CN105517360B - A method of improving copper-based copper-clad laminate and drills copper-based bottom peak - Google Patents
A method of improving copper-based copper-clad laminate and drills copper-based bottom peak Download PDFInfo
- Publication number
- CN105517360B CN105517360B CN201510963470.2A CN201510963470A CN105517360B CN 105517360 B CN105517360 B CN 105517360B CN 201510963470 A CN201510963470 A CN 201510963470A CN 105517360 B CN105517360 B CN 105517360B
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- China
- Prior art keywords
- copper
- clad laminate
- aluminium sheet
- paper
- laminate
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Improving copper-based copper-clad laminate the present invention relates to a kind of and drill the method for copper-based bottom peak, including：(1) light aluminium sheet, paper cap plate and Paper baseplate are made as required；(2) light aluminium sheet, paper cap plate, Paper baseplate and copper-based copper-clad laminate is stacked together, lamination order is followed successively by from top to bottom, paper cap plate+copper-based copper-clad laminate+light aluminium sheet+Paper baseplate；(3) the brill nozzle for being 110 ° with a cutting-tool angle drills as required to above-mentioned four laminate bodies stacked together；(4) after drilling, four laminate bodies stacked together are separated, and is polished the surface of copper-based copper-clad laminate using nonwoven fabric.It uses cutting-tool angle to bore nozzle and pad light aluminium sheet operation for 110 °, can be effectively improved copper-based copper-clad laminate drill copper-based bottom peak the problem of, and light aluminium sheet be finished after can recycle, bore nozzle and only change angle, do not increase Material Cost, not only improved production efficiency but also saves cost.
Description
Technical field
The invention belongs to printed wiring board manufacture technology fields, and in particular to a kind of to improve the (letter of copper-based copper-clad laminate
Claim copper base) method of the copper-based bottom peak of drilling.
Background technology
With the fast development of current electronics industry, the competition in industry is more and more fierce, most of high-end customer all to
High-power plate development, and copper base generally all can be as the preferred material of high-power plate, because copper base has, density is high, base
The characteristics of plate itself thermal bearing capacity is strong, heat dissipation, good heat conduction effect.But copper base can lead to copper-based bottom in drilling process
There is peak in portion, and peak must use abrasive band that could grind totally, and peak is easily rolled into hole after nog plate, is difficult to clean up, time-consuming
Arduously.To solve the problems, such as that drilling peak generally can all select diamond coating to bore nozzle processing in industry, to reduce peak, but Buddha's warrior attendant
Stone coating brill nozzle cost is high, for common bore nozzle 6-7 times.
Invention content
Deficiency for the above-mentioned prior art, the present invention, which provides one kind, can be effectively improved copper-based copper-clad laminate drilling copper
The method of basal part peak.
The purpose of the present invention is achieved by the following technical programs：
A method of improving copper-based copper-clad laminate and drills copper-based bottom peak, including：(1) light aluminium is made as required
Plate, paper cap plate and Paper baseplate；(2) light aluminium sheet, paper cap plate, Paper baseplate and copper-based copper-clad laminate is stacked together, stacking
Sequence is followed successively by from top to bottom, paper cap plate+copper-based copper-clad laminate+light aluminium sheet+Paper baseplate；(3) it is with a cutting-tool angle
110 ° of brill nozzle drills as required to above-mentioned four laminate bodies stacked together；It (4), will be stacked together after drilling
Four laminate bodies separate, and polished the surface of copper-based copper-clad laminate using nonwoven fabric.
Further, before drilling to four laminate bodies, drilling machine Z axis depth 0.5mm is raised.
Further, the thickness of the smooth aluminium sheet is 0.6mm.
Further, travelling speed of the nonwoven fabric when the surface to copper-based copper-clad laminate is polished is
3500mm/s, pressure 2.8-3.2kg/cm2。
Further, the brill nozzle selection uses common wolfram steel material.
Compared with prior art, beneficial effects of the present invention are：The present invention uses cutting-tool angle to bore nozzle and pad light for 110 °
Aluminium sheet operation, can be effectively improved copper-based copper-clad laminate drill copper-based bottom peak the problem of, and light aluminium sheet be finished after can
With recycling, bores nozzle and only change angle (former angle is 135 ° and 165 °), do not increase Material Cost, both improve production efficiency
Cost has been saved again.
Description of the drawings
Fig. 1 is copper base drilling laminate structure schematic diagram in the present invention.
Specific implementation mode
Invention is further described in detail for the embodiment provided below in conjunction with the accompanying drawings.
