CN105682365A - Method of manufacturing semi-metallized platform on PCB - Google Patents
Method of manufacturing semi-metallized platform on PCB Download PDFInfo
- Publication number
- CN105682365A CN105682365A CN201610186629.9A CN201610186629A CN105682365A CN 105682365 A CN105682365 A CN 105682365A CN 201610186629 A CN201610186629 A CN 201610186629A CN 105682365 A CN105682365 A CN 105682365A
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- CN
- China
- Prior art keywords
- platform
- boards
- edges
- pcb
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to the technical field of circuit board production, and particularly relates to a method of manufacturing a semi-metallized platform on a PCB. A drainage perforation is arranged outside a forming line area of a unit board area on a multilayer board, the drainage perforation is intersected with a board edge platform, when the board edge platform is metalized through electroplating, electroplating chemical flows out from the drainage perforation, and thus, exchange of the electroplating chemical in the board edge platform is quickened and the problems that a pin hole appears and/or the thickness of a copper layer is not enough due to poor electroplating chemical exchange as the board edge platform is large vertically and horizontally can be solved.
Description
Technical field
The present invention relates to board production technical field, particularly relate to a kind of method making semi-metal platform on PCB.
Background technology
PCB (PrintedCircuitBoard), Chinese is printed circuit board, also known as printed substrate. When producing PCB, in order to improve efficiency, convenient production, the form sawing sheet of jigsaw can be adopted, be stitched together by multiple unit figures (unit) and plus technique edges, form a set of module figure (set); Being stitched together by many set of modules figure and add technique edges, forming a production unit (panel), base material then cuts according to the size of production unit; Wherein each unit figure includes unit line figure and form wire region. The multi-layer sheet formed after pressing then includes multiple module region accordingly, each module region includes multiple cell board region for being fabricated to cell board, each cell board region includes unit line region and form wire region, multi-layer sheet as shown in Figure 1,10 is module region, and 100 is cell board region. In order to meet some functional requirement, metallization platform or semi-metal platform need to be made on part PCB. Metallization platform refers to that appointment region onboard forms a recessed platform by definite shape is regular by thin for its thickness gong, is metallized by platform then through follow-up heavy copper and electric plating of whole board operation; Semi-metal platform then refers to that the metallization platform crossing over form wire region is when follow-up processing and forming, and metallization platform is positioned at the extra-regional part of form wire and is fallen by gong, leaves behind the part within metallization platform is positioned at form wire region. General power panel and backboard need make semi-metal platform.
The technological process of production of the PCB with semi-metal platform is generally as follows: sawing sheet → inner figure → internal layer etching → internal layer AOI → brown → pressing → boring → crossing over the position gong platform → heavy copper → electric plating of whole board → outer graphics → graphic plating → outer layer etching → outer layer AOI → silk-screen welding resistance in form wire region, character → surface treatment → molding (the metallization platform in leap form wire region is positioned at the extra-regional part of form wire and is fallen by gong) → electrical testing → FQC → packaging. But; owing to the general narrower width of semi-metal platform and the degree of depth are relatively deep (for being 1.6-3.0mm by width; the semi-metal platform that the metallization platform of aspect ratio >=0.6:1 is formed); adopt existing Making programme; when platform is carried out galvanic metallization; bubble, electroplating liquid medicine exchange is often there will be by the situation such as stagnant, the problems such as copper layer thickness is not up to standard that cause the semi-metal platform eventually formed to occur in pin hole and/or platform in platform.
Summary of the invention
The present invention is directed to existing PCB Making programme to be easily caused in semi-metal platform and the problem that pin hole and/or copper layer thickness are not up to standard occurs, it is provided that the manufacture method of a kind of semi-metal platform solving this problem.
For achieving the above object, the present invention is by the following technical solutions.
A kind of method making semi-metal platform on PCB, comprises the following steps:
S1 holes: bore circuit hole in cell board region on multilayer boards, bores drain perforation outside form wire region; Described multi-layer sheet is plate core material and outer copper foil pressing being integrated by prepreg.
Preferably, the aperture of described drain perforation is equal to the width of edges of boards platform.
S2 gong platform: cell board region gong platform on multilayer boards, described platform includes the platform crossing over form wire region; The platform in described leap form wire region is called edges of boards platform.
