CN115633460A - Manufacturing method of buried-resistance multilayer microwave circuit board with four-time crossed blind holes - Google Patents
Manufacturing method of buried-resistance multilayer microwave circuit board with four-time crossed blind holes Download PDFInfo
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- CN115633460A CN115633460A CN202211629580.1A CN202211629580A CN115633460A CN 115633460 A CN115633460 A CN 115633460A CN 202211629580 A CN202211629580 A CN 202211629580A CN 115633460 A CN115633460 A CN 115633460A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 52
- 239000010410 layer Substances 0.000 claims abstract description 83
- 238000005553 drilling Methods 0.000 claims abstract description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 239000010949 copper Substances 0.000 claims abstract description 27
- 238000003825 pressing Methods 0.000 claims abstract description 23
- 239000002344 surface layer Substances 0.000 claims abstract description 23
- 239000012792 core layer Substances 0.000 claims abstract description 12
- 238000007747 plating Methods 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 22
- 238000012360 testing method Methods 0.000 claims description 5
- 238000002955 isolation Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007688 edging Methods 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 230000008719 thickening Effects 0.000 claims 1
- 238000012545 processing Methods 0.000 description 11
- 238000009713 electroplating Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
A manufacturing method of a four-time crossed blind hole buried resistance multilayer microwave circuit board comprises the following steps: manufacturing a buried resistance layer group: drilling at least one through hole on the buried resistance layer group and plating copper; manufacturing a first surface layer group, and drilling at least one blind hole on the first surface layer group; manufacturing a second surface layer group, and drilling at least one blind hole and at least one back drilling hole on the second surface layer group; manufacturing a core layer group; sequentially pressing the second surface layer group, the buried resistance layer group, the core layer group and the first surface layer group together for three times; and respectively drilling two through holes from the first surface layer group to the second surface layer group, and burying the two through holes from the second surface layer group so as to enable the two through holes to have different depths to obtain a four-step crossed blind hole. According to the manufacturing method, the blind holes are manufactured in a layered mode, the back drilling times can be reduced, the situation that the back drilling drills to lines which cannot be avoided is avoided, and meanwhile the hole copper thickness of the blind holes is guaranteed.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing method of a quadruple cross blind hole buried resistance multilayer microwave circuit board.
Background
In the electronic industry, circuit boards have become an essential component. The crossed blind holes refer to the intersection of more than or equal to 2 blind holes with different orders in an inner core board of the same layer in a circuit board. The design of the crossed blind holes can improve the welding density, reduce the wiring, save the space, and reduce the weight and the cost.
In the PCB industry, for a processing method of a blind hole circuit board, laser drilling is generally adopted for copper deposition and electroplating, blind holes are filled by electroplating, but for a crossed blind hole plate, the laser drilling and electroplating filling mode is difficult to realize, and particularly the thickness-diameter ratio of the blind holes is more than 1:1, the quality problems of insufficient liquid medicine exchange or insufficient bubble caused by electroplating hole filling, incomplete hole filling bottom contact, kong Kailu, insufficient hole copper and the like exist in the electroplating hole filling.
The smaller the aperture of the blind hole, the larger the depth and the more the order, the more difficult the processing and the realization, if some products have blind holes with different depths and directions and buried holes, if the blind holes are manufactured by adopting the traditional laser and electroplating hole filling mode, the blind holes of all orders can not be realized, and the open circuit failure is caused because copper can not be plated on the blind holes of all orders.
Disclosure of Invention
In view of the above, the present invention provides a method for manufacturing a buried multi-layer microwave circuit board with four crossed blind vias, which can solve the above technical problems.
A manufacturing method of a buried multi-layer microwave circuit board with four crossed blind holes comprises the following steps:
STEP101, manufacturing a buried resistance layer: pre-throwing two dummy plates, wherein the bottom copper is consistent with that of the embedded resistance layer, measuring the surface copper thickness before the circuit of the embedded resistance layer is manufactured, selecting the etching speed according to the surface copper thickness, etching the prepared dummy plate, etching the first plate of the real plate according to the etching speed of the dummy plate and 0.8m/min after the line width of the dummy plate is qualified, the circuit faces downwards during etching, and drilling at least one through hole on the embedded resistance layer and plating copper;
STEP102, making a first layer group, and drilling at least one blind hole on the first layer group;
STEP103: manufacturing a second layer set, and drilling at least one blind hole and at least one back drilling hole on the second layer set;
STEP104: manufacturing a core layer group;
STEP105: manufacturing a surface layer;
STEP106: pressing according to the following sequence, namely pressing a first layer group and a second layer group respectively, then pressing the core layer group and the second layer group, then pressing the first layer group and the surface layer, and finally pressing the pressed core layer group and the second layer group and the pressed first layer group and the pressed surface layer;
STEP107: two through holes are drilled from the surface layer respectively, and the first layer group is filled with the two through holes respectively so that the two through holes have different depths to prepare a four-step crossed blind hole.
