JPH0685146A - Surface mount type electronic component and base seat thereof - Google Patents

Abstract

PURPOSE:To make it possible to fix a terminal with a printed board or the like definitely and surface-mount various kinds of electronic components more effectively and efficiently. CONSTITUTION:There are provided a pedestal 22 and a quarty oscillator 24 where the pedestal 22 provides an electric insulation material-made pedestal body 26 and two metal terminals partially buried in this pedestal body 26. The metal terminals 28 consist of a terminal sheet section 32 connected to a lead wire 30 of the quartz oscillator 24 and terminal pieces 34a and 34b bent to the side of the pedestal body 26. There are installed two slots 40a and 40b, which are matchable to the terminal pieces 34a and 34b, and what is more, wider than the terminal pieces 34a and 34b by a specified dimension on both sides of the pedestal body 26.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component on which various electronic elements such as a crystal oscillator and a semiconductor element are mounted and which can be surface-mounted, and a pedestal thereof.

[0002]

2. Description of the Related Art For example, a package in which electronic parts such as a piezoelectric vibrating device loaded with an electronic element such as a crystal oscillator, and various semiconductor elements (electronic elements) such as an LSI chip are enclosed on a printed circuit board or the like. When mounted, various types that can be surface-mounted have been proposed. As one example thereof, a "piezoelectric vibrating device" disclosed in Japanese Utility Model Laid-Open No. 1-115323 is known. As shown in FIG. 7, this piezoelectric vibration device includes a crystal resonator 2, a base 4 made of an electrically insulating material, and a metal terminal plate 6, and the base 4 has lead wires extending from the crystal resonator 2. A hole 10 for passing the (metal terminal) 8 and a recess 12 communicating with the hole 10 are provided. The metal terminal plate 6 is formed with holes 14 through which the lead wires 8 pass in the portion extending along the inner wall surface of the recess 12, and extends from the lower surface of the pedestal 4 along the outer wall surface at both ends thereof. A terminal piece 16 is provided.

Then, as shown in FIG.
Of the lead wire 8 is inserted into the hole 10 of the pedestal 4 and the hole 14 of the metal terminal plate 6 and fixed by the solder 17.
A piezoelectric vibrating device is assembled by filling the whole 2 with an insulator.

[0004]

However, in the above-mentioned prior art, as shown in FIG. 8, when the surface of the printed circuit board 18 and the terminal piece 16 are fixed by soldering or the like,
There is a problem that the solder 17 provided on the surface of the printed circuit board 18 does not reach the upper side of the terminal piece 16 sufficiently and causes defective bonding.

Furthermore, in a package in which a semiconductor element is encapsulated, when each terminal is soldered to a printed circuit board, the solder is not sufficiently supplied to the upper side of the terminal, and a large number of terminals are arranged at a particularly narrow pitch. With the provided package,
It has been pointed out that it is considerably difficult to reliably solder each terminal to a printed circuit board.

The present invention solves this kind of problem, and the terminals can be securely fixed to a printed circuit board or the like, and various electronic parts can be surface-mounted effectively and efficiently. It is an object of the present invention to provide a surface mounting electronic component and its pedestal.

[0007]

To achieve the above object, the present invention provides a pedestal body made of an electrically insulating material, an electronic element mounted on the pedestal body made of an electrically insulating material, and a derivation of the electronic element. A metal terminal that is electrically connected to the portion and that is bent toward the pedestal body side made of the electrically insulating material, the pedestal body made of the electrically insulating material corresponds to the foldable metal terminal, and is wider than the width of the metal terminal. Is also characterized by providing a groove portion having a large width by a predetermined dimension.

Furthermore, the present invention comprises a pedestal body made of an electrically insulating material, and a metal terminal electrically connected to the lead-out portion of the electronic element and bent to the side of the pedestal body made of the electrically insulating material. The pedestal body made of material is characterized in that a groove portion corresponding to the bent metal terminal and having a width larger than the width of the metal terminal by a predetermined dimension is provided.

[0009]

In the surface mounting electronic component and its pedestal according to the present invention described above, the bent metal terminal is arranged in the groove provided in the pedestal body made of an electrically insulating material, and
The width of the groove is set to be larger than the width of the metal terminal by a predetermined dimension. Therefore, when soldering the metal terminal to the surface of the printed circuit board or the like, the solder rises along the gap formed between the metal terminal and the groove through the capillary phenomenon to obtain a reliable bonding state. be able to.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the surface mount electronic component and its pedestal according to the present invention will be described below with reference to the accompanying drawings.

