CN114040565A - PCB processing method, PCB processing equipment and computer readable storage medium - Google Patents
PCB processing method, PCB processing equipment and computer readable storage medium Download PDFInfo
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- CN114040565A CN114040565A CN202111344870.7A CN202111344870A CN114040565A CN 114040565 A CN114040565 A CN 114040565A CN 202111344870 A CN202111344870 A CN 202111344870A CN 114040565 A CN114040565 A CN 114040565A
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- 238000003672 processing method Methods 0.000 title claims abstract description 30
- 238000003860 storage Methods 0.000 title claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 173
- 229910052802 copper Inorganic materials 0.000 claims abstract description 173
- 239000010949 copper Substances 0.000 claims abstract description 173
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000005553 drilling Methods 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 12
- 238000006087 Brown hydroboration reaction Methods 0.000 claims description 5
- 238000004590 computer program Methods 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 131
- 230000000694 effects Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000013049 sediment Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005429 filling process Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides a PCB processing method, a device and a computer readable storage medium, wherein the PCB processing method comprises the steps of pressing a shielding plate onto a substrate to enable a signal line to be positioned between a second copper layer and a third copper layer, drilling blind holes on the left side and the right side of the signal line to enable the blind holes to use the third copper layer, a first dielectric layer and a second dielectric layer as hole walls, use the second copper layer as a hole bottom, and filling copper into the blind holes, so that the second copper layer and the third copper layer are connected through copper metal in the blind holes, and the signal line is surrounded by the copper metal in the second copper layer, the third copper layer and the blind holes, so that electromagnetic shielding of the signal line is realized.
Description
Technical Field
The present invention relates to the field of semiconductor device manufacturing, and in particular, to a PCB processing method, device and computer readable storage medium.
Background
In order to prevent the signal lines on the PCB from being interfered by the electromagnetic interference, the signal lines need to be electromagnetically shielded, and in the related art, it is common to add an additional device to the PCB to achieve the electromagnetic shielding, for example, add a metal shielding cover to the PCB or attach a shielding film to the PCB. However, the above method increases the difficulty of the PCB manufacturing process, increases the manufacturing cost, and decreases the reliability of the PCB due to the need to add additional devices to the PCB.
Disclosure of Invention
The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.
The embodiment of the invention provides a PCB processing method, a PCB processing device and a computer readable storage medium, which can reduce the processing cost and improve the reliability while realizing electromagnetic shielding of the PCB.
In a first aspect, an embodiment of the present invention provides a method for processing a PCB, where the PCB includes a substrate and a shielding plate, the substrate includes a first copper layer, a first dielectric layer, and a second copper layer, which are sequentially stacked, and the shielding plate includes a third copper layer and a second dielectric layer, which are sequentially stacked;
the PCB processing method comprises the following steps:
etching the first copper layer to form a signal line;
pressing the shielding plate to the substrate, so that the signal line wraps the first dielectric layer and the second dielectric layer, and the signal line is located between the second copper layer and the third copper layer;
drilling a hole from the third copper layer to the second copper layer to obtain a blind hole with the third copper layer, the first dielectric layer and the second dielectric layer as hole walls and the second copper layer as a hole bottom, wherein at least one blind hole is arranged on each of the left side and the right side of the signal line;
and carrying out copper filling treatment on the blind holes, so that the second copper layer and the third copper layer are connected through the copper metal in the blind holes, and obtaining the PCB.
In a second aspect, an embodiment of the present invention provides a PCB processing apparatus, including a memory, a processor, and a computer program stored on the memory and executable on the processor, wherein the processor, when executing the computer program, implements the PCB processing method as in the first aspect.
In a third aspect, the present invention provides a computer-readable storage medium, where computer-executable instructions are stored, where the computer-executable instructions are configured to enable a computer to execute the PCB processing method as in the first aspect.
