CN102612300A - Remote radio head module and method for assembling the same, base station and communication system - Google Patents
Remote radio head module and method for assembling the same, base station and communication system Download PDFInfo
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- CN102612300A CN102612300A CN2012100420367A CN201210042036A CN102612300A CN 102612300 A CN102612300 A CN 102612300A CN 2012100420367 A CN2012100420367 A CN 2012100420367A CN 201210042036 A CN201210042036 A CN 201210042036A CN 102612300 A CN102612300 A CN 102612300A
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Abstract
The invention provides a remote radio head module and a method for assembling the same, a base station and a communication system in one embodiment, relating to the communication field, wherein two-side heat dissipation of a PCB (Printed Circuit Board) can be realized; and the heat dissipation efficiency is high. The remote radio head module comprises: an upper case comprising an upper radiating portion; a lower case comprising a lower radiating portion; and a first printed circuit board (PCB) group and a second PCB group, wherein the second PCB group is fixed to the lower case; the first PCB group is fixed to the upper surface of the lower case; the upper surface of the first PCB group is connected with the lower surface of the upper case through a heat conducting medium, or fixed to the lower surface of the upper case; a box type structure member is arranged on the first PCB group, and belongs to the lower case or comes into contact with the lower case; and the first PCB group, the upper radiating portion and the lower radiating portion are partially or totally overlapped on each other in projection. The remote radio head module and the method for assembling the same provided in the embodiment of the invention are used for dissipating the heat of the remote radio head module.
Description
Technical field
The present invention relates to the communications field, relate in particular to a kind of radio frequency remoto module and assemble method thereof, base station and communication system.
Background technology
RRU (Radio Remote Unit, radio frequency remoto module) is the part of distributed base station, mainly accomplishes the function such as IF process, radio frequency processing, duplex of signal.
In the prior art; PCB among the RRU (printed circuit board; Printed circuit board (PCB)) mainly is divided into three parts: TRX (Transport Receive X; Transmit-Receive Unit) is connected through blind socket, connector or wire jumper between plate, PA (power amplifier, power amplifier) plate and the power panel, plate and plate.
State in realization in the process of technical scheme, the inventor finds that there is following problem at least in prior art: in the common application, PCB is the one side heat radiation, and radiating efficiency is low.
Summary of the invention
Embodiments of the invention provide a kind of radio frequency remoto module and assemble method, base station and communication system, can realize the heat radiation of PCB two sides, and radiating efficiency is high.
One aspect of the present invention provides a kind of radio frequency remoto module, comprising:
Upper box, said upper box comprises radiating part;
Lower box, said lower box comprise radiating part down;
The first printing board PCB group and the 2nd PCB group, said the 2nd PCB group is fixed on the said lower box;
Said PCB group:
Be fixed on the upper surface of lower box, and the upper surface of said PCB group is connected through heat-conducting medium with the lower surface of said upper box, or
Be fixed on the lower surface of upper box, and said PCB group is provided with box structure spare, said box structure spare belongs to said lower box or contacts with said lower box;
Said PCB group, saidly go up radiating part and said radiating part part projection down is overlapping or projection is overlapping.
On the one hand, a kind of radio frequency remoto module assemble method is provided, comprises:
The one PCB is organized the upper surface that is fixed on lower box, and the upper surface of said PCB group is connected through heat-conducting medium with the lower surface of said upper box, or
The one PCB group is fixed on the lower surface of upper box, and on said PCB group, box structure spare is set, said box structure spare belongs to said lower box or contacts with said lower box;
Said PCB group, saidly go up radiating part and said radiating part part projection down is overlapping or projection is overlapping.
On the one hand, a kind of base station is provided, comprises aforesaid radio frequency remoto module.
On the one hand, a kind of communication system is provided, comprises as above base station.
