CN204578344U - Integrated power module and there is pull-down module and the electronic equipment of this integrated power module - Google Patents
Integrated power module and there is pull-down module and the electronic equipment of this integrated power module Download PDFInfo
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- CN204578344U CN204578344U CN201520295641.4U CN201520295641U CN204578344U CN 204578344 U CN204578344 U CN 204578344U CN 201520295641 U CN201520295641 U CN 201520295641U CN 204578344 U CN204578344 U CN 204578344U
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- power module
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Abstract
The utility model discloses a kind of integrated power module, this integrated power module comprises insulation shell, the electronic devices and components comprising IGBT are packaged with in described insulation shell, at least part of pin of described electronic devices and components is the external link of integrated power module, the end face of described insulation shell is provided with external pin corresponding to multiple and described external link, and the bottom of described insulation shell is provided with thermal conductive metal plate.Electronic devices and components higher for caloric value based on IGBT encapsulate separately and arrange thermal conductive metal plate in the bottom of package module by integrated power module of the present utility model, the heat that IGBT is distributed can be transmitted on thermal conductive metal plate, can conduct heat to further to realize good radiating effect on radiator by this thermal conductive metal plate, thus improve the stability of power model.Meanwhile, the invention also discloses the pull-down module with above-mentioned integrated power module and electronic equipment.
Description
Technical field
The utility model relates to technical field of electronic equipment, relates more specifically to the good integrated power module of a kind of radiating effect and has pull-down module and the electronic equipment of this integrated power module.
Background technology
In converter technology field, such as, for medium voltage frequency converter, it needs employing one reduction voltage circuit plate to realize step-down object usually, reduces to 2/3 of input voltage as made output voltage.In prior art, usually as shown in Figure 1, in this reduction voltage circuit, IGBT T1 adopts SMD structure to the physical circuit of such reduction voltage circuit plate, and it directly welds on circuit boards and connects to other relevant components and parts on circuit board.Studying discovery through inventor, there is following problem in the reduction voltage circuit plate of said structure design: due to components and parts all in circuit be all paperbacked welding on circuit boards, make board area comparatively large, needed for the installing space that takies larger; Because circuit board needs comparatively high-protection level, be generally arranged on machine intimate, and can not be arranged in air channel, the weak effect of natural heat dissipation, affect circuit performance; And to improve radiating effect, then need to increase separately fan to dispel the heat, its production cost is higher.
Utility model content
A technical problem to be solved in the utility model is to provide the good integrated power module of a kind of radiating effect.
Another technical problem to be solved in the utility model be to provide a kind of radiating effect better, the less and lower-cost pull-down module of area and there is the electronic equipment of this pull-down module.
In order to solve the problems of the technologies described above, the utility model provides a kind of integrated power module, it comprises an insulation shell, the electronic devices and components comprising IGBT are packaged with in described insulation shell, at least part of pin of described electronic devices and components is the external link of integrated power module, the end face of described insulation shell is provided with external pin corresponding to multiple and described external link, and the bottom of described insulation shell is provided with thermal conductive metal plate.
Its further technical scheme is: described electronic devices and components also comprise diode, and the negative electrode of described diode is connected with the drain electrode of described IGBT, and the anode of described diode and the grid of described IGBT and source electrode are described external link.
Its further technical scheme is: the described external pin of each described external link correspondence at least two.
Its further technical scheme is: described external link also comprises the first link and second link of electrical connection.
Its further technical scheme is: the end face of described integrated power module is formed with sunk area, and multiple described external pin is along the edge distribution of this sunk area.
In order to solve the problems of the technologies described above, the utility model also provides a kind of pull-down module, and it comprises above-mentioned integrated power module and a reduction voltage circuit plate.Described reduction voltage circuit plate is formed with the multiple through holes corresponding with multiple described external pin, described reduction voltage circuit plate is installed on the end face of described integrated power module, each described external pin runs through corresponding through hole on described reduction voltage circuit plate and welds together with described reduction voltage circuit plate, thus on described integrated power module and described reduction voltage circuit plate, respective lines is formed and is electrically connected.
Its further technical scheme is: the end face of described integrated power module is formed with sunk area, and multiple described external pin is along the edge distribution of this sunk area; Described multiple through hole is along the edge distribution of described reduction voltage circuit plate; Solder joint on described reduction voltage circuit plate is contained in described sunk area.
