CN104661431A - Electronic equipment - Google Patents
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- CN104661431A CN104661431A CN201310575194.3A CN201310575194A CN104661431A CN 104661431 A CN104661431 A CN 104661431A CN 201310575194 A CN201310575194 A CN 201310575194A CN 104661431 A CN104661431 A CN 104661431A
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Abstract
The invention discloses electronic equipment, which comprises at least one processing module. The processing module is an integrated module. The integrated module comprises a baseplate and a plurality of submodules. The submodules are respectively installed at two sides of the baseplate. A first connecting area is arranged at the edge of one side of the baseplate. The electronic equipment provides the integrated module integrating the plurality of submodules on the same baseplate. As the size of each integrated submodule is small, the area of a printed circuit board (PCB) occupied by the submodules installed at two sides of the baseplate is greatly reduced, the area of the whole hardware system is reduced, and the requirement of downsizing of an intelligent mobile internet equipment system is met. Furthermore, the signal can be evoked only through a common welding way, so that the cost is low. Due to modularization, the electronic equipment only needs to be installed on a corresponding PCB according to different mobile internet equipment types so as to be convenient to use in different conditions, the developing time is saved and the developing cost is also lowered.
Description
Technical field
The present invention relates to mobile interchange equipment, particularly a kind of electronic equipment.
Background technology
AP (application processor application processor), memory(memory) and PMIC (powermanagement IC power processor) as mobile interchange device core device, in real work, need above core devices to be all welded on pcb board, thus complete between core devices and whole system interconnected.
At present, usually adopt common PCB attachment process, AP, PMIC, memory and other device are together welded on the upper surface of total pcb board, draw pin at the lower surface of this pcb board and carry out Signal transmissions, this assembling mode has larger thickness; Or the pin of plate is positioned at sidepiece when installing in the both sides of pcb board, this assembling mode adds the height of the rear device of assembling.
Realizing in process of the present invention, inventor finds that prior art at least exists following problem:
Because the own size of AP, PMIC, memory of the prior art is larger, adopt traditional PCB attachment process to be welded on the upper surface of total pcb board simultaneously, make to need between each device to keep larger distance, and then make the area of total pcb board larger, therefore cause the whole hardware system area comprising total pcb board comparatively large, be unfavorable for the demand of intelligent mobile InterWorking Equipment system compact; In addition, for different mobile interchange modes of devices, need again AP, PMIC, memory and other device layout be welded on new pcb board, while delaying the development time, too increase development cost.
Summary of the invention
In order to the problem that the area solving the total pcb board of prior art is larger, embodiments provide a kind of electronic equipment.Described technical scheme is as follows:
A kind of electronic equipment, comprise at least one processing module, described processing module is integration module, and described integration module comprises substrate and multiple submodule, described multiple submodule is arranged on substrate both sides respectively, and the edge of described substrate side is provided with the first join domain.
As preferably, described electronic equipment also comprises at least one assembled plate, described assembled plate has groove or through hole, described groove or through hole edge have the second join domain, in described integration module, at least one submodule to be arranged in assembled plate in corresponding groove or through hole, and described first join domain is connected with the second join domain.
Further, the height of described first join domain be less than this side the height of submodule is installed.
Further, first, second join domain described is multiple pin.
As preferably, the submodule be arranged in assembled plate upper groove or through hole has the height higher than other modules.
As preferably, described multiple submodule comprises application processor, memory and power processor, described application processor and described power processor are arranged on the same side of described substrate, described memory is arranged on the opposite side of described substrate, and described memory is arranged in described groove or through hole.
As preferably, described electronic equipment also comprises electric capacity and inductance, and described electric capacity and described inductance are all arranged on the side of described substrate power source processor.
The beneficial effect that the technical scheme that the embodiment of the present invention provides is brought is:
The invention provides a kind of electronic equipment, comprise integrated for multiple submodule integration module on the same substrate, because the own size of each submodule after integrated is less, and multiple submodule is arranged on respectively the both sides of substrate by surface mounting technology, namely the two-sided attachment of integration module is realized, the pcb board area that each submodule is totally taken reduces greatly, thus whole hardware system area is diminished, be conducive to the demand of intelligent mobile InterWorking Equipment system compact, and, extra connection or draw-in groove need do not increased at pcb board, only signal need can be drawn by common welding manner, with low cost, in addition, the present invention is carried out modularized processing, for different mobile interchange modes of devices, only need the present invention to be directly installed on corresponding pcb board, be convenient to use in varied situations, while saving the development time, also reduce development cost.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the electronic equipment that the embodiment of the present invention provides;
Fig. 2 is the structural representation of the electronic equipment that further embodiment of this invention provides.
