CN115835533B - Multilayer plate hole machining device and method for machining blind holes by back drilling method - Google Patents
Multilayer plate hole machining device and method for machining blind holes by back drilling method Download PDFInfo
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- CN115835533B CN115835533B CN202310150431.5A CN202310150431A CN115835533B CN 115835533 B CN115835533 B CN 115835533B CN 202310150431 A CN202310150431 A CN 202310150431A CN 115835533 B CN115835533 B CN 115835533B
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Abstract
The invention discloses a multilayer plate hole machining device and a method for machining blind holes by adopting a back drilling method, which relate to the technical field of printed circuit board machining, and the method comprises the following steps: s1, processing a plurality of inner core plates: cutting, coating, exposing, developing, etching and browning; s2, laminating: sequentially overlapping a plurality of inner core plates, separating two layers by using PP (Polypropylene), overlapping PP and copper foil outside the inner core plates, and performing hot pressing to form a multi-layer plate; s3, drilling: processing a plurality of through holes at preset positions by using a multilayer plate hole processing device; s4, hole metallization: carrying out metallization treatment on the hole wall of the through hole; s5, back drilling: removing part of the hole wall of the through hole, removing part of the hole wall to form a back drilling hole, and removing part of the hole wall to form a blind hole; s6, plugging holes of the resin: and filling resin into the through holes and drying. The scheme of the invention can realize the processing of the cross blind buried holes of all materials, and does not need to carry out a laser drilling process with higher cost.
Description
Technical Field
The invention relates to the technical field of printed circuit board processing, in particular to a multilayer plate hole processing device and a method for processing blind holes by adopting a back drilling method.
Background
PCB, collectively Printed Circuit Board, chinese is a printed wiring board or printed circuit board. The printed circuit board is a carrier for electronic components, and often has a blind hole structure, wherein the blind hole is a through hole connecting the surface layer and the inner layer without penetrating through the whole board. There are two common blind hole processing methods, one is to process the blind hole layer in a through hole mode, and then press the blind hole layer into the printed circuit board to form the blind hole. Taking eight layers of blind hole plates as an example, including an L1 layer, an L2 layer, an L3 layer, an L4 layer, an L5 layer, an L6 layer, an L7 layer and an L8 layer from top to bottom, if the eight layers of blind hole plates have L1-L4 and L5-L8 layer blind hole structures, the processing process is to press-fit the four layers of the L1-L4 layers and the four layers of the L5-L8 layers firstly, and then drill through the L1-L4 layers and the L5-L8 layer core plates in a through hole processing mode and metalize. Then, the L1-L4 layers and the L5-L8 layers are laminated together to obtain eight layers and simultaneously obtain blind hole structures of L1-L4 and L5-L8, and the method has the defect that intersecting blind holes cannot be processed, such as the blind hole structures of L1-L4, L3-L6 and L5-L8 in the eight layers, and cannot be processed. Another method for processing blind holes is a lamination method, which mainly adopts a laser drilling mode to penetrate through dielectric layers of adjacent layers, and then adopts a hole filling electroplating mode to conduct, and blind hole plates are formed by continuous accumulation.
Disclosure of Invention
In order to solve the defects in the prior art, the invention provides the multilayer plate hole processing device and the method for processing the blind holes by adopting the back drilling method, so that the processing of the cross blind buried holes of all materials can be realized, and the laser drilling process with higher cost is not needed.
In order to achieve the object of the invention, the following scheme is adopted:
a multilayer plate hole machining device comprises an operating platform, a through hole machining assembly, two second lifting mechanisms, a first driving mechanism, an upper layer hole machining assembly, a stroke assembly and a lower layer hole machining assembly.
The center of the operation desk is provided with a through groove penetrating the operation desk, a circle of placing grooves are arranged outside the through groove and used for placing the multilayer board, and two first lifting mechanisms are symmetrically arranged on two sides of the operation desk.
The through hole processing assembly is used for processing out a plurality of through holes in the multilayer board preset position department, including lifter plate, a plurality of drill bit, the lifter plate supports in first elevating system top, be equipped with a plurality of perforation and a plurality of circular slot on the lifter plate, perforation top periphery is equipped with the cross piece, the cross piece is located the circular slot, the slip is equipped with the plectane in the circular slot, the plectane bottom is through a plurality of spring coupling in the circular slot, drill bit rotation locates corresponding perforation, its bottom is to the multilayer board of waiting to bore, its top is equipped with the cross groove, the outer wall in cross piece and cross groove is hugged closely to plectane inner wall, the plectane top surface is less than cross groove top surface and is higher than the lifter plate.
