CN115835533A - Multilayer plate hole machining device and method for machining blind hole by back drilling method - Google Patents
Multilayer plate hole machining device and method for machining blind hole by back drilling method Download PDFInfo
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- CN115835533A CN115835533A CN202310150431.5A CN202310150431A CN115835533A CN 115835533 A CN115835533 A CN 115835533A CN 202310150431 A CN202310150431 A CN 202310150431A CN 115835533 A CN115835533 A CN 115835533A
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Abstract
The invention discloses a multilayer plate hole processing device and a method for processing a blind hole by adopting a back drilling method, which relate to the technical field of printed circuit board processing and comprise the following steps: s1, processing a plurality of inner-layer core plates: cutting, coating, exposing, developing, etching and browning; s2, pressing: sequentially overlapping a plurality of inner-layer core plates, separating the two layers by using PP, overlapping PP and copper foil outside the inner-layer core plates, and performing hot pressing to form a multilayer plate; s3, drilling: processing a plurality of through holes at a preset position by using a multilayer plate hole processing device; s4, hole metallization: metallizing the hole wall of the through hole; s5, back drilling: removing part of the hole wall of the through hole, wherein the part with the hole wall removed forms a back drilling hole, and the part without the hole wall removed forms a blind hole; s6, plugging holes with resin: and filling resin in the through hole and drying. The scheme of the invention can realize the processing of the crossed blind buried holes of all materials without carrying out a laser drilling process with higher cost.
Description
Technical Field
The invention relates to the technical field of printed circuit board processing, in particular to a multilayer board hole processing device and a method for processing a blind hole by adopting a back drilling method.
Background
The PCB is called Printed Circuit Board, and Chinese is Printed Circuit Board or PCB. Printed circuit boards are carriers for electronic components and often have a blind via structure, which is a via hole connecting the surface layer and the inner layer without penetrating the entire board. Two common blind hole processing methods are available, one is to process a blind hole layer in a through hole mode and then press the blind hole layer into a printed circuit board to form a blind hole. Taking an eight-layer blind hole plate as an example, the eight-layer blind hole plate comprises an L1 layer, an L2 layer, an L3 layer, an L4 layer, an L5 layer, an L6 layer, an L7 layer and an L8 layer from top to bottom, if the eight-layer plate has blind hole structures of the L1-L4 layer and the L5-L8 layer, the processing process comprises the steps of firstly pressing to form four layers of the L1-L4 layer and four layers of the L5-L8 layer, and then drilling through the core plates of the L1-L4 layer and the L5-L8 layer in a through hole processing mode and metalizing. Then, the layers L1-L4 and the layers L5-L8 are laminated together to obtain eight-layer boards, and simultaneously, the blind hole structures of L1-L4 and L5-L8 are also obtained, and the method has the defect that crossed blind holes cannot be processed, for example, the blind hole structures of L1-L4, L3-L6 and L5-L8 exist in the eight-layer boards, and cannot be processed. The other method for processing the blind hole is a lamination method, and the main method is to adopt a laser drilling mode to penetrate through the medium layers of the adjacent layers, then use a hole filling electroplating mode to conduct, and continuously stack to form the blind hole plate.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides the multilayer plate hole processing device and the method for processing the blind hole by adopting the back drilling method, so that the processing of the crossed blind buried hole of all materials can be realized, and the laser drilling process with higher cost is not required.
In order to realize the purpose of the invention, the following scheme is adopted:
the utility model provides a multilayer plate hole processingequipment, includes operation panel, through-hole processing subassembly, two second elevating system, a drive mechanism, upper hole processing subassembly, stroke subassembly, lower floor's hole processing subassembly.
The operation panel center department is equipped with the logical groove that runs through itself, leads to the groove and is equipped with the round standing groove outward for place the multiply wood, and operation panel bilateral symmetry is equipped with two first elevating system.
Through-hole processing subassembly is used for predetermineeing position department at the multiply wood and processes a plurality of through-holes, including the lifter plate, a plurality of drill bits, the lifter plate supports in first elevating system top, be equipped with a plurality of perforation and a plurality of circular recess on the lifter plate, perforation top periphery is equipped with cross type piece, cross type piece is located the circular recess, it is equipped with the plectane to slide in the circular recess, plectane bottom is through a plurality of spring coupling in the circular recess, the perforation that corresponds is located in the drill bit rotation, its bottom is facing to the multiply wood of treating drilling, its top is equipped with cross type groove, the outer wall in cross type piece and cross type groove is hugged closely to the plectane inner wall, the plectane top surface is less than cross type groove top surface and is higher than the lifter plate.
The top of the two second lifting mechanisms is connected with the two ends of the top plate, a plurality of lower inserting pieces are arranged on the top plate in a rotating mode, each lower inserting piece comprises a circular ring and a cross inserting block located in the circular ring, the cross inserting blocks are used for downwards inserting into cross-shaped grooves, and the circular rings are used for downwards pressing the circular plates. The first driving mechanism is arranged at the top of the top plate and used for driving all the lower plug-in units to rotate.
