CN204217200U - Printed circuit board (PCB) and e-machine - Google Patents
Printed circuit board (PCB) and e-machine Download PDFInfo
- Publication number
- CN204217200U CN204217200U CN201420573875.6U CN201420573875U CN204217200U CN 204217200 U CN204217200 U CN 204217200U CN 201420573875 U CN201420573875 U CN 201420573875U CN 204217200 U CN204217200 U CN 204217200U
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- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- pcb
- pin
- hole
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a kind of printed circuit board (PCB) and e-machine, and it can strengthen flexibly mounted intensity.On the printed circuit board (PCB) of the Pin insertion apertures that there is multilager base plate and inserted by the pin of electronic component, described Pin insertion apertures has the coat of metal of the hole of through described multilager base plate and the inner peripheral surface in the described hole of covering, has described pin at described Pin insertion apertures internal fixtion.
Description
Technical field
The utility model relates to a kind of printed circuit board (PCB) and e-machine of the pin for inserting installing electronic elements.
Background technology
According to the difference of the method be installed on printed circuit board (PCB), the electronic component of forming circuit is divided into pin parts and chip part.Pin parts adopt plug-in type to install, and chip part adopts surface to install.When pin parts, chip part are installed on printed circuit board (PCB), this method of main use soldering.Carry out in the method for installing, having wave-soldering, Reflow Soldering, hand to weld three kinds of methods utilizing soldering.Wave-soldering is the method for the top layer by the lower surface of printed circuit board (PCB) being impregnated into the tin solde melted in soldering groove being carried out soldering, and the method is mainly used in pin parts.Reflow Soldering prints on a printed circuit scaling powder to be added soldering powder and the tinol formed, and on tinol mounted with electronic components, the then method of heating for dissolving tinol, the method is mainly used in chip part.
Under normal circumstances, on a printed circuit during installing electronic elements, first implement twice solder reflow operation, at two chip parts on the surface of printed circuit board (PCB), then implement a wave-soldering operation, pin parts are installed.But the setting calculating and do not apply the conditions such as pressure to electronic component of the optimal temperature conditions required for the installation undertaken by soldering needs masterful technique, if setting mistake, pressure may cause damage to printed circuit board (PCB).
In patent documentation 1, prepare multiple plate (plate), this plate utilizes conductive foil to cover the Pin insertion apertures of the installing electronic elements be arranged on pre impregnated material (prepreg), and on this conductive foil, form the through hole with regulation shape, align the plurality of plate hole position after carry out lamination joint, by making conductive foil bending while make pin insert in through hole, thus fixing pin.
Clear No. 59-211295 of [patent documentation 1] Japanese invention Patent Publication No
In patent documentation 1, only have conduction foil portion due to what carry out physical contact with pin, therefore the flexibly mounted strength ratio of pin is more weak.
Utility model content
In view of the foregoing, the purpose of this utility model is, provides a kind of printed circuit board (PCB) and the e-machine that can strengthen flexibly mounted intensity.
In order to solve the problem, reach above-mentioned purpose, the feature of the printed circuit board (PCB) involved by the utility model is as follows: on the printed circuit board (PCB) of the Pin insertion apertures having multilager base plate and inserted by the pin of electronic component, described Pin insertion apertures has the coat of metal of the hole of through described multilager base plate and the inner peripheral surface in the described hole of covering, and described Pin insertion apertures internal fixtion has described pin.
In addition, the printed circuit board (PCB) involved by the utility model also has following feature: the diameter of described Pin insertion apertures is less than more than 80% 90% of the diameter of described pin.
In addition, the printed circuit board (PCB) involved by the utility model also has following feature: the diameter in the described hole of described Pin insertion apertures is greater than the diameter of described pin.
In addition, the printed circuit board (PCB) involved by the utility model also has following feature: the surface that described multilager base plate can carry out electronic component by soldering is installed.
In addition, the printed circuit board (PCB) involved by the utility model also has following feature: the section of described Pin insertion apertures is H-letter shape or alphabetical I shape.
In addition, the e-machine involved by the utility model also has following feature: this e-machine has printed electronic plate involved by described the utility model and pin and is inserted into electronic component in described Pin insertion apertures that described printed circuit board (PCB) is formed.
According to the utility model, Pin insertion apertures for the pin of fixed electronic element has the coat of metal of the hole of through multilager base plate and the inner peripheral surface in the described hole of covering, therefore the contact area of this Pin insertion apertures and pin increases, thus can strengthen flexibly mounted intensity.
Accompanying drawing explanation
Fig. 1 is the stereogram of the configuration example of the execution mode 1 of e-machine involved by the utility model.
Fig. 2 be represent etching after the figure of multilager base plate.
Fig. 3 be represent copper facing after the figure of multilager base plate.