The embodiment of the invention provides a kind of radio frequency remoto module and assemble method, base station and communication system, and this radio frequency remoto module comprises: upper box, and upper box comprises radiating part; Lower box, lower box comprise radiating part down; The first printing board PCB group and the 2nd PCB group, the 2nd PCB group is fixed on the lower box; Said PCB group: the upper surface that is fixed on lower box; And the upper surface of said PCB group is connected through heat-conducting medium with the lower surface of said upper box; Or be fixed on the lower surface of upper box; And said PCB group is provided with box structure spare, and said box structure spare belongs to said lower box or contacts with said lower box; Said PCB group, said last radiating part and the said following overlapping or whole projections of radiating part part projection are overlapping.So, through directly fixing or adopting the method for heat-conducting medium filling that the PCB veneer that the one PCB organizes is connected with upper and lower casing, can dispel the heat through the radiating part of upper and lower casing in the PCB two sides like this, realize the heat radiation of PCB two sides, the radiating efficiency height.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structure of radio frequency remoto module in the prior art;
A kind of radio frequency remoto module structure that Fig. 2 provides for the embodiment of the invention;
The another kind of radio frequency remoto module structure that Fig. 3 provides for the embodiment of the invention;
Another radio frequency remoto module structure that Fig. 4 provides for the embodiment of the invention;
Another radio frequency remoto module structure that Fig. 5 provides for the embodiment of the invention;
A kind of radio frequency remoto module structural approach flow chart that Fig. 6 provides for the embodiment of the invention.
Embodiment
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
In the prior art; As shown in Figure 1, the upper box 101 among the RRU is provided with radiating part 1011, duplexer (Fig. 1 does not indicate), and duplexer is connected with connector with any PCB veneer; Lower box 102 is provided with down radiating part 1021; PCB among the RRU mainly is divided into three parts: be connected through blind socket, connector or wire jumper (Fig. 1 does not indicate) between TRX plate 103, PA plate 104 and the power panel 105, plate and plate, all PCB veneers all are the one side heat radiations.Upper and lower casing needs the electronic devices and components on the PCB veneer that is fixed on upper and lower casing are dodged accordingly when design, because this structure is known for the person skilled of being familiar with this area, does not draw among Fig. 1.
Embodiment one
The embodiment of the invention provides a kind of radio frequency remoto module, and is as shown in Figure 2, comprising:
The one PCB group the 106 and the 2nd PCB group 107, the two PCB group 107 is fixed on the lower box.
The one PCB group 106 is fixed on the upper surface of lower box 102; And the upper surface of PCB group 106 is connected through heat-conducting medium 108 with the lower surface of upper box 102; Or the one PCB group 106 be fixed on the lower surface of upper box 101; And PCB group 106 is provided with box structure spare 109, and box structure spare 109 belongs to lower box 102 or contacts with lower box 102, is used to shield the electromagnetic wave that disturbs the electronic devices and components on the PCB group 106.
The one PCB group 106, go up radiating part 1011 and following radiating part 1021 projections overlapping so that PCB group 106 is through last radiating part 1011, following radiating part 1021 quick heat radiatings, said projection is overlapping to comprise that the overlapping and whole projections of part projection are overlapping.That is, the PCB group fixed position on upper box or lower box and last radiating part be positioned at the position of upper box and down radiating part to be positioned at the position of lower box relative, this comprises that relatively part is relatively or all relatively.
Need to prove; The embodiment of the invention is called upper surface and lower surface respectively with two maximum facing surfaces in any PCB veneer surface area in the 2nd PCB group; With being called upper box with the relative casing of this PCB veneer upper surface in the said radio frequency remoto module, be called lower box with the relative casing of this PCB veneer lower surface.
So, through directly fixing or adopting the method for heat-conducting medium filling that the PCB that the one PCB organizes is connected with upper and lower casing, can dispel the heat through the upper and lower radiating part of upper and lower casing in the PCB two sides like this, realize the heat radiation of PCB two sides, the radiating efficiency height.
Need to prove; In the practical application; Upper box 101 can also comprise that duplexer 1012, the one PCB group the 106 and the 2nd PCB group 107 comprises at least one PCB veneer respectively, is electrical connection between each PCB veneer of PCB group the 106 and the 2nd PCB group 107; For example, adopt wire jumper, connector or plate upward wiring to connect.Wherein, the power consumption of the PCB veneer in the PCB group 106 can be bigger than the power consumption of the PCB veneer in the 2nd PCB group 107.Example, PCB group can comprise: PA, said the 2nd PCB group can comprise: TRX and power panel.