The upper layer hole machining assembly is used for machining the upper part of the through hole into a back drilling hole, the structure of the upper layer hole machining assembly is the same as that of the through hole machining assembly, the outer diameter of the drill bit is larger than that of the drill bit of the through hole machining assembly, the number of the drill bits is smaller than that of the drill bit of the through hole machining assembly, and the length of each drill bit is set according to actual conditions. The stroke assembly is used for alternately placing the through hole machining assembly and the upper layer hole machining assembly on the top of the first lifting mechanism.
The lower layer hole machining assembly is arranged below the through groove of the operating platform and used for machining the lower part of the through hole into a back drilling hole, the outer diameter of a drill bit of the lower layer hole machining assembly is larger than that of the drill bit of the through hole machining assembly, the number of the drill bits is smaller than that of the drill bit of the through hole machining assembly, and the length of each drill bit is set according to actual conditions.
Further, the operation panel sets up two sets of spouts along its length direction, and the through-hole processing subassembly is located in the middle of two sets of spouts, and upper hole processing subassembly both ends slide in one of them set of spout, and upper hole processing subassembly and through-hole processing subassembly highly uniform are connected through first movable buckle between upper hole processing subassembly and the through-hole processing subassembly, and the stroke subassembly includes telescopic machanism, and it passes through the second movable buckle and connects the upper hole processing subassembly outside.
Further, first activity buckle includes that a plurality of L types are rectangular, and wherein half connects in the through-hole processing subassembly, and half connects in the corresponding position of upper hole processing subassembly, and two corresponding L types are rectangular to be a set of, upper and lower sliding fit.
Further, the second activity buckle is including falling the U template and linking the board, and telescopic machanism is connected to one of them section of the U template that falls, links the board and connects in upper hole machining subassembly, is equipped with the draw-in groove on linking the board for another section of the matching U template.
Further, when the telescopic mechanism is in a contraction state, the through hole processing assembly is positioned at the top of the first lifting mechanism; when the telescopic mechanism is in an extension state, the upper layer hole machining assembly is forced to move to the top of the first lifting mechanism, and the through hole machining assembly moves into the other group of sliding grooves.
Further, lower floor's spot facing work subassembly includes bottom plate, a plurality of drill bits, third elevating system, second actuating mechanism, and third elevating system is used for lifting bottom plate, and the bottom plate is located in a plurality of drill bit rotations, and bottom plate bottom is located to second actuating mechanism for all drill bits of drive rotate.
A method for processing a blind hole by adopting a back drilling method comprises the following steps:
s1, processing a plurality of inner-layer core plates: cutting, coating, exposing, developing, etching and browning;
s2, pressing: sequentially overlapping a plurality of inner-layer core plates, separating the two layers by using PP, overlapping PP and copper foil outside the inner-layer core plates, and performing hot pressing to form a multilayer plate;
s3, drilling: utilize in preset position multilayer plate hole processingequipment process out a plurality of through-holes, specifically include:
placing the multilayer board in a placing groove, positioning the through hole processing assembly at the top of a first lifting mechanism, utilizing a second lifting mechanism to lower a top board so as to enable a cross-shaped insert block to be downwards inserted into a cross-shaped groove, pressing a circular board downwards by a circular ring, and completing assembly when the top surface of the circular board is lower than the bottom surface of the cross-shaped groove; the second lifting mechanism and the first lifting mechanism enable the top plate and the through hole machining assembly to synchronously move downwards, and then the first driving mechanism drives all the lower plug-in units and the drill bits to rotate, so that the drilling of the multilayer board is completed; resetting;
s4, hole metallization: metallizing the hole wall of the through hole;
s5, back drilling: removing part of the hole wall of the through hole, wherein the part with the hole wall removed forms a back drilling hole, the part without the hole wall removed forms a blind hole, and the specific method for removing the hole wall comprises the following steps:
the upper layer hole machining assembly is arranged at the top of the first lifting mechanism by using the stroke assembly, the upper part of the hole wall of a part of through holes is removed by using the first lifting mechanism, the second lifting mechanism, the first driving mechanism and the upper layer hole machining assembly in a matched manner, and the lower part of the hole wall of the part of the through holes is removed by using the lower layer hole machining assembly;
s6, plugging holes with resin: and filling resin in the through hole and drying.
Furthermore, the diameter of the back drilling hole is 0.05mm-0.2mm larger than that of the blind hole.
Further, in step S3, when the through hole processing assembly moves down, the L-shaped strip between the upper layer hole processing assembly and the through hole processing assembly is always attached.
Further, in step S5, when the upper hole machining assembly is placed on the top of the first lifting mechanism, the telescopic mechanism extends to force the upper hole machining assembly to be separated from one group of sliding grooves and move to the top of the first lifting mechanism, and the through hole machining assembly moves into the other group of sliding grooves.
