JP2006173375A - Substrate through-hole processing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate through-hole processing device for processing a through-hole for inserting a press-fit contact which is perforated in a circuit board and is formed with a conductor on its surface, and a method for forming a through-hole in which a metal plating is not peeled off when the press-fit contact is inserted, in the circuit board by restricting an amount of wear of a jig as small as possible. <P>SOLUTION: This device comprises a base 10 having a board mounting part 11, a head 30 having a pointed fixture 40 which urges the sharp edge of the through-hole formed with the conductor for beveling, and a support 20 for supporting the head 30. The base 10 has a moving mechanism 12 for moving the board mounting part 11 to an x-x direction, and the support 20 has a monoaxial moving mechanism 24 for moving the head 30 to a y-y direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate through-hole processing apparatus for processing a through-hole for inserting a press-fit contact, which is formed in a circuit board and has a conductor formed on the surface thereof.

  Conventionally, for example, a press-fit contact 101 shown in FIG. 6 (see Patent Document 1) is used as a contact of a multipolar connector used in a communication device or the like, and is connected to a through hole formed in a circuit board. Recently, it has been desired to use a press-fit contact 101 as a contact of a connector used in, for example, a control unit of an automobile. The reason for this is that when connecting the press-fit contact 101 to a through hole formed on a circuit board, solder connection is not required, and the contact connection work becomes simple, and the solder corresponding to the recent demand for lead-free soldering. This is because it is possible to avoid the possibility of weakening of the connector due to an increase in the attaching temperature.

  The press-fit contact 101 shown in FIG. 6 is provided between the first terminal portion 102 formed as a support, the second terminal portion 103 formed as a support, and the first terminal portion 102 and the second terminal portion 103. The mounting part 104 is provided. A flange portion 105 is formed at the boundary between the second terminal portion 103 and the attachment portion 104. The press-fit contact 101 is formed by punching and bending a metal plate, and the surface thereof is subjected to metal plating such as tin plating.

  The mounting portion 104 has legs 106 and 107 that are sheared along the longitudinal axis of the press-fit contact 101 and are shifted outward along the shear plane. The leg portions 106 and 107 are formed so as to extend toward both the first terminal portion 102 and the second terminal portion 103 in parallel with the longitudinal axis of the press-fit contact 101 and converge from the front end of the shear plane. . The legs 106 and 107 have longitudinal outer edges 109 and 110 that are gently curved. Further, a joint portion 108 that is not sheared is formed at a portion where the leg portions 106 and 107 converge. Here, when the dimension between the outer edge portions 109 and 110 of the leg portions 106 and 107 in the coupling portion 108 is D as shown in FIG. 6C, this dimension D is the through hole 111 of the circuit board PCB shown in FIG. Is equal to the diameter Hp. A copper coating 112 is formed on the inner peripheral surface of the through hole 111. The inner peripheral diameter Hp of the copper coating 112 is shown by enlarging the thickness of the copper coating 112 in the drawing, and is substantially equal to the diameter Hp of the through hole 111 in practice. The dimension between the outer edge portions 109 and 110 of the leg portions 106 and 107 is larger than the diameter Hp of the through hole 111 of the circuit board PCB.

  Then, as shown in FIG. 8, when the leg portions 106 and 107 of the press-fit contact 101 are inserted into the through holes 111 formed in the circuit board PCB, the dimension between the outer edge portions 109 and 110 of the leg portions 106 and 107 is through. Since the diameter is larger than the diameter Hp of the hole 111, the legs 106 and 107 move along the shearing surface of the other leg. At this time, the legs 106 and 107 are held in the through-hole 111 by the elastic pressing force of the legs 106 and 107 to the inner wall of the through-hole 111, and the press-fit contact 101 is electrically connected to the copper coating 112. Is done.

  However, when the leg portions 106 and 107 of the press-fit contact 101 are inserted into the through holes 111 formed in the circuit board PCB, the outer edge portions 109 and 110 of the leg portions 106 and 107 ( The outer edge portions 109 and 110) having a dimension larger than the dimension D between the outer edge portions 109 and 110 in the joint portion 108 are in contact with the corner edges of the copper coating 112, and are applied to the surfaces of the contacted outer edge portions 109 and 110. The plated metal may be peeled off. In particular, when the copper coating 112 is made of a copper alloy, not only the hardness of the coating is high, but also the corner edges of the coating are sharp, so that the metal plating of the outer edge portions 109 and 110 is often peeled off.