Fig. 2 is for all being fixed on PCB group the 106 and the 2nd PCB group 107 situation of lower box 102 upper surfaces, and PCB group the 106 and the 2nd PCB group 107 can make the upper surface that is screwed in lower box 102.A PCB veneer in the one PCB group 106 uses connector 110 to be connected with duplexer 1012, can be blind slotting connection.Each PCB veneer of the one PCB group the 106 and the 2nd PCB group 107 is electrically connected; For example; Adopt wire jumper, connector or plate upward wiring to connect; Promptly be electrical connection between PCB group the 106 and the 2nd PCB group 107, simultaneously, also be respectively electrical connection between the PCB veneer that comprises separately in PCB group the 106 and the 2nd PCB group 107.Be used to shield the electromagnetic wave that disturbs the electronic devices and components on the PCB group 106 at the box structure spare 109 that is provided with on the PCB group 106; This box structure spare 109 can be provided with separately; Contact with lower box 102 upper surfaces; Also can directly make at lower box 102 upper surfaces, PCB group 106 contact with box structure spare 109, and the metal material heat conduction of box structure spare 109 is extremely on the following radiating part 1021 on the lower box 102 of correspondence; The one PCB group 106 can be dispelled the heat through lower box 102; The upper surface of the one PCB group 106 is connected through heat-conducting medium 108 with the lower surface of upper box 102, guarantee a PCB organize 106 with the contacting of upper box 101 lower surfaces, make heat be sent to the last radiating part 1011 of upper box 101 through heat-conducting medium 108; Such PCB group 106 can be dispelled the heat through upper box 101, thereby guarantees that PCB group is through the two-sided heat radiation of last lower box.Special; The material of the heat-conducting medium 108 between the upper surface of the one PCB group 106 and the lower surface of upper box 102 can be silica gel; This heat-conducting medium 108 can absorb the pressure that 102 couples the one PCB of upper box organize 106 upper surfaces, prevents that 102 couples the one PCB of upper box from organizing the damage of 106 upper surfaces.
Further; The upper and lower surface of the 2nd PCB group 107 all can be provided with electronic devices and components; Can contain high heat dissipation device 111 in these electronic devices and components; As shown in Figure 2, the 2nd PCB organizes and can be filled with heat-conducting medium 108, the two PCB between high hear rate device 111 and upper box 101 lower surfaces of 107 upper surfaces and organize between high hear rate device 111 and lower box 102 upper surfaces of 107 lower surfaces and also can be filled with heat-conducting medium 108.Heat-conducting medium 108 is connected high heat dissipation device 111 with corresponding casing; Simultaneously; The 2nd PCB group 107 is overlapping with following radiating part 1011 projections; This projection is overlapping to comprise that the overlapping and whole projections of part projection are overlapping, has further strengthened the thermolysis of last radiating part 1011 and 1021 pairs of high heat dissipation devices 111 of following radiating part, has improved the radiating efficiency of PCB.
Fig. 3 is for being fixed on PCB group 106 situation of upper box 101 lower surfaces, and PCB group 106 is fixed in the upper surface of lower box 102, and is exemplary, is shown as screw among Fig. 3 of present embodiment.All PCB veneers in the one PCB group 106 adopt wire jumper or connector to connect; All PCB veneers in the one PCB group 107 adopt wire jumper or connector to connect; Any PCB veneer in the one PCB group 106 uses connector 110 to be connected with duplexer 1012; Can be blind slotting connection, PCB group 106 and the 2nd PCB organize 107 and are connected through wire jumper or connector.The one PCB group 106 is fixed on the lower surface of upper box 101; And PCB group 106 is provided with box structure spare 109; This box structure spare 109 is used to shield the electromagnetic wave that disturbs the electronic devices and components on the PCB group 106, and this box structure spare 109 contacts with lower box 102, and is as shown in Figure 3; The following radiating part 1021 of lower box 102 is arranged on box structure spare 109 belows; Organize at 106 o'clock at assembling the one PCB like this, can box structure spare 109, PCB group 106 and upper box 101 usefulness screws be fixedly connected from the below, organize the corresponding following radiating part 1021 in 106 positions with a PCB then and be fixed on the box structure spare 109; Therefore, said structure makes assembling more convenient.