The invention has the beneficial effects that:
(1) Only one-time pressing process is needed, the processing flow is saved, the processing of the crossed blind buried hole can be realized, and a laser drilling process with higher cost is not needed.
(2) The method can be used for processing the blind hole structures of all materials, and is particularly suitable for processing the blind holes of high-frequency and high-speed materials.
(3) The back drilling holes are required to be processed at different positions of the two sides of the multilayer board, and the back drilling holes at different positions have different depths, but the same multilayer board hole processing device can be used for carrying out the drilling step and the back drilling step, only the stroke assembly is needed to be used for alternately arranging the upper layer hole processing assembly and the through hole processing assembly at the top of the first lifting mechanism, and the operation is simple.
Drawings
FIG. 1 is a side view of an inner core panel of example 1;
FIG. 2 is a side view of the laminated multi-layer board of example 1;
FIG. 3 is a side view of the multi-layer board of example 1 after drilling;
FIG. 4 is a side view of the multilayer board of example 1 after hole metallization;
FIG. 5 is a side view of the multi-layer board of example 1 after backdrilling;
FIG. 6 is a side view of the multilayer board of example 1 after resin plugging;
FIG. 7 is a structural view of a multilayer plate hole processing apparatus according to example 3;
FIG. 8 is a top structural view of a lifter plate according to embodiment 3;
FIG. 9 is an enlarged view of a portion A of FIG. 8;
FIG. 10 is a bottom structural view of the top plate of embodiment 3;
FIG. 11 is an enlarged view of a portion of FIG. 10 at B;
FIG. 12 is a right side view of the multilayer plate hole processing apparatus of example 3;
FIG. 13 is a plan view of a multilayer plate hole processing apparatus according to example 3;
FIG. 14 is an enlarged view of a portion of FIG. 13 at C;
FIG. 15 is a front view of the multilayer plate hole processing apparatus of example 3;
FIG. 16 is an enlarged view of a portion of FIG. 15 at D;
FIG. 17 is a diagram showing the through-hole position distribution of the multilayer board of example 2;
fig. 18 is a plan view of a drill position distribution of the through-hole machining assembly of example 2;
FIG. 19 is a plan view of the drill position distribution of the upper hole processing assembly of example 2;
FIG. 20 is a top plan view of a drill bit location distribution of the lower layer hole-machining module of example 2;
FIG. 21 is a flowchart of a method for fabricating a blind hole according to embodiment 4;
reference numerals: the device comprises a through hole-11, a back drilling hole-111, a blind hole-112, an operation table-2, a first lifting mechanism-22, a through hole processing component-3, a lifting plate-32, a perforation-321, a circular groove-322, a cross-shaped block-323, a circular plate-324, a spring-325, a cross-shaped groove-311, a second lifting mechanism-4, a top plate-41, a circular ring-42, a cross-shaped insert-43, an upper layer hole processing component-5, a sliding groove-21, a telescopic mechanism-6, an L-shaped long strip-33, an inverted U-shaped plate-61, a connecting plate-62 and a bottom plate-7.
Detailed Description
Example 1
The embodiment provides a method for processing blind holes by a back drilling method, taking an eight-layer board as an example, which includes an L1 layer, an L2 layer, an L3 layer, an L4 layer, an L5 layer, an L6 layer, an L7 layer and an L8 layer from top to bottom, and includes the following steps:
s1, processing of an inner-layer core plate: through the steps of cutting, coating, exposing, developing, etching, browning and the like, three inner-layer core plates are processed, and each inner-layer core plate is shown in figure 1.
S2, pressing: three inner core boards, two copper foils and four PPs are stacked together, and the copper foils, the PPs, the inner core boards, the PPs and the copper foils are sequentially arranged from top to bottom, and are subjected to hot pressing to form eight-layer boards, as shown in figure 2, wherein the three inner core boards form L2-L3 layers, L4-L5 layers and L6-L7 layers of the eight-layer boards.
S3, drilling: three through holes 11 are processed at the positions shown in fig. 3, each through hole 11 penetrating through the entire eight-layer board.
S4, hole metallization: the hole walls of the three through holes 11 are metallized to realize the conduction of each layer, as shown in fig. 4.
S5, back drilling: as shown in fig. 5, the hole walls of the layers L1 to L4 of the left through hole 11 are removed, the hole walls of the layers L5 to L8 of the right through hole 11 are removed, the hole walls of the layers L1 to L2 and the layers L7 to L8 of the middle through hole 11 are removed, a back drilled hole 111 is formed in the removed hole wall part, a blind hole 112 is formed in the non-removed hole wall part, and the back drilled hole 111 is 0.05mm to 0.2mm larger than the blind hole 112, for example, the hole diameter of the blind hole 112 is 0.2mm, and the hole diameter of the back drilled hole is 0.3mm.
S6, plugging holes with resin: the through hole 11 is filled with resin and dried as shown in fig. 6.