Its further technical scheme is: described reduction voltage circuit plate is provided with multiple wiring interface.
In order to solve the problems of the technologies described above, the utility model also provides a kind of electronic equipment, it comprises casing and is located at the parts in described casing, described parts comprise radiator and above-mentioned pull-down module, described pull-down module is installed on described radiator, and the surface of the thermal conductive metal plate on described integrated power module and described radiator fits together.
Its further technical scheme is: described electronic equipment is frequency converter.
Compared with prior art, electronic devices and components higher for caloric value based on IGBT encapsulate separately and arrange thermal conductive metal plate in the bottom of package module by integrated power module of the present utility model, the heat that IGBT is distributed can be transmitted on thermal conductive metal plate, can conduct heat to further to realize good radiating effect on radiator by this thermal conductive metal plate, thus improve the stability of power model.Meanwhile, pull-down module radiating effect provided by the utility model better, area is less and cost is lower, and corresponding electronic equipment has above-mentioned advantage equally.
By following description also by reference to the accompanying drawings, the utility model will become more clear, and these accompanying drawings are for explaining embodiment of the present utility model.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of existing reduction voltage circuit intralamellar part circuit structure.
Fig. 2 is the stereogram of the utility model integrated power module one embodiment.
Fig. 3 is the schematic diagram of the internal circuit configuration of integrated power module shown in Fig. 2.
Fig. 4 is the stereogram of the utility model pull-down module one embodiment.
Fig. 5 is the three-dimensional exploded view of pull-down module shown in Fig. 4.
Fig. 6 is the schematic diagram of the internal circuit configuration of pull-down module shown in Fig. 4.
Fig. 7 illustrates state when the utility model pull-down module is installed on radiator.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in embodiment, reference numerals similar in accompanying drawing represents similar assembly.Obviously, be only the utility model part embodiment below by the embodiment of description, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Fig. 2 illustrates an embodiment of the utility model integrated power module.With reference to Fig. 2, the integrated power module 10 of the present embodiment comprises insulation shell 11, and in the present embodiment, this insulation shell 11 is the rectangular structure of flat.With reference to Fig. 3, in described insulation shell 11, be packaged with the electronic devices and components 13 comprising IGBT T1.Described electronic devices and components comprise multiple pin, at least part of pin is the external link of integrated power module 10, the end face of described insulation shell 11 is provided with external pin C corresponding to multiple and described external link, and the bottom of described insulation shell 11 is provided with thermal conductive metal plate.
Continue with reference to Fig. 3, in the present embodiment, in described insulation shell 11, the electronic devices and components 13 of encapsulation also comprise diode D2, and the negative electrode of described diode D2 is connected with the drain electrode of IGBT T1, and the anode of diode D2 and the grid of IGBT T1 and source electrode are the external link of integrated power module 10.In order to the inside of above-mentioned external link from integrated power module 10 is drawn, the end face of described insulation shell 11 is provided with external pin C corresponding to multiple and described external link, and described IGBT T1 is connected with other circuit electrical by external pin C with diode D2.
In the preferred embodiment, the external pin C being arranged at insulation shell 11 end face comprises: the external pin C1 corresponding with the anode of diode D2, the external pin C5 corresponding with the grid of IGBT T1 and the external pin C6 corresponding with the source electrode of IGBT T1.Integrated power module 10 realizes fixing by external pin C1, C5 and C6 being fixed on other modules or circuit board.
Quantity due to said external pin is only 3, and the fixed effect of integrated power module 10 is poor.Be connected with between other circuit module or circuit board to strengthen this integrated power module 10, each external link correspondence at least two external pins of diode D2 and IGBT T1, such as, the anode of diode D2 also correspondence is provided with external pin C2, and the source electrode of IGBT T1 also correspondence is provided with external pin C7 and C8.In addition, corresponding external pin C3 and C4 can also be set at the negative electrode of diode D2.
In some embodiment, such as, in this preferred embodiment, described external link also comprises the first link and second link of electrical connection, wherein the first link can corresponding two external pin C9 and C10, and corresponding two external pin C11 and C12 of the second link, the external pin C that can increase integrated power module 10 based on this design is further connected with between other circuit module or circuit board to reinforce this integrated power module 10 further.
