CN113810201A - 5G accelerator card communication module, accelerator card and communication transmission method - Google Patents

5G accelerator card communication module, accelerator card and communication transmission method Download PDF

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Publication number
CN113810201A
CN113810201A CN202111083401.4A CN202111083401A CN113810201A CN 113810201 A CN113810201 A CN 113810201A CN 202111083401 A CN202111083401 A CN 202111083401A CN 113810201 A CN113810201 A CN 113810201A
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CN
China
Prior art keywords
circuit board
card
plc circuit
accelerator card
communication module
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Withdrawn
Application number
CN202111083401.4A
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Chinese (zh)
Inventor
陈新民
马锦
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Shanyue Wuhan High Tech Co ltd
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Shanyue Wuhan High Tech Co ltd
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Priority to CN202111083401.4A priority Critical patent/CN113810201A/en
Publication of CN113810201A publication Critical patent/CN113810201A/en
Withdrawn legal-status Critical Current

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00Data switching networks
    • H04L12/02Details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00Insulators or insulating bodies characterised by their form
    • H01B17/56Insulating bodies
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04WWIRELESS COMMUNICATION NETWORKS
    • H04W88/00Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
    • H04W88/08Access point devices
    • H04W88/085Access point devices with remote components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention belongs to the technical field of 5G communication, in particular to a 5G acceleration card communication module, an acceleration card and a communication transmission method, aiming at the problems of heavy acceleration card module and low communication corresponding speed in the prior art, the invention provides the following scheme, which comprises the 5G acceleration card communication module and the acceleration card, wherein the PLC circuit board 1 is provided with eight mounting holes uniformly on the upper surface close to four corners and in the middle part of the PLC circuit board 1, gaskets 6 are embedded on the lower surface of the mounting holes on the lower surface of the PLC circuit board 1, an insulating plate 3 is fixed on the upper surface of the PLC circuit board 1 through screws, a plurality of clamping grooves 7 for positioning are formed in the end part of the long edge of the PLC circuit board 1, and Finger joints 8 distributed at equal intervals are fixed on the upper surface of the PLC circuit board 1 at the edge of one side provided with the clamping grooves 7; the invention can reduce the volume of the accelerator card and increase the compression resistance and the heat dissipation effect of the accelerator card.