The embodiment of the invention comprises the following steps: etching the first copper layer to form a signal line; pressing the shielding plate to the substrate, so that the signal line wraps the first dielectric layer and the second dielectric layer, and the signal line is located between the second copper layer and the third copper layer; drilling a hole from the third copper layer to the second copper layer to obtain a blind hole with the third copper layer, the first dielectric layer and the second dielectric layer as hole walls and the second copper layer as a hole bottom, wherein at least one blind hole is arranged on each of the left side and the right side of the signal line; and carrying out copper filling treatment on the blind holes, so that the second copper layer and the third copper layer are connected through the copper metal in the blind holes, and obtaining the PCB. According to the scheme provided by the embodiment of the invention, the signal wire is positioned between the second copper layer and the third copper layer by pressing the shielding plate to the substrate, and drilling blind holes at the left and right sides of the signal line, wherein the blind holes use the third copper layer, the first dielectric layer and the second dielectric layer as hole walls, the second copper layer is taken as the bottom of the hole, and the blind hole is filled with copper, so that the second copper layer and the third copper layer are connected through copper metal in the blind hole, the signal line is surrounded by the copper metal in the second copper layer, the third copper layer and the blind hole, thereby realizing the electromagnetic shielding of the signal wire, therefore, the embodiment of the invention does not need to adopt an electromagnetic shielding cover or a shielding film when realizing the electromagnetic shielding, but the second copper layer and the third copper layer which are integrated with the PCB are used as shielding layers, so that the electromagnetic shielding of the PCB can be realized, and simultaneously, the processing cost is reduced and the reliability is improved.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention.
Fig. 1 is a flow chart of a PCB board processing method according to an embodiment of the present invention;
FIG. 2 is a detailed flow chart of an etching process performed on a first copper layer according to another embodiment of the present invention;
FIG. 3 is a flowchart illustrating a copper filling process for blind vias according to another embodiment of the present invention;
fig. 4 is a schematic diagram of a PCB board processing apparatus 100 according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It should be noted that although functional blocks are partitioned in a schematic diagram of an apparatus and a logical order is shown in a flowchart, in some cases, the steps shown or described may be performed in a different order than the partitioning of blocks in the apparatus or the order in the flowchart. The terms first, second and the like in the description and in the claims, and the drawings described above, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
The embodiment of the invention provides a PCB processing method, which comprises the following steps: etching the first copper layer to form a signal line; pressing the shielding plate to the substrate, so that the signal line wraps the first dielectric layer and the second dielectric layer, and the signal line is located between the second copper layer and the third copper layer; drilling a hole from the third copper layer to the second copper layer to obtain a blind hole with the third copper layer, the first dielectric layer and the second dielectric layer as hole walls and the second copper layer as a hole bottom, wherein at least one blind hole is arranged on each of the left side and the right side of the signal line; and carrying out copper filling treatment on the blind holes, so that the second copper layer and the third copper layer are connected through the copper metal in the blind holes, and obtaining the PCB. According to the scheme provided by the embodiment of the invention, the signal wire is positioned between the second copper layer and the third copper layer by pressing the shielding plate to the substrate, and drilling blind holes at the left and right sides of the signal line, wherein the blind holes use the third copper layer, the first dielectric layer and the second dielectric layer as hole walls, the second copper layer is used as the bottom of the hole, and the blind hole is filled with copper, so that the second copper layer and the third copper layer are connected through the copper metal in the blind hole, the signal line is surrounded by the copper metal in the second copper layer, the third copper layer and the blind hole, thereby realizing the electromagnetic shielding of the signal wire, therefore, the embodiment of the invention does not need to adopt an electromagnetic shielding cover or a shielding film when realizing the electromagnetic shielding, but the second copper layer and the third copper layer which are integrated with the PCB are used as shielding layers, so that the electromagnetic shielding of the PCB can be realized, and simultaneously, the processing cost is reduced and the reliability is improved.
The embodiments of the present invention will be further explained with reference to the drawings.
As shown in fig. 1, fig. 1 is a flowchart of a PCB processing method according to an embodiment of the present invention, and in the example of fig. 1, the PCB processing method according to the embodiment of the present invention includes, but is not limited to, step S100, step S200, step S300, and step S400.
Step S100: etching the first copper layer to form a signal line;
step S200: pressing the shielding plate to the substrate, so that the signal line wraps the first dielectric layer and the second dielectric layer, and the signal line is located between the second copper layer and the third copper layer;
step S300: drilling a hole from the third copper layer to the second copper layer to obtain a blind hole with the third copper layer, the first dielectric layer and the second dielectric layer as hole walls and the second copper layer as a hole bottom, wherein at least one blind hole is arranged on each of the left side and the right side of the signal line;
step S400: and carrying out copper filling treatment on the blind holes, so that the second copper layer and the third copper layer are connected through the copper metal in the blind holes, and obtaining the PCB.
