CN201491399U - Bottom backing board of printed circuit board (PCB) - Google Patents
Bottom backing board of printed circuit board (PCB) Download PDFInfo
- Publication number
- CN201491399U CN201491399U CN 200920205112 CN200920205112U CN201491399U CN 201491399 U CN201491399 U CN 201491399U CN 200920205112 CN200920205112 CN 200920205112 CN 200920205112 U CN200920205112 U CN 200920205112U CN 201491399 U CN201491399 U CN 201491399U
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- board
- printed circuit
- pcb
- interlayer
- layer
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Abstract
The utility model discloses a bottom backing board of a printed circuit board (PCB), which comprises a paper board layer, interlayers, a PCB layer and a backing board layer; the paper board layer is arranged in the first layer from the upper part to the lower part of the backing board, and the backing board layer is arranged in the bottommost layer; the PCB layer is arranged between the paper board layer and the backing board layer; the interlayers comprise an interlayer I and an interlayer II, wherein, the interlayer I is arranged between the paper board layer and the PCB layer, and the interlayer layer II is arranged between the PCB layer and the backing board layer. The bottom backing board of the PCB has the advantages of no burr on the edges of the PCB, high production efficiency, even board face, good elasticity, no delamination, no warpage after long-term storage, no deformation and low manufacturing cost.
Description
Technical field
The utility model relates to the printed-board technology field, relates in particular to a kind of printed circuit board (PCB) bottom backing plate.
Background technology
Burr is meant the surplus bits that the metalwork surface occurs, and burr is many more, illustrates that the quality of metalwork is low more.
Burr is one of steel surface defective, and there is uneven overlap the steel end that shows as cold cut, hot saw or flame cutting, and there is the excess metal of extruding the commissure during welded tube.The thickness of cold cut product end burr depends on the slit between blade.The burr that common product allows certain altitude exists; But the inside and outside burr of welded tube must strike off.
The reason that burr produces comprises:
One, shearing knife edge rust, excesssive gap; Saw blade is blunt, or install improper.
Two, drift wearing and tearing or install improper.
Three, the flame cutting operation is improper.
Four, welding system is lack of standardization.
When printed circuit board (PCB) (PCB) is holed, in order to protect drilling platform and to guarantee drilling quality, the essential bottom backing plate that uses.
Existingly when being shaped processing printed circuit board, can produce burr at the printed circuit board (PCB) edges of boards as ARLON, TACONIC plate machine gong, must adopt blade to come the burr that the printed circuit board (PCB) edges of boards are produced is cleared up by manpower before follow-up operation, efficient be extremely low.
The utility model content
The technical problems to be solved in the utility model provides a kind of printed circuit board (PCB) bottom backing plate.
The purpose of this utility model is to provide a kind of printed circuit board (PCB) bottom backing plate, comprising: ply of board, interlayer, printed circuit pcb board layer, raft;
Described ply of board is a ground floor from top to down;
Described raft is the bottom from top to down;
Described printed circuit pcb board layer is between ply of board and raft;
Described interlayer comprises interlayer one and interlayer two; Interlayer one is between ply of board and printed circuit pcb board layer, and interlayer two is between printed circuit pcb board layer and raft.
Described ply of board is the ground paper flaggy.
Described raft is the phenolic aldehyde raft.
Described interlayer one is the blank sheet of paper layer.
Described interlayer two is blank sheet of paper layers.
Described interlayer one is a dipping gummed paper layer.
Described interlayer two is dipping gummed paper layers.
Upper and lower surface at described printed circuit pcb board is provided with interlayer one and interlayer two respectively, through the hot pressing composite molding.
Described printed circuit pcb board is a vegetable fibre board, and described printed circuit pcb board will carry out sand milling before Compound Machining, and size is on request cut then, organizes plate after interlayer one and interlayer two being cut by the size of printed circuit pcb board again.
