CN112616245B - Acceleration processor acceleration card and manufacturing method thereof - Google Patents
Acceleration processor acceleration card and manufacturing method thereof Download PDFInfo
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- CN112616245B CN112616245B CN202011468696.2A CN202011468696A CN112616245B CN 112616245 B CN112616245 B CN 112616245B CN 202011468696 A CN202011468696 A CN 202011468696A CN 112616245 B CN112616245 B CN 112616245B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
The invention provides an acceleration processor accelerator card and a manufacturing method thereof. The accelerated processor accelerator card includes: the system comprises a PCB, an acceleration processor module and a plurality of power supply modules; the plurality of power modules and the acceleration processor module are fixedly arranged on the first surface of the PCB, the PCB is provided with a first through hole and a second through hole on the first surface, and the plurality of power modules and the acceleration processor module are electrically connected through the first through hole and the second through hole. The acceleration processor provided by the invention has high space utilization rate of the acceleration card.
Description
Technical Field
The invention relates to the technical field of electronic equipment, in particular to an acceleration card of an acceleration processor and a manufacturing method thereof.
Background
With the rapid development of technology, the PCB interconnection scheme needs to meet the requirements of high density, high power and high speed, and the accelerated processor accelerator card affected by the requirement is simultaneously challenged by small installation space and high speed, high PIN density and large current.
The requirement of high power consumption and large current requires more VR (Voltage Regulator Module) power layout space of the accelerator card of the accelerator processor to meet the specifications of X16 PCI-E4.0 and 32LANE xGMI, where VR may also be called VRM, i.e. VR power Module. But this results in limited layout and routing space on the PCB board. If the area of the PCB board is increased, the space of the bottom board is insufficient, or the whole scheme is changed, and even the function of compatible with the main board cannot be realized.
Disclosure of Invention
In order to solve the problems, the accelerated processor accelerator card and the manufacturing method thereof provided by the invention have the advantages that the accelerated processor module and the plurality of connector modules are fixed on the PCB in a deep micropore mode, so that the space utilization rate of the accelerated processor accelerator card can be improved.
In a first aspect, the present invention provides an accelerated processor accelerator card comprising: the system comprises a PCB, an acceleration processor module, a plurality of connector modules and a plurality of power supply modules;
the plurality of power modules and the accelerator processor module are fixedly arranged on a first surface of the PCB, the PCB is provided with a first through hole and a second through hole on the first surface, the plurality of power modules and the accelerator processor module are electrically connected through the first through hole and the second through hole, the plurality of connector modules are fixedly connected with the PCB, the surface of the PCB is provided with a plurality of first connecting holes, and the plurality of connector modules are electrically connected with the accelerator processor module through the plurality of first connecting holes;
the plurality of first connection holes includes: a plurality of deep micro-wells.
Optionally, the PCB is provided with the plurality of first connection holes on the second surface, and the first surface and the second surface are two opposite surfaces of the PCB.
Optionally, the plurality of connector modules are located between the plurality of power supply modules and the acceleration processor module relative to the first surface.
Optionally, the PCB board comprises a plurality of insulating layers;
an insulating layer is arranged between the adjacent conducting layers;
the conductive layer includes: 2oz copper foil.
Optionally, the acceleration processor accelerator card further comprises: a plurality of resistor-capacitor modules;
the plurality of resistance-capacitance modules are fixedly connected with the PCB, a plurality of second connecting holes are further formed in the first surface or the second surface of the PCB, and the plurality of resistance-capacitance modules are electrically connected with the acceleration processor module through the plurality of second connecting holes.
Optionally, the plurality of resistive-capacitive modules are located between the plurality of power supply modules and the acceleration processor module relative to the first surface.
Optionally, the aperture of the first and second plurality of vias ranges from 8 mils to 10 mils.
Optionally, the aperture of each of the first connection hole and the second connection hole is smaller than 8 mil.
In a second aspect, the present invention provides a method for manufacturing an accelerator card of an acceleration processor, including:
providing a PCB, an acceleration processor module, a plurality of connector modules and a plurality of power supply modules;
forming a first through hole and a second through hole on the first surface of the PCB;
electrically connecting the plurality of power modules with the acceleration processor module through the first and second vias;
forming a plurality of first connecting holes in one surface of the PCB;
electrically connecting the plurality of connector modules with the acceleration processor module through the plurality of first connection holes;
wherein the plurality of first connection holes include: a plurality of deep micro-wells.