Further, when the buried resistance layer is manufactured, the tolerance of the line width on the dummy board is controlled according to +/-0.5 mil.
Further, when the buried resistance layer is manufactured, the control range of the etched resistor is 90-105 omega, and the etching speed or the line width is adjusted by excessively adjusting the resistance value; and the resistance is slightly smaller, and laser equipment is adopted for resistance adjustment, so that the resistance of the buried resistance layer group is 90-110 omega.
Furthermore, when the etching process of manufacturing the embedded resistance layer is carried out, etching is carried out firstly, then the film is removed, the resistance circuit surface is placed upwards when the film is removed, and the thick edge strips arranged on the two sides of the plate pass through the machine together, so that the resistance film is prevented from being scratched.
Further, in STEP103, the method for manufacturing the back drill includes the following STEPs:
STEP201: making an isolation ring in advance on the back drilling layer;
STEP201: controlling the back drill STUB according to 0.1-0.2 mm;
STEP201: and (3) back drilling test holes of different orders are arranged on the plate edge in advance, the hole diameter is consistent with that of the back drilling hole, the plate edge is drilled firstly before production, and the plate is sliced and confirmed and then the first piece in the plate is made after the plate is qualified.
Furthermore, the blind hole filling and plugging holes in the first layer group are manufactured by a pressing self-filling method, and a resin plugging flow is not required to be added.
Furthermore, the blind holes in the second layer group need to be plugged first and then pressed.
Compared with the prior art, in the manufacturing method of the buried-resistance multilayer microwave circuit board, the blind holes are manufactured in a layered mode, so that the back drilling times can be reduced, lines which cannot be avoided are prevented from being drilled by the back drilling, and the hole copper thickness of the blind holes is guaranteed. Through the four-time pressing, on one hand, the manufacturing of buried holes can be realized, on the other hand, the manufacturing of each layer of blind holes is facilitated, and the technical problems that blind hole copper plating core-spun, copper plating is not in contact with base copper, copper is thin/uneven, sunken and the like are solved. In addition, back drilling is selectively carried out, so that a back drilling processing mode and a blind hole processing mode are mutually related, and the complementary matching of the blind hole and the back drilling is simultaneously selected, so that the processing technical difficulty of the back drilling processing mode and the blind hole processing mode is reduced, the process flow is reduced, and the structural design of the crossed blind hole is finally realized.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a four-time cross blind via buried multi-layer microwave circuit board according to the present invention.
FIG. 2 is a schematic structural diagram of a buried resistance layer in a manufacturing process.
Fig. 3 is a schematic diagram of a first layer set during fabrication.
Fig. 4 is a schematic diagram of a second layer set during fabrication.
Fig. 5 is a schematic view of the core layer set during the manufacturing process.
FIG. 6 is a schematic view of a top layer in a manufacturing process
Fig. 7 is a schematic structural diagram of a circuit board prepared by the method for preparing the buried multi-layer microwave circuit board with four crossed blind holes in fig. 1.
Detailed Description
Specific examples of the present invention will be described in further detail below. It should be understood that the description herein of embodiments of the invention is not intended to limit the scope of the invention.
Referring to fig. 1 to 6, the method for manufacturing a quadruple cross blind via buried multi-layer microwave circuit board according to the present invention includes the following steps:
STEP101: making a buried resistance layer L15: pre-throwing two dummy plates, wherein the bottom copper is consistent with that of the embedded resistance layer, measuring the surface copper thickness before the circuit of the embedded resistance layer is manufactured, selecting the etching speed according to the surface copper thickness, etching the prepared dummy plate, etching the first plate of the real plate according to the etching speed of the dummy plate and 0.8m/min after the line width of the dummy plate is qualified, the circuit faces downwards during etching, and drilling at least one through hole on the embedded resistance layer and plating copper;
STEP102, making a first layer group L3 to L6, and drilling at least one blind hole on the first layer group L3 to L6;
STEP103: manufacturing a second layer group L13-L16, and drilling at least one blind hole and at least one back drilling hole on the second layer group L13-L16;
STEP104: manufacturing a core layer group L7-L12;
STEP105: manufacturing a surface layer L1;
STEP106: pressing according to the following sequence, firstly pressing a first layer group L3-L6 and a second layer group L3-L16 respectively, then pressing a core layer group L7-L12 and a second layer group L3-L16, then pressing a first layer group L3-L6 and a surface layer L1, and finally pressing a pressed core layer group L7-L12 and a second layer group L3-L16 and a pressed first layer group L3-L6 and a pressed surface layer L1;
STEP107: two through holes are drilled from the surface layer L1 respectively, and the two through holes are buried in the first layer group L3 to the first layer group L6 respectively so that the two through holes have different depths to prepare a four-step crossed blind hole.