The shielding plate is pressed on the substrate, so that the signal line is positioned between the second copper layer and the third copper layer, the blind holes are drilled on the left side and the right side of the signal line, the blind holes are formed by taking the third copper layer, the first dielectric layer and the second dielectric layer as hole walls and taking the second copper layer as a hole bottom, and then the blind holes are filled with copper, so that the second copper layer and the third copper layer can be connected through copper metal in the blind holes, and therefore the signal line is surrounded by the copper metal in the second copper layer, the third copper layer and the blind holes, and electromagnetic shielding of the signal line is achieved.
The PCB comprises a substrate and a shielding plate, wherein the substrate comprises a first copper layer, a first dielectric layer and a second copper layer which are sequentially stacked, and the shielding plate comprises a third copper layer and a second dielectric layer which are sequentially stacked.
In one embodiment, the blind holes are arranged on the left side and the right side of the signal line, and the blind holes on the left side and the right side of the signal line are arranged in at least one row so as to ensure the electromagnetic shielding effect.
As shown in fig. 2, fig. 2 is a detailed flowchart of an etching process performed on a first copper layer according to another embodiment of the present invention, and in the example of fig. 2, the PCB processing method according to the embodiment of the present invention includes, but is not limited to, step S110, step S120, and step S130.
Step S110, coating photosensitive circuit ink on the first copper layer and then baking;
step S120, exposing the first copper layer;
in step S130, the first copper layer is etched to form a signal line.
Specifically, in one embodiment, the photosensitive circuit ink is first coated on the first coating layer, the ink thickness ranges from 10um to 16um, and then the first copper layer is baked at a baking temperature ranging from 85 ℃ to 95 ℃ for 6 minutes to 10 minutes.
Specifically, in one embodiment, the etching temperature for etching the first copper layer is between 45 degrees celsius and 55 degrees celsius, and the etching solution is used to etch the first copper layer.
In an embodiment, before the pressing the shielding plate to the substrate, the PCB processing method according to an embodiment of the invention further includes performing a browning treatment on the substrate. The substrate is browned before the shielding plate is pressed to the substrate, so that the roughness of the surface of the substrate can be increased, and the shielding plate and the substrate can be combined more stably after the shielding plate is pressed to the substrate.
Specifically, when the substrate is subjected to the browning treatment, the temperature ranges from 35 ℃ to 39 ℃, and the micro-etching amount ranges from 1.524 micrometers to 2.032 micrometers.
In an embodiment, before drilling the hole from the third copper layer to the second copper layer, the PCB processing method of the embodiment of the present invention further includes: and performing brown oxidation treatment on the second copper layer and the third copper layer. Through carrying out brown oxidation treatment to second copper layer and third copper layer, can reduce the thickness of PCB board second copper layer and third copper layer, also be the face copper thickness of PCB board, do benefit to follow-up laser drilling processing of carrying on.
Specifically, when the second copper layer and the third copper layer are subjected to the browning treatment, the temperature ranges from 28 degrees celsius to 32 degrees celsius.
Specifically, after two times of browning treatment, the thickness of the second copper layer and the third copper layer is made to be in a range of 8 micrometers to 10 micrometers.
In one embodiment, the second copper layer is drilled from the third copper layer using a laser drilling process. The mode that adopts laser drilling can reduce the piece that produces among the drilling process to can make the pore wall of the blind hole that drills out smooth, because the blind hole that drills out uses third copper layer, first dielectric layer and second dielectric layer as the pore wall, the smooth pore wall can promote to the blind hole intussuseption copper back blind hole in copper metal and the contact effect of second copper layer and third copper layer, thereby has promoted PCB board electromagnetic shielding's effect.
Specifically, the aperture range of the blind holes is 0.1mm to 0.2mm, the hole depth is 0.08mm, and the distance between two adjacent blind holes on the same side of the signal line is 0.2mm to 0.4 mm.
In an embodiment, before the copper filling processing is performed on the blind via, the method for processing a PCB according to an embodiment of the present invention further includes: and carrying out plasma degumming treatment on the blind hole to remove glue residues generated by laser drilling in the blind hole. In the laser drilling process, because laser drilling's high temperature can produce gluey sediment in the blind hole, and gluey sediment can stop the contact of empty metal in the blind hole and second copper layer and third copper layer at the in-process of filling out the copper, consequently removes to glue through carrying out plasma to the blind hole and handles in order to get rid of gluey sediment, can promote the contact effect on second copper layer and third copper layer to PCB board electromagnetic shielding's effect has been promoted.