Description

5G accelerator card communication module, accelerator card and communication transmission method
Technical Field
The invention relates to the technical field of 5G communication, in particular to a 5G accelerator card communication module, an accelerator card and a communication transmission method.
Background
The 5G day world is interconnected, the cloud computing development speed is remarkable, and the requirements of various internet companies, cloud computing service providers and communication service providers on the operational performance and the data processing speed of the server are higher and higher. The traditional CPU can not meet the requirement of data processing in the 5G era; the application of high-performance servers is increased, the market demand on the high-performance servers is increased, the current high-performance servers generally adopt 4-path accelerator cards or even 6-path 8-path accelerator cards, the accelerator cards belong to high-performance operation cards and are provided with large-area heat dissipation plates and electronic components, the weight can reach 2 kilograms, the servers have the accelerator cards, the biggest problem is how to ensure the stability of the accelerator cards in the transportation and installation processes, and the phenomenon that the precision electronic components of the accelerator cards are damaged due to redundant vibration and hundreds of thousands of losses are avoided.
Therefore, a new portable accelerator card and a communication transmission method thereof are needed to solve the problems in the prior art.
Disclosure of Invention
The invention provides a 5G accelerator card communication module, an accelerator card and a communication transmission method, aiming at overcoming the problems of heavy accelerator card module and low communication corresponding speed in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme: A5G accelerates the card communication module, accelerator card, include a 5G accelerates the card communication module, accelerator card, including PLC breadboard, the upper surface of the said PLC breadboard is close to the four corners department and the middle part equipartition has eight mounting holes, and the lower surface of the PLC breadboard locates at the lower surface of the mounting hole and all inlays and is equipped with the packing ring, the upper surface of the said PLC breadboard has insulation boards through the fix with screw, the long edge end of the said PLC breadboard 1 opens several draw-in grooves used for positioning, and the PLC breadboard locates at one side edge of draw-in groove upper surface fixed with equidistantly distributed Finger joint, the end of the PLC breadboard welds interface and SAM joint respectively, thus can reduce the volume of the accelerator card, increase its resist compression and radiating effect, cooperate with the 5G NR transmission system that the apparatus carries, used for realizing 5G NR base station processing unit, centralized control manages the whole base station system, the direct access and data interaction with a 5G core network are realized, NGAP and XnAP interfaces are realized, and simultaneously, the functions of a 5G NR access network protocol stack, the functions of RRC, PDCP, SDAP, RLC, MAC and PHY protocol layers and the function of baseband processing are realized.
As a preferable scheme in the present invention, a plurality of grooves are reserved on the upper surface of the insulating plate, and the screw fixing blocks are fixed above the four mounting holes in the middle of the grooves, so that the insulating effect of the device can be improved when in use, the strength and the heat dissipation effect of the accelerator card can be increased, and a part of dust can be blocked on the surface of the PLC circuit board 1.
As the preferable scheme in the invention, the edge of one side of the upper surface of the Finger joint, which is far away from the insulating plate, is provided with an inclined chamfer, so that the plugging convenience of the accelerator card can be improved.
A communication transmission method of a 5G acceleration card communication module and an acceleration card comprises the following steps:
the method comprises the following steps: the system built in the device realizes network intellectualization, interface opening, hardware generalization and software development, wherein the chip comprises: the general processor is used for processing an L2/L3 protocol layer and mainly uses an x86/Arm architecture; a fronthaul FPGA for terminating CPRI traffic to and from the radio unit, using a medium FPGA device including Kintex or Zynq; the L1 baseband ASIC or FPGA realizes LoPHY and HiPHY functions, the FPGA is firstly deployed in the used chip, and then the 2 nd generation ASIC chip is deployed;
step two: the forwarding termination is completed by Zynq UltraScale + and 2 SSP28 frames for a radio uplink, L1 backup acceleration is performed by Zynq RFSoC to realize high-throughput FEC under low power consumption, and finally the whole card is made into a PCIe shape, an FHL (full height half length) card and a 75W card (as shown in figure 3) and is compatible with NEBS. In addition, for the O-RAN forward terminal, the board can process multiple sectors of 5G NR 4TRX at 100MHz OBW through its 50Gbps optical port;
the system takes a baseband unit (BBU) as a network core component, the left side is a signal tower containing a remote Radio Unit (RU), the middle is an edge cloud constructed on a Distributed Unit (DU)/baseband unit (BBU), and the right side is a core network composed of an edge/core router and a centralized processing unit (CU).
To sum up, the beneficial effect in this scheme is:
1. the 5G accelerator card communication module and the accelerator card can reduce the volume of the accelerator card, increase the pressure resistance and the heat dissipation effect of the accelerator card, and are matched with a 5G NR BB transmission system carried by the device to realize a 5G NR base station processing unit, centrally control and manage the whole base station system, realize direct access and data interaction with a 5G core network, realize NGAP and XnAP interfaces, and simultaneously realize 5G NR access network protocol stack functions, RRC, PDCP, SDAP, RLC, MAC and PHY protocol layer functions and baseband processing functions;
2. this kind of 5G accelerates speed card communication module, acceleration card, through setting up the insulation board that opens the recess that has a plurality of vertical mutual parallels on the PLC circuit board, can once improve the insulating effect of device when using, secondly can increase the intensity and the radiating effect of this acceleration card, can block partly dust moreover to the surface of PLC circuit board.
Drawings
Fig. 1 is a schematic structural diagram of a 5G accelerator card communication module according to the present invention;
fig. 2 is a schematic perspective view of an accelerator card in a 5G accelerator card communication module according to the present invention;
FIG. 3 is an enlarged schematic structural diagram of an acceleration card in a 5G acceleration card communication module shown in FIG. 2;
fig. 4 is a schematic structural diagram of a 5G accelerator card communication module, an accelerator card and a communication transmission method according to the present invention.
In the figure: the device comprises a PLC circuit board 1, a screw fixing block 2, an insulating plate 3, a network cable interface 4, a SAM joint 5, a gasket 6, a clamping groove 7, a Finger joint 8 and an inclined chamfer 9.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In this example
Referring to fig. 1-4, a 5G accelerator card communication module, accelerator card, including a PLC circuit board 1, the upper surface of the PLC circuit board 1 is close to four corners and the middle part is evenly distributed with eight mounting holes, and the lower surface of the PLC circuit board 1 located at the lower surface of the mounting hole is embedded with a gasket 6, the upper surface of the PLC circuit board 1 is fixed with an insulating plate 3 by screws, the long edge end of the PLC circuit board 1 is opened with a plurality of slots 7 for positioning, and the upper surface of the PLC circuit board 1 located at one side edge opened with the slots 7 is fixed with fingerer connectors 8 distributed equidistantly, the end of the PLC circuit board 1 is welded with a network cable interface 4 and an SAM connector 5 respectively, thereby reducing the volume of the accelerator card, increasing the compression resistance and heat dissipation effect, matching with the 5G NR BB transmission system carried by the device, for realizing a 5G NR base station processing unit, centralized control and management of the whole base station system, the direct access and data interaction with a 5G core network are realized, NGAP and XnAP interfaces are realized, and simultaneously, the functions of a 5G NR access network protocol stack, the functions of RRC, PDCP, SDAP, RLC, MAC and PHY protocol layers and the function of baseband processing are realized.
According to the invention, a plurality of grooves are reserved on the upper surface of the insulating plate 3, and the screw fixing blocks 2 are fixed above the four mounting holes in the middle of the grooves, so that the insulating effect of the device can be improved at one time when the device is used, the strength and the heat dissipation effect of the accelerator card can be improved, and part of dust can be blocked on the surface of the PLC circuit board 1.
Wherein, the upper surface of Finger joint 8 is kept away from one side edge department of insulation board 3 and is opened inclined plane chamfer 9 to can improve the plug convenience of this accelerator card.
A communication transmission method of a 5G acceleration card communication module and an acceleration card comprises the following steps:
the method comprises the following steps: the system built in the device realizes network intellectualization, interface opening, hardware generalization and software development, wherein the chip comprises: the general processor is used for processing an L2/L3 protocol layer and mainly uses an x86/Arm architecture; a fronthaul FPGA for terminating CPRI traffic to and from the radio unit, using a medium FPGA device including Kintex or Zynq; the L1 baseband ASIC or FPGA realizes LoPHY and HiPHY functions, the FPGA is firstly deployed in the used chip, and then the 2 nd generation ASIC chip is deployed;
step two: the forwarding termination is completed by Zynq UltraScale + and 2 SSP28 frames for a radio uplink, L1 backup acceleration is performed by Zynq RFSoC to realize high-throughput FEC under low power consumption, and finally the whole card is made into a PCIe shape, an FHL (full height half length) card and a 75W card (as shown in figure 3) and is compatible with NEBS. In addition, for the O-RAN forward terminal, the board can process multiple sectors of 5G NR 4TRX at 100MHz OBW through its 50Gbps optical port;
the system takes a baseband unit (BBU) as a network core component, the left side is a signal tower containing a remote Radio Unit (RU), the middle is an edge cloud constructed on a Distributed Unit (DU)/baseband unit (BBU), and the right side is a core network composed of an edge/core router and a centralized processing unit (CU).
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (4)