Wherein: 1 integration module,
11 application processors, 12 power processors, 13 memories, 14 substrates,
15 electric capacity, 16 inductance, 17 first join domains,
2 assembled plate,
21 through holes, 22 second join domains.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, embodiment of the present invention is described further in detail.
Embodiment one
As shown in Figure 1, a kind of electronic equipment that the embodiment of the present invention provides, comprise at least one processing module, described processing module is integration module 1, described integration module 1 comprises substrate 14 and multiple submodule, described multiple submodule is arranged on substrate 14 both sides respectively, and the edge of described substrate 14 side is provided with the first join domain 17.
Wherein, submodule is only mounted on the situation of side compared to existing technology, multiple submodule is mounted on the both sides of substrate 14 by the embodiment of the present invention respectively by surface mounting technology, the area of the substrate 14 taken is reduced greatly, namely the area of whole integration module 1 reduces greatly, when being arranged on pcb board, the pcb board area taken is made also greatly to reduce equally, and the first join domain 17 is provided with at the edge of substrate 14 side, object is the signal of each submodule to be exported by this first join domain 17, very convenient during actual use, and cost is lower, and the integration module 1 multiple submodule is integrated on same substrate 14, because the own size of each submodule after integrated is less, and multiple submodule is arranged on respectively the both sides of substrate 14 by surface mounting technology, namely the two-sided attachment of integration module 1 is realized, the pcb board area that each submodule is totally taken reduces greatly, thus whole hardware system area is diminished, be conducive to the demand of intelligent mobile InterWorking Equipment system compact, and, extra connection or draw-in groove need do not increased at pcb board, only signal need can be drawn by common welding manner, with low cost, be convenient to the present invention use in varied situations, while saving the development time, also reduce development cost.
In addition, the present invention is carried out modularized processing, for different mobile interchange modes of devices, only the present invention need be directly installed on corresponding pcb board, especially be core devices at submodule, time higher to its installation requirement, therefore its place part needs high-density multi-layered PCB processing procedure just can complete, prior art generally needs whole pcb board to be carried out high-density multi-layered wiring to complete the interconnected of whole system, but interconnected in fact for other device on pcb board, do not need the PCB of accurate processing procedure like this, so just cause need not cost waste, therefore, the embodiment of the present invention is by by integrated for each a submodule total integration module 1, then in use, only integration module 1 higher for this installation requirement need be adopted high-density multi-layered PCB processing procedure, other device then adopts common PCB, cost is so made greatly to reduce, avoid causing unnecessary waste.
Embodiment two
A kind of electronic equipment that the embodiment of the present invention provides, comprise at least one processing module, described processing module is integration module 1, described integration module 1 comprises substrate 14 and multiple submodule, described multiple submodule is arranged on substrate 14 both sides respectively, and the edge of described substrate 14 side is provided with the first join domain 17.As shown in Figure 2, as preferably, described electronic equipment also comprises at least one assembled plate 2, described assembled plate 2 has groove or through hole 21, described groove or through hole 21 edge have the second join domain 22, in described integration module 1, at least one submodule to be arranged in assembled plate 2 in corresponding groove or through hole 21, and described first join domain 17 is connected with the second join domain 22.
As shown in Figure 2, further, the height of described first join domain 17 be less than this side the height of submodule is installed.Therefore, the submodule that this side is installed can to embed in assembled plate 2 in corresponding groove or through hole 21, and the first join domain and the second join domain can bonded to each otherly be connected after submodule embeds, thus reduces overall package thickness
As shown in Figure 2, further, first, second join domain 22 described can be multiple pin.
