
Consent process is cumbersome, and when first time whole plate is electroplated that the thick plating of copper in hole is enough, then carries out finished product when POFV is electroplated for second
Crimping hole hole tolerance be difficult to control to, therefore the second through hole of connecting-type function in first time, machine drilling does not get out.
11) metallization and POFV holes (i.e. the hole of filling holes with resin) in the second secondary aperture are carried out to multi-layer sheet carries out block plating
Copper, accordingly the second through-hole inner surface in multiple-plate plate face and connecting-type function enclose second metal layer, and to needing
The second through hole for filling in resin carries out block.Refer to Figure 11, multi-layer sheet 10 is carried out second drilling endoporus metalized and
The upper cap copper facing of POFV holes, after second drilling endoporus metalized, plate face and functional form back drill hole 32 in multi-layer sheet 10
Inner surface is formed with second metal layer 41, by the upper cap copper facing of POFV holes, so that subsequent diagram is etched in filling holes with resin
Solder joint is done on hole.Specifically, its hole tolerance within ± 2mil, and plates >=6 μm on the resin of filling holes with resin after copper facing
Copper is thick, to be connected as pad herein.
12) back drill processing is carried out to some second through holes, processes the via of signal transmission.
13) outer graphics transfer and etched figure are carried out to multi-layer sheet.Figure 12 is referred to, completing second in multi-layer sheet bores
Behind hole and the interior metallization of the second secondary aperture and back drill, one layer of photosensitive material sheet is sticked in plate face, then by laser scanning or figure
The shape film is exposed, and the line transitions of design are peeled off unwanted photosensitive material sheet to plate face, then by liquid medicine,
Expose copper face, then unwanted face copper is reacted by removal by etching solution, be left line pattern.
14) welding resistance and surface treatment are completed, is all that copper face is exposed in atmosphere as circuit after the completion of figure, if
Circuit is exposed for a long time in atmosphere, and copper is oxidized easily corrosion, therefore coats layer protective layer photosensitive-ink in circuit surface, this guarantor
Sheath another effect be exactly prevent weld because the pad and solder joint of many welding components of plate face are can not to be covered by ink
Lid, it is necessary to it is exposed outside, for prevent copper face aoxidize and easily welding, a surface treatment is done at pad and solder joint, first plate
One layer of nickel, then plate last layer gold.
To sum up, by above-mentioned process, profound and subtle blind hole, single order blind hole can on multilayer boards be processed and is set increasing wiring
Meter density, and deep micro-aperture technique can regard the design of " 0 " STUB as, the transmission to two-forty signal realizes minimum damage
Consumption；Functional form back drill hole removal edge PTH hole is not used in signal transmission, a useless sector hole copper, to reduce Stub length, so as to subtract
Few loss of signal, supports signal transmission integrality；Carry out filling holes with resin (including profound and subtle hole, single order blind hole, through hole, single two-sided small
Hole back drill hole etc.) copper facing is carried out as solder joint on consent surface, outer layer wiring space is reduced, improve the Technology designs such as wiring density
Make to reach High-Speed PCB making requirement.
The above, is only presently preferred embodiments of the present invention, and any formal limitation is not made to the present invention, though
So the present invention is disclosed above with preferred embodiment, but is not limited to the present invention, any to be familiar with this professional technology people
Member, without departing from the scope of the present invention, when making a little change or modification using the technology contents of the disclosure above
Be the Equivalent embodiments of equivalent variations, as long as be without departing from technical solution of the present invention content, according to technical spirit of the invention,
Within the spirit and principles in the present invention, any simple modification, equivalent and improvement for being made to above example etc., still
Belong within the protection domain of technical solution of the present invention.
Claims (10)
1. a kind of preparation method of High-Speed PCB, comprises the following steps：
1) some core plates are laminated after inner figure making respectively, form a multi-layer sheet；
2) multiple-plate face layers of copper is subtracted into copper；
3) need the region for processing profound and subtle hole and blind hole to open a window in the face layers of copper after copper to subtracting；
4) split window shape into fenestra carry out laser drill, be obtained profound and subtle hole, ladder blind hole；
5) first time machine drilling is carried out to the multi-layer sheet after laser drill, being obtained some follow-up needs the first of filling holes with resin to lead to
Hole；
6) multi-layer sheet is carried out being metallized in the first secondary aperture, copper is covered in first through hole, while multiple-plate face layers of copper layers of copper thickeies；
7) back drill) is carried out to the multiple-plate some first through hole after being metallized in the first secondary aperture, to process functional form back drill
Hole；
8) by vacuum taphole mode to profound and subtle hole, ladder blind hole, functional form back drill hole and first through hole carry out filling holes with resin
Filling；
9) copper is subtracted using dry film cap bore, chemistry and ceramic nog plate mode is subtracted copper again to multiple-plate face layers of copper；
10) second machine drilling is carried out to subtracting the multi-layer sheet after copper, to get out the second through hole of connecting-type function；
11) metallization and the hole of filling holes with resin in the second secondary aperture are carried out to multi-layer sheet has carried out block copper facing；
12) back drill processing is carried out to some second through holes, processes the via of signal transmission；
13) outer graphics transfer and etching fine-line figure are carried out to multi-layer sheet.