The two ends of roof are connected at two second elevating system tops, rotate on the roof and are equipped with a plurality of inserts down, and the insert includes ring and is located the cross-shaped insert in the ring down, and cross-shaped insert is used for inserting the cross-shaped groove downwards, and the ring is used for pushing down the plectane. The first driving mechanism is arranged at the top of the top plate and used for driving all the lower plug-ins to rotate.
The upper layer hole processing assembly is used for processing the upper part of the through hole into back drilling holes, the structure of the upper layer hole processing assembly is the same as that of the through hole processing assembly, the outer diameter of the drill bit is larger than that of the drill bit of the through hole processing assembly, the number of the drill bits is smaller than that of the drill bits of the drill bit, and the length of each drill bit is set according to actual conditions. The stroke component is used for alternately placing the through hole processing component and the upper layer hole processing component on the top of the first lifting mechanism.
The lower layer hole processing assembly is arranged below the through groove of the operating platform and is used for processing the lower part of the through hole into back drilling holes, the outer diameter of the drill bit is larger than that of the drill bit of the through hole processing assembly, the number of the drill bits is smaller than that of the drill bits of the through hole processing assembly, and the length of each drill bit is set according to actual conditions.
Further, the operation panel sets up two sets of spouts along its length direction, and the through-hole processing subassembly is located in the middle of two sets of spouts, and upper hole processing subassembly both ends slide in one of them a set of spout, and upper hole processing subassembly is high unanimous with the through-hole processing subassembly, is connected through first movable buckle between upper hole processing subassembly and the through-hole processing subassembly, and the stroke subassembly includes telescopic machanism, and it is outside through the upper hole processing subassembly of second movable buckle connection.
Further, the first movable buckle comprises a plurality of L-shaped strips, one half of the L-shaped strips are connected to the through hole processing assembly, the other half of the L-shaped strips are connected to the corresponding positions of the upper layer hole processing assembly, and the two corresponding L-shaped strips are in a group and are in sliding fit up and down.
Further, the second movable buckle comprises an inverted U-shaped plate and a connecting plate, one section of the inverted U-shaped plate is connected with the telescopic mechanism, the connecting plate is connected with the upper layer hole processing assembly, and a clamping groove is formed in the connecting plate and used for matching with the other section of the inverted U-shaped plate.
Further, when the telescopic mechanism is in a contracted state, the through hole processing assembly is positioned at the top of the first lifting mechanism; when the telescopic mechanism is in an extension state, the upper layer hole processing assembly is forced to move to the top of the first lifting mechanism, and the through hole processing assembly moves into the other group of sliding grooves.
Further, the lower-layer hole processing assembly comprises a bottom plate, a plurality of drill bits, a third lifting mechanism and a second driving mechanism, wherein the third lifting mechanism is used for lifting the bottom plate, the drill bits are rotationally arranged on the bottom plate, and the second driving mechanism is arranged at the bottom of the bottom plate and is used for driving all the drill bits to rotate.
A method for processing a blind hole by adopting a back drilling method, comprising the following steps:
s1, processing a plurality of inner core plates: cutting, coating, exposing, developing, etching and browning;
s2, laminating: sequentially overlapping a plurality of inner core plates, separating two layers by using PP (Polypropylene), overlapping PP and copper foil outside the inner core plates, and performing hot pressing to form a multi-layer plate;
s3, drilling: and processing a plurality of through holes at preset positions by using the multilayer plate hole processing device, which specifically comprises the following steps:
placing the multilayer board in a placing groove, arranging a through hole processing assembly at the top of the first lifting mechanism, and descending the top plate by using the second lifting mechanism so that the cross-shaped inserting block is downwards inserted into the cross-shaped groove, pressing the circular plate by the circular ring, and completing assembly when the top surface of the circular plate is lower than the bottom surface of the cross-shaped groove; the second lifting mechanism and the first lifting mechanism enable the top plate and the through hole machining assembly to synchronously move downwards, and then the first driving mechanism drives all the lower plug-ins and the drill bit to rotate, so that the drilling of the multilayer board is completed; resetting;
s4, hole metallization: carrying out metallization treatment on the hole wall of the through hole;
s5, back drilling: removing part of the hole wall of the through hole, forming back drilling holes at the part of the removed hole wall, forming blind holes at the part of the non-removed hole wall, and removing the hole wall, wherein the concrete method comprises the following steps:
the upper layer hole machining assembly is arranged at the top of the first lifting mechanism by utilizing the stroke assembly, the upper part hole wall of a part of the through hole is removed by utilizing the cooperation of the first lifting mechanism, the second lifting mechanism, the first driving mechanism and the upper layer hole machining assembly, and the lower part hole wall of a part of the through hole is removed by utilizing the lower layer hole machining assembly;
s6, plugging holes of the resin: and filling resin into the through holes and drying.