Example 2
The present embodiment provides an eight-layer board, the seven through holes 11 of the eight-layer board are distributed as shown in fig. 17, and for convenience of description, each of the positions is respectively named as 1-1, 1-2, 1-3, 1-4, 1-5, 1-6, and 1-7, where 1-1 is a blind hole structure of L2-L7 layer, 1-2 is a blind hole structure of L4-L8 layer, 1-3 is a blind hole structure of L1-L2 layer, 1-4 is a blind hole structure of L3-L6 layer, 1-5 is a blind hole structure of L1-L5 layer, 1-6 is a blind hole structure of L1-L4 layer, and 1-7 is a blind hole structure of L7-L8 layer.
Example 3
As shown in fig. 7, the present embodiment provides a multilayer plate hole processing apparatus, which can be used in the drilling and back drilling steps of the eight-layer plate in the processing process in embodiment 2, and the multilayer plate hole processing apparatus includes an operation table 2, a through hole processing assembly 3, two second lifting mechanisms 4, a first driving mechanism, an upper layer hole processing assembly 5, a stroke assembly, and a lower layer hole processing assembly.
Specifically, 2 center departments of operation panel are equipped with the logical groove that runs through itself, lead to the groove and be equipped with the round standing groove outward for place the eight plywood of treating drilling, 2 bilateral symmetry of operation panel are equipped with two first elevating system 22, and one of them mode of first elevating system 22 adopts the first lifter of pneumatic cylinder drive.
Specifically, the through-hole machining assembly 3 is used for machining seven through holes 11 at predetermined positions of eight plates, as shown in fig. 8 and 9, and includes a lifting plate 32 and seven drills, wherein the lifting plate 32 is supported on top of the first lifting mechanism 22, and it is noted that the lifting plate is only supported and not fixedly connected. Seven through holes 321 and seven circular grooves 322 are arranged on the lifting plate 32, a cross-shaped block 323 is arranged on the periphery of the top of each through hole 321, each cross-shaped block 323 is located in each circular groove 322, a circular plate 324 is arranged in each circular groove 322, the bottom of each circular plate 324 is connected to each circular groove 322 through a plurality of springs 325, each circular plate 324 slides up and down along the inner wall of each circular groove 322 under the action of external force, a drill is arranged in the corresponding through hole 321 and is in rotating fit with the corresponding through hole 321 in the horizontal plane under the action of external force, the bottom of each drill is opposite to eight-layer plates to be drilled, the seven drill positions are distributed as shown in fig. 18 and correspond to the eight-layer plates 1-1, 1-2, 1-3, 1-4, 1-5, 1-6 and 1-7, a cross-shaped groove 311 is arranged on the top of each drill, the outer wall of each circular plate 324 is tightly attached to the circular grooves 322, the inner walls of the circular plates 324 are tightly attached to the cross-shaped blocks 323 and the outer walls of the cross-shaped grooves 311, and the top surfaces of the circular plates 324 are lower than the top surfaces of the lifting plate 32 and higher than the top surfaces of the cross-shaped grooves 311 as shown in fig. 16.
Specifically, the tops of the two second lifting mechanisms 4 are connected to two ends of the top plate 41, and one of the second lifting mechanisms 4 adopts a hydraulic cylinder or an air cylinder to drive the second lifting rod. Seven lower plug-ins are arranged on the top plate 41 in a rotating mode, a first driving mechanism is arranged at the top of the top plate 41 and used for driving all the lower plug-ins to rotate, the first driving mechanism is a conventional mechanism, one of the driving mechanisms is realized by a motor, a chain wheel and a chain, the bottom of each chain wheel penetrates through the top plate 41 through an upright post, and then the corresponding lower plug-ins are connected. As shown in fig. 10 and 11, the lower insert includes a circular ring 42 and a cross-shaped insert 43 located in the circular ring 42, the cross-shaped insert 43 is used to be inserted downward into the cross-shaped groove 311 to complete the assembly of the lower insert with the drill, the circular ring 42 is used to press the circular plate 324 downward to make the top surface of the circular plate 324 lower than the bottom surface of the cross-shaped groove 311, so that the drill can rotate with the lower insert, and when the lower insert is noticed to move downward, the cross-shaped insert 43 is inserted into the cross-shaped groove 311 before the top surface of the circular plate 324 is lower than the bottom surface of the cross-shaped groove 311, so as to prevent the circular plate 324 from releasing the cross-shaped groove 311 and the cross-shaped insert 43 is not yet inserted into the free space of the cross-shaped groove 311, and in this free space, the drill loses the restriction and a certain angle of rotation may occur to affect the assembly of the lower insert with the drill. After the lower plug-in unit moves upwards to separate from the cross-shaped slot 311, the circular plate 324 is reset under the action of the spring 325, and when the cross-shaped plug-in block 43 is not completely separated from the cross-shaped slot 311, the top surface of the circular plate 324 is already higher than the bottom surface of the cross-shaped slot 311, and the circular plate 324 limits the cross-shaped slot 311, so that the drill bit is ensured not to rotate when not in use.