Wherein, in the embodiment of the present invention, assembled plate 2 can be pcb board, second join domain 22 is for being connected with the first join domain 17, namely the pin on substrate 14 is connected with the pin on pcb board, realize the Signal transmissions between integration module 1 and pcb board, if directly above integration module 1 is directly mounted on this pcb board, because submodule has certain thickness, when mounting, integration module 1 substrate 14 is far away apart from pcb board, need to arrange longer pin can realize being connected with the signal of pcb board, longer pin causes actual process complicated, and connect insecure, reliability is not high, and the present invention is provided with groove or through hole 21 on this pcb board, the submodule of side on substrate 14 is put into this groove or through hole 21, the distance between substrate 14 and pcb board is so made greatly to reduce, the pin connected also can correspondingly shorten, namely the height of pin on substrate 14 can be less than this side the height of submodule is installed, namely the connection with pin on pcb board can be realized, and reduce overall package thickness, firm and reliable connection, practical application is with the obvious advantage.Submodule is only mounted on the situation of side compared to existing technology, multiple submodule is mounted on the both sides of substrate 14 by the embodiment of the present invention respectively by surface mounting technology, the area of the substrate 14 taken is reduced greatly, namely the area of whole integration module 1 reduces greatly, when being arranged on pcb board, the pcb board area taken is made also greatly to reduce equally, and the first join domain 17 is provided with at the edge of substrate 14 side, object is the signal of each submodule to be exported by this first join domain 17, very convenient during actual use, and cost is lower, and the integration module 1 multiple submodule is integrated on same substrate 14, because the own size of each submodule after integrated is less, and multiple submodule is arranged on respectively the both sides of substrate 14 by surface mounting technology, namely the two-sided attachment of integration module 1 is realized, the pcb board area that each submodule is totally taken reduces greatly, thus whole hardware system area is diminished, be conducive to the demand of intelligent mobile InterWorking Equipment system compact, and, extra connection or draw-in groove need do not increased at pcb board, only signal need can be drawn by common welding manner, with low cost, be convenient to the present invention use in varied situations, while saving the development time, also reduce development cost.
In addition, the present invention is carried out modularized processing, for different mobile interchange modes of devices, only the present invention need be directly installed on corresponding pcb board, especially be core devices at submodule, time higher to its installation requirement, therefore its place part needs high-density multi-layered PCB processing procedure just can complete, prior art generally needs whole pcb board to be carried out high-density multi-layered wiring to complete the interconnected of whole system, but interconnected in fact for other device on pcb board, do not need the PCB of accurate processing procedure like this, so just cause need not cost waste, therefore, the embodiment of the present invention is by by integrated for each a submodule total integration module 1, then in use, only integration module 1 higher for this installation requirement need be adopted high-density multi-layered PCB processing procedure, other device then adopts common PCB, cost is so made greatly to reduce, avoid causing unnecessary waste.
Embodiment three
A kind of electronic equipment that the embodiment of the present invention provides, comprise at least one processing module, described processing module is integration module 1, described integration module 1 comprises substrate 14 and multiple submodule, described multiple submodule is arranged on substrate 14 both sides respectively, and the edge of described substrate 14 side is provided with the first join domain 17.Described electronic equipment also comprises at least one assembled plate 2, described assembled plate 2 has groove or through hole 21, described groove or through hole 21 edge have the second join domain 22, in described integration module 1, at least one submodule to be arranged in assembled plate 2 in corresponding groove or through hole 21, and described first join domain 17 is connected with the second join domain 22.
As shown in Figure 2, as preferably, the submodule be arranged in assembled plate 2 upper groove or through hole 21 has the height higher than other modules.
Submodule is only mounted on the situation of side compared to existing technology, multiple submodule is mounted on the both sides of substrate 14 by the embodiment of the present invention respectively by surface mounting technology, the area of the substrate 14 taken is reduced greatly, namely the area of whole integration module 1 reduces greatly, when being arranged on pcb board, the pcb board area taken is made also greatly to reduce equally, and the first join domain 17 is provided with at the edge of substrate 14 side, object is the signal of each submodule to be exported by this first join domain 17, very convenient during actual use, and cost is lower, and the integration module 1 multiple submodule is integrated on same substrate 14, because the own size of each submodule after integrated is less, and multiple submodule is arranged on respectively the both sides of substrate 14 by surface mounting technology, namely the two-sided attachment of integration module 1 is realized, the pcb board area that each submodule is totally taken reduces greatly, thus whole hardware system area is diminished, be conducive to the demand of intelligent mobile InterWorking Equipment system compact, and, extra connection or draw-in groove need do not increased at pcb board, only signal need can be drawn by common welding manner, with low cost, be convenient to the present invention use in varied situations, while saving the development time, also reduce development cost.