1. The utility model provides a 5G accelerates card communication module, card with higher speed, includes PLC circuit board (1), its characterized in that, the upper surface of PLC circuit board (1) is close to four corners department and middle part equipartition has eight mounting holes, and the lower surface that the lower surface of PLC circuit board (1) is located the mounting hole all inlays and is equipped with packing ring (6), the upper surface of PLC circuit board (1) has insulation board (3) through the fix with screw, the long limit tip of PLC circuit board (1) is opened has a plurality of draw-in grooves (7) that are used for the location, and PLC circuit board (1) is located one side arris department upper surface that opens draw-in groove (7) and is fixed with Finger joint (8) that the equidistance distributes, and the tip of PLC circuit board (1) has welded net twine interface (4) and SAM joint (5) respectively.
2. The communication module, the accelerator card and the communication transmission method of the 5G accelerator card according to claim 1, wherein a plurality of grooves are reserved on the upper surface of the insulating plate (3), and the screw fixing blocks (2) are fixed above the four mounting holes in the middle of the grooves.
3. The communication module, the accelerator card and the communication transmission method for the 5G accelerator card according to claim 1, wherein the upper surface of the Finger joint (8) is provided with a bevel chamfer (9) at the edge of one side far away from the insulating plate (3).
4. The communication transmission method of the 5G accelerator card communication module and the accelerator card according to claim 1, comprising the following steps:
the method comprises the following steps: the system built in the device realizes network intellectualization, interface opening, hardware generalization and software development, wherein the chip comprises: the general processor is used for processing an L2/L3 protocol layer and mainly uses an x86/Arm architecture; a fronthaul FPGA for terminating CPRI traffic to and from the radio unit, using a medium FPGA device including Kintex or Zynq; the L1 baseband ASIC or FPGA realizes LoPHY and HiPHY functions, the FPGA is firstly deployed in the used chip, and then the 2 nd generation ASIC chip is deployed;
step two: finishing the end of forward transmission by Zynq UltraScale + and 2 SSP28 frames for a radio uplink, then using Zynq RFSoC to make L1 backup acceleration, realizing high throughput FEC under low power consumption, and finally making the whole card into a PCIe shape, an FHL (full height half length) card and a 75W card (as shown in figure 3) and being compatible with NEBS; in addition, for the O-RAN forward terminal, the board can process multiple sectors of 5G NR 4TRX at 100MHz OBW through its 50Gbps optical port;
the system takes a baseband unit (BBU) as a network core component, the left side is a signal tower containing a remote Radio Unit (RU), the middle is an edge cloud constructed on a Distributed Unit (DU)/baseband unit (BBU), and the right side is a core network composed of an edge/core router and a centralized processing unit (CU).
CN202111083401.4A 2021-09-16 2021-09-16 5G accelerator card communication module, accelerator card and communication transmission method Withdrawn CN113810201A (en)