Specifically, the upper layer hole machining assembly 5 includes four drill bits, the four drill bits are distributed as shown in fig. 19, and are used for corresponding to eight-layer plates 1-1, 1-2, 1-4 and 1-7, and removing hole walls of L1 layers at 1-1, L1-L4 layers at 1-2, L1-L2 layers at 1-4 and L1-L6 layers at 1-7, the upper layer hole machining assembly 5 is identical to the through hole machining assembly 3 in structure, and different points are that: the outer diameter of the drill of the upper layer hole machining assembly 5 is larger than that of the drill of the latter, the number of the drill is smaller than that of the drill of the latter, the four drill are different in length and are arranged according to requirements, wherein the drill corresponding to the eight layers of plates 1-7 is the longest, and the drill corresponding to the eight layers of plates 1-1 is the shortest.
Specifically, as shown in fig. 12 and 15, the lower layer hole machining assembly is disposed below the through groove of the operating table 2, and includes a bottom plate 7, five drill bits, a third lifting mechanism and a second driving mechanism, wherein one of the third lifting mechanism adopts a hydraulic cylinder to drive a third lifting rod for lifting the bottom plate 7, the five drill bits are rotatably disposed on the bottom plate 7, the second driving mechanism is disposed at the bottom of the bottom plate 7 for driving all the drill bits to rotate, and the structure of the second driving mechanism is the same as that of the first driving mechanism. Note that the cross-shaped groove 311 is not formed in the drill of the lower hole machining assembly, and the drill is directly and fixedly connected with the second driving mechanism. The five drill bits are distributed as shown in fig. 20, and are used for corresponding to eight-layer plates 1-1, 1-3, 1-4, 1-5 and 1-6 and removing hole walls of 1-1L 8 layer, 1-3L 3-L8 layer, 1-4L 7-L8 layer, 1-5L 6-L8 layer and 1-6L 5-L8 layer, wherein the outer diameter of the drill bit of the lower layer hole processing assembly is larger than that of the drill bit of the through hole processing assembly 3, the number of the drill bits is smaller than that of the drill bit of the latter, the five drill bits are different in length and are arranged as required, wherein the drill bit corresponding to the eight-layer plate 1-3 is the longest, and the drill bit corresponding to the eight-layer plate 1-1 is the shortest.
Specifically, the stroke assembly is used to alternately place the through-hole machining assembly 3 and the upper-layer hole machining assembly 5 on top of the first lifting mechanism 22, so it can be further understood herein that the aforementioned "the lifting plate 32 is only supported on top of the first lifting mechanism 22, and is not fixedly connected" for the purpose of facilitating replacement of the through-hole machining assembly 3 and the upper-layer hole machining assembly 5. One way of the stroke assembly is as follows: telescopic machanism 6 including the level setting, operation panel 2 sets up two sets of spouts 21 along its length direction, and through-hole machining subassembly 3 is located the region in the middle of two sets of spouts 21, 5 both ends of upper hole machining subassembly slide in one of them set of spout 21, upper hole machining subassembly 5 and 3 highly uniform of through-hole machining subassembly, be connected through first activity buckle between upper hole machining subassembly 5 and the through-hole machining subassembly 3, telescopic machanism 6 one of them mode adopts hydraulic drive's telescopic link, telescopic machanism 6 connects the upper hole machining subassembly 5 outsides through second activity buckle. When the telescoping mechanism 6 is in the retracted state, the through-hole machining assembly 3 is positioned on top of the first elevating mechanism 22. When the telescopic mechanism 6 is in an extended state, the upper hole machining assembly 5 is forced to move to the top of the first lifting mechanism 22, and the through hole machining assembly 3 moves into the other group of sliding grooves 21.
The first movable buckle has the functions of: when the upper layer hole machining assembly 5 is consistent with the through hole machining assembly 3 in height, the first movable buckle enables the upper layer hole machining assembly 5 and the through hole machining assembly 3 to be interlocked, and therefore the upper layer hole machining assembly 5 is moved back and forth in the horizontal direction through the telescopic mechanism 6; when the upper layer hole machining assembly 5 or the through hole machining assembly 3 moves downwards, the first movable buckle does not influence the movement of the upper layer hole machining assembly. Therefore, in this embodiment, as shown in fig. 13 and 14, the first movable buckle includes four L-shaped strips 33, two of the L-shaped strips are connected to the through hole processing component 3, the other two L-shaped strips are connected to corresponding positions of the upper layer hole processing component 5, and the two L-shaped strips 33 are in a group and are in up-and-down sliding fit. In order to increase the stability, the length of the L-shaped strip 33 ensures that the L-shaped strips 33 of the upper layer hole processing assembly 5 and the through hole processing assembly 3 are always attached when one of the two moves downwards.