The program of described group of plate is to place interlayer two on raft earlier, interlayer two has facing down of remover, accordingly the printed circuit pcb board is placed on the interlayer two then, again interlayer one is had remover towards on be placed on the printed circuit pcb board, putting ply of board on interlayer one, to carry out many plates compound, and the plate that group is good is sent into and carried out hot forming in the hot press.
The utility model printed circuit board (PCB) bottom backing plate is used ply of board, interlayer, printed circuit pcb board layer, raft; Wherein, ply of board is the ground floor of the utility model printed circuit board (PCB) bottom backing plate; Wherein, raft is the bottom of the utility model printed circuit board (PCB) bottom backing plate; Wherein, interlayer comprises interlayer one and interlayer two; Wherein, printed circuit pcb board layer is between ply of board and raft; Wherein, interlayer one is between ply of board and printed circuit pcb board layer; Wherein, interlayer two is between printed circuit pcb board layer and raft; Wherein, ply of board is the ground paper flaggy; Wherein, raft is the phenolic aldehyde raft; Wherein, interlayer one is a ply of paper, can be the blank sheet of paper layer, also can be dipping gummed paper layer; Wherein, interlayer two is ply of papers, can be the blank sheet of paper layer, also can be dipping gummed paper layer; The utility model printed circuit board (PCB) bottom backing plate can not produce at the printed circuit board (PCB) edges of boards that burr, production efficiency height, plate face are smooth, good springiness, do not peel off, long-term storage warpage, indeformable not, low production cost.
Description of drawings
Fig. 1 is the front view of the utility model printed circuit board (PCB) bottom backing plate;
Fig. 2 is the structural representation of the utility model printed circuit board (PCB) bottom backing plate.
Embodiment
The utility model provides a kind of printed circuit board (PCB) bottom backing plate, is applied to the printed-board technology field, and this printed circuit board (PCB) bottom backing plate comprises: ply of board, interlayer, printed circuit pcb board layer, raft; Wherein, ply of board is the ground floor of the utility model printed circuit board (PCB) bottom backing plate; Wherein, raft is the bottom of the utility model printed circuit board (PCB) bottom backing plate; Wherein, interlayer comprises interlayer one and interlayer two; Wherein, printed circuit pcb board layer is between ply of board and raft; Wherein, interlayer one is between ply of board and printed circuit pcb board layer; Wherein, interlayer two is between printed circuit pcb board layer and raft; Wherein, ply of board is the ground paper flaggy; Wherein, raft is the phenolic aldehyde raft; Wherein, interlayer one is a ply of paper, can be the blank sheet of paper layer, also can be dipping gummed paper layer; Wherein, interlayer two is ply of papers, can be the blank sheet of paper layer, also can be dipping gummed paper layer; The utility model printed circuit board (PCB) bottom backing plate can not produce at the printed circuit board (PCB) edges of boards that burr, production efficiency height, plate face are smooth, good springiness, do not peel off, long-term storage warpage, indeformable not, low production cost.
In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
See also Fig. 1 and Fig. 2, Fig. 1 is the front view of the utility model printed circuit board (PCB) bottom backing plate, Fig. 2 is the structural representation of the utility model printed circuit board (PCB) bottom backing plate, and this printed circuit board (PCB) bottom backing plate comprises: ply of board, interlayer, printed circuit pcb board layer, raft.
Wherein, ply of board is the ground floor of the utility model printed circuit board (PCB) bottom backing plate.
Wherein, raft is the bottom of the utility model printed circuit board (PCB) bottom backing plate.
Wherein, interlayer comprises interlayer one and interlayer two.
Wherein, printed circuit pcb board layer is between ply of board and raft.
Wherein, interlayer one is between ply of board and printed circuit pcb board layer.
Wherein, interlayer two is between printed circuit pcb board layer and raft.
Wherein, ply of board is the ground paper flaggy.
Wherein, raft is the phenolic aldehyde raft.