Fig. 4 be pin parts be pressed into Pin insertion apertures state under the figure of printed circuit board (PCB).
Fig. 5 is the figure of an example of Pin insertion apertures.
Fig. 6 is the figure of other examples of Pin insertion apertures.
[description of reference numerals]
1: printed circuit board (PCB); 2: hole; 3: internal layer circuit; 4: Pin insertion apertures; 7: the coat of metal; 10 chip parts; 20: pin parts; 21: pin.
Embodiment
Below, the execution mode of printed circuit board (PCB) involved by the utility model and e-machine is explained based on accompanying drawing.In addition, the utility model is not limited to this execution mode.Execution mode 1.
Fig. 1 is for representing the figure of the configuration example of the execution mode 1 of the e-machine involved by the utility model.Be equipped with on the printed circuit board 1: chip part 10, it is surface mounted on printed circuit board (PCB) 1 by soldering; Pin parts 20, it is pressed into and is installed on printed circuit board (PCB) 1.This printed circuit board (PCB) 1 can carry out soldering connection by methods such as wave-soldering, Reflow Soldering, hand welderings.Pin parts 20 have many bar-shaped pins 21.By pin 21 is pressed on printed circuit board (PCB) 1 formed as in the Pin insertion apertures 4 of hole tie point, pin 20 is installed on printed circuit board (PCB) 1.
Fig. 2 is the profile of printed circuit board (PCB) 1.Printed circuit board (PCB) 1 is that multilager base plate 1a ~ 1d is laminated rear formed multilager base plate.Substrate 1a ~ 1d is such as pre impregnated material (prepreg).Substrate 1a ~ 1d is formed through hole and wiring pattern (pattern), and through hole and wiring pattern form internal layer circuit 3.Fixing base 1a ~ 1d after laminated substrate 1a ~ 1d, then by etching, desired position forms the hole 2 with internal diameter d1.In fig. 2, the forming position of internal layer circuit 3 forms hole 2.As shown in Figure 3, the internal diameter d1 in hole 2 is larger than the diameter d 3 of the pin 21 of pin parts.Due to fixing base 1a ~ 1d after being laminated substrate 1a ~ 1d, then form hole 2, therefore hole 2 is for having the continuous print through hole of specified diameter.
By forming hole 2, internal layer circuit 3 is exposed on internal perisporium.In this state, as shown in Figure 3, internal perisporium forms the coat of metal 7 as metal internal perisporium, the inner peripheral surface of its coverage hole 2.The coat of metal 7 is such as copper coating.Like this, form the coat of metal 7 by the inner peripheral surface in hole 2, thus form Pin insertion apertures 4.The thickness of the adjustment coat of metal 7, makes the diameter d 2 of the Pin insertion apertures 4 after the formation coat of metal 7 be 80 ~ 90% of the diameter d 3 of pin 21.
As shown in Figure 4, the pin 21 on pin parts 20 is pressed in Pin insertion apertures 4.As a result, the coat of metal 7 is squeezed bad, and pin 21 is firmly elastically supported in Pin insertion apertures 4.In addition, because the diameter d 1 in hole 2 self is larger than the diameter d 3 of pin, therefore can not to printed circuit board (PCB) 1 stress application.
Preferably in 1, the printed circuit board (PCB) 1 be made up of multilager base plate forms hole 2, by forming the coat of metal 7 on the inner peripheral surface in formed hole 2, thus form the Pin insertion apertures 4 that can be pressed into the pin 21 of pin parts 20, by being pressed into the pin 21 of pin parts 20 in this Pin insertion apertures 4, make pin parts 20 install on the printed circuit board 1, therefore flexibly mounted intensity enhancing, pin parts 20 firmly can be supported on the printed circuit board 1.
In addition, in execution mode 1, fixing base 1a ~ 1d after laminated substrate 1a ~ 1d, then by being etched in the hole 2 desired position being formed and has internal diameter d1, owing to forming Pin insertion apertures 4 by applying the coat of metal 7 on the inner peripheral surface in this hole 2, therefore, it is possible to reduce operation.
In addition, in embodiment 1, because the press-in can carrying out pin parts is installed, if therefore only soldering chip parts, then the object reducing soldering and shorten working hours can be realized.
Execution mode 2.
Fig. 5 is the figure of the example representing Pin insertion apertures 4.In Figure 5, the hole 2 before the formation coat of metal 7 is in H-letter shape.That is, the hole 2 of H-letter shape is formed in and is laminated and on fixing substrate 1a ~ 1d.The hole 2 of H-letter shape is made up of following a few part: rounded portions 2a, and it is positioned at central part; Line part 2b, it is positioned at the both sides of rounded portions 2a; Connecting portion 2c, it connects rounded portions 2a and line part 2b.The length of line part 2b is longer than the diameter of rounded portions 2a.