The second movable buckle has the following functions: when the upper layer hole machining assembly 5 and the through hole machining assembly 3 are consistent in height, the second movable buckle enables the upper layer hole machining assembly 5 and the through hole machining assembly 3 to be interlocked, and therefore the upper layer hole machining assembly 5 can be moved back and forth in the horizontal direction through the telescopic mechanism 6; when the upper hole machining assembly 5 is located on top of the first lifting mechanism 22 and moves downwards, the second movable buckle does not influence the movement of the first lifting mechanism. Therefore, in this embodiment, the second movable buckle includes the inverted U-shaped plate 61 and the connecting plate 62, wherein one of the branch sections of the inverted U-shaped plate 61 is connected with the telescopic mechanism 6, the connecting plate 62 is connected with the upper hole machining assembly 5, and the connecting plate 62 is provided with a clamping groove for matching with the other branch section of the inverted U-shaped plate 61.
Example 4
As shown in fig. 21, the present embodiment provides a method for processing a blind hole by using a back drilling method, and the multilayer board hole processing apparatus in embodiment 3 includes the following steps:
s1, processing of an inner-layer core plate: the three inner-layer core plates are processed through the steps of cutting, coating, exposing, developing, etching, browning and the like.
S2, pressing: three inner core plates, two copper foils and four PPs are overlapped together, the copper foils, the PPs, the inner core plates, the PPs and the copper foils are sequentially arranged from top to bottom, and the eight-layer plate is formed through hot pressing.
S3, drilling: placing the eight-layer board to be drilled into a placing groove, positioning by using a positioning assembly, wherein the through hole machining assembly 3 is positioned at the top of the first lifting mechanism 22, lowering the top plate 41 by using the second lifting mechanism 4 so that the cross-shaped inserting block 43 is downwards inserted into the cross-shaped groove 311, pressing the circular plate 324 by using the circular ring 42, and completing assembly when the top surface of the circular plate 324 is lower than the bottom surface of the cross-shaped groove 311; the second lifting mechanism 4 and the first lifting mechanism 22 enable the top plate 41 and the through hole machining assembly 3 to synchronously move downwards, and then the first driving mechanism drives all the lower plug-in units and the drill bits to rotate so as to finish eight-layer plate drilling; then, the second lifting mechanism 4 and the first lifting mechanism 22 move the top plate 41 and the through-hole machining module 3 up synchronously to reset.
S4, hole metallization: the hole wall of the through hole 11 is metallized.
S5, back drilling: the upper layer hole machining assembly 5 is arranged at the top of the first lifting mechanism 22 through the stroke assembly, the upper part hole wall of the partial through hole 11 is removed through the cooperation of the first lifting mechanism 22, the second lifting mechanism 4, the first driving mechanism and the upper layer hole machining assembly 5, and the lower part hole wall of the partial through hole 11 is removed through the lower layer hole machining assembly.
S6, plugging holes with resin: and filling resin into the through hole 11 and drying.
In conclusion, the embodiment only needs to perform the pressing process once, so that the processing flow is saved, the processing of the crossed blind buried hole can be realized, and the laser drilling process with higher cost is not needed. The method can be used for processing the blind hole structures of all materials, and is particularly suitable for processing the blind holes of high-frequency and high-speed materials. The two-sided different positions of eight plywood all need process out back drilling hole 111, and the degree of depth of different positions back drilling hole 111 is different, and this embodiment utilizes same set of multilayer diaphragm orifice processingequipment both can carry out the drilling step, can carry out the back drilling step again, only need utilize the stroke subassembly with upper strata hole processing subassembly 5 and through-hole processing subassembly 3 arrange in first elevating system 22 top in turn can, easy operation.
The above embodiments are only for illustrating the technical ideas and features of the present invention, and are not meant to be exclusive or limiting of the present invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention.
Claims (10)
1. A multilayer plate hole processingequipment which characterized in that includes:
the center of the operating platform (2) is provided with a through groove penetrating through the operating platform, a circle of placing grooves are formed outside the through groove and used for placing a multilayer board, and two first lifting mechanisms (22) are symmetrically arranged on two sides of the operating platform (2);
the through hole processing assembly (3) is used for processing a plurality of through holes (11) at preset positions of the multilayer board, and comprises a lifting plate (32) and a plurality of drill bits, wherein the lifting plate (32) is supported at the top of a first lifting mechanism (22), the lifting plate (32) is provided with a plurality of through holes (321) and a plurality of circular grooves (322), the periphery of the top of each through hole (321) is provided with a cross-shaped block (323), the cross-shaped block (323) is positioned in the circular groove (322), a circular plate (324) is slidably arranged in the circular groove (322), the bottom of the circular plate (324) is connected to the circular groove (322) through a plurality of springs (325), the drill bits are rotatably arranged in the corresponding through holes (321), the bottom of the multilayer board faces the to-be-drilled holes, the top of the multilayer board is provided with cross-shaped grooves (311), the inner walls of the circular plate (324) are tightly attached to the outer walls of the cross-shaped blocks (323) and the cross-shaped grooves (311), and the top surfaces of the circular plate (324) are lower than the top surfaces of the cross-shaped grooves (311) and higher than the lifting plate (32);
the tops of the two second lifting mechanisms (4) are connected with two ends of the top plate (41), a plurality of lower plug-in units are arranged on the top plate (41) in a rotating mode, each lower plug-in unit comprises a circular ring (42) and a cross plug-in block (43) located in the circular ring (42), the cross plug-in blocks (43) are used for being downwards inserted into the cross grooves (311), and the circular ring (42) is used for downwards pressing the circular plate (324);
the first driving mechanism is arranged at the top of the top plate (41) and used for driving all the lower plug-ins to rotate;
an upper layer hole machining assembly (5) for machining the upper part of the through hole (11) into a back-drilled hole (111) having the same structure as the through hole machining assembly (3) and having a larger outer diameter of the drill than the latter and a smaller number of drills than the latter;
the stroke assembly is used for alternately placing the through hole machining assembly (3) and the upper layer hole machining assembly (5) on the top of the first lifting mechanism (22);
and the lower layer hole machining assembly is arranged below the through groove of the operating platform (2) and is used for machining the lower part of the through hole (11) into a back drilling hole (111), the outer diameter of a drill bit of the lower layer hole machining assembly is larger than that of the drill bit of the through hole machining assembly (3), and the number of the drill bits is less than that of the drill bit of the through hole machining assembly.