Special, following radiating part 1021 can be divided into first time radiating part and second time radiating part (Fig. 3 does not indicate), and second time radiating part can belong to lower box 102, corresponding the 2nd PCB group 107.First time radiating part can belong to lower box 102, also can be provided with separately and contact with lower box 102, corresponding PCB group 106.First time radiating part among Fig. 3 is to be provided with separately.Example, this first time radiating part can be the dissipating cover plate.On the following radiating part 1021 on the metal material heat conduction of box structure spare 109 to the corresponding lower box 102; The one PCB group 106 can be dispelled the heat through lower box 102; The upper surface of the one PCB group 106 is fixedly connected with the lower surface of upper box 102; Be convenient to the last radiating part 1011 that heat is sent to upper box 101, PCB group 106 can be dispelled the heat through upper box 101, thereby guarantee that PCB group is through the two-sided heat radiation of last lower box.Special; When PCB group 106 is fixed on upper box 101 lower surfaces; The upper surface of the one PCB group 106 and the lower surface of upper box 102 can be added with conducting resinl and absorb the pressure that 102 couples the one PCB of upper box organize 106 upper surfaces, prevent that 102 couples the one PCB of upper box from organizing the damage of 106 upper surfaces.
The structure of the 2nd PCB group 107 is identical with Fig. 1 essence among Fig. 3, just repeats no more here.
Special, PCB group the 106 and the 2nd PCB group 107 is arranged at same horizontal plane in radio frequency remoto module, and PCB group the 106 and the 2nd PCB organize 107 can be for a PCB veneer 112, as shown in Figure 4.But the structure reference pin of PCB just repeats no more to the description of Fig. 2 here among Fig. 4.Same, also can PCB group the 106 and the 2nd PCB group 107 among Fig. 3 be a PCB veneer 112, as shown in Figure 5.
So, PCB group 106 need not adopt wire jumper or connector to be connected with the 2nd PCB group 107, but adopts the plate upward wiring to connect, and has reduced manufacturing cost.
Further, have the PCB veneer that is arranged at same horizontal plane in all the PCB veneers in said the 2nd PCB group of said PCB group neutralization, and the said PCB veneer that is arranged at same horizontal plane can be a PCB veneer.So, the said PCB veneer that is arranged at same horizontal plane need not adopt wire jumper or connector to connect, but adopts the plate upward wiring to connect, and has reduced manufacturing cost.
The embodiment of the invention also provides a kind of base station, comprises any one above-mentioned radio frequency remoto module.Further, a kind of communication system is provided, comprises said base station.
The radio frequency remoto module that the embodiment of the invention provides, on the one hand, can be through directly fixing or adopting the method for heat-conducting medium filling that the PCB that the one PCB organizes is connected with upper and lower casing; The two sides heat radiation of PCB group can have been realized, on the other hand through the radiating part heat radiation of upper and lower casing in the PCB two sides like this; Can the PCB that the 2nd PCB organizes be connected with upper and lower casing through on high heat dissipation device, covering heat-conducting medium, realize the two sides heat radiation of the 2nd PCB group, radiating efficiency is high; Further; Can also pcb board be integrated into a plate, adopt the plate upward wiring to connect, reduce manufacturing cost.
Embodiment two
The embodiment of the invention provides a kind of radio frequency remoto module assemble method, comprising:
The one PCB is organized the upper surface that is fixed on lower box, and the upper surface of PCB group is connected through heat-conducting medium with the lower surface of upper box.
Or PCB group is fixed on the lower surface of upper box, and on PCB group, box structure spare is set, box structure spare belongs to lower box or contacts with lower box.
Need to prove that the surface of PCB group is provided with electronic devices and components; The one PCB group, last radiating part and the overlapping or whole projections of following radiating part part projection are overlapping.