Further, the back drilling hole is 0.05mm-0.2mm larger than the aperture of the blind hole.
Further, in step S3, when the through hole processing assembly moves down, the L-shaped strip between the upper layer hole processing assembly and the through hole processing assembly is always attached.
Further, in step S5, when the upper hole processing assembly is placed on top of the first lifting mechanism, the telescopic mechanism stretches to force the upper hole processing assembly to separate from one set of sliding grooves and move to the top of the first lifting mechanism, and the through hole processing assembly moves into the other set of sliding grooves.
The invention has the beneficial effects that:
(1) Only one pressing process is needed, so that the processing flow is saved, the processing of the cross blind buried holes can be realized, and the laser drilling process with higher cost is not needed.
(2) The method can process blind hole structures of all materials, and is particularly suitable for processing blind holes of high-frequency and high-speed materials.
(3) The back drilling holes are needed to be machined at different positions of the double sides of the multi-layer board, the depths of the back drilling holes at different positions are different, the drilling step and the back drilling step can be performed by using the same multi-layer board hole machining device, and only the stroke component is needed to alternately place the upper layer hole machining component and the through hole machining component at the top of the first lifting mechanism, so that the operation is simple.
Drawings
FIG. 1 is a side view of the inner core panel of example 1;
FIG. 2 is a side view of the laminated multiwall sheet of example 1;
FIG. 3 is a side view of the multiwall sheet of example 1 after drilling;
FIG. 4 is a side view of the multilayer plate hole of example 1 after metallization;
FIG. 5 is a side view of the multi-layer plate of example 1 after backdrilling;
FIG. 6 is a side view of the multilayer board of example 1 after plugging the resin holes;
FIG. 7 is a block diagram showing a multilayer plate hole processing apparatus according to example 3;
FIG. 8 is a top view of the lifter plate in accordance with example 3;
FIG. 9 is an enlarged view of a portion of FIG. 8 at A;
fig. 10 is a bottom plate structure diagram of embodiment 3;
FIG. 11 is an enlarged view of a portion of FIG. 10 at B;
FIG. 12 is a right side view of the multilayer plate hole machining apparatus of example 3;
FIG. 13 is a top view of the multilayer plate hole machining apparatus of example 3;
FIG. 14 is an enlarged view of a portion of FIG. 13 at C;
FIG. 15 is a front view of the multilayer plate hole machining apparatus of example 3;
FIG. 16 is an enlarged view of a portion of FIG. 15 at D;
FIG. 17 is a through hole position distribution diagram of a multilayer board of example 2;
FIG. 18 is a top view of the bit location distribution of the through-hole processing assembly of example 2;
FIG. 19 is a top view of the bit position profile of the upper hole machining assembly of example 2;
FIG. 20 is a top view of the bit position profile of the lower hole machining assembly of example 2;
FIG. 21 is a flow chart of a method for processing blind holes in example 4;
reference numerals: the device comprises a through hole-11, a back drilling hole-111, a blind hole-112, an operation table-2, a first lifting mechanism-22, a through hole machining component-3, a lifting plate-32, a through hole-321, a circular groove-322, a cross-shaped block-323, a circular plate-324, a spring-325, a cross-shaped groove-311, a second lifting mechanism-4, a top plate-41, a circular ring-42, a cross-shaped insert block-43, an upper layer hole machining component-5, a chute-21, a telescopic mechanism-6, an L-shaped strip-33, an inverted U-shaped plate-61, a connecting plate-62 and a bottom plate-7.
Detailed Description
Example 1
The embodiment provides a method for processing blind holes by adopting a back drilling method, taking eight layers as an example, including an L1 layer, an L2 layer, an L3 layer, an L4 layer, an L5 layer, an L6 layer, an L7 layer and an L8 layer from top to bottom, comprising the following steps:
s1, processing an inner core plate: three inner core plates, each of which is shown in fig. 1, are processed through the steps of cutting, coating, exposing, developing, etching, browning, and the like.