The coat of metal 7 is only formed in the inner peripheral portion of rounded portions 2a.Preferably in 2, the pin 21 that rounded portions 2a is pressed into Pin insertion apertures 4 is expanded, by guaranteeing the line part 2b keeping out of the way space when being expanded by pin 21 as rounded portions 2a, integral elastic support pin 21 around the hole of H-letter shape.Therefore, the area that pin 21 is resiliently supported becomes large, the flexibly mounted intensity grow of pin 21.
Fig. 6 is the figure of other examples representing Pin insertion apertures 4.In figure 6, the hole 2 formed before the coat of metal 7 is alphabetical I shape.That is, the hole 2 of alphabetical I shape is formed in and is laminated and on fixing substrate 1a ~ 1d.The hole 2 of letter I shape is made up of following a few part: rounded portions 2a, and it is positioned at central part; Line part 2b, it is positioned at the both sides of rounded portions 2a; Connecting portion 2c, it connects rounded portions 2a and line part 2b.The length of line part 2b is identical with the diameter of rounded portions 2a.The coat of metal 7 is only formed in the inner peripheral portion of rounded portions 2a.
Even if in the structure of Fig. 6, the pin 21 that rounded portions 2a is pressed into Pin insertion apertures 4 is expanded, also can by guaranteeing the line part 2b keeping out of the way space when being expanded by pin 21 as rounded portions 2a, integral elastic support pin 21 around the hole of alphabetical I shape.Therefore, the area that pin 21 is resiliently supported becomes large, the flexibly mounted intensity grow of pin 21.
As mentioned above, the printed circuit board (PCB) involved by the utility model and e-machine are very useful in the printed circuit board (PCB) needing to install pin parts and e-machine.
Claims (6)
1. a printed circuit board (PCB), is characterized in that,
In the printed circuit board (PCB) of the Pin insertion apertures that there is multilager base plate and inserted by the pin of electronic component,
Described Pin insertion apertures has the coat of metal of the hole of through described multilager base plate and the inner peripheral surface in the described hole of covering,
Described Pin insertion apertures internal fixtion has described pin.
2. printed circuit board (PCB) according to claim 1, is characterized in that,
The diameter of described Pin insertion apertures is less than more than 80% 90% of the diameter of described pin.
3. printed circuit board (PCB) according to claim 1, is characterized in that,
The diameter in the described hole of described Pin insertion apertures is greater than the diameter of described pin.
4. printed circuit board (PCB) according to claim 1, is characterized in that,
Described multilager base plate can carry out the installation of electronic component by being soldered to its surface.
5. printed circuit board (PCB) according to claim 1, is characterized in that,
The section of described Pin insertion apertures is H-letter shape or I shape.
6. an e-machine, is characterized in that, has:
Printed circuit board (PCB) in Claims 1 to 5 described in any one;
Pin is inserted into the electronic component in the described Pin insertion apertures that formed on the printed circuit board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-078989 | 2014-04-07 | ||
| JP2014078989A JP2015201530A (en) | 2014-04-07 | 2014-04-07 | Printed circuit board and electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204217200U true CN204217200U (en) | 2015-03-18 |
Family
ID=52985828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420573875.6U Expired - Fee Related CN204217200U (en) | 2014-04-07 | 2014-09-30 | Printed circuit board (PCB) and e-machine |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2015201530A (en) |
| CN (1) | CN204217200U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108120471A (en) * | 2016-11-28 | 2018-06-05 | 大陆汽车投资（上海）有限公司 | Detection device and vehicle speed variation system |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7210634A (en) * | 1972-08-03 | 1974-02-05 | ||
| JPS62145368U (en) * | 1986-03-06 | 1987-09-12 | ||
| JPH0685146A (en) * | 1992-03-10 | 1994-03-25 | Nippon Chemitec Kk | Surface mount type electronic component and base seat thereof |
| JP2000261119A (en) * | 1999-03-12 | 2000-09-22 | Canon Inc | Mounting structure of component having lead wires onto printed wiring board |
| JP2002305375A (en) * | 2001-04-05 | 2002-10-18 | Sony Corp | Multilayer interconnection board and manufacturing method thereof |
| JP2005044990A (en) * | 2003-07-22 | 2005-02-17 | Sony Corp | Land, manufacturing method, and mounting method for multilayer printed wiring board |
| JP2005150525A (en) * | 2003-11-18 | 2005-06-09 | Denso Corp | Structure and method for mounting terminal insertion type member |
-
2014
- 2014-04-07 JP JP2014078989A patent/JP2015201530A/en active Pending
- 2014-09-30 CN CN201420573875.6U patent/CN204217200U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108120471A (en) * | 2016-11-28 | 2018-06-05 | 大陆汽车投资（上海）有限公司 | Detection device and vehicle speed variation system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015201530A (en) | 2015-11-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150318 Termination date: 20200930 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |