CN108966495A - A kind of production method and circuit board of circuit board molding - Google Patents
A kind of production method and circuit board of circuit board molding Download PDFInfo
- Publication number
- CN108966495A CN108966495A CN201710351830.2A CN201710351830A CN108966495A CN 108966495 A CN108966495 A CN 108966495A CN 201710351830 A CN201710351830 A CN 201710351830A CN 108966495 A CN108966495 A CN 108966495A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- film
- production method
- molding
- computer program
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Abstract
The invention proposes a kind of production method of circuit board molding, circuit board, computer installation and computer readable storage medium, the production method of circuit board molding includes: that circuit board is sticked film；Circuit board is processed according to default gong knife using parameter；After processing is completed, film is torn for circuit board, and the present invention can be avoided peak burr and impact to the appearance of circuit board, is effectively prevented quality of circuit board defect, is reduced production cost, improves production efficiency.
Description
Technical field
The present invention relates to circuit board technology fields, in particular to the production method and circuit of a kind of circuit board molding
Plate.
Background technique
Printed circuit board is needed due to the requirement of electric property and heat resistance using to some extraordinary substrate such as polytetrafluoros
Ethylene composite base material, polytetrafluoroethylene (PTFE), English name Teflon, due to the cause of pronunciation, it is general be referred to as again Teflon,
Iron richness dragon, Teflon, teflon etc..
It individually or with the pressing of other FR4 materials is fabricated to print together using polytetrafluoroethylene (PTFE) composite base material as shown in Figure 1a
When circuit board processed, since the physical-mechanical properties of the material is softer, in circuit board PNL schematic top plan view Fig. 1 b, empty white area
Domain is to need to mill empty region using gong knife, in the production process of printed circuit board, the especially molding of mechanical external force processing
Workshop, under the running at high speed of gong knife, gong knife is when cutting polytetrafluoroethylene (PTFE) composite base material, as illustrated in figure 1 c in single circuit board
Edge be particularly easy to the defect for some peak burrs occur, the appearance of circuit board is impacted, hand finish, Yi Zao are needed
At scrapping or the complaint of client.
Summary of the invention
The present invention is directed to solve at least one of the technical problems existing in the prior art or related technologies.
For this purpose, an object of the present invention is to provide a kind of production methods of circuit board molding.
It is another object of the present invention to propose a kind of circuit board.
Another object of the present invention is to propose a kind of computer installation.
Yet another object of the invention is that proposing a kind of computer readable storage medium.
In view of this, a purpose according to the present invention, proposes a kind of production method of circuit board molding, comprising: will
Circuit board sticks film；Circuit board is processed according to default gong knife using parameter；After processing is completed, film is torn for circuit board
Fall.
Monolith circuit board is sticked one before using the processing of gong knife by the production method of circuit board molding provided by the invention
Layer carries out gong knife processing, gong knife tears film after processing, utilizes film with sticking film together with monolith circuit board
Viscosity removes peak burr, and peak burr is avoided to impact the appearance of circuit board, effectively prevents quality of circuit board defect,
Production cost is reduced, production efficiency is improved.
The production method of foregoing circuit sheet metal forming according to the present invention, can also have following technical characteristic:
In the above-mentioned technical solutions, it is preferable that the circuit board is sticked into the film, is specifically included:
Film is sticked by laminator and/or manually by the front and back of circuit board.
In the technical scheme, the two-sided of monolith circuit board is respectively sticked one layer with sticking film, guarantees circuit board
It is two-sided to remove peak burr, subsequent hand finish is avoided, it can be by laminator and/or manually by the double of circuit board
Film in face paste improves production efficiency.
In the above-mentioned technical solutions, it is preferable that the one side of film has viscose, and the another side of film is without viscose.
In the technical scheme, the one side of film has viscose, and film is had the one side of viscose without viscose by another side
It is attached on circuit board, since film can guarantee that film is firmly attached on circuit board with viscose, and when tearing film
Remove peak burr.