In STEP STEP101, the line width tolerance on the dummy board is controlled to + -0.5 mil. The control range of the etched resistor is 90-105 omega, and the etching speed or the line width is adjusted by excessively adjusting the resistance value; and the resistance is slightly smaller, and the resistance of the finished product is adjusted by adopting laser equipment to ensure that the resistance is 90-110 omega.
The "sub-wash" cylinder was turned off before etching. Etching is performed firstly, then film stripping is performed, the resistance circuit surface is placed upwards during film stripping, and the thick edge strips on the two sides of the plate are processed together to avoid scratching the resistance film.
Firstly, using a dummy plate to confirm the etching speed; measuring the resistance value, and not allowing over-etching; the allowance of the false plate is 0.5mil in total of the residual rough edges on the two sides; producing the core plate according to the dummy plate etching speed; the test is carried out within 1 hour after etching.
The plate is held by two hands in the operation process, the resistive film is protected, and the problems of scratching, liquid medicine pollution, water vapor and the like are not allowed.
In STEP103, a method for manufacturing a back drill includes the STEPs of:
STEP201, making an isolation ring in advance on a back drilling layer;
STEP202, controlling the back drill STUB according to 0.1-0.2 mm;
STEP203, back drilling test holes of different orders are arranged on the plate edge in advance, the hole diameter is consistent with that of the back drilling hole, plate edge slices are firstly drilled for confirmation before production, and the first piece in the plate is manufactured after the plate is qualified, so that test scrap is reduced.
In STEP105, the press-fit manufacturing method and parameters:
the blind hole filling plug holes in the first layer group L3-L6 are manufactured by a pressing self-filling method, and a resin plug hole flow is not required to be added.
Other blind buried holes need to be plugged and then pressed, and cannot be manufactured by a pressing self-filling method;
the pressing heating rate is controlled at 2.0+/-0.5 ℃/min, the maximum pressure is 360PSI, the maximum material temperature is 180-185 ℃, the full pressure is set for 15-20min, and the heat preservation and pressure maintaining are carried out for 60-90min.
Through the manufacturing steps, a circuit board blank is manufactured, and then 3# and 4# through holes are drilled according to actual requirements. Then, the through holes 3# and 4# are buried according to actual requirements, in this embodiment, the through holes 3# and 4# are respectively formed on two sides of one insulating layer of the buried resistance layer group through the buried holes, so as to form blind holes with different depths, as shown in fig. 7. In fig. 7, the holes 1#, 2#, 3#, and 4# are all blind holes and are all formed on the buried resistance layer group, and thus are called four-step cross blind holes.
Compared with the prior art, in the manufacturing method of the buried-resistance multilayer microwave circuit board, the blind holes are manufactured in a layered mode, so that the back drilling times can be reduced, lines which cannot be avoided are prevented from being drilled by the back drilling, and the hole copper thickness of the blind holes is guaranteed. Through the four-time pressing, on one hand, the manufacturing of buried holes can be realized, on the other hand, the manufacturing of each layer of blind holes is facilitated, and the technical problems that blind hole copper plating core-spun, copper plating is not in contact with base copper, copper is thin/uneven, sunken and the like are solved. In addition, back drilling is selectively carried out, so that a back drilling processing mode and a blind hole processing mode are mutually related, and the complementary matching of the blind hole and the back drilling is simultaneously selected, so that the processing technical difficulty of the back drilling processing mode and the blind hole processing mode is reduced, the process flow is reduced, and the structural design of the crossed blind hole is finally realized.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, and any modifications, equivalents or improvements that are within the spirit of the present invention are intended to be covered by the following claims.
Claims (7)
1. A manufacturing method of a four-time crossed blind hole buried resistance multilayer microwave circuit board comprises the following steps:
STEP101, manufacturing a buried resistance layer: pre-throwing two dummy plates, wherein the bottom copper is consistent with that of the embedded resistance layer, measuring the surface copper thickness before the circuit of the embedded resistance layer is manufactured, selecting the etching speed according to the surface copper thickness, etching the prepared dummy plate, etching the first plate of the real plate according to the etching speed of the dummy plate and 0.8m/min after the line width of the dummy plate is qualified, the circuit faces downwards during etching, and drilling at least one through hole on the embedded resistance layer and plating copper;
STEP102, manufacturing a first layer group, and drilling at least one blind hole on the first layer group;
STEP103: manufacturing a second layer set, and drilling at least one blind hole and at least one back drilling hole on the second layer set;
STEP104: manufacturing a core layer group;
STEP105: manufacturing a surface layer;
STEP106: pressing according to the following sequence, namely pressing a first layer group and a second layer group respectively, then pressing the core layer group and the second layer group, then pressing the first layer group and the surface layer, and finally pressing the pressed core layer group and the second layer group and the pressed first layer group and the pressed surface layer;
STEP107: two through holes are drilled from the surface layer respectively, and the first layer group is filled with the two through holes respectively so that the two through holes have different depths to prepare a four-step crossed blind hole.
