JP2719459B2 - Numerical display for surface mounting and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a numerical display for surface mounting which can be reflow bonded to a wiring board, and a method of manufacturing the same.

[0002]

2. Description of the Related Art FIG. 5 is a partially sectional side view showing a conventional numeric display. This numerical display is a so-called lead frame type display, in which an LED chip 83 is provided on a lead frame 82 in a case body (resin body) 81.
Die bonding and wire bonding,
A portion corresponding to the LED chip 83 is filled with a transparent resin 85 to form a segment portion 84. This LED
The surface of the transparent resin 85 corresponding to the chip 83 is shown in FIG.
As shown in the figure, a segment portion (in the illustrated example, 8 segments including a decimal point) 84 is provided.

When connecting this numeric display to a wiring board, a lead frame protruding outward from the case body is cut to an appropriate length, bent, inserted into a through hole of the wiring board, and connected to a wiring board. Dip or hand solder to the pattern on the substrate.

[0004]

A conventional numeric display is:
All are dip type (lead frame type) as shown in FIG. Therefore, when a numeric display is connected to a wiring board, dip or hand soldering is used. For this reason, the cutting work, the bending work, and the fitting work into the through hole of the lead frame (lead leg) protruding outside the case are troublesome.

On the wiring board on which the numeric display is mounted, various electronic components (chips such as semiconductors, resistors, capacitors, etc.) are usually mounted in addition to the numeric display. If these electronic components are of the surface mount type (reflow solder type), if the numeric display is of the dip type (lead frame type), separate soldering work is required, and And the efficiency of the solder connection work was very poor.

The present invention solves the above-mentioned problems, and provides a surface-mounting numerical display which can be easily manufactured, can be easily connected to a wiring board, and has a high solder connection work efficiency, and a method of manufacturing the same. The purpose is to:

[0007]

In order to achieve this object, a numerical display for surface mounting according to the first aspect of the present invention has the following structure. I have. Numerical indicators for surface mounting are composed of segments corresponding to the segments inside the surface of the body and LEDs corresponding to the segments inside.
It is characterized in that a chip is built in, a semi-cylindrical through-hole is exposed at the lower part of both ends of the body, and the LED chip and the conductor pattern portion of the through-hole are electrically connected.

In the numerical display having such a configuration,
Electrodes of through-holes are formed at lower portions of both ends of the body main body, which is a so-called leadless type display. The semi-cylindrical through-holes (conductor pattern portions) protruding at the lower portions of both ends of the body correspond to the pattern portions of the wiring board, so that half-reflow (surface mounting) is possible. Therefore, it is possible to eliminate the drawbacks of the dip type in which the lead frame (lead leg) protrudes from the body main body as in the conventional case (cutting, bending, insertion of the lead leg into the through hole).
In addition, when the electrical connection to the wiring board is performed, a single reflow half-mounting operation is required together with other electronic components (surface mounting type components) to be mounted on the wiring board, and the soldering operation is extremely simplified.

[0009] Claim 2 (Claim 2)
The method of manufacturing the numerical display device described above includes opening through holes at both ends, forming a common electrode in the plane, mounting a segment LED chip on the common electrode, and forming a conductor between the LED chip and the through hole. Electrically connecting the pattern portion to form a lower body, forming an upper body providing a segment portion corresponding to the LED chip in the plane, and bonding the upper body to the upper surface of the lower body, A step of cutting both end portions of the lower and upper bodies that are integrated into one body, and forming a side electrode to expose the through hole into a semi-cylindrical shape.

In such a manufacturing method, an upper body provided with a transparent segment portion corresponding to an LED chip in the plane is bonded to an upper surface of a flat resin-made lower body, and both ends of the lower and upper bodies to be superimposed. Just cut the electrode (the conductor pattern of the through hole) at the bottom of both ends of the display.
Can come out. Therefore, a surface-mount type numeric display can be obtained very easily.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view of an essential part showing a specific embodiment of a numerical display for surface mounting according to the first aspect of the present invention.

The numerical display for surface mounting has a segment portion 2 in the surface of the body 1 and an LED chip 3 corresponding to the segment 2 therein. The LED chip 3 and the conductor pattern portion 4 of the through hole 4 are exposed.
1 are electrically connected to each other.

This numerical display for surface mounting is formed by the following steps. The body 1 includes a lower body 11 and an upper body 12, as shown in FIG. FIG.
As shown in the figure, the lower body 11 is formed of a black epoxy resin material in the shape of a flat plate,
) Are opened. In the through hole 4, a conductor film (conductor pattern) 41 is formed on the peripheral surface of the opening and the peripheral surface of the hole. Further, the lower body 11
A flat common electrode 5 is formed on the upper surface of the LED chip 3, and the segment LED chip 3 (8 in the embodiment) is formed on the common electrode 5.
Mounted). The individual electrode portions of each LED chip 3 are electrically connected to the corresponding conductor pattern 41 of the through hole 4 by the lead wire 31. Lead wire 3
1 is performed through an insulator, and the common electrode 5
To prevent short circuit. Further, one 4 a of the ten through holes 4 is electrically connected to the common electrode 5 via the lead wire 32.