Optionally, the method further comprises:
providing a plurality of resistance-capacitance modules;
a plurality of second connecting holes are formed in the first surface or the second surface of the PCB;
electrically connecting the plurality of resistive-capacitive modules with the acceleration processor module through the plurality of second connection holes;
set up a plurality of first connecting holes in a surface of PCB board, include: forming a plurality of first connecting holes in the second surface of the PCB;
wherein the first surface and the second surface are two opposite surfaces of the PCB; relative to the first surface, the plurality of resistive-capacitive modules are located between the plurality of power supply modules and the acceleration processor module, and the plurality of resistive-capacitive modules are located between the plurality of power supply modules and the acceleration processor module.
According to the accelerated processor accelerator card and the manufacturing method thereof provided by the embodiment of the invention, the corresponding deep micropores are formed on the surface of the PCB, and the accelerated processor module and the plurality of connector modules are electrically connected and fixed on the PCB through the corresponding deep micropores, so that the space utilization rate of the accelerated processor accelerator card is improved.
Drawings
FIG. 1 is a block diagram of an accelerator card of an acceleration processor according to an embodiment of the present application;
FIG. 2 is a block diagram of an acceleration processor accelerator card according to an embodiment of the present application under a perspective view of a PCB;
FIG. 3 is a flowchart illustrating a method for manufacturing an accelerated processor speed card according to an embodiment of the present disclosure.
Reference numerals
1. A PCB board; 11. a conductive layer; 2. an acceleration processor module; 3. a resistance-capacitance module; 4. a connector module; 5. a power supply module; 61. a first through hole; 62. a second through hole; 63. a third through hole; 64. a first connection hole; 65. a second connection hole; 66. and a third connecting hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In a first aspect, the present invention provides an accelerated processor accelerator card comprising: the system comprises a PCB (printed circuit board) 1, an acceleration processor module 2, two resistance-capacitance modules 3, two connector modules 4 and two power supply modules 5.
The PCB board 1 comprises a plurality of conductive layers 11, and an insulating layer is arranged between every two adjacent conductive layers 11; the acceleration processor module 2, the two resistance-capacitance modules 3 and the two power supply modules 5 are all fixedly arranged on the upper surface of the PCB 1; the two connector modules 4 are fixedly arranged on the lower surface of the PCB board 1; the two resistance-capacitance modules 3 are respectively positioned on two opposite sides of the acceleration processor module 2, the two power supply modules 5 are also respectively positioned on two opposite sides of the acceleration processor module 2, and the resistance-capacitance modules 3 are respectively positioned between the corresponding power supply modules 5 and the acceleration processor module 2. The upper surface is a left side surface of the PCB board 1 in fig. 1, and the lower surface is a right side surface of the PCB board 1 in fig. 1.
In this embodiment, the PCB board 1 includes eight conductive layers 11 and seven insulating layers, and the conductive layers 11 and the insulating layers are alternately arranged; specifically, the conductive layer 11 is a 2oz copper foil, and through the arrangement of the 2oz copper foil, the through flow of the accelerated processor accelerator card can be increased, so that the requirement of high power consumption of the accelerated processor accelerator card is met; the two power supply modules 5, the two resistance-capacitance modules 3 and the acceleration processor module 2 are all fixedly arranged on the upper surface of the PCB 1; the PCB board 1 is provided with two first through holes 61, two second through holes 62, two second connecting holes 65, two third connecting holes 66 and two third through holes 63 on the upper surface, and the PCB board 1 is provided with two first connecting holes 64 on the lower surface; the two first through holes 61, the two second through holes 62 and the two third through holes 63 are all through holes, and the two first connecting holes 64, the two second connecting holes 65 and the two third connecting holes 66 are all deep micro holes, i.e. blind holes; the aperture of each of the first through hole 61 and the second through hole 62 is 8 mil; the diameters of the first connecting hole 64, the second connecting hole 65, the third through hole 63 and the third connecting hole 66 are all 6 mil; the PCB 1 is manufactured by adopting a deep micropore and POFV process. Wherein the two first connection holes 64, the two second connection holes 65, the two third through holes 63, and the two third connection holes 66 are second-order deep micro holes. The deep micropore is formed by processing a laser hole process, can be processed into a via hole from the surface layer of the PCB board 1 to the secondary outer layer of the PCB board 1, also can be processed into a via hole from the surface layer of the PCB board 1 to the third layer of the PCB board 1, adopts a hole of 6mil smaller than a conventional hole of 8mil, can be used for walking a high-speed signal, can reduce capacitive impedance, and can reach the influence of 0mil STUB (STUB).
Specifically, the two power modules 5 are respectively connected with one end of the corresponding second through hole 62; the acceleration processor module 2 is simultaneously connected with one ends of the two first through holes 61, the two third through holes 63 and the two third connecting holes 66; the two corresponding second through holes 62 are respectively connected with the corresponding first through holes 61 through the corresponding conductive layers 11, the two corresponding first connection holes 64 are respectively connected with the corresponding third through holes 63 through the corresponding conductive layers 11, and the two corresponding second connection holes 65 are respectively connected with the corresponding third connection holes 66 through the corresponding conductive layers 11; the two connectors are electrically connected with the acceleration processor module 2 in a PCIE (peripheral component interface express) wiring mode and an XGMI (XGMI) wiring mode respectively.
In an optional embodiment, the first connection hole 64, the second connection hole 65, the third connection hole 63, and the third connection hole 66 are implemented by using an HDI (High Density interconnect) or N + N processing technology. The HDI processing technology is a high-density interconnected circuit board utilizing a blind hole burying technology, is mainly used for terminal consumer products, and is divided into a first-order 1+ N +1 and a second-order 1+1+ N +1+1 and the like through a process method of blind hole electroplating and secondary pressing; the N + N processing technology is to process the two PCBs in a mechanical through hole mode and press the PCBs for one time to obtain the PCB.
A second aspect. The invention provides a method for manufacturing an acceleration card of an acceleration processor, which comprises the following steps of S101 to S105:
step S101: a PCB board 1, an accelerated processor module 2, two connector modules 4 and two power supply modules 5 are provided.
Step S102: a first through hole 61 and a second through hole 62 are formed in the first surface of the PCB board 1.
Step S103: the two power supply modules 5 are electrically connected to the acceleration processor module 2 through the first through hole 61 and the second through hole 62.
Step S104: two first connection holes 64 are formed in the second surface of the PCB board 1, and the first surface and the second surface are two opposite surfaces of the PCB board 1.
Step S105: the two connector modules 4 are electrically connected with the acceleration processor module 2 through the two first connection holes 64.
In this embodiment, both first connection holes 64 are deep micro holes. The method further comprises the following steps:
providing two resistance-capacitance modules;
two second connection holes 65 are formed in the first surface or the second surface of the PCB board 1;
the two resistance-capacitance modules are electrically connected with the acceleration processor module 2 through the two second connecting holes 65;
wherein, with respect to the first surface, the two resistive-capacitive modules are located between the two power modules 5 and the acceleration processor module 2, and the two resistive-capacitive modules are located between the two power modules 5 and the acceleration processor module 2.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. An accelerated processor accelerator card, comprising: the system comprises a PCB, an acceleration processor module, a plurality of connector modules and a plurality of power supply modules;
the plurality of power modules and the acceleration processor module are fixedly arranged on a first surface of the PCB, the plurality of connector modules are arranged on a second surface of the PCB, the first surface and the second surface are two opposite surfaces of the PCB, the PCB is provided with a first through hole and a second through hole on the first surface, the plurality of power modules and the acceleration processor module are electrically connected through the first through hole and the second through hole, the plurality of connector modules are fixedly connected with the PCB, the second surface of the PCB is provided with a plurality of first connecting holes, and the plurality of connector modules are electrically connected with the acceleration processor module through the plurality of first connecting holes;
the plurality of first connection holes includes: a plurality of deep micro-wells.
2. The accelerated processor accelerator card of claim 1, wherein the plurality of connector modules are located between the plurality of power supply modules and the accelerated processor module relative to the first surface.