2. The method for manufacturing a buried multi-layer microwave circuit board with four crossed blind holes according to claim 1, wherein: when the buried resistance layer group is manufactured, the tolerance of the line width on the false plate is controlled according to +/-0.5 mil.
3. The method for manufacturing a buried multi-layer microwave circuit board with four crossed blind holes according to claim 1, wherein: when the buried resistance layer group is manufactured, the control range of the etched resistance is 90-105 omega, and the etching speed or the line width is adjusted by excessively adjusting the resistance; and the resistance is slightly smaller, and laser equipment is adopted for resistance adjustment, so that the resistance of the buried resistance layer group is 90-110 omega.
4. The method for manufacturing a buried multi-layer microwave circuit board with four crossed blind holes according to claim 1, wherein: when the etching process of the buried resistance layer group is manufactured, etching is performed firstly, then the film is removed, the resistance circuit surface is placed upwards when the film is removed, and the thickening edgings on the two sides of the plate pass through the machine together, so that the resistance film is prevented from being scratched.
5. The method of claim 1, wherein the step of forming the multilayer microwave circuit board comprises: in STEP103, the method for manufacturing the back drill includes the following STEPs:
STEP201: making an isolation ring in advance on the back drilling layer;
STEP201: controlling the back drill STUB according to 0.1-0.2 mm;
STEP201: and (3) back drilling test holes of different orders are arranged on the plate edge in advance, the hole diameter is consistent with that of the back drilling hole, the plate edge is drilled firstly before production, and the plate is sliced and confirmed and then the first piece in the plate is made after the plate is qualified.
6. The method for manufacturing a buried multi-layer microwave circuit board with four crossed blind holes according to claim 1, wherein: and blind hole glue filling and plugging holes in the first surface layer group are manufactured by a pressing self-filling method without increasing a resin plugging flow.
7. The method for manufacturing a buried multi-layer microwave circuit board with four crossed blind holes according to claim 1, wherein: the blind holes on the second surface layer group need to be plugged and then pressed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211629580.1A CN115633460A (en) | 2022-12-19 | 2022-12-19 | Manufacturing method of buried-resistance multilayer microwave circuit board with four-time crossed blind holes |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211629580.1A CN115633460A (en) | 2022-12-19 | 2022-12-19 | Manufacturing method of buried-resistance multilayer microwave circuit board with four-time crossed blind holes |
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| CN115633460A true CN115633460A (en) | 2023-01-20 |
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| CN202211629580.1A Pending CN115633460A (en) | 2022-12-19 | 2022-12-19 | Manufacturing method of buried-resistance multilayer microwave circuit board with four-time crossed blind holes |
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|---|---|---|---|---|
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| US20180279473A1 (en) * | 2017-03-21 | 2018-09-27 | Sanmina Corporation | Methods of forming blind vias for printed circuit boards |
| CN111343800A (en) * | 2020-03-18 | 2020-06-26 | 四川英创力电子科技股份有限公司 | Processing technology for local electroplating of blind buried hole |
-
2022
- 2022-12-19 CN CN202211629580.1A patent/CN115633460A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008016482A (en) * | 2006-07-03 | 2008-01-24 | Nippon Mektron Ltd | Manufacturing method of multilayer printed wiring board |
| CN106358386A (en) * | 2016-10-10 | 2017-01-25 | 深圳崇达多层线路板有限公司 | Manufacturing method of blind hole of backboard plugin |
| CN106793577A (en) * | 2017-01-16 | 2017-05-31 | 生益电子股份有限公司 | The preparation method and PCB of a kind of High-Speed PCB |
| US20180279473A1 (en) * | 2017-03-21 | 2018-09-27 | Sanmina Corporation | Methods of forming blind vias for printed circuit boards |
| CN207820317U (en) * | 2018-02-08 | 2018-09-04 | 中山奥士森电子有限公司 | A kind of quadravalence HDI wiring boards |
| CN108323008A (en) * | 2018-03-06 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of production method of buried resistor Rigid Flex |
| CN111343800A (en) * | 2020-03-18 | 2020-06-26 | 四川英创力电子科技股份有限公司 | Processing technology for local electroplating of blind buried hole |
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Application publication date: 20230120 |
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