CN201940675U - Precisely controlled depth processing device for ordinary milling machine - Google Patents
Precisely controlled depth processing device for ordinary milling machine Download PDFInfo
- Publication number
- CN201940675U CN201940675U CN2011200285027U CN201120028502U CN201940675U CN 201940675 U CN201940675 U CN 201940675U CN 2011200285027 U CN2011200285027 U CN 2011200285027U CN 201120028502 U CN201120028502 U CN 201120028502U CN 201940675 U CN201940675 U CN 201940675U
- Authority
- CN
- China
- Prior art keywords
- plate
- milling machine
- cover plate
- milling
- thick cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
The utility model belongs to the technical field of print circuit production, and relates to a precisely controlled depth processing device for ordinary milling machine, which comprises a Bakelite plate fixed on the machine desk of the milling machine, wherein the upper side of said Bakelite plate has a sunken platform for accommodating plate materials ready for milling. A thick cover plate is placed on the plate material ready for milling and a presser foot of the milling machine is arranged on the thick cover plate so that the thick cover plate is tightly pressed. The pressure can be adjusted by adjusting the height of the presser foot. The utility model has a broad range of application, is free from the influence of the structure and shape of the plate material, avoids the complicated compression process and V-cut, and therefore is easy to be put into practice. No expensive milling machine with blind milling function is needed. The tolerance of depth processing is as precise as no more than 241 0.1mm, which can meet the needs of the present customers. The utility model has low processing cost and high cost-efficiency.
Description
Technical field
The utility model belongs to printed circuit board and makes the field, relates to a kind of plain-milling machine and accurately controls deep processing equipment.
Background technology
Continuous promotion along with information-based industry, the speed of digital data transmission is more and more faster, frequency is more and more higher, and the utilization of device is put in high-power confession, for integrality transmission that guarantees signal and the purpose that reaches the exposed interfering signal of minimizing components and parts, the manufacturing enterprise of some technological precedences more and more payes attention to the installation site of components and parts and location mode design, and blind groove (containing step trough) is wherein a kind of important mode, blind groove can be used for depositing the redundance of some device, such as power tube.On the one hand along with miniaturization of electronic products, lightweight and multifunction development, rigid-flex combined board is used widely with its unique interconnection characteristic in addition.In the manufacturing process to the destruction of flex section; rigid-flex combined board generally need use rigid plate that flex section is protected in internal layer; by controlling dark milling machine the rigid plate of flexible section is milled certain depth when being fabricated into sharp processing Deng rigid-flex combined board; manual then breaking into two with one's hands finally exposed flexible section.
Blind groove make and rigid-flex combined board open half groove, the dark ability of the control of milling machine is proposed higher requirement, the method for controlling at the degree of depth has two kinds at present:
First method adopts the non-mode of milling to control groove depth, makes blind groove, V groove cutting (V-Cut) mode half groove of opening to rigid-flex combined board as the pressing mode; The method is subjected to the restriction of sheet metal thickness, endothecium structure and lamination requirement, the blind groove of pressing mode system only is applicable to single sided board and dual platen making, can not be used for the blind groove of multi-layer sheet and make, and every (upper and lower surface) generally can only a kind of degree of depth of pressing blind groove (this is obstructed?); The V-Cut mode is to the half groove method of opening of rigid-flex combined board, if slotting position and circuit on same horizontal line, will injure circuit, and fluting too much, the V-Cut lifts can't be operated, and therefore can not be used for slotting position and the plate of circuit on same horizontal line.
Second method adopts with the blind milling machine that mills function and makes; The method mainly is the lifting means function, but this type of is relatively more expensive with the blind milling machine that mills function, and limited production and the manufacturer that lacks of capital use in being not suitable for, and the groove depth kind and the sheet construction of its making are more single.
Summary of the invention
The purpose of this utility model is to overcome the defective of prior art, and a kind of accurate control flume deep processing device is provided, and can carry out accurate control flume deep processing using under the condition of plain-milling machine, make depth tolerances≤± 0.1mm.
The utility model is achieved through the following technical solutions above-mentioned purpose:
A kind of plain-milling machine is accurately controlled the deep processing device, comprise the bakelite plate 1 that is fixed in the milling machine board, it is characterized in that the one side that described bakelite plate 1 makes progress has one to recessed platform, to its cup depth of recessed platform is 0.5mm～1.5mm, be used for placing and wait to mill plate 3, wait to mill and place thick cover plate 2 on the plate 3, milling machine presser feet 4 is positioned at the top of thick cover plate 2, thick cover plate 2 is compressed, regulate pressure by the height of adjusting milling machine presser feet 4.The shape of cover plate 2 is with to wait to mill plate 3 consistent; Thickness is not less than 1.5mm; Preferred highdensity papery force fit plate.