2. The multilayer plate hole machining device according to claim 1, wherein the operating platform (2) is provided with two sets of sliding grooves (21) along the length direction thereof, the through hole machining assembly (3) is located between the two sets of sliding grooves (21), two ends of the upper layer hole machining assembly (5) slide in one set of sliding grooves (21), the upper layer hole machining assembly (5) is in height consistency with the through hole machining assembly (3), the upper layer hole machining assembly (5) is connected with the through hole machining assembly (3) through a first movable buckle, and the stroke assembly comprises a telescopic mechanism (6) which is connected with the outer side of the upper layer hole machining assembly (5) through a second movable buckle.
3. The multilayer plate hole machining device according to claim 2, characterized in that the first movable buckle comprises a plurality of L-shaped long strips (33), wherein one half of the L-shaped long strips is connected to the through hole machining assembly (3), the other half of the L-shaped long strips is connected to the corresponding position of the upper layer hole machining assembly (5), and two corresponding L-shaped long strips (33) form a group and are in up-and-down sliding fit.
4. The multilayer plate hole machining device according to claim 3, wherein the second movable buckle comprises an inverted U-shaped plate (61) and a connecting plate (62), one branch section of the inverted U-shaped plate (61) is connected with the telescopic mechanism (6), the connecting plate (62) is connected with the upper layer hole machining assembly (5), and a clamping groove is formed in the connecting plate (62) and used for being matched with the other branch section of the inverted U-shaped plate (61).
5. The multilayer plate hole machining device according to claim 3, characterized in that when the telescopic mechanism (6) is in a contracted state, the through hole machining assembly (3) is positioned on the top of the first lifting mechanism (22); when the telescopic mechanism (6) is in an extension state, the upper layer hole machining assembly (5) is forced to move to the top of the first lifting mechanism (22), and the through hole machining assembly (3) moves into the other group of sliding grooves (21).
6. The multilayer plate hole machining device according to claim 3, wherein the lower layer hole machining assembly comprises a bottom plate (7), a plurality of drill bits, a third lifting mechanism and a second driving mechanism, the third lifting mechanism is used for lifting the bottom plate (7), the plurality of drill bits are rotatably arranged on the bottom plate (7), and the second driving mechanism is arranged at the bottom of the bottom plate (7) and is used for driving all the drill bits to rotate.
7. A method for processing a blind hole by a back drilling method is characterized by comprising the following steps:
s1, processing a plurality of inner-layer core plates: cutting, coating, exposing, developing, etching and browning;
s2, pressing: sequentially overlapping a plurality of inner-layer core plates, separating the two layers by using PP, overlapping PP and copper foil outside the inner-layer core plates, and performing hot pressing to form a multilayer plate;
s3, drilling: machining a plurality of through holes (11) at preset positions by using the multilayer plate hole machining device as defined in any one of claims 3 to 6, wherein the machining method specifically comprises the following steps:
placing the multilayer board in a placing groove, enabling the through hole machining assembly (3) to be located at the top of the first lifting mechanism (22), enabling the top board (41) to descend through the second lifting mechanism (4), enabling the cross-shaped inserting block (43) to be inserted into the cross-shaped groove (311) downwards, enabling the circular ring (42) to press the circular board (324), and completing assembly when the top surface of the circular board (324) is lower than the bottom surface of the cross-shaped groove (311); the second lifting mechanism (4) and the first lifting mechanism (22) enable the top plate (41) and the through hole machining assembly (3) to synchronously move downwards, and then the first driving mechanism drives all the lower plug-in units and the drill bits to rotate, so that drilling of the multilayer board is completed; resetting;
s4, hole metallization: metallizing the wall of the through hole (11);
s5, back drilling: removing part of the hole wall of the through hole (11), wherein the part with the hole wall removed forms a back drilling hole (111), the part without the hole wall removed forms a blind hole (112), and the specific method for removing the hole wall comprises the following steps:
the upper layer hole machining assembly (5) is arranged at the top of the first lifting mechanism (22) through the stroke assembly, the upper part of the hole wall of a part of through holes (11) is removed through the cooperation of the first lifting mechanism (22), the second lifting mechanism (4), the first driving mechanism and the upper layer hole machining assembly (5), and the lower part of the hole wall of the part of through holes (11) is removed through the lower layer hole machining assembly;
s6, plugging holes with resin: and filling resin into the through hole (11) and drying.