  Therefore, the corner edge of the copper coating 112 at the insertion hole of the through hole 111 is chamfered so that the outer edge portions 109 and 110 of the leg portions 106 and 107 do not come into contact with the corner edge of the copper coating 112, and the outer edge portion 109. , 110 is desirably prevented from peeling off the metal plating applied to the surface.

  Conventionally, Patent Document 2 discloses a through-hole processing method in which a corner edge of an inner wall surface of a through-hole formed in a circuit board is chamfered, and then the through-hole is filled with a conductive member.

  The through-hole processing method disclosed in Patent Document 2 is shown in FIG. 9, and first, as shown in FIGS. 9A and 9B, a through-hole 203 is drilled in a glass substrate 201 with a drill 202. Thereafter, as shown in FIG. 9C, chamfering 203a is applied to the corner edges on both the upper and lower sides of the through hole 203 by a polishing drill 204 such as an electrodeposition diamond drill. Then, as shown in FIG. 9D, the conductor 206 is supplied to the chamfered through hole 203 by the conductor supplier 205 and cut to a predetermined length. 9 (e) and 9 (f), the conductor 206 supplied into the through hole 203 has a flat surface with respect to both ends of the conductor 206 protruding vertically from the glass substrate 201. Using the jig 207 and the pedestal 208, the lead wire 206 is sandwiched in the vertical direction and pressed. As a result, the conductive wire 206 is shaped like a rivet in which heads for preventing return are formed in the openings on the upper surface and the lower surface of the glass substrate 201 and fixed to the through hole 203.

  Further, Patent Document 3 discloses a through-hole machining method in which the shape of a through-hole plating hole to which a component is attached is chamfered on the component surface side after drilling or press punching.

In the through hole processing method disclosed in Patent Document 3, as shown in FIG. 10, the shape of the through hole plating hole 301 formed in the circuit board PCB is formed by drill cutting or press punching, and then the component surface. A chamfer 302 is provided on the side (the upper side in FIG. 10).
JP-A-61-110979 Utility Model Registration No. 3084452 Japanese Utility Model Publication No. 58-129663

  However, the through-hole processing methods disclosed in Patent Document 2 and Patent Document 3 have the following problems.

  That is, in the case of the through-hole processing method disclosed in Patent Document 2, chamfering 203a is applied to the upper and lower corner edges of the through-hole 203 by an abrasive drill 204 such as an electrodeposition diamond drill, in order to form the chamfer 203a. In addition, since the hard glass substrate 201 itself is processed by the polishing drill 204, the polishing drill 204 may be worn.

  Further, in the case of the through hole processing method disclosed in Patent Document 3, there is no disclosure about a specific through hole processing method, and whether or not appropriate chamfering can be performed on the plated through hole, that is, FIG. It is doubtful whether chamfering can be performed to prevent peeling of the metal plating applied to the outer edges 109 and 110 of the press-fit contact 101 when the press-fit contact 101 as shown is inserted into the through-hole plating hole 301. . That is, after making a hole in the circuit board PCB, plating the inner surface of the hole and then chamfering, or after making a hole in the circuit board PCB, chamfering, and then In addition to the disclosure of whether or not to plate, a specific method of chamfering, for example, chamfering by drilling, or pressing the corner edge of the through hole using a jig to chamfer There is no disclosure of how to do it.

  Therefore, the present invention has been made in view of the above-mentioned problems, and its purpose is to suppress the amount of wear of the jig as much as possible through holes that do not peel metal plating when inserting press-fit contacts. An object of the present invention is to provide a substrate through-hole processing apparatus that can be formed on a circuit board.