So, through directly fixing or adopting the method for heat-conducting medium filling that the PCB that the one PCB organizes is connected with upper and lower casing, can dispel the heat through the radiating part of upper and lower casing in the PCB two sides like this, realize the heat radiation of PCB two sides, the radiating efficiency height.
Simultaneously, this radio frequency remoto module assemble method also comprises: between the high hear rate device of the 2nd PCB group upper surface and upper box lower surface, fill heat-conducting medium; Can also between the high hear rate device of the 2nd PCB group lower surface and lower box upper surface, fill heat-conducting medium.The 2nd PCB group and the overlapping or whole projections of following radiating part part projection are overlapping.
Need to prove; The one PCB group and the 2nd PCB group comprise at least one PCB veneer respectively; The radio frequency remoto module assemble method that the embodiment of the invention provides also comprises: all PCB veneers of said PCB group and the 2nd PCB group are electrically connected; For example, adopt wire jumper, connector or plate upward wiring to connect.If PCB group and the 2nd PCB group are arranged at same horizontal plane in radio frequency remoto module; Then can PCB group and the 2nd PCB group be merged into a PCB veneer; Promptly adopt the layout technology; This layout technology makes PCB group adopt the plate upward wiring to be connected with the 2nd PCB group, is convenient to the connection of components and parts, has reduced manufacturing cost simultaneously.
Example, above-mentioned PCB group can comprise: PA; Above-mentioned the 2nd PCB group can comprise: TRX and power panel.
Optional, when the radio frequency remoto module structure was as shown in Figure 2, the concrete assemble method of this radio frequency remoto module was as shown in Figure 6:
S601, on the high hear rate device of the 2nd PCB group the coated with thermally conductive medium.
The corresponding box structure spare degree of depth is relevant on heat-conducting medium thickness on the high hear rate device of the 2nd PCB group lower surface and the lower box, and this heat-conducting medium need contact with corresponding box structure spare upper surface; The corresponding box structure spare degree of depth of setting is relevant on heat-conducting medium thickness on the high hear rate device of the 2nd PCB group upper surface and the 2nd PCB group, and this heat-conducting medium need contact with corresponding box structure spare lower surface.
S602, first and second PCB group is fixed on lower box.
Can use jockey such as screw to hammer into, PCB group is fixed on the relevant position of the following radiating part top of lower box from PCB group upper surface.Simultaneously, can use jockey such as screw to hammer into, make box structure spare, the 2nd PCB group be fixed on the relevant position of the following radiating part top of lower box simultaneously from the box structure spare relevant position on the 2nd PCB group.
S603, mould assembling.
On the box structure spare of the 2nd PCB group with high hear rate device on the corresponding position of heat-conducting medium coated with thermally conductive medium; Upper box lower surface after this heat-conducting medium and the mould assembling is contacted; So that the high hear rate device of the 2nd PCB group conducts to upper box through heat-conducting medium, box structure spare, heat-conducting medium with heat successively, reach the heat radiation purpose.Simultaneously, each PCB veneer connects through wire jumper or connector, and wherein, any PCB veneer is connected through the blind plug in connector that waits with duplexer.Then, upper box is fastened on the lower box relevant position.
Example, as radio frequency remoto module structure such as Fig. 3, in the concrete assemble method of this radio frequency remoto module, the installation method of the 2nd PCB group is with reference to the associated description to step S601.The method of mould assembling is with reference to the associated description to step S603.Special; When assembling the one PCB group; Can box structure spare, PCB group and upper box be fixedly connected from the below with screw, be fixed on the box structure spare with the corresponding following radiating part in PCB group position then, so that PCB group can be through the heat radiation of this time radiating part after the mould assembling.
When the radio frequency remoto module structure is as shown in Figure 4; The concrete assemble method of this radio frequency remoto module is with reference to associated description among the step S601 to S604; Special; Because there is the PCB veneer that is arranged at same horizontal plane in all the PCB veneers in PCB group neutralization the 2nd PCB group, example, can adopt the layout technology that the said PCB veneer that is arranged at same horizontal plane is merged into a PCB veneer.Simultaneously, this PCB veneer can be connected through the blind plug in connector that waits with duplexer.