In the above-mentioned technical solutions, it is preferable that the thickness of film is less than 1.0 millimeters.
In the technical scheme, the thickness of film is less than 1.0 millimeters, i.e., thickness is just enough in 1.0 millimeters of films below
Peak burr can be removed when tearing, and avoided the thickness of film blocked up and influenced the precision that gong knife is processed.
In the above-mentioned technical solutions, it is preferable that film is the film with toughness.
In the technical scheme, film is the film with toughness, before carrying out the processing of gong knife to circuit board, this is thin
Film is attached to the two sides of circuit board, tears this film off after processing is completed, due to film have toughness thus can to avoid tear it is thin
Film breaks during film.
Another purpose according to the present invention, proposes a kind of circuit board, comprising: circuit board is by any of the above-described circuit
The circuit board of the production method production of sheet metal forming.
Circuit board provided by the invention, the circuit board made by the production method of circuit board molding, board edge is not
The phenomenon that will appear peak burr, does not need subsequent hand finish, avoids easily causing circuit board from scrapping or the complaint of client.
Foregoing circuit plate according to the present invention, can also have following technical characteristic:
In the above-mentioned technical solutions, it is preferable that circuit board is polytetrafluoroethylene (PTFE) composite base material printed circuit board, or is poly-
Tetrafluoroethene composite base material and FR4 material press printed circuit board.
In the technical scheme, circuit board is polytetrafluoroethylene (PTFE) composite base material printed circuit board or is that polytetrafluoroethylene (PTFE) is multiple
It closes substrate and FR4 material and presses printed circuit board, since the material is soft for the circuit board of above-mentioned material, add carrying out mechanical external force
The phenomenon that work easily occurs when forming, peak burr, can by the above-mentioned material circuit board that the application above method is processed
The phenomenon that avoiding the occurrence of peak burr.
Further object according to the present invention, proposes a kind of computer installation, including memory, processor and is stored in
On memory and the computer program that can run on a processor, processor realize any of the above-described when executing computer program
The step of production method of circuit board molding.
Computer installation provided by the invention, including memory, processor and storage are on a memory and can be in processor
The computer program of upper operation, processor is realized when executing computer program before using the processing of gong knife, and monolith circuit board is pasted
Upper one layer, with sticking film, carries out gong knife processing together with monolith circuit board, and gong knife tears film after processing, utilization is thin
The viscosity of film removes peak burr, avoids peak burr from impacting the appearance of circuit board, effectively prevents quality of circuit board
Defect reduces production cost, improves production efficiency.
Another purpose according to the present invention, proposes a kind of computer readable storage medium, is stored thereon with computer
Program, when computer program is executed by processor the step of the production method of the circuit board molding of realization any of the above-described.
Computer readable storage medium provided by the invention, is stored thereon with computer program, and computer program is processed
It is realized when device executes before using the processing of gong knife, monolith circuit board is sticked one layer with sticking film, with monolith circuit board
The processing of gong knife is carried out together, and gong knife tears film after processing, and removes peak burr using the viscosity of film, avoids peak hair
Thorn impacts the appearance of circuit board, effectively prevents quality of circuit board defect, reduces production cost, improves production effect
Rate.
Additional aspect and advantage of the invention will become obviously in following description section, or practice through the invention
Recognize.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 a shows board structure of circuit schematic diagrames in the prior art；
Fig. 1 b shows circuit board PNL schematic top plan view in the prior art；
Fig. 1 c shows the single circuit board schematic diagram after gong knife processing in the prior art；
Fig. 2 shows the flow diagrams of the production method of the circuit board molding of one embodiment of the present of invention；
Fig. 3 shows the flow diagram of the production method of the circuit board molding of another embodiment of the invention；
Fig. 4 shows the schematic block diagram of the computer installation of one embodiment of the present of invention；
Fig. 5 shows the two-sided pad pasting schematic diagram of circuit board of one embodiment of the present of invention；
Fig. 6 shows the circuit board gong knife machining sketch chart of one embodiment of the present of invention；
The circuit board that Fig. 7 shows one embodiment of the present of invention tears film schematic diagram.