The substrate through-hole processing apparatus of the present invention that achieves the above object is a substrate through-hole processing apparatus that processes a through hole that is drilled in a circuit board and has a conductor formed on the surface thereof.
A base having a substrate mounting portion; a head portion having a pointed jig that chamfers by pressing a corner edge of the through hole in which the conductor is formed; and a support portion that supports the head portion. And a uniaxial moving mechanism that relatively moves the substrate mounting part and the head part in one direction;
And a further uniaxial movement mechanism for moving the substrate mounting part and the head part in another direction orthogonal to the one direction.

  Here, in the substrate through-hole processing apparatus of the present invention, it is preferable that the head portion is connected to a load detection unit that monitors the pressing load.

  The substrate through-hole processing apparatus of the present invention has a relatively simple configuration, and chamfers by pressing the corner edge of the through-hole after the conductor is formed. Cutting is prevented and the substrate through hole can be continuously processed.

  Here, in the substrate through-hole processing apparatus according to the present invention, when the configuration in which the head portion is connected to the load detection portion is provided, the processing quality can be stabilized by detecting the pressing load.

  Embodiments of the present invention will be described below.

  FIG. 1 is an external perspective view showing a substrate through-hole processing apparatus according to an embodiment of the present invention.

  The substrate through-hole processing apparatus 1 includes a base 10, a support part 20, and a head part 30.

  The base 10 has a substrate platform 11 on which the circuit board PCB is positioned, and this substrate platform 11 is shown in FIG. 1 by a uniaxial moving mechanism 12 such as a linear scale or a uniaxial robot. It is configured to move in the arrow xx direction.

  In addition, a switch base 13 is disposed on the base 10, and a power switch 131 for turning on and off the power to the substrate through-hole processing apparatus 1, The substrate through-hole processing apparatus 1 is provided with a start switch 132 for starting chamfering operation of a plurality of through holes 50 formed in the circuit board PCB, and an emergency stop switch 133 for urgently stopping the operation. ing.

  Although the operation of the substrate through-hole processing apparatus 1 after operating the start switch 132 will be described later, if the operation is known, the circuit configuration for realizing the operation is self-explanatory. Illustration and description of the circuit configuration for realizing the operation of the through-hole processing apparatus 1 are omitted.

  The support portion 20 is for supporting the head portion 30, and is a beam connecting the two column portions 21 and 22 standing on the base 10 and the upper ends of the two column portions 21 and 22. Part 23. The beam portion 23 has a uniaxial movement mechanism 24 that freely moves the head portion 30 in the direction of the arrow yy shown in FIG. 1, and the head portion 30 is supported by the support portion 20 via the uniaxial movement mechanism 24. Has been.

  The head unit 30 is a base of the head unit 30 and includes a load cell built-in unit 31 in which a load cell (load detection cell) is incorporated, a pressing head 32 protruding downward from the load cell built-in unit 31, and A cylinder 33 is provided above the load cell built-in portion 31 and moves the pressing head 32 up and down. A pressing jig 40 for through-hole processing is fixed to the tip of the pressing head 32.

  In this substrate through-hole processing apparatus 1, position information of the through-hole 50 drilled in the circuit board PCB placed on the substrate mounting table 11 is incorporated in advance. Movement of the substrate PCB in the xx direction by the uniaxial movement mechanism 12 provided in the base 10, movement of the head unit 30 in the yy direction by the uniaxial movement mechanism 24 provided in the support unit 20, and cylinder Through the vertical movement of the pressing head 32 and the pressing jig 40 fixed to the tip of the pressing head 33, the through holes 50 of the circuit board PCB mounted on the substrate mounting table 11 are chamfered one by one. The shape of the through hole of the circuit board PCB will be described later.

  FIG. 2 is a cross-sectional view showing the structure around the pressing head 32 of the head portion 30 of the substrate through-hole processing apparatus 1 shown in FIG.

  In FIG. 2, the lower part of the load cell incorporating portion 31 and the pressing head 32 are shown.

  The load cell built-in portion 31 has a through hole 311, and the upper portion of the pressing head 32 enters the through hole 311.

  The pressing head 32 is formed with a vertically extending groove 321 for preventing slipping and preventing rotation. By inserting the protrusion 313 of the load cell incorporating part 31 into the groove 321, the load cell incorporating part 31 is formed. The pressing head 32 is supported so as to be movable up and down.