In FIG. 1, reference numeral 20 indicates a piezoelectric vibrating device which is an electronic component according to this embodiment, and the piezoelectric vibrating device 20 includes a pedestal 22 and a crystal oscillator 24 which is an electronic element. The pedestal 22 includes a pedestal body 26 made of an electrically insulating material, and two metal terminals 28 partially embedded in the pedestal body 26. The metal terminals 28 are
A terminal plate portion 32 connected to a lead wire (lead-out portion) 30 of the crystal unit 24, and terminal piece portions 34a and 34b bent toward the pedestal body 26 side.

The lead wire 30 is provided at the center of the terminal plate portion 32.
Is provided with a hole portion 36 for inserting, and an H-shaped slit 38 communicates with this hole portion 36. This hole 36
The central portion of the terminal plate portion 32 provided with is inclined inward with respect to the insertion direction of the lead wire 30 (see FIG. 2).

The pedestal body 26 is formed of a thermosetting resin material such as epoxy, has a substantially rectangular shape with an opening at the center, and has terminal pieces 34 on both sides thereof.
A groove portion 40 corresponding to a and 34b and having a width larger by a predetermined dimension than the width of the terminal piece portions 34a and 34b.
Two a and 40b are provided. Specifically, the width of the terminal pieces 34a, 34b is 1.0 mm, and the width of the groove 40 is 40 mm.
The width of a and 40b is set to 1.5 mm. On the surface of the pedestal body 26 on the surface mounting side (bottom surface), the terminal piece portion 34
Inclined wall surfaces 42a and 42b are provided for inwardly bending the a and 34b from both sides of the pedestal body 26 and inclining inward in the thickness direction of the pedestal body 26 (see FIG. 2). ).

FIG. 3 shows a manufacturing apparatus 50 for manufacturing the pedestal 22 according to this embodiment. The vertical injection molding machine 52 that constitutes the manufacturing apparatus 50 includes a lower mold 54 and an upper mold 56, and the upper mold 56 can be moved up and down via a die plate 58. The lower mold 54 and the upper mold 56 form a cavity (not shown) capable of simultaneously molding a plurality of base bodies 26. For example, an in-line screw type injection mechanism 60 is connected to the upper mold 56, and the molding material supplied to the hopper 62 is sent to the injection mechanism 60 via the linear feeder 64.

A long metal strip 70 is disposed between the lower die 54 and the upper die 56 so as to be conveyed in the direction of arrow A. Both ends of the metal strip 70 are wound with a feed roller 72 and a take-up roller. It is attached to the roller 74. As shown in FIG. 4, in the metal strip 70, two metal terminal portions 28a forming the metal terminal 28 after cutting are shown by arrows A in two rows.
Both ends of a connecting portion 76, which is provided sequentially in the direction of the arrow and extends in the arrow B direction by connecting the adjacent end portions of the metal terminal portion 28a to each other, has a long length extending in the arrow A direction. It is configured integrally with the parts 78a to 78c.

When the pedestal body 26 is molded through the vertical injection molding machine 52, the pedestal body is formed on the portions of the elongated portions 78a, 78b that face each other and the portions of the elongated portions 78b, 78c that face each other. Projecting portions 80 are provided which are embedded in both ends of the base plate 26 in the longitudinal direction and which can be detached from the base body 26. The long parts 78a to 78
The reference character c includes positioning hole portions 82a to 82c for positioning a predetermined portion of the metal strip 70 with respect to the lower mold 54 and the upper mold 56 that form the vertical injection molding machine 52.

Next, the manufacturing apparatus 50 configured as described above.
The operation of will be described.

As shown in FIG. 3, with both ends of the metal strip 70 fixed to the feed roller 72 and the winding roller 74, the metal strip 70 corresponds to the vertical injection molding machine 52. After being conveyed, a predetermined number of metal terminal parts 28a are positioned with respect to the lower mold 54 and the upper mold 56. Then, the upper die 56 is lowered via the die plate 58, and a cavity (not shown) is formed by the upper die 56, the lower die 54, and the metal strip 70.