Wherein, interlayer one is a ply of paper, can be the blank sheet of paper layer, also can be dipping gummed paper layer.
Wherein, interlayer two is ply of papers, can be the blank sheet of paper layer, also can be dipping gummed paper layer.
Below in conjunction with the example of the utility model printed circuit board (PCB) bottom pad, printed circuit board (PCB) bottom pad of the present utility model is described in detail, wherein interlayer one is dipping gummed paper layer one in this example, interlayer two is dipping gummed paper layer two.
A kind of printed circuit board (PCB) bottom backing plate, the upper and lower surface at the printed circuit pcb board is provided with dipping gummed paper layer one and dipping gummed paper layer two respectively in the specific implementation, through the hot pressing composite molding.The printed circuit pcb board is to adopt vegetable fibre board, preferably adopt medium density fibre board (MDF), the printed circuit pcb board will carry out sand milling before Compound Machining, even to guarantee monolith substrate thickness, size is on request cut then, will flood to organize plate after gummed paper layer one and dipping gummed paper layer two are cut by the size of printed circuit pcb board again.The program of group plate is to place dipping gummed paper layer two on raft earlier, dipping gummed paper layer two has facing down of remover, accordingly the printed circuit pcb board is placed on then on the dipping gummed paper layer two, to flood again gummed paper layer one have remover towards on be placed on the printed circuit pcb board, putting ply of board on dipping gummed paper layer one, to carry out many plates compound.The plate that group is good is sent into and is carried out hot forming in the hot press.The utility model printed circuit board (PCB) bottom backing plate can not produce at the printed circuit board (PCB) edges of boards that burr, production efficiency height, plate face are smooth, good springiness, do not peel off, long-term storage warpage, indeformable not, low production cost.
For printed circuit board (PCB) bottom backing plate of the present utility model, the form of realization is diversified.All within spirit of the present utility model and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within the protection range of the present utility model.
Claims (10)
1. a printed circuit board (PCB) bottom backing plate is characterized in that, comprising:
Ply of board, interlayer, printed circuit pcb board layer, raft;
Described ply of board is a ground floor from top to down;
Described raft is the bottom from top to down;
Described printed circuit pcb board layer is between ply of board and raft;
Described interlayer comprises interlayer one and interlayer two; Interlayer one is between ply of board and printed circuit pcb board layer, and interlayer two is between printed circuit pcb board layer and raft.
2. printed circuit board (PCB) bottom backing plate as claimed in claim 1 is characterized in that described ply of board is the ground paper flaggy.
3. printed circuit board (PCB) bottom backing plate as claimed in claim 1 is characterized in that described raft is the phenolic aldehyde raft.
4. printed circuit board (PCB) bottom backing plate as claimed in claim 1 is characterized in that described interlayer one is the blank sheet of paper layer.
5. printed circuit board (PCB) bottom backing plate as claimed in claim 1 is characterized in that described interlayer two is blank sheet of paper layers.
6. printed circuit board (PCB) bottom backing plate as claimed in claim 1 is characterized in that, described interlayer one is a dipping gummed paper layer.
7. printed circuit board (PCB) bottom backing plate as claimed in claim 1 is characterized in that, described interlayer two is dipping gummed paper layers.
8. printed circuit board (PCB) bottom backing plate as claimed in claim 1 is characterized in that, at the upper and lower surface of described printed circuit pcb board interlayer one and interlayer two is set respectively, through the hot pressing composite molding.
9. printed circuit board (PCB) bottom backing plate as claimed in claim 8, it is characterized in that, described printed circuit pcb board is a vegetable fibre board, described printed circuit pcb board will carry out sand milling before Compound Machining, size is on request cut then, organizes plate after interlayer one and interlayer two being cut by the size of printed circuit pcb board again.