Specifically, the glue residues in the blind hole are removed by adopting a plasma glue removing mode.
As shown in fig. 3, fig. 3 is a specific flowchart of a copper filling process for blind vias according to another embodiment of the present invention, and in the example of fig. 3, the PCB processing method according to the embodiment of the present invention includes, but is not limited to, step S410 and step S420.
Step S410, carrying out chemical copper deposition treatment on the blind hole;
step S420, a vertical continuous electroplating process is performed on the blind via with the chemical copper deposition completed, so that the blind via is filled with copper metal.
In one embodiment, the blind holes are subjected to horizontal chemical copper deposition and then vertical continuous electroplating treatment, so that copper filled in the blind holes can be well contacted with the second copper layer and the third copper layer, and the electromagnetic shielding effect of the PCB is improved.
In addition, referring to fig. 4, fig. 4 is a schematic view of a PCB processing apparatus 100 according to an embodiment of the present invention, the apparatus including: memory 120, processor 110, and computer programs stored on memory 120 and executable on processor 110.
The processor 110 and the memory 120 may be connected by a bus or other means.
The memory 120, which is a non-transitory computer readable storage medium, may be used to store non-transitory software programs as well as non-transitory computer executable programs. Further, the memory 120 may include high speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid state storage device. In some embodiments, the memory 120 optionally includes remote memory located remotely from the processor 110, and the remote memory may be connected to the processor 110 via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The non-transitory software programs and instructions required to implement the PCB board processing method of the above-described embodiment are stored in the memory 120, and when executed by the processor 110, perform the PCB board processing method of the above-described embodiment, for example, perform the method steps in fig. 1 to 3 described above.
Furthermore, an embodiment of the present invention also provides a computer-readable storage medium, which stores computer-executable instructions, which are executed by a processor or a controller, for example, by a processor in the above-mentioned apparatus embodiment or device embodiment, and can make the above-mentioned processor execute the PCB board processing method in the above-mentioned embodiment, for example, execute the above-mentioned method steps in fig. 1 to 3.
One of ordinary skill in the art will appreciate that all or some of the steps, systems, and methods disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as is well known to those of ordinary skill in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, Digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can accessed by a computer. In addition, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media as known to those skilled in the art.
While the preferred embodiments of the present invention have been described in detail, it will be understood by those skilled in the art that the foregoing and various other changes, omissions and deviations in the form and detail thereof may be made without departing from the scope of this invention.
Claims (10)
- The PCB processing method is characterized in that the PCB comprises a substrate and a shielding plate, the substrate comprises a first copper layer, a first dielectric layer and a second copper layer which are sequentially laminated, and the shielding plate comprises a third copper layer and a second dielectric layer which are sequentially laminated;the PCB processing method comprises the following steps:etching the first copper layer to form a signal line;pressing the shielding plate to the substrate, so that the signal line wraps the first dielectric layer and the second dielectric layer, and the signal line is located between the second copper layer and the third copper layer;drilling a hole from the third copper layer to the second copper layer to obtain a blind hole with the third copper layer, the first dielectric layer and the second dielectric layer as hole walls and the second copper layer as a hole bottom, wherein at least one blind hole is arranged on each of the left side and the right side of the signal line;and carrying out copper filling treatment on the blind holes, so that the second copper layer and the third copper layer are connected through the copper metal in the blind holes, and obtaining the PCB.
- 2. The PCB processing method of claim 1, wherein the etching the first copper layer to form signal lines comprises:baking the first copper layer after coating photosensitive circuit ink on the first copper layer;exposing the first copper layer;the first copper layer is etched to form a signal line.
- 3. The PCB processing method of claim 1, wherein before the pressing the shielding plate to the substrate, the method further comprises: and performing brown oxidation treatment on the substrate.
- 4. The PCB processing method of claim 3, wherein prior to said drilling from said third copper layer to said second copper layer, said method further comprises: and performing brown oxidation treatment on the second copper layer and the third copper layer.
- 5. The PCB processing method of claim 4, wherein the second copper layer and the third copper layer have a thickness ranging from 8 microns to 10 microns after two times of brown oxidation treatment.
- 6. The method of claim 1, wherein the hole is drilled from the third copper layer to the second copper layer by laser drilling.