The cavity is filled with the molding material supplied to the hopper 62 in a state of being heated to a predetermined temperature through the injection mechanism 60, and after a lapse of a predetermined time, a part of the plurality of metal terminal portions 28a is filled. A predetermined number of base bodies 26 are embedded and integrally molded (see FIG. 4). Next, upper mold 5
6 is lifted and opened from the lower mold 54, and the metal strip 7
0 is conveyed by a predetermined distance in the direction of arrow A, and the pedestal body 26 is formed by embedding another portion of the metal strip 70, that is, a part of a plurality of new metal terminal portions 28a.

After the pedestal body 26 has been molded, the boundary portion between the metal terminal portion 28a and the connection portion 76 is cut, and this portion is bent as the terminal piece portions 34a and 34b corresponding to the groove portions 40a and 40b of the pedestal body 26. . At that time, the two protruding portions 80 have a positioning function for the pedestal body 26.

Next, in a state of being held by the protruding portion 80,
When the pedestal body 26 is loaded with the crystal oscillators 24, the assembling work of the piezoelectric vibrating device 20 is performed in a state where the crystal oscillators 24 are arranged on the metal strip 70. Here, since the central portion of the terminal plate portion 32 provided with the hole portion 36 is inclined inward with respect to the insertion direction of the lead wire 30, the lead wire 30 is reliably guided to the hole portion 36. In addition, springback occurs in the central portion, and the lead wire 30 can be reliably held. The lead wire 30 inserted in the hole 36 is fixed by welding, brazing, or the like.

The piezoelectric vibration device 20 taken out of the metal strip 70 is surface-mounted on the surface of the printed board 90 (see FIG. 2) via solder. At that time, in this embodiment, the width of the groove portions 40a and 40b of the pedestal body 26 is determined by the width of the terminal piece portion 3.
The width is set to be larger than the width of 4a and 34b by a predetermined dimension. Therefore, in practice, about 0.25 mm (preferably 0.05 mm to 0.3 m) is provided between both sides of the terminal piece portions 34a, 34b and the wall surface forming the groove portions 40a, 40b.
(within the range of m), a printed circuit board 9 is formed.
The solder provided on the surface of No. 0 rises along this gap due to the capillary phenomenon. Therefore, the solder is sufficiently spread to the upper side of the terminal piece portions 34a, 34b, and the terminal piece portions 34a, 34b
34b can be securely fixed, and the piezoelectric vibration device 20
It is possible to effectively and efficiently surface-mount the printed circuit board 90 on the printed circuit board 90.

Furthermore, the end portions of the terminal pieces 34a, 34b are inclined wall surfaces 42a, 42 provided on the pedestal body 26.
Along the line b, the pedestal body 26 is bent inwardly in the thickness direction from the bottom surface of the pedestal body 26. Therefore, the terminal piece portion 34a,
The corner portion 34b surely contacts the surface of the printed circuit board 90, the piezoelectric vibration device 20 can be firmly fixed to the printed circuit board 90, and it is possible to effectively prevent the occurrence of defective bonding. .

In this embodiment, two metal terminals 28 are used.
Although the piezoelectric vibrating device 20 including the above has been described, the number is not limited to this, and the number of the metal terminals 28 can be selected according to the electronic element used.

Further, the manufacturing apparatus 50 for manufacturing the pedestal 22 is provided with the vertical injection molding machine 52, but the invention is not limited to this, and various molding machines such as a transfer molding machine are used. can do.

Next, a package 100 which is an electronic component according to a second embodiment of the present invention is shown in FIGS. A semiconductor element (electronic element) 1 such as an LSI chip is provided on a plate body 104 arranged in the center of the package 100
06 is placed. The package 100 has a resin body (pedestal) 110 made of an electrically insulating material.
In addition, the semiconductor element 106 and the bonding wire (lead-out portion)
One end side of a plurality of lead pins (metal terminals) 116 electrically connected via 112 is fixed, and the lead pins 116 are bent toward the resin body 110 side.

A groove 118 corresponding to the lead pin 116 and having a width larger than the width of the lead pin 116 by a predetermined dimension is provided on a side portion of the resin body 110. On the surface (bottom surface) of the resin body 110 on the surface mounting side, the lead pins 116 are bent inwardly from the side portions of the resin body 110 and inclined inward in the thickness direction of the resin body 110. An inclined wall surface 120 is provided (see FIG. 6).