Specific embodiment
To better understand the objects, features and advantages of the present invention, with reference to the accompanying drawing and specific real
Applying mode, the present invention is further described in detail.It should be noted that in the absence of conflict, the implementation of the application
Feature in example and embodiment can be combined with each other.
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, still, the present invention may be used also
To be implemented using other than the one described here other modes, therefore, protection scope of the present invention is not limited to following public affairs
The limitation for the specific embodiment opened.
The embodiment of first aspect present invention, the production method for proposing a kind of circuit board molding, Fig. 2 shows of the invention
The flow diagram of the production method of the circuit board molding of one embodiment.Wherein, which includes:
Step 202, circuit board is sticked into film；
Step 204, circuit board is processed according to default gong knife using parameter；
Step 206, after processing is completed, film is torn for circuit board.
Monolith circuit board is sticked one before using the processing of gong knife by the production method of circuit board molding provided by the invention
Layer carries out gong knife processing, gong knife tears film after processing, utilizes film with sticking film together with monolith circuit board
Viscosity removes peak burr, and peak burr is avoided to impact the appearance of circuit board, effectively prevents quality of circuit board defect,
Production cost is reduced, production efficiency is improved.
Fig. 3 shows the flow diagram of the production method of the circuit board molding of another embodiment of the invention.Wherein,
The production method includes:
Step 302, film is sticked into the front and back of circuit board by laminator and/or manually；
Step 304, circuit board is processed according to default gong knife using parameter；
Step 306, after processing is completed, film is torn for circuit board.
In one embodiment of the invention, it is preferable that film is sticked into the front and back of circuit board, it is specific to wrap
It includes: sticking film by laminator and/or manually by the front and back of circuit board.
In this embodiment, the two-sided of monolith circuit board is respectively sticked one layer with sticking film, guarantees that circuit board is double
Face can remove peak burr, avoid subsequent hand finish, can be by laminator and/or manually by the two-sided of circuit board
Film is sticked, production efficiency is improved.
In one embodiment of the invention, it is preferable that the one side of film has viscose, and the another side of film is without glutinous
Glue.
In this embodiment, the one side of film has viscose, and film is had a face paste of viscose without viscose by another side
Onto circuit board, since film can guarantee that film is firmly attached on circuit board with viscose, and gone when tearing film
Except peak burr.
In one embodiment of the invention, it is preferable that the thickness of film is less than 1.0 millimeters.
In this embodiment, the thickness of film is less than 1.0 millimeters, i.e., thickness is just sufficient in 1.0 millimeters of films below
It is enough that peak burr is removed when tearing, it avoids the thickness of film blocked up and influences the precision that gong knife is processed.
In one embodiment of the invention, it is preferable that film is the film with toughness.
In this embodiment, film is the film with toughness, before carrying out the processing of gong knife to circuit board, by this film
It is attached to the two sides of circuit board, tears this film off after processing is completed, since film has toughness so can be to avoid tearing film
During film breaks.
The embodiment of second aspect of the present invention proposes a kind of circuit board, comprising: circuit board is by any of the above-described circuit board
The circuit board of molding production method production.
Circuit board provided by the invention, the circuit board made by the production method of circuit board molding, board edge is not
The phenomenon that will appear peak burr, does not need subsequent hand finish, avoids easily causing circuit board from scrapping or the complaint of client.
In one embodiment of the invention, it is preferable that circuit board is polytetrafluoroethylene (PTFE) composite base material printed circuit board, or
Person is that polytetrafluoroethylene (PTFE) composite base material and FR4 material press printed circuit board.