The manufacturing process of this device is easy, and its manufacturing process and using method are as shown in Figure 1, and be specific as follows:
1, step 1 mills out a platform at bakelite plate (phenolic resins plate), promptly mills out a smooth platform at the bakelite plate that is fixed in the milling machine board (generally being the phenolic resins plate), shown in the bakelite plate among Fig. 11.Reduce the uneven harmful effect that control brings to the degree of depth of board and backing plate like this, reached the smooth purpose of surfacing.
2, step 2 is used thick cover plate of groove milling documenting, promptly uses the groove milling documenting to go out one and has the thick cover plate that has identical shaped groove with plate to be milled, shown in thick cover plate 2 among Fig. 1.This thick cover plate need keep surfacing smooth, and enough rigidity are arranged, and thickness is not less than 1.5mm, generally selects highdensity papery force fit plate.
3, step 3 is fixed in plate (among Fig. 1 3) on the step 1 platform, is about to plate and is positioned on the platform, guarantees the flatness of lower surface, is filling up the thick cover plate of step 2 on the plate again, further makes the plate upper surface smooth and prevent to wipe the card face.
4, step 4 is adjusted milling machine presser feet (among Fig. 1 4) pressure plate is compressed, and adjusts and highly produces, and promptly adjusts the foot pressure of milling machine, and it is reached more than the 0.1MPa, and the plate upper surface is flattened, and prevents that plate face local location warpage from seriously causing accuracy error too big.
Make platform and thick cover plate making seal face by bakelite plate, compress thick cover plate by presser feet again, reduce the influence that board and plate face undesirable condition bring to greatest extent, make milling machine Z axle depth tolerances be controlled at ± 0.1mm within, realized under the plain-milling machine condition, by making the plate upper and lower surface reach best flatness, reduce the influence that board and plate face undesirable condition bring to greatest extent.
The utility model scheme is: make the groove platform on the bakelite plate, thick cover plate is made seal face.The effect of its further groove platform is for waiting to mill the burnishing surface that the plate lower surface provides a rigidity, avoiding the uneven deviation that causes of board and lower surface to greatest extent; The effect of thick cover plate is for waiting to mill the seal face that the plate upper surface provides a rigidity, the influence that maximum minimizing limit plate face undesirable condition (as warpage) brings.Compress by presser feet again, make platform, wait to mill plate and thick cover plate closely cooperates, thereby improve degree of depth control accuracy.
The beneficial effects of the utility model are as follows: with to adopt the non-mode of milling to compare the scope of application extensive, be not subjected to the influence of sheet construction and shape, avoided complicated pressing process and V-Cut lifts process, implement easily; Compare with the blind milling machine production method that mills function with employing, do not need to buy the expensive blind function milling machine that mills of being with, the accurate control deep processing tolerance of its realization≤± 0.1mm, can satisfy existing client's tolerance, the utility model processing cost is low, the cost performance height.
Description of drawings
Fig. 1 is that milling machine of the present utility model is accurately controlled the deep processing device;
Fig. 2 is a processing schematic diagram of the present utility model.
The specific embodiment
Further explain the utility model below in conjunction with embodiment, but embodiment does not do any type of qualification to the utility model.
On the bakelite plate that is fixed in the milling machine board (phenolic resins plate), mill out a length and width, be respectively the platform of the rectangle of 350mm, 200mm, 1.0mm deeply to lower recess, make platform surface smooth, on platform, place and wait to mill plate 3, cover thick cover plate 2 again, thick cover plate 2 is highdensity papery force fit plate, and thickness is 2.0mm, and milling machine presser feet 4 compresses thick cover plate 2, the pressure of regulating milling machine presser feet 4 is 0.2MPa, will wait to mill plate 3 upper surfaces and flatten.By above embodiment, the groove depth tolerance of plate 3 can be controlled at ± 0.1mm in, process capability C
PkReach 1.32.
Claims (5)
1. a plain-milling machine is accurately controlled the deep processing device, comprise the bakelite plate (1) that is fixed in the milling machine board, it is characterized in that the one side that described bakelite plate (1) makes progress has one to recessed platform, be used for placing plate to be milled (3), plate to be milled (3) is gone up and is placed thick cover plate (2), milling machine presser feet (4) is positioned at the top of thick cover plate (2), and thick cover plate (2) is compressed, and regulates pressure by the height of adjusting milling machine presser feet (4).