In this case, in the second embodiment, the resin body 11
The width of the 0 groove portion 118 is set to be larger than the width of the lead pin 116 by a predetermined dimension. Therefore, as in the first embodiment, the solder rises due to the capillary phenomenon along the gap provided between both sides of the lead pin 116 and the wall surface forming the groove 118. Therefore, even when a large number of lead pins 116 are provided with a narrow pitch like the package 100, it is possible to prevent defective joints of the lead pins 116 as much as possible and to perform highly accurate surface mounting work. can get.

[0029]

According to the surface mount electronic component and its pedestal of the present invention, the following effects can be obtained.

The bent metal terminal is arranged in the groove provided in the pedestal body made of an electrically insulating material, and the width of the groove is set to be larger than the width of the metal terminal by a predetermined dimension. When soldering a metal terminal to the surface of a printed circuit board or the like, the solder rises along the gap formed between the metal terminal and the groove via capillary action, and a good bonding state can be obtained. . Therefore, it is possible to reliably and easily surface-mount a printed circuit board or the like without causing a bonding failure.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a piezoelectric vibration device which is a surface-mounting electronic component according to a first embodiment of the present invention.

FIG. 2 is a vertical sectional side view of a pedestal that constitutes the piezoelectric vibration device.

FIG. 3 is a schematic explanatory view of a manufacturing apparatus for manufacturing the pedestal.

FIG. 4 is a perspective view of a metal strip used in the manufacturing apparatus.

FIG. 5 is a perspective explanatory view of a package which is a surface mounting electronic component according to a second embodiment of the present invention.

FIG. 6 is a vertical sectional side view of the package.

FIG. 7 is an exploded perspective view of a piezoelectric vibration device according to a conventional technique.

FIG. 8 is a side view of the piezoelectric vibration device.

[Explanation of symbols]

 20 ... Piezoelectric vibrating device 22 ... Pedestal 24 ... Crystal oscillator 26 ... Pedestal main body 28 ... Metal terminal 28a ... Metal terminal part 30 ... Lead wire 32 ... Terminal plate part 34a, 34b ... Terminal piece part 36 ... Hole part 40a, 40b ... Groove 50 ... Manufacturing device 52 ... Vertical injection molding machine 70 ... Metal strip 100 ... Package 106 ... Semiconductor element 110 ... Resin body 116 ... Lead pin 118 ... Groove

Claims (5)

[Claims] 1. A pedestal body made of an electrically insulating material, an electronic element mounted on the pedestal body made of an electrically insulating material, an electrically insulating material pedestal body side electrically connected to a lead-out portion of the electronic element. Characterized in that the pedestal body made of an electrically insulating material is provided with a groove portion corresponding to the metal terminal to be folded and having a width larger by a predetermined dimension than the width of the metal terminal. Electronic components for surface mounting. 2. The electronic component for surface mounting according to claim 1, wherein the metal terminal is directed inward from a side portion of the pedestal body made of the electrically insulating material along a surface on the surface mounting side and the electrically insulating material. An electronic component for surface mounting, characterized in that the pedestal body is bent inward in the thickness direction of the pedestal body. 3. A pedestal body made of an electrically insulating material, comprising: a pedestal body made of an electrically insulating material; and a metal terminal electrically connected to a lead-out portion of an electronic element and bent to the side of the pedestal body made of the electrically insulating material. Is a pedestal of a surface-mounting electronic component, wherein a groove corresponding to the bent metal terminal and having a width larger than the width of the metal terminal by a predetermined dimension is provided. 4. The pedestal according to claim 3, wherein the metal terminal is partially embedded in the pedestal body made of an electrically insulating material, and the lead-out portion of the electronic element is electrically connected to the terminal plate portion. And a terminal piece portion that is bent toward the pedestal body made of the electrically insulating material, the pedestal of a surface-mounting electronic component. 5. The pedestal according to claim 4, wherein the terminal piece portion is directed inward from a side portion of the pedestal body made of an electrically insulating material along a surface of a surface mounting side and the pedestal body made of an electrically insulating material. A pedestal for surface-mounting electronic components, which is bent inward in the thickness direction of the.