8. Method for machining blind holes by back drilling according to claim 7, characterized in that the back drilled hole (111) has a diameter of 0.05mm to 0.2mm larger than the diameter of the blind hole (112).
9. The method for processing a blind hole by back drilling according to claim 7, wherein in step S3, when the through hole processing assembly (3) moves downwards, the L-shaped strip (33) between the upper layer hole processing assembly (5) and the through hole processing assembly (3) is always attached.
10. The method for processing the blind hole by the back drilling method according to claim 7, wherein in step S5, when the upper layer hole processing assembly (5) is placed on top of the first lifting mechanism (22), the telescopic mechanism (6) is extended to force the upper layer hole processing assembly (5) to be separated from one group of sliding grooves (21) and move to the top of the first lifting mechanism (22), and the through hole processing assembly (3) moves into the other group of sliding grooves (21).
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006173375A (en) * | 2004-12-16 | 2006-06-29 | Tyco Electronics Amp Kk | Substrate through-hole processing device |
| US20070010086A1 (en) * | 2005-07-06 | 2007-01-11 | Delta Electronics, Inc. | Circuit board with a through hole wire and manufacturing method thereof |
| US20090188710A1 (en) * | 2008-01-30 | 2009-07-30 | Cisco Technology, Inc. | System and method for forming filled vias and plated through holes |
| CN104551088A (en) * | 2014-12-23 | 2015-04-29 | 深圳市五株科技股份有限公司 | Printed circuit board backdrill device and backdrill method |
| CN105491800A (en) * | 2015-12-23 | 2016-04-13 | 江门崇达电路技术有限公司 | Fabrication method of PCB with back-drill hole |
| CN106793577A (en) * | 2017-01-16 | 2017-05-31 | 生益电子股份有限公司 | The preparation method and PCB of a kind of High-Speed PCB |
| CN109465905A (en) * | 2018-09-01 | 2019-03-15 | 浙江众亿智能科技有限公司 | A kind of desktop type annular perforating device of helicopter main wing connector |
| CN110839321A (en) * | 2018-08-17 | 2020-02-25 | 深南电路股份有限公司 | PCB back drilling processing equipment and processing method thereof |
| CN110868803A (en) * | 2018-08-28 | 2020-03-06 | 深南电路股份有限公司 | Machining method and system of micro-hole back drill and printed circuit board |
| CN111050494A (en) * | 2019-12-31 | 2020-04-21 | 大连崇达电子有限公司 | Manufacturing method of back drilling hole in circuit board |
-
2023
- 2023-02-22 CN CN202310150431.5A patent/CN115835533B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006173375A (en) * | 2004-12-16 | 2006-06-29 | Tyco Electronics Amp Kk | Substrate through-hole processing device |
| US20070010086A1 (en) * | 2005-07-06 | 2007-01-11 | Delta Electronics, Inc. | Circuit board with a through hole wire and manufacturing method thereof |
| US20090188710A1 (en) * | 2008-01-30 | 2009-07-30 | Cisco Technology, Inc. | System and method for forming filled vias and plated through holes |
| CN104551088A (en) * | 2014-12-23 | 2015-04-29 | 深圳市五株科技股份有限公司 | Printed circuit board backdrill device and backdrill method |
| CN105491800A (en) * | 2015-12-23 | 2016-04-13 | 江门崇达电路技术有限公司 | Fabrication method of PCB with back-drill hole |
| CN106793577A (en) * | 2017-01-16 | 2017-05-31 | 生益电子股份有限公司 | The preparation method and PCB of a kind of High-Speed PCB |
| CN110839321A (en) * | 2018-08-17 | 2020-02-25 | 深南电路股份有限公司 | PCB back drilling processing equipment and processing method thereof |
| CN110868803A (en) * | 2018-08-28 | 2020-03-06 | 深南电路股份有限公司 | Machining method and system of micro-hole back drill and printed circuit board |
| CN109465905A (en) * | 2018-09-01 | 2019-03-15 | 浙江众亿智能科技有限公司 | A kind of desktop type annular perforating device of helicopter main wing connector |
| CN111050494A (en) * | 2019-12-31 | 2020-04-21 | 大连崇达电子有限公司 | Manufacturing method of back drilling hole in circuit board |
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