In this embodiment, circuit board is polytetrafluoroethylene (PTFE) composite base material printed circuit board or is that polytetrafluoroethylene (PTFE) is compound
Substrate and FR4 material press printed circuit board, since the material is soft for the circuit board of above-mentioned material, are carrying out mechanical external force processing
Easily occur when molding, the phenomenon that peak burr, can be kept away by the above-mentioned material circuit board that the application above method is processed
Exempt from the phenomenon that peak burr occur.
The embodiment of third aspect present invention, proposes a kind of computer installation, and Fig. 4 shows an implementation of the invention
The schematic block diagram of the computer installation 400 of example.Wherein, which includes:
Memory 402, processor 404 and it is stored in the computer journey that can be run on memory 402 and on processor 404
The step of sequence, processor 404 realizes the production method of circuit board molding of any of the above-described when executing computer program.
Computer installation provided by the invention, including memory, processor and storage are on a memory and can be in processor
The computer program of upper operation, processor is realized when executing computer program before using the processing of gong knife, and monolith circuit board is pasted
Upper one layer, with sticking film, carries out gong knife processing together with monolith circuit board, and gong knife tears film after processing, utilization is thin
The viscosity of film removes peak burr, avoids peak burr from impacting the appearance of circuit board, effectively prevents quality of circuit board
Defect reduces production cost, improves production efficiency.
The embodiment of fourth aspect present invention proposes a kind of computer readable storage medium, is stored thereon with computer
Program, when computer program is executed by processor the step of the production method of the circuit board molding of realization any of the above-described.
Computer readable storage medium provided by the invention, is stored thereon with computer program, and computer program is processed
It is realized when device executes before using the processing of gong knife, monolith circuit board is sticked one layer with sticking film, with monolith circuit board
The processing of gong knife is carried out together, and gong knife tears film after processing, and removes peak burr using the viscosity of film, avoids peak hair
Thorn impacts the appearance of circuit board, effectively prevents quality of circuit board defect, reduces production cost, improves production effect
Rate.
In the prior art, contour machining procedure process: preceding process, gong knife processing and forming, downstream, due to polytetrafluoroethyl-ne
Alkene composite base material printed circuit board or pressed for polytetrafluoroethylene (PTFE) composite base material and FR4 material printed circuit board material spy
Property, inevitably there is the defects of circuit board edge peak burr, needs to spend a large amount of manpower and material resources to go in assembly room
These defects are repaired, high production cost and production efficiency are very low, and the present invention is by printing electricity to polytetrafluoroethylene (PTFE) composite base material
Road plate presses printed circuit board and sticks thin film for polytetrafluoroethylene (PTFE) composite base material and FR4 material, and gong knife is torn after having milled
To fall film, peak burr is removed using the viscosity of film, can effectively prevent the defect, overall cost will not increase, while
Production efficiency is accelerated, ensure that quality.Specific implementation process is as follows:
1. the type and specification of film are selected:
Film must be on one side with viscose, be to have certain toughness without viscose to guarantee tearing on one side
Easy fracture is not allowed in the process, and thickness is within 1.0 millimeters.
2. circuit board pad pasting:
As shown in figure 5, using the common laminator of circuit board plant man or artificial pad pasting, by circuit board it is two-sided all stick it is thin
Film.
3. gong knife processing and forming and tearing film:
As shown in fig. 6, after circuit board has pasted film, according to normal gong knife using parameter (consistent with when non-pad pasting) into
Row machining, as shown in fig. 7, tearing film after processing.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one reality of the invention
It applies in example or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or reality
Example.Moreover, description particular features, structures, materials, or characteristics can in any one or more of the embodiments or examples with
Suitable mode combines.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of production method of circuit board molding characterized by comprising
Circuit board is sticked into film；
The circuit board is processed according to default gong knife using parameter；
After processing is completed, the film is torn for the circuit board.
2. the production method of circuit board molding according to claim 1, which is characterized in that stick the circuit board described
Film specifically includes:
The film is sticked by laminator and/or manually by the front and back of the circuit board.