When the radio frequency remoto module structure is as shown in Figure 5; The concrete assemble method of this radio frequency remoto module is with reference to the associated description to Fig. 3, and is special, because PCB group and the 2nd PCB group are arranged at same horizontal plane in said radio frequency remoto module; Can adopt the layout technology that the one PCB group and the 2nd PCB group are merged into a PCB veneer; So each PCB veneer among the step S604 among this PCB connects through the plate upward wiring, simultaneously, this PCB veneer can be connected through the blind plug in connector that waits with duplexer.
Special, if having the PCB veneer that is arranged at same horizontal plane in all the PCB veneers in PCB group neutralization the 2nd PCB group, then the said PCB veneer that is arranged at same horizontal plane is merged into a PCB veneer.Concrete grammar no longer details with reference to the associated description to Fig. 4, Fig. 5 here.
Need to prove; Difference according to the radio frequency remoto module structure that will assemble; The step of the concrete assemble method of radio frequency remoto module can adjust accordingly, and the quantity of step can increase and decrease, order can conversion, and any technical staff who is familiar with the present technique field is in the technical scope that the present invention discloses; Can expect the method adjusted easily, no longer detail here.
The radio frequency remoto module assemble method that the embodiment of the invention provides, on the one hand, can be through directly fixing or adopting the method for heat-conducting medium filling that the PCB that the one PCB organizes is connected with upper and lower casing; The two sides heat radiation of PCB group can have been realized, on the other hand through the radiating part heat radiation of upper and lower casing in the PCB two sides like this; Can the PCB that the 2nd PCB organizes be connected with upper and lower casing through on high heat dissipation device, covering heat-conducting medium, realize the two sides heat radiation of the 2nd PCB group, radiating efficiency is high; Further; Can pcb board be integrated into a plate, adopt the plate upward wiring to connect, reduce manufacturing cost.
One of ordinary skill in the art will appreciate that: all or part of step that realizes said method embodiment can be accomplished through the relevant hardware of program command; Aforesaid program can be stored in the computer read/write memory medium; This program the step that comprises said method embodiment when carrying out; And aforesaid storage medium comprises: various media that can be program code stored such as ROM, RAM, magnetic disc or CD.
The above; Be merely embodiment of the present invention, but protection scope of the present invention is not limited thereto, any technical staff who is familiar with the present technique field is in the technical scope that the present invention discloses; Can expect easily changing or replacement, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of said claim.
Claims (14)
1. radio frequency remoto module comprises:
Upper box, said upper box comprises radiating part;
Lower box, said lower box comprise radiating part down;
It is characterized in that, also comprise:
The first printing board PCB group and the 2nd PCB group, said the 2nd PCB group is fixed on the said lower box;
Said PCB group:
Be fixed on the upper surface of lower box, and the upper surface of said PCB group is connected through heat-conducting medium with the lower surface of said upper box, or
Be fixed on the lower surface of upper box, and said PCB group is provided with box structure spare, said box structure spare belongs to said lower box or contacts with said lower box;
Said PCB group, said last radiating part and the said following overlapping or whole projections of radiating part part projection are overlapping.
2. radio frequency remoto module according to claim 1 is characterized in that,
Be filled with heat-conducting medium between the high hear rate device of said the 2nd PCB group upper surface and the said upper box lower surface, and/or
Be filled with heat-conducting medium between the high hear rate device of said the 2nd PCB group lower surface and the said lower box upper surface;
Said the 2nd PCB group and the said following overlapping or whole projections of radiating part part projection are overlapping.
3. radio frequency remoto module according to claim 1 and 2 is characterized in that, said PCB group and the 2nd PCB group comprise at least one PCB veneer respectively;
The PCB veneer of said PCB group and said the 2nd PCB group is electrically connected.
4. radio frequency remoto module according to claim 1 and 2 is characterized in that,
Said PCB group and said the 2nd PCB group are arranged at same horizontal plane and said PCB group and said the 2nd PCB group in said radio frequency remoto module be a PCB veneer.