In order to realize good heat-conducting effect to the electronic devices and components 13 of integrated power module 10 inside, the bottom of described insulation shell 11 is provided with thermal conductive metal plate, in the preferred embodiment, described thermal conductive metal plate is copper coin, this copper coin to be embedded in insulation shell 11 and to flush with the bottom surface of insulation shell 11, thus the heat that described IGBTT1 and diode D1 produces outwardly can conduct by thermal conductive metal plate.Understandably, in other embodiments, the electronic devices and components be encapsulated in insulation shell 11 can only comprise IGBT T1, also can comprise outside IGBT T1 and diode D1, also comprise the electronic devices and components that other caloric value is larger, such as, be connected in parallel on the sustained diode 1 between the drain electrode of IGBT T1 and source electrode.
Meanwhile, the utility model additionally provides a kind of pull-down module, with reference to Fig. 4 to Fig. 5, which show an embodiment of the utility model pull-down module.The pull-down module of the present embodiment is applicable to frequency converter, such as, in 660V medium voltage frequency converter.With reference to Fig. 4 and Fig. 5, the pull-down module 100 of the present embodiment comprises integrated power module 10 and reduction voltage circuit plate 20, wherein, described reduction voltage circuit plate 20 is rectangular-shaped circuit board, it is formed with the multiple through holes 21 corresponding with multiple described external pin C, described reduction voltage circuit plate 20 is installed on the end face of described integrated power module 10, such as be fixed by securing member, each described external pin C runs through corresponding through hole 21 on described reduction voltage circuit plate 20 and welds together with described reduction voltage circuit plate 20, thus described integrated power module 10 is formed with respective lines on described reduction voltage circuit plate 20 and is electrically connected, based on this, integrated power module 10 and reduction voltage circuit plate 20 form a complete pull-down module 100 with hypotensive effect, its inner physical circuit as shown in Figure 6.This pull-down module 100 degree of modularity is high, compact conformation, when conveniently installing and install, area occupied is less, and, the integrated power module 10 that wherein caloric value is larger can dispel the heat by radiator further owing to being provided with thermal conductive metal plate, reach great heat radiation effect, thus ensure circuit performance.
Preferably, in some embodiment, such as, in the present embodiment, the end face of described integrated power module 10 is formed with the sunk area 13 of rectangle, and multiple described external pin C is along the edge distribution of this sunk area 13; Correspondingly, described multiple through hole 21 is along the edge distribution of described reduction voltage circuit plate 20; After described reduction voltage circuit plate 20 is assembled with described integrated power module 10, the solder joint on described reduction voltage circuit plate 20 is contained in described sunk area 13, makes structure more compact and avoids solder joint impaired.
Preferably, in some embodiment, such as, in the present embodiment, described reduction voltage circuit plate 20 is provided with three wiring interfaces 22, particularly, with reference to Fig. 6, these three wiring interfaces 22 comprise an input end interface CN1 and two output interface CN2 and CN3 and are electrically connected with other circuit module to facilitate this pull-down module 100.
In addition, the utility model additionally provides a kind of electronic equipment, and in the preferred embodiment, this electronic equipment is frequency converter, such as 660V medium voltage frequency converter.This electronic equipment comprises casing and is located at the parts in described casing, and wherein, described parts comprise radiator 200 and above-mentioned pull-down module 100.As shown in Figure 7, described pull-down module 100 is installed on described radiator 200, such as in the present embodiment, by arranging two installing holes and by securing member, integrated power module 10 is fixed on radiator 200 on described integrated power module 10, meanwhile, pull-down module 100 is electrically connected with other circuit module in electronic equipment by the wiring interface 22 on it.In the present embodiment, the position arranging installing hole is also formed with depression breach 14 to accommodate corresponding securing member.After voltage reduction module is installed, the surface of the thermal conductive metal plate bottom integrated power module 10 and described radiator 200 fits together, thus, the heat that integrated power module 10 produces is transmitted on radiator 200 by thermal conductive metal plate, and radiator 200 can be installed in the air channel of electronic equipment, thus good radiating effect can be realized.Other structure of described frequency converter is well known to those skilled in the art, and does not repeat them here.
As mentioned above, electronic devices and components higher for caloric value based on IGBT encapsulate separately and arrange thermal conductive metal plate in the bottom of package module by integrated power module of the present utility model, the heat that IGBT is distributed can be transmitted on thermal conductive metal plate, can conduct heat to further to realize good radiating effect on radiator by this thermal conductive metal plate, thus improve the stability of integrated power module.Meanwhile, pull-down module provided by the utility model and electronic equipment, owing to having above-mentioned integrated power module, have above-mentioned advantage equally.