S2, laminating: the three inner core plates, the two copper foils and the four PP are overlapped together, and the copper foils, the PP, the inner core plates, the PP and the copper foils are sequentially arranged from top to bottom, and eight layers of plates are formed through hot pressing, as shown in figure 2, wherein the three inner core plates form L2-L3 layers, L4-L5 layers and L6-L7 layers of the eight layers of plates.
S3, drilling: three through holes 11 are machined at the positions shown in fig. 3, each through hole 11 penetrating the entire eight-layer board.
S4, hole metallization: the walls of the three through holes 11 are metallized to realize the conduction of each layer, as shown in fig. 4.
S5, back drilling: as shown in FIG. 5, the L1-L4 layer hole wall of the left through hole 11 is removed, the L5-L8 layer hole wall of the right through hole 11 is removed, the L1-L2 layer and the L7-L8 layer hole wall of the middle through hole 11 are removed, the part with the hole wall removed forms a back drilling hole 111, the part without the hole wall removed forms a blind hole 112, the back drilling hole 111 is 0.05mm-0.2mm larger than the aperture of the blind hole 112, for example, the aperture of the blind hole 112 is 0.2mm, and the aperture of the back drilling hole is 0.3mm.
S6, plugging holes of the resin: the through holes 11 are filled with resin and baked as shown in fig. 6.
Example 2
The embodiment provides an eight-layer board, wherein seven through holes 11 of the eight-layer board are distributed as shown in fig. 17, and each position is named as 1-1, 1-2, 1-3, 1-4, 1-5, 1-6 and 1-7 respectively, wherein 1-1 is a blind hole structure of L2-L7 layers, 1-2 is a blind hole structure of L4-L8 layers, 1-3 is a blind hole structure of L1-L2 layers, 1-4 is a blind hole structure of L3-L6 layers, 1-5 is a blind hole structure of L1-L5 layers, 1-6 is a blind hole structure of L1-L4 layers, and 1-7 is a blind hole structure of L7-L8 layers.
Example 3
As shown in fig. 7, the present embodiment provides a multi-layer plate hole machining device, which can be used for the drilling and back drilling steps of the eight-layer plate in the machining process of embodiment 2, and the multi-layer plate hole machining device comprises an operation table 2, a through hole machining assembly 3, two second lifting mechanisms 4, a first driving mechanism, an upper layer hole machining assembly 5, a stroke assembly and a lower layer hole machining assembly.
Specifically, the center of the operation table 2 is provided with a through groove penetrating the operation table 2, a circle of placing groove is arranged outside the through groove and used for placing eight layers of plates to be drilled, two sides of the operation table 2 are symmetrically provided with two first lifting mechanisms 22, and one of the first lifting mechanisms 22 adopts a hydraulic cylinder to drive a first lifting rod.
Specifically, the through hole processing assembly 3 is used for processing seven through holes 11 at preset positions of eight layers, as shown in fig. 8 and 9, and includes a lifting plate 32 and seven drill bits, where the lifting plate 32 is supported on top of the first lifting mechanism 22, and note that the support is only the fixed connection. Seven through holes 321 and seven circular grooves 322 are formed in the lifting plate 32, a cross-shaped block 323 is arranged on the periphery of the top of each through hole 321, the cross-shaped block 323 is located in each circular groove 322, a circular plate 324 is arranged in each circular groove 322, the bottom of each circular plate 324 is connected to each circular groove 322 through a plurality of springs 325, each circular plate 324 slides up and down along the inner wall of each circular groove 322 under the action of external force, a drill bit is arranged in the corresponding through hole 321, the drill bit is in rotary fit with the corresponding through hole 321 in the horizontal plane under the action of external force, the bottom of each drill bit faces the eight layers of plates to be drilled, seven drill bit positions are distributed as shown in fig. 18 and correspond to the eight layers 1-1, 1-2, 1-3, 1-4, 1-5, 1-6 and 1-7, the cross-shaped grooves 311 are formed in the top of each drill bit, the outer wall of each circular plate 324 is tightly attached to the circular grooves 322, the inner wall of each circular plate 324 is tightly attached to the outer walls of the cross-shaped block 323 and the cross-shaped grooves 311, the top surface of each circular plate 324 is lower than the top surface of each cross-shaped groove 311, and is higher than the lifting plate 32, as shown in fig. 16.