Preferably, the width of described edges of boards platform is 1.6-3.0mm, aspect ratio >=0.6:1.
S3 normal process steps: be sequentially carried out heavy Copper treatment, electric plating of whole board process, outer graphics process, graphic plating process, the making of outer layer etch processes, solder mask and surface treatment according to prior art on multilayer boards; Metallization edges of boards platform is formed after described edges of boards platform is processed.
S4 gong limit: metallization edges of boards platform is positioned at the extra-regional part gong of form wire and falls, forms semi-metal platform.
In actual production, make operation after also including step S5 after forming semi-metal platform on multilayer boards: be shaped on multilayer boards according to prior art processing and test, prepare PCB finished product.
Compared with prior art, the invention has the beneficial effects as follows: the present invention arranges drain outside the form wire region by cell board region on multilayer boards and bores a hole and make drain perforation intersect with edges of boards platform, when plating makes edges of boards platform metallize, electroplating liquid medicine can flow out via drain perforation, thus the exchange of the electroplating liquid medicine can accelerated in edges of boards platform, solve and cause that electroplating liquid medicine exchange is bad because edges of boards platform is relatively larger in length and breadth and pin hole and/or the not enough problem of copper layer thickness occur.
Accompanying drawing explanation
Fig. 1 is the distribution schematic diagram in module region and cell board region in multi-layer sheet;
Fig. 2 is the structural representation (having made drain perforation and edges of boards platform) of module region in embodiment;
Fig. 3 is the structural representation of the semi-metal platform in embodiment on cell board region.
Detailed description of the invention
In order to understand the technology contents of the present invention more fully, below in conjunction with specific embodiment technical scheme it is described further and illustrates.
Embodiment
The present embodiment provides a kind of method making semi-metal platform on PCB, and the method is first making edges of boards platform, then passes through heavy copper and electric plating of whole board makes edges of boards platform metallize, and is fabricated to semi-metal platform then through the gong limit platform that metallized by edges of boards. The width of the edges of boards platform made in the present embodiment is 1.6mm, and aspect ratio is 1:1.
Concrete making step is as follows:
(1) multi-layer sheet
According to prior art, sequentially passing through sawing sheet → negative film technique and make internal layer circuit → internal layer AOI → brown → pressing, base material is fabricated to multi-layer sheet, namely multi-layer sheet is plate core material and outer copper foil pressing being integrated by prepreg; The multi-layer sheet prepared includes at least two module region, and each module region includes four for making the region forming cell board, and this region is called that cell board region, cell board region include again unit line region and form wire region. Module region 20,201 as shown in Figure 2 is unit line region, and 202 is form wire region.
(2) boring
According to prior art, boring circuit hole by drilling data cell board region on multilayer boards, additionally bore the drain perforation 204 of circle outside form wire region, the aperture of drain perforation 204 is 1.6mm.
(3) gong platform
Cross over the platform in form wire region with blind gong machine cell board region gong on multilayer boards, this platform is called edges of boards platform 203, and the width of edges of boards platform 203 is 1.6mm, and the degree of depth of edges of boards platform 203 is 1.6mm.
(4) normal process steps
Heavy Copper treatment, electric plating of whole board process, outer graphics process, graphic plating process, outer layer etch processes, outer layer AOI, solder mask making (silk-screen welding resistance, character) and surface treatment it is sequentially carried out on multilayer boards according to prior art.
After heavy Copper treatment and electric plating of whole board process, edges of boards platform 203 metallizes, and forms metallization edges of boards platform.
(5) gong limit
Along form wire gong limit, metallization edges of boards platform being positioned at the extra-regional part gong of form wire and falls, making metallization platform transition is semi-metal platform, as it is shown on figure 3,205 is semi-metal platform.
(6) operation afterwards
It is shaped on multilayer boards according to prior art processing and test, prepares PCB finished product.
In other embodiments, it is also possible to make width edges of boards platform within the scope of 1.6-3.0mm and the aspect ratio >=0.6:1 of edges of boards platform.
The above only further illustrates the technology contents of the present invention with embodiment, in order to reader is easier to understand, but does not represent embodiments of the present invention and be only limitted to this, and any technology done according to the present invention extends or recreation, all by the protection of the present invention.