3. the production method of circuit board molding according to claim 1, which is characterized in that
The one side of the film has viscose, and the another side of the film is without viscose.
4. the production method of circuit board molding according to any one of claim 1 to 3, which is characterized in that
The thickness of the film is less than 1.0 millimeters.
5. the production method of circuit board molding according to any one of claim 1 to 3, which is characterized in that
The film is the film with toughness.
6. a kind of circuit board characterized by comprising
The circuit board is the circuit board that the production method of the circuit board molding as described in any one of claims 1 to 5 makes.
7. circuit board according to claim 6, which is characterized in that
The circuit board is polytetrafluoroethylene (PTFE) composite base material printed circuit board.
8. circuit board according to claim 6, which is characterized in that
The circuit board is that polytetrafluoroethylene (PTFE) composite base material and FR4 material press printed circuit board.
9. a kind of computer installation, including memory, processor and it is stored on the memory and can be on the processor
The computer program of operation, which is characterized in that the processor realizes such as claim 1 to 5 when executing the computer program
Any one of described in circuit board molding production method the step of.
10. a kind of computer readable storage medium, is stored thereon with computer program, which is characterized in that the computer program
The step of production method of the circuit board molding as described in any one of claims 1 to 5 is realized when being executed by processor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710351830.2A CN108966495A (en) | 2017-05-18 | 2017-05-18 | A kind of production method and circuit board of circuit board molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710351830.2A CN108966495A (en) | 2017-05-18 | 2017-05-18 | A kind of production method and circuit board of circuit board molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108966495A true CN108966495A (en) | 2018-12-07 |
Family
ID=64462736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710351830.2A Pending CN108966495A (en) | 2017-05-18 | 2017-05-18 | A kind of production method and circuit board of circuit board molding |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996517A (en) * | 2019-12-06 | 2020-04-10 | 深圳市兴森快捷电路科技股份有限公司 | Circuit board processing method |
| CN114040565A (en) * | 2021-11-15 | 2022-02-11 | 广东世运电路科技股份有限公司 | PCB processing method, PCB processing equipment and computer readable storage medium |
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| CN103763859A (en) * | 2014-01-18 | 2014-04-30 | 上海美维电子有限公司 | Machining method for printed circuit board |
| CN105050325A (en) * | 2015-07-03 | 2015-11-11 | 深圳市景旺电子股份有限公司 | Rigid-flex printed circuit board milling method |
| CN105392283A (en) * | 2015-10-16 | 2016-03-09 | 广州杰赛科技股份有限公司 | Process for realizing no carbon black on pattern in laser edge-milling |
| CN105407644A (en) * | 2015-12-25 | 2016-03-16 | 深圳市景旺电子股份有限公司 | Method for reducing burrs in milling process for rigid-flexible combined plate and rigid-flexible combined plate |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103763859A (en) * | 2014-01-18 | 2014-04-30 | 上海美维电子有限公司 | Machining method for printed circuit board |
| CN105050325A (en) * | 2015-07-03 | 2015-11-11 | 深圳市景旺电子股份有限公司 | Rigid-flex printed circuit board milling method |
| CN105392283A (en) * | 2015-10-16 | 2016-03-09 | 广州杰赛科技股份有限公司 | Process for realizing no carbon black on pattern in laser edge-milling |
| CN105407644A (en) * | 2015-12-25 | 2016-03-16 | 深圳市景旺电子股份有限公司 | Method for reducing burrs in milling process for rigid-flexible combined plate and rigid-flexible combined plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996517A (en) * | 2019-12-06 | 2020-04-10 | 深圳市兴森快捷电路科技股份有限公司 | Circuit board processing method |
| CN114040565A (en) * | 2021-11-15 | 2022-02-11 | 广东世运电路科技股份有限公司 | PCB processing method, PCB processing equipment and computer readable storage medium |
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