Specifically, the top of the two second lifting mechanisms 4 is connected with two ends of the top plate 41, and one mode of the second lifting mechanisms 4 adopts a hydraulic cylinder or an air cylinder to drive the second lifting rods. Seven lower plug-ins are rotatably arranged on the top plate 41, a first driving mechanism is arranged at the top of the top plate 41 and used for driving all the lower plug-ins to rotate, the first driving mechanism is a conventional mechanism, one of the first driving mechanism is realized by a motor, a chain wheel and a chain, and the bottom of each chain wheel penetrates through the top plate 41 through an upright post and then is connected with the corresponding lower plug-in. As shown in fig. 10 and 11, the lower insert includes a circular ring 42 and a cross insert 43 positioned in the circular ring 42, the cross insert 43 is used for being inserted into the cross slot 311 downwards to complete the assembly of the lower insert and the drill bit, the circular ring 42 is used for pressing down the circular plate 324, the top surface of the circular plate 324 is lower than the bottom surface of the cross slot 311, so that the drill bit can rotate along with the lower insert, the lower insert moves downwards, before the top surface of the circular plate 324 is lower than the bottom surface of the cross slot 311, the cross insert 43 is inserted into the cross slot 311, so as to prevent the circular plate 324 from releasing the cross slot 311, but the cross insert 43 is not inserted into the neutral position of the cross slot 311, and in the neutral position, the drill bit loses restriction and can rotate at a certain angle, and the assembly of the lower insert and the drill bit is affected. When the lower insert moves upwards to separate from the cross-shaped groove 311 and the circular plate 324 is reset under the action of the spring 325 and the cross-shaped insert 43 is not completely separated from the cross-shaped groove 311, the top surface of the circular plate 324 is higher than the bottom surface of the cross-shaped groove 311, and the circular plate 324 limits the cross-shaped groove 311, so that the drill bit is ensured not to rotate under the condition of no use.
Specifically, the upper hole processing assembly 5 includes four drill bits, and the four drill bit position distributions are shown in fig. 19, and are used for corresponding to the eight layers 1-1, 1-2, 1-4, and 1-7, and for removing the L1 layer at 1-1, the L1-L4 layer at 1-2, the L1-L2 layer at 1-4, and the L1-L6 layer hole wall at 1-7, where the upper hole processing assembly 5 has the same structure as the through hole processing assembly 3, and the difference is that: the outer diameter of the drill bits of the upper layer hole processing assembly 5 is larger than that of the drill bits of the upper layer hole processing assembly, the number of the drill bits is smaller than that of the drill bits of the upper layer hole processing assembly, the lengths of the four drill bits are different, and the drill bits are set according to requirements, wherein the drill bits corresponding to the eight layers of plates 1-7 are longest, and the drill bits corresponding to the eight layers of plates 1-1 are shortest.
Specifically, as shown in fig. 12 and 15, the lower hole machining assembly is disposed below the through groove of the operating platform 2, and includes a base plate 7, five drill bits, a third lifting mechanism, and a second driving mechanism, where one mode of the third lifting mechanism adopts a hydraulic cylinder to drive a third lifting rod for lifting the base plate 7, the five drill bits are rotationally disposed on the base plate 7, the second driving mechanism is disposed at the bottom of the base plate 7 and is used for driving all drill bits to rotate, and the second driving mechanism has the same structure as the first driving mechanism. Note that the drill bit of the lower hole processing assembly is not provided with the cross-shaped groove 311, and the drill bit thereof is directly and fixedly connected with the second driving mechanism. The five drill bit position distributions are shown in fig. 20, and are used for corresponding to eight layers 1-1, 1-3, 1-4, 1-5 and 1-6, removing L8 layers at 1-1, L3-L8 layers at 1-3, L7-L8 layers at 1-4, L6-L8 layers at 1-5 and L5-L8 layers at 1-6, wherein the outer diameter of the drill bit of the lower layer hole processing assembly is larger than that of the drill bit of the through hole processing assembly 3, the number of the drill bits is smaller than that of the drill bit of the lower layer hole processing assembly, the lengths of the five drill bits are different, and the drill bits are set according to requirements, wherein the drill bit corresponding to the eight layers 1-3 is longest, and the drill bit corresponding to the eight layers 1-1 is shortest.