2. the preparation method of High-Speed PCB according to claim 1, it is characterised in that：The core plate has substrate layer and shape
Into the bottom layers of copper in substrate layer bottom surface, core plate is formed with signal transmission line, shielding before pressing in the bottom layers of copper of some core plates
Layer and vacancy section, vacancy section passes through for laser or machine drilling.
3. the preparation method of High-Speed PCB according to claim 1, it is characterised in that：Step 2) in subtract copper thickness to 6 μm -8
μm。
4. the preparation method of High-Speed PCB according to claim 1, it is characterised in that：Step 4) in, during opening, fenestra
Diameter dimension 4.5mil wider than blind hole diameter size.
5. the preparation method of High-Speed PCB according to claim 2, it is characterised in that：Step 4) in, profound and subtle hole is burnt for laser
In erosion after the substrate layer of core plate, and by the vacancy section of substrate layer bottom surface bottom layers of copper, to the bottom layers of copper of lower section core plate at formed.
6. the preparation method of High-Speed PCB according to claim 1, it is characterised in that：Step 9) in, ground by abrasive band first
Plate polishes plate face default thickness, and the removal of plate face cull is clean.
7. the preparation method of High-Speed PCB according to claim 6, it is characterised in that：Step 9) in, the size of dry film capping
Beyond orifice edge 5mil, then copper is subtracted by chemistry face copper is reduced to 20 μm -25 μm, it is by sulfuric acid and dioxygen that etching subtracts copper
Water chemically reacts with copper, is again polished the copper in cap bore area by abrasive belt grinding after subtracting copper.
8. the preparation method of High-Speed PCB according to claim 1, it is characterised in that：Step 10) in, the second through hole includes
Play and crimp hole with high speed connector is attached, crimping hole hole tolerance is within ± 50 μm.
9. the preparation method of High-Speed PCB according to claim 1, it is characterised in that：Step 11) in, the second through hole is carried out
Hole tolerance after copper facing plates >=6 μm of copper thickness within ± 2mil on the resin of filling holes with resin, so as to conduct herein
Pad is connected.
10. a kind of circuit board, it is characterised in that：The preparation method of the High-Speed PCB as described in any one of claim 1 to 9 is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710028825.8A CN106793577B (en) | 2017-01-16 | 2017-01-16 | A kind of production method and PCB of High-Speed PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710028825.8A CN106793577B (en) | 2017-01-16 | 2017-01-16 | A kind of production method and PCB of High-Speed PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106793577A true CN106793577A (en) | 2017-05-31 |
| CN106793577B CN106793577B (en) | 2019-07-05 |
Family
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| CN107484361A (en) * | 2017-09-25 | 2017-12-15 | 生益电子股份有限公司 | The preparation method and High-Speed PCB of a kind of High-Speed PCB |
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| CN109104829A (en) * | 2018-08-31 | 2018-12-28 | 生益电子股份有限公司 | A kind of profound and subtle hole production method and PCB |
| CN109121305A (en) * | 2018-09-29 | 2019-01-01 | 生益电子股份有限公司 | A kind of PCB back drill control method and PCB |
| CN109302808A (en) * | 2018-09-10 | 2019-02-01 | 武汉铱科赛科技有限公司 | A method of making fine-line |
| TWI661758B (en) * | 2018-05-30 | 2019-06-01 | Tripod Technology Corporation | Circuit board structure and manufacturing method thereof |
| CN110190389A (en) * | 2019-06-03 | 2019-08-30 | 深圳市景旺电子股份有限公司 | A kind of antenna plate and preparation method thereof |