- 7. The PCB processing method of claim 6, wherein before the copper filling treatment of the blind holes, the method further comprises: and carrying out plasma degumming treatment on the blind hole to remove glue residues generated in the blind hole due to laser drilling.
- 8. The PCB processing method of claim 1, wherein the copper filling treatment of the blind holes comprises the following steps:carrying out chemical copper deposition treatment on the blind holes;and carrying out vertical continuous electroplating treatment on the blind hole subjected to chemical copper deposition, so that the blind hole is filled with copper metal.
- A PCB processing apparatus comprising a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the PCB processing method of any one of claims 1 to 8 when executing the computer program.
- 10. A computer-readable storage medium, characterized in that the computer-readable storage medium stores computer-executable instructions for causing a computer to perform the PCB panel processing method of any one of claims 1 to 8.
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| CN202111344870.7A CN114040565A (en) | 2021-11-15 | 2021-11-15 | PCB processing method, PCB processing equipment and computer readable storage medium |
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Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004140254A (en) * | 2002-10-18 | 2004-05-13 | Toray Ind Inc | Member for multilayer circuit board, and manufacturing method thereof |
| JP2005109101A (en) * | 2003-09-30 | 2005-04-21 | Nippon Mektron Ltd | Electromagnetic shield type flexible circuit board |
| EP1699275A2 (en) * | 2005-03-02 | 2006-09-06 | Samsung Electro-mechanics Co., Ltd | Printed circuit board with embedded capacitors therein and manufacturing process thereof |
| CN1989650A (en) * | 2004-07-23 | 2007-06-27 | 日本电气株式会社 | Composite via structures and filters in multilayer printed circuit boards |
| JP2007294996A (en) * | 2007-07-06 | 2007-11-08 | Tatsuta System Electronics Kk | Shielding film, shielding printed wiring board, shielding flexible printed circuit board, and method of manufacturing shielding film and shielding printed wiring board |
| JP2009010266A (en) * | 2007-06-29 | 2009-01-15 | Meiko:Kk | Printed circuit board and method of manufacturing same |
| US20090201654A1 (en) * | 2008-02-08 | 2009-08-13 | Lambert Simonovich | Method and system for improving electrical performance of vias for high data rate transmission |
| JP2009290193A (en) * | 2008-04-28 | 2009-12-10 | Cmk Corp | Rigid flexible multilayer printed wiring board and its production method |
| CN102281700A (en) * | 2010-06-10 | 2011-12-14 | 南亚电路板股份有限公司 | Electrical structure of multilayer printed circuit board and manufacturing method thereof |
| CN104080279A (en) * | 2014-07-10 | 2014-10-01 | 广州杰赛科技股份有限公司 | Method for machining PCB through hole |
| JP2015222776A (en) * | 2014-05-23 | 2015-12-10 | イビデン株式会社 | Printed wiring board, printed wiring board manufacturing method |
| CN105578704A (en) * | 2014-10-13 | 2016-05-11 | 富葵精密组件(深圳)有限公司 | Multilayer flexible circuit board and manufacturing method thereof |
| CN106332434A (en) * | 2015-06-24 | 2017-01-11 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN106470523A (en) * | 2015-08-19 | 2017-03-01 | 富葵精密组件(深圳)有限公司 | Flexible PCB and preparation method thereof |
| CN106488642A (en) * | 2015-08-27 | 2017-03-08 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and preparation method thereof |
| CN106793577A (en) * | 2017-01-16 | 2017-05-31 | 生益电子股份有限公司 | The preparation method and PCB of a kind of High-Speed PCB |
| CN107835587A (en) * | 2017-09-11 | 2018-03-23 | 四川省华兴宇电子科技有限公司 | A kind of high-frequency microwave multilayer printed circuit blind slot and its manufacture craft |
| CN108093554A (en) * | 2016-11-21 | 2018-05-29 | 鹏鼎控股(深圳)股份有限公司 | High frequency signal transmission structure and preparation method thereof |
| CN108966495A (en) * | 2017-05-18 | 2018-12-07 | 北大方正集团有限公司 | A kind of production method and circuit board of circuit board molding |