In particular, the stroke assembly is used to place the through-hole machining assembly 3 and the upper hole machining assembly 5 on top of the first lifting mechanism 22 alternately, so it will be further understood that the foregoing description of "the lifting plate 32 is supported on top of the first lifting mechanism 22, and is not fixedly connected" or is used to facilitate replacement of both the through-hole machining assembly 3 and the upper hole machining assembly 5. One way of the travel assembly is: including telescopic machanism 6 that the level set up, operating panel 2 sets up two sets of spouts 21 along its length direction, and the region that through-hole processing subassembly 3 is located the middle of two sets of spouts 21, upper hole processing subassembly 5 both ends slip in one of them a set of spout 21, upper hole processing subassembly 5 highly uniform with through-hole processing subassembly 3, be connected through first movable buckle between upper hole processing subassembly 5 and the through-hole processing subassembly 3, telescopic machanism 6 one of them mode adopts hydraulic drive's telescopic link, telescopic machanism 6 passes through the second movable buckle and connects the upper hole processing subassembly 5 outside. When the telescopic mechanism 6 is in the contracted state, the through-hole processing assembly 3 is positioned on top of the first lifting mechanism 22. When the telescopic mechanism 6 is in the extended state, the upper layer hole processing assembly 5 is forced to move to the top of the first lifting mechanism 22, and the through hole processing assembly 3 moves into the other group of sliding grooves 21.
The first movable buckle has the functions that: when the upper layer hole processing assembly 5 is in height consistency with the through hole processing assembly 3, the first movable buckle enables the upper layer hole processing assembly 5 and the through hole processing assembly 3 to be interlocked, so that the upper layer hole processing assembly 5 can be moved back and forth in the horizontal direction by utilizing the telescopic mechanism 6; when the upper layer hole processing assembly 5 or the through hole processing assembly 3 moves downwards, the first movable buckle does not influence the movement of the upper layer hole processing assembly or the through hole processing assembly. In this embodiment, as shown in fig. 13 and 14, the first movable buckle includes four L-shaped strips 33, two of which are connected to the through hole processing assembly 3, and the other two of which are connected to corresponding positions of the upper hole processing assembly 5, and the two corresponding L-shaped strips 33 are in a group and are matched in a vertically sliding manner. For stability, the length of the L-shaped strip 33 is such that the L-shaped strips 33 of the upper hole processing assembly 5 or the through hole processing assembly 3 always fit when one of the two is moved downward.
The second movable buckle has the functions that: when the upper layer hole processing assembly 5 is consistent with the through hole processing assembly 3 in height, the second movable buckle enables the upper layer hole processing assembly 5 and the through hole processing assembly 3 to be interlocked, so that the upper layer hole processing assembly 5 can be moved back and forth in the horizontal direction by utilizing the telescopic mechanism 6; when the upper layer hole processing assembly 5 is positioned at the top of the first lifting mechanism 22 and moves downwards, the second movable buckle does not influence the movement of the upper layer hole processing assembly. Therefore, in this embodiment, the second movable buckle includes an inverted U-shaped plate 61 and a connecting plate 62, one of the sections of the inverted U-shaped plate 61 is connected with the telescopic mechanism 6, the connecting plate 62 is connected with the upper hole processing assembly 5, and a clamping groove is formed in the connecting plate 62 for matching with the other section of the inverted U-shaped plate 61.
Example 4
As shown in fig. 21, the present embodiment provides a method for machining a blind hole by back drilling, using the multi-layer plate hole machining apparatus of embodiment 3, comprising the steps of:
s1, processing an inner core plate: three inner core plates are processed through the steps of cutting, coating, exposing, developing, etching, browning and the like.
S2, laminating: and (3) superposing the three inner core plates, the two copper foils and the four PP together, wherein the copper foils, the PP, the inner core plates, the PP, the inner core plates, the copper foils are sequentially arranged from top to bottom, and forming eight layers of plates through hot pressing.
S3, drilling: placing the eight-layer plate to be drilled in a placing groove, positioning by using a positioning assembly, wherein the through hole processing assembly 3 is positioned at the top of the first lifting mechanism 22, and the top plate 41 is lowered by using the second lifting mechanism 4 so that the cross-shaped insert block 43 is downwards inserted into the cross-shaped groove 311, the circular ring 42 downwards presses the circular plate 324, and the assembly is completed when the top surface of the circular plate 324 is lower than the bottom surface of the cross-shaped groove 311; the second lifting mechanism 4 and the first lifting mechanism 22 enable the top plate 41 and the through hole machining assembly 3 to synchronously move downwards, and then the first driving mechanism drives all the lower inserts and the drill bit to rotate, so that eight-layer plate drilling is completed; the second lifting mechanism 4 and the first lifting mechanism 22 then move up the top plate 41 and the through-hole processing assembly 3 synchronously to reset.
S4, hole metallization: the walls of the through holes 11 are metallized.