| CN110493964A (en) * | 2019-09-11 | 2019-11-22 | 深圳市景旺电子股份有限公司 | A kind of production method in the non-metallic hole without etching ring |
| CN110933856A (en) * | 2019-12-30 | 2020-03-27 | 东莞市五株电子科技有限公司 | High-frequency blind hole plate manufacturing process and high-frequency blind hole plate |
| WO2020114454A1 (en) * | 2018-12-05 | 2020-06-11 | 中兴通讯股份有限公司 | Double-sided press-fit backplane and production method therefor |
| CN111867270A (en) * | 2020-07-29 | 2020-10-30 | 深圳市正基电子有限公司 | Method for removing alkaline ink after solder mask laser exposure |
| CN111935913A (en) * | 2020-07-30 | 2020-11-13 | 珠海杰赛科技有限公司 | Control method for thickness of cladding coating and printed board |
| CN112055481A (en) * | 2020-08-11 | 2020-12-08 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of common-blind co-plating PCB with high thickness-diameter ratio |
| CN112165782A (en) * | 2020-11-02 | 2021-01-01 | 胜华电子（惠阳）有限公司 | Resin hole plugging process for printed circuit board with high aspect ratio |
| CN112616245A (en) * | 2020-12-14 | 2021-04-06 | 海光信息技术股份有限公司 | Acceleration processor acceleration card and manufacturing method thereof |
| CN112822878A (en) * | 2021-01-31 | 2021-05-18 | 惠州中京电子科技有限公司 | Manufacturing method of variable-frequency high-speed printed circuit board |
| CN113260163A (en) * | 2021-05-07 | 2021-08-13 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing circuit board fine line |
| CN113271716A (en) * | 2021-05-14 | 2021-08-17 | 惠州中京电子科技有限公司 | Process method for realizing shallow back drilling through etching |
| WO2021189744A1 (en) * | 2020-03-27 | 2021-09-30 | 广东科翔电子科技股份有限公司 | Preparation method for 77 ghz millimeter wave radar circuit board |
| CN113660794A (en) * | 2021-07-14 | 2021-11-16 | 江门崇达电路技术有限公司 | Manufacturing method of high-reliability printed circuit board |
| CN114040565A (en) * | 2021-11-15 | 2022-02-11 | 广东世运电路科技股份有限公司 | PCB processing method, PCB processing equipment and computer readable storage medium |
| CN114190011A (en) * | 2021-11-11 | 2022-03-15 | 江苏普诺威电子股份有限公司 | High-heat-dissipation PCB and manufacturing process thereof |
| CN114269071A (en) * | 2021-12-08 | 2022-04-01 | 江苏普诺威电子股份有限公司 | Through hole filling manufacturing process of multilayer board |
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| CN115835533A (en) * | 2023-02-22 | 2023-03-21 | 四川英创力电子科技股份有限公司 | Multilayer plate hole machining device and method for machining blind hole by back drilling method |
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| CN107041084A (en) * | 2017-06-06 | 2017-08-11 | 苏州胜科设备技术有限公司 | A kind of preparation method of wiring board |
| CN107484361A (en) * | 2017-09-25 | 2017-12-15 | 生益电子股份有限公司 | The preparation method and High-Speed PCB of a kind of High-Speed PCB |
| TWI661758B (en) * | 2018-05-30 | 2019-06-01 | Tripod Technology Corporation | Circuit board structure and manufacturing method thereof |
| CN109041410A (en) * | 2018-08-30 | 2018-12-18 | 歌尔股份有限公司 | A kind of printed circuit board and design method |
| CN109104829A (en) * | 2018-08-31 | 2018-12-28 | 生益电子股份有限公司 | A kind of profound and subtle hole production method and PCB |
| CN109302808B (en) * | 2018-09-10 | 2020-05-08 | 武汉铱科赛科技有限公司 | Method for manufacturing fine circuit |
| CN109302808A (en) * | 2018-09-10 | 2019-02-01 | 武汉铱科赛科技有限公司 | A method of making fine-line |
| CN109121305A (en) * | 2018-09-29 | 2019-01-01 | 生益电子股份有限公司 | A kind of PCB back drill control method and PCB |
| WO2020114454A1 (en) * | 2018-12-05 | 2020-06-11 | 中兴通讯股份有限公司 | Double-sided press-fit backplane and production method therefor |
| CN110190389A (en) * | 2019-06-03 | 2019-08-30 | 深圳市景旺电子股份有限公司 | A kind of antenna plate and preparation method thereof |
| CN110493964A (en) * | 2019-09-11 | 2019-11-22 | 深圳市景旺电子股份有限公司 | A kind of production method in the non-metallic hole without etching ring |
