JP3099382B2 - Small oscillator - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small and thin oscillator.

[0002]

2. Description of the Related Art FIG. 5 shows a conventional oscillator. (A) shows a front view and (b) shows a side view.

In a conventional oscillator, an IC 51 is die-bonded to a lead frame 50 with an adhesive 52 as shown in FIG.
The electrodes of the IC 51 and the lead frame 50 are connected by wires 53 by wire bonding.

The lead 55 of the piezoelectric vibrator 54 having a circular cross section is bent twice at a right angle to the lead frame 50 as shown in FIG. 5A and fixed by welding or the like. The case of the piezoelectric vibrator 54 and the lead frame 50 are insulated by an insulator 56.

[0005] The lead frame 50 to which the parts are attached is molded with a thermoplastic resin or the like, and the outer case 57 is molded.
After that, the lead 58 of the lead frame 50 is cut and bent using a press, and the SOJ type oscillator 59 is cut.
And had

[0006]

However, in the prior art, since the piezoelectric vibrator is thick and the IC is also fixed on the lead frame, the thickness of the oscillator is as large as 5 mm.

Also, the lead of the piezoelectric vibrator was drawn out long for welding, so that the oscillator was as long as 12 mm and the bottom area was as large as 12 × 5 mm.

[0008]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and comprises a semiconductor element, a substrate having a hole for receiving the semiconductor element, and a piezoelectric vibrator having a flat portion on a part of the surface of the case. And fixing the flat part to the substrate with the flat part facing the hole, and fixing the semiconductor element to the flat part by inserting the semiconductor element into the hole. A semiconductor device, a lead frame having a hole into which the semiconductor device is inserted, and a piezoelectric vibrator having a flat portion on a part of the surface of the case, wherein the flat portion faces the hole and the lead The semiconductor device is fixed to the frame while being fixed to the flat portion while being inserted into the hole.

[0009]

An embodiment of the present invention will be described with reference to FIG.

(A) is a plan view, (b) is a front view, (c)
Shows a side view. A hole for inserting the IC 2 is formed in the substrate 1 in advance, and a pattern for wiring to the IC 2 is printed on one surface of the substrate 1. A piezoelectric vibrator 3 having a flat surface on one side of a cross section is attached to one side of the substrate 1 having no wiring pattern with an adhesive 4.

In this embodiment, the piezoelectric vibrator 3 is a hermetically sealed piezoelectric vibrator 3 having an oval cross section.

As the material of the substrate 1, a ceramic or glass epoxy plate may be used.

The continuity between the piezoelectric vibrator 3 and the substrate 1 is made by making a hole in the substrate 1 as shown in FIGS.
What is necessary is just to insert the lead 5 of the piezoelectric vibrator 3 bent at a right angle, and to use the conductive adhesive 6 etc.

The IC 2 is inserted into a hole on the substrate 1 side of the piezoelectric vibrator 3 having the oval cross section fixed to the substrate 1 in this manner, and the IC 2 is die-bonded to the flat portion of the case surface of the piezoelectric vibrator 3 with an adhesive 7 I do.

Next, the electrodes of the IC 2 and the electrode patterns of the substrate 1 are connected by wires 8 by wire bonding.

Then, the lead terminals 9 are inserted into the substrate 1 and fixed by soldering or the like.

The substrate 1 thus manufactured is molded using a thermoplastic resin or the like to form an outer case 10.
Lead terminal 9 is for surface mounting (SOJ type in FIG. 1 (c))
To complete the small oscillator 11.

By using the piezoelectric vibrator 3 having an oval cross section and directly fixing the IC 2 to the piezoelectric vibrator 3, the conventional thickness can be reduced to almost half and the thickness can be reduced to 2.6 mm. . Also, the bottom area was 4.5 × 9.5 mm, which was reduced to 70% of the conventional size.

FIGS. 2A and 2B show another embodiment of the present invention. FIG. 2A is an enlarged view of an IC part, and FIG. 2B is a sectional view.

After fixing the piezoelectric vibrator 20 to the substrate 18 with the adhesive 17 and fixing the IC 19 to the piezoelectric vibrator 20,
This is an example in which conduction between the substrate 19 and the substrate 18 is performed using the sheet electrode 12 made of polyimide or the like.

The sheet electrode 12 is made of a resin such as polyimide or the like.
4, an electrode pattern 15 is formed.

Then, the sheet-like electrode 12 is attached to the conductive adhesive 16 in accordance with the IC 19 and the electrode pattern 14 of the substrate 18.
By conducting the electrical connection using heat or pressure bonding, it is possible to further reduce the thickness as compared with the connection by the wire bonding method.

3A and 3B show another embodiment of the present invention. FIG. 3A is a front view, and FIG. 3B is a side view.

In this example, the substrate 1 and the lead terminals 9 of FIG. 1 are metal lead frames 21 and the material and shape of the lead frame 21 as the substrate 1 are changed.

An adhesive 23 is attached to a lead frame 21 in a state where a piezoelectric vibrator 22 having an oval cross section is insulated on a lead frame 21.
Attach with

The lead 23 of the piezoelectric vibrator 22 is bent at a right angle, inserted into a hole of the lead frame 21, and fixed with a conductive adhesive 24 or the like as shown in FIG.