  A load cell 312 is disposed at a position of the load cell incorporating portion 31 in contact with the upper surface of the pressing head 32, and a rod 331 of a cylinder 33 (see FIG. 1) is further placed on the load cell 312. The rod 331, the load cell 312 and the pressing head 32 are fixed to each other by fixing means (not shown). Therefore, when the rod 331 moves up and down by the operation of the cylinder 33 (see FIG. 1), the pressing head 32 also moves up and down integrally with the rod 331 with the load cell 312 sandwiched therebetween.

  The pressing head 32 is provided with a jig mounting hole 322 having a downward opening and having an internal thread formed on the inner wall, and the pressing jig 40 is screwed into the jig mounting hole 322, and From below, a jig support member 60 having a through hole 601 and having an external thread formed on the outer periphery is screwed. The pressing jig 40 includes a shaft portion 401 accommodated in the jig support member 60, a screw-in portion 402 that extends upward from the shaft portion 401 and has a male screw formed thereon, and a pointed pressing that extends downward from the shaft portion 401. A rod 403 is provided and is configured integrally. The pressing jig 40 is fixed to the pressing head 32 by screwing the screwed portion 402 into the female screw of the jig mounting hole 322 of the pressing head 32. The material of the pressing jig 40 is normal tool steel. The outer diameter of the screw-in portion 402 is larger than the outer diameter of the shaft portion 401, and the shoulder formed at the lower end of the screw-in portion 402 is seated on the jig support member 60, so that the pressing jig 40 is unintentionally removed. Prevention is intended. Further, the outer diameter of the pressing rod 403 is smaller than the outer diameter of the shaft portion 401, and the corner edge of the through hole 50 (see FIG. 1) formed in the circuit board PCB is pressed to the lower end of the pressing rod 403 (for details, see FIG. 1). A pointed corner edge pressing portion 404 (to be described later) is formed. The angle θ formed by the ridge line of the corner edge pressing portion 404 is preferably 30 ° to 90 °. This is because if the angle θ is smaller than 30 °, the chamfered portion 52 (see FIG. 3) having an appropriate shape cannot be formed because it is too acute. Further, even if the angle θ is larger than 90 °, the chamfered portion 52 having an appropriate shape cannot be formed.

  A method of chamfering the through hole 50 formed in the circuit board PCB using the through hole processing apparatus 1 configured as described above will be described with reference to FIGS. FIG. 3 is a cross-sectional view of the through hole 50 formed in the circuit board PCB.

  Prior to the chamfering process described above, the conductor 51 is formed on the inner wall surface of the through hole 50 formed in the circuit board PCB. Then, the circuit board PCB having the through hole 50 in which the conductor 51 is formed on the inner wall surface is placed on the board mounting table 11, and the circuit board PCB is positioned in the xy direction.

  Subsequently, when the start switch 132 is pressed in a state where the power switch 131 is pressed and the substrate through-hole processing apparatus 1 is turned on, the substrate mounting table 11 stored in the substrate through-hole processing apparatus 1 in advance is stored. Based on the positional information of the through hole 50 of the upper circuit board PCB, the tip of the corner edge pressing portion 404 sequentially enters each of the plurality of through holes 50 of the circuit board PCB, and as shown in FIG. A chamfered portion 52 (see FIG. 3) is formed by pressing at the corner edge.

  When the chamfering process of one circuit board PCB is completed, the circuit board PCB is removed from the substrate mounting table 11, and the next circuit board PCB before chamfering processing is mounted on the substrate mounting table 11, and the above operation is performed. Repeated.

  Next, a modified example of chamfering will be described.