S5, back drilling: the upper layer hole processing assembly 5 is arranged at the top of the first lifting mechanism 22 by utilizing the stroke assembly, the upper part hole wall of the part through hole 11 is removed by utilizing the cooperation of the first lifting mechanism 22, the second lifting mechanism 4, the first driving mechanism and the upper layer hole processing assembly 5, and the lower part hole wall of the part through hole 11 is removed by utilizing the lower layer hole processing assembly.
S6, plugging holes of the resin: the through-holes 11 are filled with resin and baked.
In summary, the embodiment only needs to perform the pressing process once, so that the processing flow is saved, the processing of the cross blind buried holes can be realized, and the laser drilling process with higher cost is not needed. The method can process blind hole structures of all materials, and is particularly suitable for processing blind holes of high-frequency and high-speed materials. The back drilling holes 111 are required to be machined in different positions of the eight-layer plate, the depths of the back drilling holes 111 in different positions are different, the drilling step can be performed by using the same set of multi-layer plate hole machining device, the back drilling step can be performed, and only the stroke component is required to alternately place the upper layer hole machining component 5 and the through hole machining component 3 at the top of the first lifting mechanism 22, so that the operation is simple.
The above embodiments are merely for illustrating the technical ideas and features of the present invention, and are not meant to be exclusive or limiting. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention.
Claims (10)
1. A multilayer plate hole machining device, comprising:
the center of the operation table (2) is provided with a through groove penetrating through the operation table, a circle of placing grooves are arranged outside the through groove and used for placing the multilayer board, and two first lifting mechanisms (22) are symmetrically arranged on two sides of the operation table (2);
the through hole processing assembly (3) is used for processing a plurality of through holes (11) at the preset position of the multilayer plate and comprises a lifting plate (32) and a plurality of drill bits, wherein the lifting plate (32) is supported at the top of a first lifting mechanism (22), a plurality of through holes (321) and a plurality of circular grooves (322) are formed in the lifting plate (32), a cross-shaped block (323) is arranged at the periphery of the top of each through hole (321), the cross-shaped block (323) is positioned in each circular groove (322), a circular plate (324) is arranged in the corresponding circular groove (322) in a sliding mode, the bottoms of the circular plates (324) are connected to the circular grooves (322) through a plurality of springs (325), the drill bits are rotatably arranged at the corresponding through holes (321), the bottoms of the drill bits face the multilayer plate to be drilled, the top of the drill bits are provided with cross-shaped grooves (311), the inner walls of the circular plates (324) are tightly attached to the outer walls of the cross-shaped blocks (323) and the cross-shaped grooves (311), and the top surfaces of the circular plates (324) are lower than the top surfaces of the cross-shaped grooves (311) and higher than the lifting plate (32).
The top of the two second lifting mechanisms (4) is connected with two ends of the top plate (41), a plurality of lower plug-ins are rotatably arranged on the top plate (41), each lower plug-in includes a circular ring (42) and a cross-shaped plug-in block (43) positioned in the circular ring (42), the cross-shaped plug-in block (43) is used for being downwards inserted into the cross-shaped groove (311), and the circular ring (42) is used for downwards pressing the circular plate (324);
the first driving mechanism is arranged at the top of the top plate (41) and is used for driving all the lower plug-ins to rotate;
an upper layer hole processing component (5) for processing the upper part of the through hole (11) into a back drilling hole (111), the structure is the same as that of the through hole processing assembly (3), the outer diameter of the drill bit is larger than that of the drill bit, and the number of the drill bits is smaller than that of the drill bits;
the stroke assembly is used for alternately placing the through hole machining assembly (3) and the upper layer hole machining assembly (5) on the top of the first lifting mechanism (22);
and the lower layer hole machining assembly is arranged below the through groove of the operating platform (2) and is used for machining the lower part of the through hole (11) into back drilling holes (111), the outer diameter of the drill bit is larger than that of the drill bit of the through hole machining assembly (3), and the number of the drill bits is smaller than that of the drill bits of the through hole machining assembly.
2. The multilayer plate hole machining device according to claim 1, wherein the operation table (2) is provided with two groups of sliding grooves (21) along the length direction of the operation table, the through hole machining assembly (3) is positioned between the two groups of sliding grooves (21), two ends of the upper layer hole machining assembly (5) slide in one group of sliding grooves (21), the upper layer hole machining assembly (5) is consistent with the through hole machining assembly (3) in height, the upper layer hole machining assembly (5) is connected with the through hole machining assembly (3) through a first movable buckle, and the travel assembly comprises a telescopic mechanism (6) which is connected with the outer side of the upper layer hole machining assembly (5) through a second movable buckle.