FIG. 3 is a perspective view showing the upper body 12. As shown in FIG. The upper body 12 is resin-molded into a flat plate having the same size as the lower body 11, and after a through hole 12a for a segment is formed in a plane, the through hole 12a is filled with a transparent epoxy resin. The segment 2 is formed.

The upper body 12 is bonded to the upper surface of the lower body 11 with an adhesive. In this state, each LED chip 3 is located corresponding to each segment portion 2. Further, both ends of the lower body 11 and the upper body 12 which are superposed and integrally bonded are cut. That is,
The lower body 12 is cut such that the through holes 4 at both ends thereof have a semi-cylindrical shape. As a result, as shown in FIG. 1, through holes (conductor pattern portions 41) 4 having a semi-cylindrical shape protrude below the both ends of the body 1.

In the numerical display for surface mounting having such a configuration, through holes (electrodes) 4 are exposed at the lower portions of both ends of the body 1, so that it is a so-called leadless type display. Semi-cylindrical through-holes (conductor pattern portions 41) 4 projecting to the lower portions of both ends of body body 1
Corresponds to each pattern portion 61 of the wiring board 6, and the reflow half (surface mounting) 7 becomes possible. Therefore, it is possible to eliminate the drawbacks of the dip type in which the lead frame (lead leg) protrudes from the body main body 1 (cutting, bending, and insertion into the through hole) as in the related art. In addition, when electrically connecting to the wiring board 6, together with other electronic parts (parts of a surface mounting type) mounted on the wiring board 6, the other electronic parts and the numeric display can be connected by a single half-lifting operation. Soldering work is completed, and soldering work efficiency is improved.

Further, claim 2 (claim 2)
According to the method for manufacturing a surface-mounted numeric display device described above, the upper body 1 in which the transparent segment portion 2 corresponding to the LED chip 3 is provided on the upper surface of the flat lower resin body 11 in the plane.
The electrodes (the conductor pattern portion 41 of the through-hole 4) can be exposed at the lower portions of both ends of the display by merely bonding the two and cutting both ends of the lower portion 11 and the upper body 12 to be superposed. Therefore, a surface-mount type numerical display can be obtained at a low cost by an extremely easy manufacturing process.

[0018]

According to the present invention, as described above, the segment portion is built in the plane of the body main body, and the LED chips corresponding to the segment portion are built therein, and the semi-cylindrical through holes are formed in the lower portions of both ends of the body main body. And the LED chip and the conductor pattern portion of the through hole are electrically connected, so that a so-called leadless display device can be realized, and surface mounting becomes possible. Therefore, the cutting, bending, and fitting work of the lead leg of the conventional lead frame type (dip type) display are not required at all, and other surface mounting types mounted on the wiring board are not allowed. The reflow can be performed at the same time as the electronic parts, and the efficiency of the work is improved.

Further, in the method of manufacturing a surface-mounted numeric display,
The advantages of achieving the object of the invention, such as the fact that connection electrodes can be protruded below both ends of the display by an extremely simple manufacturing process, and that a surface-mount type numeric display can be obtained easily and at low cost. Have.

[Brief description of the drawings]

FIG. 1 is a perspective view of an essential part showing a numerical display for surface mounting according to an embodiment.

FIG. 2 is a perspective view showing a lower body of the numerical display for surface mounting according to the embodiment.

FIG. 3 is a perspective view showing an upper body of the numerical display for surface mounting according to the embodiment.

FIG. 4 is an explanatory diagram showing an example of a segment of a numeric display.

FIG. 5 is a partially sectional side view showing a conventional numeric display.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Body main body 2 Segment part 3 LED chip 4 Through hole 5 Common electrode 11 Lower body 12 Upper body

Claims (2)

(57) [Claims] An LED chip corresponding to a segment portion in a surface of a body main body, and a semi-cylindrical through-hole are exposed at lower portions of both ends of the body main body. Numerical display for surface mounting, which is electrically connected to the conductor pattern of the through hole. 2. A through hole is opened at both ends, a common electrode is formed in a plane, and a segment LED chip is mounted on the common electrode, and the LED chip and a conductor pattern portion of the through hole are electrically connected to each other. Forming a lower body by electrically connecting, forming an upper body provided with a segment portion corresponding to the LED chip in a plane, bonding the upper body to the upper surface of the lower body, and then integrally polymerizing. A method of manufacturing a surface-mounting numeric display, comprising: a step of cutting both end portions of a lower / upper body to form a through-hole into a semi-cylindrical shape.