More than in conjunction with preferred embodiment, the utility model is described, but the utility model is not limited to the embodiment of above announcement, and the various amendment carried out according to essence of the present utility model should be contained.
Claims (10)
1. an integrated power module, it is characterized in that: comprise an insulation shell, the electronic devices and components comprising IGBT are packaged with in described insulation shell, described electronic devices and components comprise multiple pin, at least part of pin is the external link of integrated power module, the end face of described insulation shell is provided with external pin corresponding to multiple and described external link, and the bottom of described insulation shell is provided with thermal conductive metal plate.
2. integrated power module according to claim 1, it is characterized in that: described electronic devices and components also comprise diode, the negative electrode of described diode is connected with the drain electrode of described IGBT, and the anode of described diode and the grid of described IGBT and source electrode are described external link.
3. integrated power module according to claim 1, is characterized in that: the described external pin of each described external link correspondence at least two.
4. integrated power module according to claim 1, is characterized in that: described external link also comprises the first link and second link of electrical connection.
5. integrated power module according to claim 1, is characterized in that: the end face of described integrated power module is formed with sunk area, and multiple described external pin is along the edge distribution of this sunk area.
6. a pull-down module, is characterized in that, comprising:
One integrated power module, described integrated power module is the integrated power module described in any one of claim 1-4; And
One reduction voltage circuit plate, described reduction voltage circuit plate is formed with the multiple through holes corresponding with multiple described external pin, described reduction voltage circuit plate is installed on the end face of described integrated power module, the each described external pin of described integrated power module end face runs through corresponding through hole on described reduction voltage circuit plate and welds together with described reduction voltage circuit plate, thus on described integrated power module and described reduction voltage circuit plate, respective lines is electrically connected.
7. pull-down module according to claim 6, is characterized in that: the end face of described integrated power module is formed with sunk area, and multiple described external pin is along the edge distribution of this sunk area; Described multiple through hole is along the edge distribution of described reduction voltage circuit plate; Solder joint on described reduction voltage circuit plate is contained in described sunk area.
8. pull-down module according to claim 6, is characterized in that: described reduction voltage circuit plate is provided with multiple wiring interface.
9. an electronic equipment, comprise casing and be located at the parts in described casing, it is characterized in that: described parts comprise radiator and the pull-down module described in any one of claim 6-8, described pull-down module is installed on described radiator, and the surface of the thermal conductive metal plate on described integrated power module and described radiator fits together.
10. electronic equipment according to claim 9, is characterized in that: described electronic equipment is frequency converter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520295641.4U CN204578344U (en) | 2015-05-08 | 2015-05-08 | Integrated power module and there is pull-down module and the electronic equipment of this integrated power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520295641.4U CN204578344U (en) | 2015-05-08 | 2015-05-08 | Integrated power module and there is pull-down module and the electronic equipment of this integrated power module |
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| Publication Number | Publication Date |
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| CN204578344U true CN204578344U (en) | 2015-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520295641.4U Active CN204578344U (en) | 2015-05-08 | 2015-05-08 | Integrated power module and there is pull-down module and the electronic equipment of this integrated power module |
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| CN (1) | CN204578344U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108107055A (en) * | 2017-11-20 | 2018-06-01 | 珠海格力电器股份有限公司 | Control method and device of intelligent power module, storage medium and processor |
| CN110996606A (en) * | 2020-01-06 | 2020-04-10 | 西安电掣风云智能科技有限公司 | Anti-interference integrated heat dissipation capacitor module and preparation method thereof |
-
2015
- 2015-05-08 CN CN201520295641.4U patent/CN204578344U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108107055A (en) * | 2017-11-20 | 2018-06-01 | 珠海格力电器股份有限公司 | Control method and device of intelligent power module, storage medium and processor |
| CN108107055B (en) * | 2017-11-20 | 2019-11-15 | 珠海格力电器股份有限公司 | Control method and device of intelligent power module, storage medium and processor |
| CN110996606A (en) * | 2020-01-06 | 2020-04-10 | 西安电掣风云智能科技有限公司 | Anti-interference integrated heat dissipation capacitor module and preparation method thereof |
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| GR01 | Patent grant |