3. The device according to claim 2, wherein the first movable buckle comprises a plurality of L-shaped strips (33), one half of which is connected to the through hole processing assembly (3) and the other half of which is connected to the corresponding position of the upper hole processing assembly (5), and the two corresponding L-shaped strips (33) are combined into a group and are matched in a sliding manner up and down.
4. A multi-layer plate hole machining device according to claim 3, wherein the second movable buckle comprises an inverted U-shaped plate (61) and a connecting plate (62), one of the sections of the inverted U-shaped plate (61) is connected with the telescopic mechanism (6), the connecting plate (62) is connected with the upper layer plate hole machining assembly (5), and a clamping groove is formed in the connecting plate (62) and used for matching with the other section of the inverted U-shaped plate (61).
5. A multilayer plate hole machining device according to claim 3, characterized in that when the telescopic mechanism (6) is in the contracted state, the through hole machining assembly (3) is located on top of the first lifting mechanism (22); when the telescopic mechanism (6) is in an extension state, the upper layer hole machining assembly (5) is forced to move to the top of the first lifting mechanism (22), and the through hole machining assembly (3) moves into the other group of sliding grooves (21).
6. A multilayer plate hole machining apparatus according to claim 3, wherein the lower hole machining assembly comprises a bottom plate (7), a plurality of drill bits, a third lifting mechanism for lifting the bottom plate (7), a second driving mechanism provided at the bottom of the bottom plate (7) for rotating the plurality of drill bits, and a second driving mechanism provided at the bottom of the bottom plate (7) for driving all drill bits to rotate.
7. A method for processing a blind hole by adopting a back drilling method, which is characterized by comprising the following steps:
s1, processing a plurality of inner core plates: cutting, coating, exposing, developing, etching and browning;
s2, laminating: sequentially overlapping a plurality of inner core plates, separating two layers by using PP (Polypropylene), overlapping PP and copper foil outside the inner core plates, and performing hot pressing to form a multi-layer plate;
s3, drilling: processing a plurality of through holes (11) at preset positions by using the multilayer plate hole processing device according to any one of claims 3 to 6, specifically comprising:
placing the multilayer board in a placing groove, arranging a through hole processing assembly (3) at the top of a first lifting mechanism (22), and using a second lifting mechanism (4) to enable a top plate (41) to descend so that a cross-shaped insertion block (43) is downwards inserted into a cross-shaped groove (311), pressing a circular plate (324) by a circular ring (42), and completing assembly when the top surface of the circular plate (324) is lower than the bottom surface of the cross-shaped groove (311); the second lifting mechanism (4) and the first lifting mechanism (22) enable the top plate (41) and the through hole machining assembly (3) to synchronously move downwards, and then the first driving mechanism drives all the lower plug-ins and the drill bit to rotate, so that the drilling of the multilayer board is completed; resetting;
s4, hole metallization: metallizing the hole wall of the through hole (11);
s5, back drilling: removing part of the hole wall of the through hole (11), forming a back drilling hole (111) by removing part of the hole wall, forming a blind hole (112) by removing part of the hole wall, and specifically removing the hole wall comprises the following steps:
the upper layer hole machining assembly (5) is arranged at the top of the first lifting mechanism (22) by utilizing the stroke assembly, the upper part hole wall of part of the through hole (11) is removed by utilizing the cooperation of the first lifting mechanism (22), the second lifting mechanism (4), the first driving mechanism and the upper layer hole machining assembly (5), and the lower part hole wall of part of the through hole (11) is removed by utilizing the lower layer hole machining assembly;
s6, plugging holes of the resin: filling resin into the through holes (11) and drying.
8. The method for machining blind holes by back drilling according to claim 7, characterized in that the back drilling (111) is 0.05-0.2 mm larger than the hole diameter of the blind hole (112).
9. The method of claim 7, wherein in step S3, when the through hole processing component (3) moves down, the L-shaped strip (33) between the upper hole processing component (5) and the through hole processing component (3) is always attached.
10. The method according to claim 7, wherein in step S5, when the upper hole processing component (5) is placed on top of the first lifting mechanism (22), the telescopic mechanism (6) is extended to force the upper hole processing component (5) to separate from one set of sliding grooves (21) and move to the top of the first lifting mechanism (22), and the through hole processing component (3) is moved into the other set of sliding grooves (21).
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