3. The accelerated processor accelerator card of claim 1, wherein the PCB board comprises multiple layers of insulation;
an insulating layer is arranged between the adjacent conducting layers;
the conductive layer includes: 2oz copper foil.
4. The accelerated processor accelerator card of claim 1, further comprising: a plurality of resistor-capacitor modules;
the plurality of resistance-capacitance modules are fixedly connected with the PCB, a plurality of second connecting holes are further formed in the first surface or the second surface of the PCB, and the plurality of resistance-capacitance modules are electrically connected with the acceleration processor module through the plurality of second connecting holes.
5. The accelerated processor accelerator card of claim 4, wherein the plurality of resistive-capacitive modules are located between the plurality of power modules and the accelerated processor module relative to the first surface.
6. An accelerated processor speed card according to claim 1, wherein the first and second plurality of vias have an aperture ranging from 8 mils to 10 mils.
7. An accelerated processor speed card according to claim 4, wherein the first connection hole and the second connection hole each have an aperture diameter of less than 8 mils.
8. A method for manufacturing an acceleration card of an acceleration processor, comprising:
providing a PCB, an acceleration processor module, a plurality of connector modules and a plurality of power supply modules;
forming a first through hole and a second through hole on the first surface of the PCB;
electrically connecting the plurality of power modules and the acceleration processor module through the first through hole and the second through hole, wherein the plurality of power modules and the acceleration processor module are fixedly arranged on the first surface of the PCB;
forming a plurality of first connecting holes in the second surface of the PCB;
electrically connecting the plurality of connector modules with an acceleration processor module through the plurality of first connection holes, the plurality of connector modules being disposed on the second surface of the PCB board;
wherein the plurality of first connection holes include: a plurality of deep micro holes, the first surface and the second surface being opposite surfaces of the PCB.
9. The method of claim 8, further comprising:
providing a plurality of resistance-capacitance modules;
a plurality of second connecting holes are formed in the first surface or the second surface of the PCB;
electrically connecting the plurality of resistive-capacitive modules with the acceleration processor module through the plurality of second connection holes;
wherein, relative to the first surface, the plurality of connector modules are located between the plurality of power supply modules and the acceleration processor module, and the plurality of resistive-capacitive modules are located between the plurality of power supply modules and the acceleration processor module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011468696.2A CN112616245B (en) | 2020-12-14 | 2020-12-14 | Acceleration processor acceleration card and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011468696.2A CN112616245B (en) | 2020-12-14 | 2020-12-14 | Acceleration processor acceleration card and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN112616245A CN112616245A (en) | 2021-04-06 |
| CN112616245B true CN112616245B (en) | 2022-04-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011468696.2A Active CN112616245B (en) | 2020-12-14 | 2020-12-14 | Acceleration processor acceleration card and manufacturing method thereof |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113810201A (en) * | 2021-09-16 | 2021-12-17 | 善悦(武汉)高新技术有限公司 | 5G accelerator card communication module, accelerator card and communication transmission method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661431A (en) * | 2013-11-15 | 2015-05-27 | 联想(北京)有限公司 | Electronic equipment |
| CN106793577A (en) * | 2017-01-16 | 2017-05-31 | 生益电子股份有限公司 | The preparation method and PCB of a kind of High-Speed PCB |
| CN106910722A (en) * | 2015-12-23 | 2017-06-30 | 三星电子株式会社 | System module and the mobile computing device including the system module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10251273B2 (en) * | 2008-09-08 | 2019-04-02 | Intel Corporation | Mainboard assembly including a package overlying a die directly attached to the mainboard |
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- 2020-12-14 CN CN202011468696.2A patent/CN112616245B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661431A (en) * | 2013-11-15 | 2015-05-27 | 联想(北京)有限公司 | Electronic equipment |
| CN106910722A (en) * | 2015-12-23 | 2017-06-30 | 三星电子株式会社 | System module and the mobile computing device including the system module |
| CN106793577A (en) * | 2017-01-16 | 2017-05-31 | 生益电子股份有限公司 | The preparation method and PCB of a kind of High-Speed PCB |
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| CN112616245A (en) | 2021-04-06 |
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