2. device as claimed in claim 1 is characterized in that the shape of described cover plate (2) is consistent with plate to be milled (3).
3. device as claimed in claim 1 is characterized in that described cover plate (2) thickness is not less than 1.5mm.
4. device as claimed in claim 3 is characterized in that described cover plate (2) is highdensity papery force fit plate.
5. device as claimed in claim 1 is characterized in that described is 0.5mm～1.5mm to its cup depth of recessed platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200285027U CN201940675U (en) | 2011-01-27 | 2011-01-27 | Precisely controlled depth processing device for ordinary milling machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200285027U CN201940675U (en) | 2011-01-27 | 2011-01-27 | Precisely controlled depth processing device for ordinary milling machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201940675U true CN201940675U (en) | 2011-08-24 |
Family
ID=44468026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200285027U Expired - Lifetime CN201940675U (en) | 2011-01-27 | 2011-01-27 | Precisely controlled depth processing device for ordinary milling machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201940675U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103561543A (en) * | 2013-11-13 | 2014-02-05 | 惠州中京电子科技股份有限公司 | PCB countersunk groove processing method |
| CN104625181A (en) * | 2014-12-31 | 2015-05-20 | 广州兴森快捷电路科技有限公司 | PCB milling device and PCB milling method |
| CN105269055A (en) * | 2015-10-22 | 2016-01-27 | 胜宏科技（惠州）股份有限公司 | Depth control milling structure for circuit board and depth control milling method |
| CN112770498A (en) * | 2019-11-05 | 2021-05-07 | 深南电路股份有限公司 | Circuit board processing method |
-
2011
- 2011-01-27 CN CN2011200285027U patent/CN201940675U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103561543A (en) * | 2013-11-13 | 2014-02-05 | 惠州中京电子科技股份有限公司 | PCB countersunk groove processing method |
| CN104625181A (en) * | 2014-12-31 | 2015-05-20 | 广州兴森快捷电路科技有限公司 | PCB milling device and PCB milling method |
| CN105269055A (en) * | 2015-10-22 | 2016-01-27 | 胜宏科技（惠州）股份有限公司 | Depth control milling structure for circuit board and depth control milling method |
| CN112770498A (en) * | 2019-11-05 | 2021-05-07 | 深南电路股份有限公司 | Circuit board processing method |
| CN112770498B (en) * | 2019-11-05 | 2022-07-01 | 深南电路股份有限公司 | Circuit board processing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102724822B (en) | Control technological method for planeness of surface of LTCC substrate | |
| CN201940675U (en) | Precisely controlled depth processing device for ordinary milling machine | |
| CN203618240U (en) | Gasket for pressing stepped printed circuit board | |
| CN107846792A (en) | A kind of processing technology for reducing Rigid Flex and taking off lid damage soft board | |
| CN104105357A (en) | Method of pressing copper block into PCB (Printed Circuit Board) and application thereof | |
| CN108811375B (en) | Multilayer PCB blind groove gasket processing and filling method | |
| CN102045948A (en) | Method for manufacturing PCB by laminating metal substrate with non-flow prepreg | |
| CN100469221C (en) | Method for manufacturing printed circuit board | |
| CN203661404U (en) | Bonding structure of high-smoothness step blind slot circuit board | |
| CN106102325A (en) | A kind of manufacture method of half built-in copper billet printed board | |
| CN104470199A (en) | Rigid-flexible combined board laminar structure | |
| CN102135764B (en) | Stamping control method for computer press machine | |
| CN202385404U (en) | Equipment for embedding copper block | |
| CN102148082A (en) | Manufacturing methods and equipment of laminated type ceramic electronic element and cover plate layer | |
| CN107835591A (en) | A kind of processing technology that can lift soft or hard combination printed substrate contraposition precision | |
| CN207625860U (en) | Multilayer circuit board structure | |
| CN202310294U (en) | Golden finger board provided with special golden finger position | |
| CN203528068U (en) | Printing plate for finishing embossing and gold stamping at different positions through one step | |
| CN210139167U (en) | A pressfitting tool for PVBA circuit board | |
| CN207927012U (en) | One kind having convex-concave structure abnormal shape confluence electronic conduction copper coin | |
| CN109129941B (en) | Touch screen membrane processing production facility | |
| CN105517360B (en) | A method of improving copper-based copper-clad laminate and drills copper-based bottom peak | |
| CN108990262A (en) | The manufacture craft of two-sided thick copper circuit board | |
| CN213766252U (en) | Anti-deformation environment-friendly multilayer plywood | |
| CN213496888U (en) | Environment-friendly engineering pipeline processing unloading platform |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110824 |