A kind of method of copper-based bottom peak as shown in Figure 1, copper-based copper-clad laminate of improvement drills, including：(1) by wanting
It asks and makes light aluminium sheet, paper cap plate and Paper baseplate；(2) by 4 layers of light aluminium sheet 1, paper cap plate 2, Paper baseplate 3 and copper-based copper-clad laminate
It stacks, lamination order is followed successively by from top to bottom, the copper-based copper-clad laminate 4+ light aluminium sheet 1+ Paper baseplates of paper cap plate 2+ 3；(3)
The brill nozzle for being 110 ° with a cutting-tool angle drills as required to above-mentioned four laminate bodies stacked together；(4) drilling finishes
Afterwards, four laminate bodies stacked together are separated, and is polished the surface of copper-based copper-clad laminate 4 using nonwoven fabric.
Preferably, before drilling to four laminate bodies, drilling machine Z axis depth 0.5mm can be raised, prevents from burning plate.
Preferably, the thickness of the smooth aluminium sheet 1 is 0.6mm, and the nonwoven fabric is on the surface to copper-based copper-clad laminate 4
Travelling speed when being polished is 3500mm/s, pressure 2.8-3.2kg/cm2.The brill nozzle selection uses common wolfram steel material
Matter.
As described above, only presently preferred embodiments of the present invention, when cannot be limited the scope of implementation of the present invention with this,
All still belong to this hair according to simple equivalent changes and modifications made by scope of the present invention patent and invention description content generally
In the range of bright patent covers.
Claims (5)
- A kind of method of copper-based bottom peak 1. copper-based copper-clad laminate of improvement drills, it is characterised in that including：(1) as required Make light aluminium sheet, paper cap plate and Paper baseplate；(2) light aluminium sheet, paper cap plate, Paper baseplate and copper-based copper-clad laminate are layered in one It rises, lamination order is followed successively by from top to bottom, paper cap plate+copper-based copper-clad laminate+light aluminium sheet+Paper baseplate；(3) with a tool angle Degree drills as required to above-mentioned four laminate bodies stacked together for 110 ° of brill nozzle；(4) it after drilling, will be layered in Four laminate bodies together separate, and are polished the surface of copper-based copper-clad laminate using nonwoven fabric.
- 2. a kind of according to claim 1 improve copper-based copper-clad laminate and drill the method for copper-based bottom peak, feature It is：Before drilling to four laminate bodies, drilling machine Z axis depth 0.5mm is raised.
- 3. a kind of according to claim 1 improve copper-based copper-clad laminate and drill the method for copper-based bottom peak, feature It is：The thickness of the smooth aluminium sheet is 0.6mm.
- 4. a kind of according to claim 1 improve copper-based copper-clad laminate and drill the method for copper-based bottom peak, feature It is：Travelling speed of the nonwoven fabric when the surface to copper-based copper-clad laminate is polished is 3500mm/s, pressure For 2.8-3.2kg/cm2。
- 5. a kind of according to claim 1 improve copper-based copper-clad laminate and drill the method for copper-based bottom peak, feature It is：The brill nozzle selection uses common wolfram steel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510963470.2A CN105517360B (en) | 2015-12-18 | 2015-12-18 | A method of improving copper-based copper-clad laminate and drills copper-based bottom peak |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510963470.2A CN105517360B (en) | 2015-12-18 | 2015-12-18 | A method of improving copper-based copper-clad laminate and drills copper-based bottom peak |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105517360A CN105517360A (en) | 2016-04-20 |
| CN105517360B true CN105517360B (en) | 2018-08-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510963470.2A Active CN105517360B (en) | 2015-12-18 | 2015-12-18 | A method of improving copper-based copper-clad laminate and drills copper-based bottom peak |
Country Status (1)
| Country | Link |
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| CN (1) | CN105517360B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413857B (en) * | 2018-11-09 | 2021-07-06 | 博罗康佳精密科技有限公司 | Manufacturing process of high-frequency high-speed plate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102143656A (en) * | 2011-03-16 | 2011-08-03 | 蔡新民 | Manufacturing method of circuit board made of high-dielectric composite material |
| CN104640378A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Manufacturing method for improving holing yield of high-frequency circuit board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5112934B2 (en) * | 2008-04-10 | 2013-01-09 | 昭和電工パッケージング株式会社 | Drilling plate and drilling method |
| CN202162412U (en) * | 2011-04-27 | 2012-03-14 | 金安国纪科技股份有限公司 | Cover plate or bearing plate used in drilling printed circuit board |
| US9826643B2 (en) * | 2012-03-21 | 2017-11-21 | Mitsubishi Gas Chemical Company, Inc. | Entry sheet for drilling and drilling method |
| CN104149125B (en) * | 2013-05-14 | 2015-12-23 | 大族激光科技产业集团股份有限公司 | A kind of detection method of PCB mechanical drilling machine borehole accuracy |
-
2015
- 2015-12-18 CN CN201510963470.2A patent/CN105517360B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102143656A (en) * | 2011-03-16 | 2011-08-03 | 蔡新民 | Manufacturing method of circuit board made of high-dielectric composite material |
| CN104640378A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Manufacturing method for improving holing yield of high-frequency circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105517360A (en) | 2016-04-20 |
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