In addition, the present invention is carried out modularized processing, for different mobile interchange modes of devices, only the present invention need be directly installed on corresponding pcb board, especially be core devices at submodule, time higher to its installation requirement, therefore its place part needs high-density multi-layered PCB processing procedure just can complete, prior art generally needs whole pcb board to be carried out high-density multi-layered wiring to complete the interconnected of whole system, but interconnected in fact for other device on pcb board, do not need the PCB of accurate processing procedure like this, so just cause need not cost waste, therefore, the embodiment of the present invention is by by integrated for each a submodule total integration module 1, then in use, only integration module 1 higher for this installation requirement need be adopted high-density multi-layered PCB processing procedure, other device then adopts common PCB, cost is so made greatly to reduce, avoid causing unnecessary waste.
Embodiment four
A kind of electronic equipment that the embodiment of the present invention provides, comprise at least one processing module, described processing module is integration module 1, described integration module 1 comprises substrate 14 and multiple submodule, described multiple submodule is arranged on substrate 14 both sides respectively, and the edge of described substrate 14 side is provided with the first join domain 17.Described electronic equipment also comprises at least one assembled plate 2, described assembled plate 2 has groove or through hole 21, described groove or through hole 21 edge have the second join domain 22, in described integration module 1, at least one submodule to be arranged in assembled plate 2 in corresponding groove or through hole 21, and described first join domain 17 is connected with the second join domain 22.
As shown in Figure 2, as preferably, described multiple submodule comprises application processor 11, memory 13 and power processor 12, described application processor 11 and described power processor 12 are arranged on the same side of described substrate 14, described memory 13 is arranged on the opposite side of described substrate 14, and described memory 13 is arranged in described groove or through hole 21.
Wherein, in the embodiment of the present invention, the submodule installed on the substrate 14 adopts the core devices of mobile interchange equipment respectively, as application processor 11, memory 13 and power processor 12, when integration module 1 mounts with pcb board, be generally arranged on by memory 13 in groove or through hole 21, therefore the height of memory 13 can be unrestricted, can be higher than other modules, so can tackle different actual needs.
As shown in Figure 2, as preferably, described electronic equipment also comprises electric capacity 15 and inductance 16, and described electric capacity 15 and described inductance 16 are all arranged on the side of described substrate 14 power source processor 12.Electric capacity 15 and inductance 16 generally arrange the side of application processor 11 and power processor 12 on the substrate 14, for the transmission of its signal auxiliary.
In addition, in the embodiment of the present invention, pin on substrate 14 is generally arranged on the surrounding of substrate 14, and the pin on pcb board is arranged on the surrounding of groove or through hole 21, and the size of substrate 14 is generally greater than the size of groove or through hole 21, so when mounting, integration module 1 just can better be fitted with pcb board and be installed.
Submodule is only mounted on the situation of side compared to existing technology, multiple submodule is mounted on the both sides of substrate 14 by the embodiment of the present invention respectively by surface mounting technology, the area of the substrate 14 taken is reduced greatly, namely the area of whole integration module 1 reduces greatly, when being arranged on pcb board, the pcb board area taken is made also greatly to reduce equally, and the first join domain 17 is provided with at the edge of substrate 14 side, object is the signal of each submodule to be exported by this first join domain 17, very convenient during actual use, and cost is lower, and the integration module 1 multiple submodule is integrated on same substrate 14, because the own size of each submodule after integrated is less, and multiple submodule is arranged on respectively the both sides of substrate 14 by surface mounting technology, namely the two-sided attachment of integration module 1 is realized, the pcb board area that each submodule is totally taken reduces greatly, thus whole hardware system area is diminished, be conducive to the demand of intelligent mobile InterWorking Equipment system compact, and, extra connection or draw-in groove need do not increased at pcb board, only signal need can be drawn by common welding manner, with low cost, be convenient to the present invention use in varied situations, while saving the development time, also reduce development cost.