  The shape of the pointed pressing jig 40 is such that a pair of notches 405 are formed from the outer peripheral surface of the pressing rod 403 toward the tip of the outer peripheral surface of the corner edge pressing portion 404 as shown in FIG. It may be. The circumferential positions of the notches 405 are opposed to correspond to the circumferential positions of the portions of the press-fit contact 101 where the outer edge portions 109 and 110 of the press-fit contact 101 are not formed. (See FIGS. 4B and 6C). Therefore, when the upper corner edge of the conductor 51 formed in the through hole 50 is pressed using the pressing jig 40 shown in FIG. 4, the upper corner edge of the conductor 51 is, as shown in FIG. The chamfered portion 52 is formed by the portion of the corner edge pressing portion 404 having no notch 405, while the remaining portion 53 remains without being pressed at the portion of the notch 405. When the press-fit contact 101 is inserted, the outer edge portions 109 and 110 of the leg portions 106 and 107 of the press-fit contact 101 are prevented from coming into contact with the corner edges of the conductor 51 corresponding to the chamfered portion 52. Peeling of the metal plating formed on the contact 101 surface is avoided. Therefore, by forming the notch 405 on the outer peripheral surface of the pressing jig 40, it is not necessary to provide the chamfered portion 52 more than necessary, and the pressing load required for forming the chamfered portion 52 can be reduced. For this reason, the processing operation using the through-hole processing apparatus 1 can be speeded up. Note that the angle θ formed by the ridgeline of the corner edge pressing portion 404 is preferably 30 ° to 90 °.

  As mentioned above, although embodiment of this invention has been described, this invention is not limited to this, A various change and improvement can be performed.

  For example, a plurality of pressing jigs 40 may be arranged and fixed on the head unit 30 and the plurality of through holes 50 may be chamfered at a time.

  In the above embodiment, the position of the through hole 50 of the circuit board PCB is stored in the substrate through hole processing apparatus 1 in advance, and the pressing jig 40 is positioned based on the stored information. A monitor camera for observing the through hole 50 of the circuit board PCB on the substrate mounting table 11 is placed, the through hole 50 is recognized by pattern recognition from an image photographed by the monitor camera, and the recognized through hole 50 is detected. The position may be transmitted to the substrate through-hole processing apparatus 1 for positioning, or both positioning means may be used in combination. Instead of the two uniaxial moving mechanisms 12 and 24, a so-called XY table that moves in the X and Y biaxial directions on the base 10 or the beam portion 23 may be used.

It is an appearance perspective view showing a substrate through hole processing device concerning one embodiment of the present invention. It is sectional drawing which shows the structure around the press head of the head part of the substrate through-hole processing apparatus shown in FIG. It is sectional drawing of the through hole processed by the through hole processing apparatus shown in FIG. The modification of a press jig | tool is shown, (A) is a partial front view of a jig | tool, (B) is a bottom view of (A). The through-hole processed by the press by the jig | tool of FIG. 4 is shown, (A) is a top view, (B) is sectional drawing which follows the AA line of (A). The general example of a press-fit contact is shown, (A) is a fragmentary perspective view, (B) is a fragmentary front view, (C) is sectional drawing which follows the BB line of (B). It is a top view of the through hole formed in the circuit board in which the press fit contact shown in FIG. 6 is inserted. FIG. 8 is a partial cross-sectional perspective view showing a state where the press-fit contact shown in FIG. 6 is inserted into the through hole of FIG. 7. It is explanatory drawing which shows the board | substrate through-hole processing method of a prior art example. It is sectional drawing of the through hole processed by the substrate through-hole processing method of the other conventional example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate through-hole processing apparatus 10 Base 11 Board | substrate mounting base 12 Uniaxial movement mechanism 13 Switch stand 20 Support part 21,22 Column part 23 Beam part 24 Uniaxial movement mechanism 30 Head part 31 Load cell incorporating part 32 Press head 33 Cylinder 40 Point Head jig 404 Square edge pressing part 50 Through hole of substrate PCB 51 Conductor 52 Chamfered part

Claims (2)

A substrate through-hole processing apparatus for processing a through-hole formed in a circuit board and having a conductor formed on a surface thereof,
A base having a substrate mounting portion; a head portion having a pointed jig that chamfers by pressing a corner edge of the through hole in which the conductor is formed; and a support portion that supports the head portion. And a uniaxial movement mechanism that relatively moves the substrate placement part and the head part in one direction;
A substrate through-hole processing apparatus, comprising: another uniaxial movement mechanism that relatively moves the substrate mounting portion and the head portion in another direction orthogonal to the one direction.   The substrate through-hole processing apparatus according to claim 1, wherein the head unit is connected to a load detection unit that monitors a pressing load.

Images