The lead frame 21 has a hole into which the IC 25 can be inserted.
2 is fixed with an adhesive 26.

Then, the IC 25 and the lead frame 21 are connected by wire bonding with the wires 27.

The lead frame 21 is molded with a thermoplastic resin or the like, and the leads 28 of the lead frame 21 are bent for surface mounting (SOJ type in FIG. 3B) to form a small oscillator 29.

By attaching components directly to the lead frame 21 in this manner, it is very easy to reduce component costs and to automate the components.

FIG. 4 also shows another embodiment of the present invention, wherein (a) is a front view and (b) is a bottom view.

A thin sheet-like electrode 32 in which an electrode 31 is attached to a polyimide resin or the like is insulated from the flat portion of the piezoelectric vibrator 30 having an oval cross section and having a flat portion.

The lead 33 of the piezoelectric vibrator 30 is bent at a right angle and inserted into the hole of the lead frame 34, and the conductive adhesive 3
5 and so on.

Then, the IC 36 is bonded to the electrode 31 of the sheet electrode 32. Next, the lead frame 34 is joined to the electrode 31.

As described above, the sheet-like electrode 32, the IC 36, and the lead frame 34 are attached to the piezoelectric vibrator 30 and molded with a thermoplastic resin or the like to form an outer case 37, and the leads 38 of the lead frame 34 are surface-mounted. The small oscillator 39 is bent. By attaching a thin sheet-like electrode 32 to the piezoelectric vibrator 30 and attaching an IC 36 and a lead frame 34 thereto, a thin oscillator 39 that is thin and easy to automate can be manufactured.

In this embodiment, an example is described in which the piezoelectric vibrator 3 and the substrate 1 are mounted in an insulated manner. However, if the piezoelectric vibrator 3 is mounted on the substrate 1 so that the case is grounded, the stray capacitance is eliminated, and the oscillator as an oscillator is provided. The properties are even better.

In this embodiment, an example is shown in which the outer case is molded with a thermoplastic resin or the like. However, a box-shaped resin case sandwiching the substrate 1 and the lead frame 17, a ceramic sandwich, a low melting glass or the like is used. It may be sealed with an adhesive or the like and used as an outer case.

The cross-sectional shape of the piezoelectric vibrator may be an oval shape, a square shape, or a modified shape, as long as the piezoelectric vibrator only needs to have a partly flat portion.

[0039]

As described above, according to the present invention, I
Instead of mounting C, mount the IC on a thin piezoelectric vibrator that has a flat surface in part of the cross section, mount a substrate with a hole for the IC, and after wire bonding, make an external case by molding etc. The thickness can be reduced to 2.6 mm which is almost half of the conventional thickness. Further, the conduction between the IC and the substrate can be made thinner by using sheet-like electrodes. Further, by attaching a sheet-like electrode to the piezoelectric vibrator, the structure becomes thin and easy to automate.

By mounting the lead of the piezoelectric vibrator at a right angle to the substrate, it is possible to provide a small surface-mounted oscillator having a bottom area reduced by 70% as compared with the prior art.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention, wherein (a) is a plan view,
(B) is a front view, (c) is a side view.

FIGS. 2A and 2B show another embodiment of the present invention, wherein FIG. 2A is an enlarged view of an IC part, and FIG.

FIG. 3 shows another embodiment of the present invention, wherein (a) is a front view,
(B) is a side view.

FIG. 4 shows another embodiment of the present invention, wherein (a) is a front view,
(B) is a bottom view.

5A and 5B show a conventional oscillator, wherein FIG. 5A is a front view and FIG.
Is a side view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 IC 3 Piezoelectric vibrator 4 Adhesive 5 Lead 6 Conductive adhesive 7 Adhesive 8 Wire 9 Lead terminal 10 Outer case 11 Small oscillator 12 Sheet electrode 13 Electrode pad 14 Electrode pattern 15 Electrode pattern 16 Conductive adhesive 17 Adhesive 18 Substrate 19 IC 20 Piezoelectric vibrator 21 Lead frame 22 Piezoelectric vibrator 23 Adhesive 24 Conductive adhesive 25 IC 26 Adhesive 27 Wire 28 Lead 29 Small oscillator 30 Piezoelectric vibrator 31 Electrode 32 Sheet electrode 33 Lead 34 Lead frame 35 Conductive adhesive 36 IC 37 Outer case 38 Lead 39 Small oscillator

Claims (4)

(57) [Claims] 1. A semiconductor device comprising: a semiconductor element; a substrate having a hole into which the semiconductor element is inserted; and a piezoelectric vibrator having a flat part on a part of the surface of the case, wherein the flat part faces the hole. A small oscillator fixed to the substrate, wherein the semiconductor element is inserted into the hole and fixed to the flat portion. 2. The small oscillator according to claim 1, wherein conduction between said semiconductor element and said substrate is performed by a sheet-like electrode. 3. A sheet-like electrode is attached to said case,
2. The small oscillator according to claim 1, wherein said semiconductor element and said substrate are attached to said electrode. 4. A semiconductor device, a lead frame having a hole for receiving the semiconductor element, and a piezoelectric vibrator having a flat portion on a part of the surface of the case, wherein the flat portion faces the hole. Wherein the semiconductor element is fixed in the flat portion by inserting the semiconductor element into the hole.