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Publication number Priority date Publication date Assignee Title
CN108990259A (en) * 2018-09-10 2018-12-11 缙云县源都自动化科技有限公司 A kind of PCB circuit board
CN208985090U (en) * 2018-09-17 2019-06-14 阿里巴巴集团控股有限公司 A kind of FPGA accelerator card
CN210924459U (en) * 2019-10-11 2020-07-03 曾振东 Instruction accelerator card based on cloud computing basic platform
CN211047658U (en) * 2019-07-30 2020-07-17 深圳佰才邦技术有限公司 Acceleration card and DU equipment
US20200363135A1 (en) * 2019-05-15 2020-11-19 Cambricon Technologies Corporation Limited Heat dissipation device and board card
US20210043537A1 (en) * 2019-08-06 2021-02-11 Intel Corporation Electronic systems with inverted circuit board with heat sink to chassis attachment
CN112616245A (en) * 2020-12-14 2021-04-06 海光信息技术股份有限公司 Acceleration processor acceleration card and manufacturing method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108990259A (en) * 2018-09-10 2018-12-11 缙云县源都自动化科技有限公司 A kind of PCB circuit board
CN208985090U (en) * 2018-09-17 2019-06-14 阿里巴巴集团控股有限公司 A kind of FPGA accelerator card
US20200363135A1 (en) * 2019-05-15 2020-11-19 Cambricon Technologies Corporation Limited Heat dissipation device and board card
CN211047658U (en) * 2019-07-30 2020-07-17 深圳佰才邦技术有限公司 Acceleration card and DU equipment
US20210043537A1 (en) * 2019-08-06 2021-02-11 Intel Corporation Electronic systems with inverted circuit board with heat sink to chassis attachment
CN210924459U (en) * 2019-10-11 2020-07-03 曾振东 Instruction accelerator card based on cloud computing basic platform
CN112616245A (en) * 2020-12-14 2021-04-06 海光信息技术股份有限公司 Acceleration processor acceleration card and manufacturing method thereof

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