10. printed circuit board (PCB) bottom backing plate as claimed in claim 9, it is characterized in that, the program of described group of plate is to place interlayer two on raft earlier, interlayer two has facing down of remover, accordingly the printed circuit pcb board is placed on the interlayer two then, again interlayer one is had remover towards on be placed on the printed circuit pcb board, putting ply of board on interlayer one, to carry out many plates compound, the plate that group is good is sent into and is carried out hot forming in the hot press.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920205112 CN201491399U (en) | 2009-09-16 | 2009-09-16 | Bottom backing board of printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920205112 CN201491399U (en) | 2009-09-16 | 2009-09-16 | Bottom backing board of printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201491399U true CN201491399U (en) | 2010-05-26 |
Family
ID=42430261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920205112 Expired - Fee Related CN201491399U (en) | 2009-09-16 | 2009-09-16 | Bottom backing board of printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201491399U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102248202A (en) * | 2011-04-27 | 2011-11-23 | 金安国纪科技股份有限公司 | Cover board or backing board for drilling printed circuit board, and processing method thereof |
| CN102781173A (en) * | 2012-07-24 | 2012-11-14 | 景旺电子（深圳）有限公司 | Method for machining and molding printed circuit board (PCB) made of polytetrafluoroethylene (PTFE) material |
| CN103240452A (en) * | 2013-05-21 | 2013-08-14 | 无锡江南计算技术研究所 | Polytetrafluoroethylene (PTFE) plate milling and cutting method |
| CN103428999A (en) * | 2012-05-25 | 2013-12-04 | 北大方正集团有限公司 | PCB board moulding processing method and laminated plate |
| CN103465663A (en) * | 2013-09-05 | 2013-12-25 | 常州市双进电子有限公司 | Circuit board double-face character printing technology and printing structure thereof |
| CN107696647A (en) * | 2017-09-18 | 2018-02-16 | 乐凯特科技铜陵有限公司 | A kind of boring backing plates of pcb and preparation method thereof |
| CN110996517A (en) * | 2019-12-06 | 2020-04-10 | 深圳市兴森快捷电路科技股份有限公司 | Circuit board processing method |
-
2009
- 2009-09-16 CN CN 200920205112 patent/CN201491399U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102248202A (en) * | 2011-04-27 | 2011-11-23 | 金安国纪科技股份有限公司 | Cover board or backing board for drilling printed circuit board, and processing method thereof |
| CN103428999A (en) * | 2012-05-25 | 2013-12-04 | 北大方正集团有限公司 | PCB board moulding processing method and laminated plate |
| CN103428999B (en) * | 2012-05-25 | 2016-03-23 | 北大方正集团有限公司 | A kind of pcb board method for processing forming and superimposed sheet |
| CN102781173A (en) * | 2012-07-24 | 2012-11-14 | 景旺电子（深圳）有限公司 | Method for machining and molding printed circuit board (PCB) made of polytetrafluoroethylene (PTFE) material |
| CN103240452A (en) * | 2013-05-21 | 2013-08-14 | 无锡江南计算技术研究所 | Polytetrafluoroethylene (PTFE) plate milling and cutting method |
| CN103240452B (en) * | 2013-05-21 | 2015-10-07 | 无锡江南计算技术研究所 | A kind of PTFE sheet material milling method |
| CN103465663A (en) * | 2013-09-05 | 2013-12-25 | 常州市双进电子有限公司 | Circuit board double-face character printing technology and printing structure thereof |
| CN107696647A (en) * | 2017-09-18 | 2018-02-16 | 乐凯特科技铜陵有限公司 | A kind of boring backing plates of pcb and preparation method thereof |
| CN107696647B (en) * | 2017-09-18 | 2019-08-16 | 乐凯特科技铜陵有限公司 | A kind of boring backing plate of pcb and preparation method thereof |
| CN110996517A (en) * | 2019-12-06 | 2020-04-10 | 深圳市兴森快捷电路科技股份有限公司 | Circuit board processing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100526 Termination date: 20140916 |
|
| EXPY | Termination of patent right or utility model |