| CN110933856A (en) * | 2019-12-30 | 2020-03-27 | 东莞市五株电子科技有限公司 | High-frequency blind hole plate manufacturing process and high-frequency blind hole plate |
| WO2021189744A1 (en) * | 2020-03-27 | 2021-09-30 | 广东科翔电子科技股份有限公司 | Preparation method for 77 ghz millimeter wave radar circuit board |
| CN111867270A (en) * | 2020-07-29 | 2020-10-30 | 深圳市正基电子有限公司 | Method for removing alkaline ink after solder mask laser exposure |
| CN111935913A (en) * | 2020-07-30 | 2020-11-13 | 珠海杰赛科技有限公司 | Control method for thickness of cladding coating and printed board |
| CN111935913B (en) * | 2020-07-30 | 2022-02-22 | 珠海杰赛科技有限公司 | Control method for thickness of cladding coating and printed board |
| CN112055481A (en) * | 2020-08-11 | 2020-12-08 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of common-blind co-plating PCB with high thickness-diameter ratio |
| CN112165782A (en) * | 2020-11-02 | 2021-01-01 | 胜华电子（惠阳）有限公司 | Resin hole plugging process for printed circuit board with high aspect ratio |
| CN112616245A (en) * | 2020-12-14 | 2021-04-06 | 海光信息技术股份有限公司 | Acceleration processor acceleration card and manufacturing method thereof |
| CN112616245B (en) * | 2020-12-14 | 2022-04-19 | 海光信息技术股份有限公司 | Acceleration processor acceleration card and manufacturing method thereof |
| CN112822878A (en) * | 2021-01-31 | 2021-05-18 | 惠州中京电子科技有限公司 | Manufacturing method of variable-frequency high-speed printed circuit board |
| CN113260163A (en) * | 2021-05-07 | 2021-08-13 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing circuit board fine line |
| CN113271716A (en) * | 2021-05-14 | 2021-08-17 | 惠州中京电子科技有限公司 | Process method for realizing shallow back drilling through etching |
| CN113660794A (en) * | 2021-07-14 | 2021-11-16 | 江门崇达电路技术有限公司 | Manufacturing method of high-reliability printed circuit board |
| CN114190011A (en) * | 2021-11-11 | 2022-03-15 | 江苏普诺威电子股份有限公司 | High-heat-dissipation PCB and manufacturing process thereof |
| CN114190011B (en) * | 2021-11-11 | 2024-02-23 | 江苏普诺威电子股份有限公司 | High-heat-dissipation PCB and manufacturing process thereof |
| CN114040565A (en) * | 2021-11-15 | 2022-02-11 | 广东世运电路科技股份有限公司 | PCB processing method, PCB processing equipment and computer readable storage medium |
| CN114340223B (en) * | 2021-12-08 | 2023-11-14 | 江苏普诺威电子股份有限公司 | Manufacturing method of high aspect ratio-based selective semi-conductive hole multilayer board |
| CN114340223A (en) * | 2021-12-08 | 2022-04-12 | 江苏普诺威电子股份有限公司 | Manufacturing method of multilayer board based on high aspect ratio selective semiconductor through hole |
| CN114302561A (en) * | 2021-12-08 | 2022-04-08 | 江苏普诺威电子股份有限公司 | Manufacturing method of multilayer board with ultralow copper residue semi-conductive through holes |
| CN114302561B (en) * | 2021-12-08 | 2024-02-02 | 江苏普诺威电子股份有限公司 | Manufacturing method of multilayer board with ultralow copper residue and semi-through holes |
| CN114269071A (en) * | 2021-12-08 | 2022-04-01 | 江苏普诺威电子股份有限公司 | Through hole filling manufacturing process of multilayer board |
| CN114269071B (en) * | 2021-12-08 | 2024-04-26 | 江苏普诺威电子股份有限公司 | Through hole filling manufacturing process of multilayer board |
| CN114423161A (en) * | 2021-12-27 | 2022-04-29 | 生益电子股份有限公司 | PCB processing method and PCB |
| WO2023123909A1 (en) * | 2021-12-27 | 2023-07-06 | 生益电子股份有限公司 | Pcb processing method and pcb |
| CN115633460A (en) * | 2022-12-19 | 2023-01-20 | 浙江万正电子科技股份有限公司 | Manufacturing method of buried-resistance multilayer microwave circuit board with four-time crossed blind holes |
| CN115835533A (en) * | 2023-02-22 | 2023-03-21 | 四川英创力电子科技股份有限公司 | Multilayer plate hole machining device and method for machining blind hole by back drilling method |
| CN115835533B (en) * | 2023-02-22 | 2023-04-25 | 四川英创力电子科技股份有限公司 | Multilayer plate hole machining device and method for machining blind holes by back drilling method |
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