In addition, the present invention is carried out modularized processing, for different mobile interchange modes of devices, only the present invention need be directly installed on corresponding pcb board, especially be core devices at submodule, time higher to its installation requirement, therefore its place part needs high-density multi-layered PCB processing procedure just can complete, prior art generally needs whole pcb board to be carried out high-density multi-layered wiring to complete the interconnected of whole system, but interconnected in fact for other device on pcb board, do not need the PCB of accurate processing procedure like this, so just cause need not cost waste, therefore, the embodiment of the present invention is by by integrated for each a submodule total integration module 1, then in use, only integration module 1 higher for this installation requirement need be adopted high-density multi-layered PCB processing procedure, other device then adopts common PCB, cost is so made greatly to reduce, avoid causing unnecessary waste.
Compared to existing technology, components and parts can be mounted on the both sides of substrate by the embodiment of the present invention respectively according to function and characteristic, this not only reduces assembling area, make the layout of device more flexibly, rationally simultaneously, shorten the track lengths between device, improve degree of integration.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. an electronic equipment, comprises at least one processing module, and described processing module is integration module, it is characterized in that, described integration module comprises substrate and multiple submodule, and described multiple submodule is arranged on substrate both sides respectively, and the edge of described substrate side is provided with the first join domain.
2. electronic equipment according to claim 1, it is characterized in that, described electronic equipment also comprises at least one assembled plate, described assembled plate has groove or through hole, described groove or through hole edge have the second join domain, in described integration module, at least one submodule to be arranged in assembled plate in corresponding groove or through hole, and described first join domain is connected with the second join domain.
3. electronic equipment according to claim 1 and 2, is characterized in that, the height of described first join domain be less than this side the height of submodule is installed.
4. electronic equipment according to claim 3, is characterized in that, first, second join domain described is multiple pin.
5. electronic equipment according to claim 2, is characterized in that, the submodule be arranged in assembled plate upper groove or through hole has the height higher than other modules.
6. electronic equipment according to claim 5, it is characterized in that, described multiple submodule comprises application processor, memory and power processor, described application processor and described power processor are arranged on the same side of described substrate, described memory is arranged on the opposite side of described substrate, and described memory is arranged in described groove or through hole.
7. electronic equipment according to claim 6, is characterized in that, described electronic equipment also comprises electric capacity and inductance, and described electric capacity and described inductance are all arranged on the side of described substrate power source processor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310575194.3A CN104661431A (en) | 2013-11-15 | 2013-11-15 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310575194.3A CN104661431A (en) | 2013-11-15 | 2013-11-15 | Electronic equipment |
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| CN104661431A true CN104661431A (en) | 2015-05-27 |
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| CN201310575194.3A Pending CN104661431A (en) | 2013-11-15 | 2013-11-15 | Electronic equipment |
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Cited By (6)
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| CN105809852A (en) * | 2016-03-07 | 2016-07-27 | 福建联迪商用设备有限公司 | Modularized POS machine |
| JP2019033245A (en) * | 2017-08-04 | 2019-02-28 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Semiconductor package connection system |
| CN110139477A (en) * | 2018-02-09 | 2019-08-16 | 台达电子企业管理（上海）有限公司 | Power module and power module package assembly applied to intelligent terminal |
| CN110602915A (en) * | 2019-09-30 | 2019-12-20 | 联想(北京)有限公司 | Electronic equipment |
| CN110621122A (en) * | 2019-09-03 | 2019-12-27 | Oppo（重庆）智能科技有限公司 | Manufacturing method of multilayer circuit board, multilayer circuit board and electronic equipment |
| CN112616245A (en) * | 2020-12-14 | 2021-04-06 | 海光信息技术股份有限公司 | Acceleration processor acceleration card and manufacturing method thereof |
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| CN110602915A (en) * | 2019-09-30 | 2019-12-20 | 联想(北京)有限公司 | Electronic equipment |
| CN112616245A (en) * | 2020-12-14 | 2021-04-06 | 海光信息技术股份有限公司 | Acceleration processor acceleration card and manufacturing method thereof |
| CN112616245B (en) * | 2020-12-14 | 2022-04-19 | 海光信息技术股份有限公司 | Acceleration processor acceleration card and manufacturing method thereof |
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Application publication date: 20150527 |
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