Claims (4)
1. the method making semi-metal platform on PCB, it is characterised in that comprise the following steps:
S1 holes: bore circuit hole in cell board region on multilayer boards, bores drain perforation outside form wire region; Described multi-layer sheet is plate core material and outer copper foil pressing being integrated by prepreg;
S2 gong platform: cell board region gong platform on multilayer boards, described platform includes the platform crossing over form wire region; The platform in described leap form wire region is called edges of boards platform; Described edges of boards platform intersects with drain perforation;
S3 normal process steps: be sequentially carried out heavy Copper treatment, electric plating of whole board process, outer graphics process, graphic plating process, the making of outer layer etch processes, solder mask and surface treatment according to prior art on multilayer boards; Metallization edges of boards platform is formed after described edges of boards platform is processed;
S4 gong limit: metallization edges of boards platform is positioned at the extra-regional part gong of form wire and falls, forms semi-metal platform.
2. according to claim 1 a kind of on PCB make semi-metal platform method, it is characterised in that operation after also including step S5: according to prior art on multilayer boards be shaped process and test, prepare PCB finished product.
3. a kind of method making semi-metal platform on PCB according to claim 1, it is characterised in that the aperture of described drain perforation is equal to the width of edges of boards platform.
4. according to claim 3 a kind of on PCB make semi-metal platform method, it is characterised in that the width of described edges of boards platform is 1.6-3.0mm, aspect ratio >=0.6:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610186629.9A CN105682365A (en) | 2016-03-29 | 2016-03-29 | Method of manufacturing semi-metallized platform on PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610186629.9A CN105682365A (en) | 2016-03-29 | 2016-03-29 | Method of manufacturing semi-metallized platform on PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105682365A true CN105682365A (en) | 2016-06-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610186629.9A Pending CN105682365A (en) | 2016-03-29 | 2016-03-29 | Method of manufacturing semi-metallized platform on PCB |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108811369A (en) * | 2018-06-29 | 2018-11-13 | 中国电子科技集团公司第二十九研究所 | A kind of printed circuit board edge blind slot processing method |
| CN111031674A (en) * | 2019-11-21 | 2020-04-17 | 惠州美锐电子科技有限公司 | Method for removing selective plating edge at specific position on PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003340666A (en) * | 2002-05-27 | 2003-12-02 | Dainippon Screen Mfg Co Ltd | Suction table and processing apparatus using the same |
| CN202000013U (en) * | 2011-03-23 | 2011-10-05 | 福清三照电子有限公司 | Floating target for plating bath of pattern plating equipment of printed circuit board |
| CN105246254A (en) * | 2015-10-14 | 2016-01-13 | 江门崇达电路技术有限公司 | Method for manufacturing a PTH platform on printed circuit board (PCB) |
-
2016
- 2016-03-29 CN CN201610186629.9A patent/CN105682365A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003340666A (en) * | 2002-05-27 | 2003-12-02 | Dainippon Screen Mfg Co Ltd | Suction table and processing apparatus using the same |
| CN202000013U (en) * | 2011-03-23 | 2011-10-05 | 福清三照电子有限公司 | Floating target for plating bath of pattern plating equipment of printed circuit board |
| CN105246254A (en) * | 2015-10-14 | 2016-01-13 | 江门崇达电路技术有限公司 | Method for manufacturing a PTH platform on printed circuit board (PCB) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108811369A (en) * | 2018-06-29 | 2018-11-13 | 中国电子科技集团公司第二十九研究所 | A kind of printed circuit board edge blind slot processing method |
| CN108811369B (en) * | 2018-06-29 | 2021-09-24 | 中国电子科技集团公司第二十九研究所 | Printed circuit board edge blind slot processing method |
| CN111031674A (en) * | 2019-11-21 | 2020-04-17 | 惠州美锐电子科技有限公司 | Method for removing selective plating edge at specific position on PCB |
| CN111031674B (en) * | 2019-11-21 | 2023-04-21 | 惠州美锐电子科技有限公司 | Method for removing selective electroplating edge at specific position on PCB |
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Application publication date: 20160615 |