| CN108966478A (en) * | 2017-05-17 | 2018-12-07 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and preparation method thereof |
| US20190014667A1 (en) * | 2017-07-10 | 2019-01-10 | Sierra Circuits, Inc. | Semi-additive process for printed circuit boards |
| CN111491442A (en) * | 2020-04-30 | 2020-08-04 | 武汉铱科赛科技有限公司 | Circuit board with electromagnetic shielding structure and manufacturing method thereof |
-
2021
- 2021-11-15 CN CN202111344870.7A patent/CN114040565A/en active Pending
Patent Citations (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004140254A (en) * | 2002-10-18 | 2004-05-13 | Toray Ind Inc | Member for multilayer circuit board, and manufacturing method thereof |
| JP2005109101A (en) * | 2003-09-30 | 2005-04-21 | Nippon Mektron Ltd | Electromagnetic shield type flexible circuit board |
| CN1989650A (en) * | 2004-07-23 | 2007-06-27 | 日本电气株式会社 | Composite via structures and filters in multilayer printed circuit boards |
| EP1699275A2 (en) * | 2005-03-02 | 2006-09-06 | Samsung Electro-mechanics Co., Ltd | Printed circuit board with embedded capacitors therein and manufacturing process thereof |
| JP2009010266A (en) * | 2007-06-29 | 2009-01-15 | Meiko:Kk | Printed circuit board and method of manufacturing same |
| JP2007294996A (en) * | 2007-07-06 | 2007-11-08 | Tatsuta System Electronics Kk | Shielding film, shielding printed wiring board, shielding flexible printed circuit board, and method of manufacturing shielding film and shielding printed wiring board |
| US20090201654A1 (en) * | 2008-02-08 | 2009-08-13 | Lambert Simonovich | Method and system for improving electrical performance of vias for high data rate transmission |
| JP2009290193A (en) * | 2008-04-28 | 2009-12-10 | Cmk Corp | Rigid flexible multilayer printed wiring board and its production method |
| CN102281700A (en) * | 2010-06-10 | 2011-12-14 | 南亚电路板股份有限公司 | Electrical structure of multilayer printed circuit board and manufacturing method thereof |
| JP2015222776A (en) * | 2014-05-23 | 2015-12-10 | イビデン株式会社 | Printed wiring board, printed wiring board manufacturing method |
| CN104080279A (en) * | 2014-07-10 | 2014-10-01 | 广州杰赛科技股份有限公司 | Method for machining PCB through hole |
| CN105578704A (en) * | 2014-10-13 | 2016-05-11 | 富葵精密组件(深圳)有限公司 | Multilayer flexible circuit board and manufacturing method thereof |
| CN106332434A (en) * | 2015-06-24 | 2017-01-11 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN106470523A (en) * | 2015-08-19 | 2017-03-01 | 富葵精密组件(深圳)有限公司 | Flexible PCB and preparation method thereof |
| CN106488642A (en) * | 2015-08-27 | 2017-03-08 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and preparation method thereof |
| CN108093554A (en) * | 2016-11-21 | 2018-05-29 | 鹏鼎控股(深圳)股份有限公司 | High frequency signal transmission structure and preparation method thereof |
| US10117328B1 (en) * | 2016-11-21 | 2018-10-30 | Avary Holding (Shenzhen) Co., Limited. | Flexible circuit board and method for manufacturing same |
| CN106793577A (en) * | 2017-01-16 | 2017-05-31 | 生益电子股份有限公司 | The preparation method and PCB of a kind of High-Speed PCB |
| CN108966478A (en) * | 2017-05-17 | 2018-12-07 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and preparation method thereof |
| TW201907771A (en) * | 2017-05-17 | 2019-02-16 | 大陸商鵬鼎控股（深圳）股份有限公司 | Flexible circuit board and manufacturing method thereof |
| CN108966495A (en) * | 2017-05-18 | 2018-12-07 | 北大方正集团有限公司 | A kind of production method and circuit board of circuit board molding |
| US20190014667A1 (en) * | 2017-07-10 | 2019-01-10 | Sierra Circuits, Inc. | Semi-additive process for printed circuit boards |
| CN107835587A (en) * | 2017-09-11 | 2018-03-23 | 四川省华兴宇电子科技有限公司 | A kind of high-frequency microwave multilayer printed circuit blind slot and its manufacture craft |
| CN111491442A (en) * | 2020-04-30 | 2020-08-04 | 武汉铱科赛科技有限公司 | Circuit board with electromagnetic shielding structure and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 田文超等: "《电子封装结构设计》", vol. 1, 31 January 2017, 西安电子科技大学出版社, pages: 32 - 33 * |
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