5. radio frequency remoto module according to claim 1 and 2 is characterized in that,
Have the PCB veneer that is arranged at same horizontal plane in the PCB veneer in said the 2nd PCB group of said PCB group neutralization, and the said PCB veneer that is arranged at same horizontal plane is a PCB veneer.
6. radio frequency remoto module according to claim 5 is characterized in that,
Said PCB group comprises: power amplifier PA;
Said the 2nd PCB group comprises: Transmit-Receive Unit TRX and power panel.
7. a base station is characterized in that, comprises according to any described radio frequency remoto module of claim 1 to 6.
8. a communication system is characterized in that, comprises base station according to claim 7.
9. a radio frequency remoto module assemble method is characterized in that, comprising:
The one PCB is organized the upper surface that is fixed on lower box, and the upper surface of said PCB group is connected through heat-conducting medium with the lower surface of said upper box, or
The one PCB group is fixed on the lower surface of upper box, and on said PCB group, box structure spare is set, said box structure spare belongs to said lower box or contacts with said lower box;
Said PCB group, said last radiating part and the said following overlapping or whole projections of radiating part part projection are overlapping.
10. method according to claim 9 is characterized in that,
Between the high hear rate device of the 2nd PCB group upper surface and said upper box lower surface, fill heat-conducting medium, and/or
Between the high hear rate device of said the 2nd PCB group lower surface and said lower box upper surface, fill heat-conducting medium;
Said the 2nd PCB group and the said following overlapping or whole projections of radiating part part projection are overlapping.
11., it is characterized in that said PCB group and the 2nd PCB group comprise at least one PCB veneer respectively according to claim 9 or 10 described methods, said method also comprises:
The PCB veneer of said PCB group and said the 2nd PCB group is electrically connected.
12. method according to claim 11 is characterized in that,
If said PCB group and said the 2nd PCB group are arranged at same horizontal plane in said radio frequency remoto module, then said PCB group and said the 2nd PCB group are merged into a PCB.
13. radio frequency remoto module according to claim 11 is characterized in that,
If have the PCB veneer that is arranged at same horizontal plane in the PCB veneer in said the 2nd PCB group of said PCB group neutralization, then the said PCB veneer that is arranged at same horizontal plane merged into a PCB veneer.
14. radio frequency remoto module according to claim 13 is characterized in that,
Said PCB group comprises: power amplifier PA;
Said the 2nd PCB group comprises: Transmit-Receive Unit TRX and power panel.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2017067418A1 (en) * | 2015-10-21 | 2017-04-27 | 中兴通讯股份有限公司 | Heat dissipation structure and method for cooling veneer in extending way |
| CN107547123A (en) * | 2016-06-29 | 2018-01-05 | 中兴通讯股份有限公司 | A kind of Remote Radio Unit and extensive multiple-input and multiple-output Remote Radio Unit |
| CN108260227A (en) * | 2016-12-28 | 2018-07-06 | 中兴通讯股份有限公司 | A kind of architecture of base station |
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| CN101106235A (en) * | 2007-06-06 | 2008-01-16 | 华为技术有限公司 | A single-board hardware device and RF blind insertion connection device |
| CN101668410A (en) * | 2009-09-25 | 2010-03-10 | 上海微电子装备有限公司 | Heat dissipation system of heating modules |
| CN201718149U (en) * | 2010-05-07 | 2011-01-19 | 中兴通讯股份有限公司 | Radio remote unit structure with high heat dissipation performance |
| CN202444691U (en) * | 2012-02-23 | 2012-09-19 | 华为技术有限公司 | Radio remote unit, base station and communication system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2017067418A1 (en) * | 2015-10-21 | 2017-04-27 | 中兴通讯股份有限公司 | Heat dissipation structure and method for cooling veneer in extending way |
| CN107547123A (en) * | 2016-06-29 | 2018-01-05 | 中兴通讯股份有限公司 | A kind of Remote Radio Unit and extensive multiple-input and multiple-output Remote Radio Unit |
| CN108260227A (en) * | 2016-12-28 | 2018-07-06 | 中兴通讯股份有限公司 | A kind of architecture of base station |
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