CN105269055A - Depth control milling structure for circuit board and depth control milling method - Google Patents
Depth control milling structure for circuit board and depth control milling method Download PDFInfo
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- CN105269055A CN105269055A CN201510686865.2A CN201510686865A CN105269055A CN 105269055 A CN105269055 A CN 105269055A CN 201510686865 A CN201510686865 A CN 201510686865A CN 105269055 A CN105269055 A CN 105269055A
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Abstract
The invention relates to a depth control milling structure for a circuit board and a corresponding depth control milling method. The depth control milling structure for the circuit board comprises a longitudinal depth control plane and a bottom plane, and the joint of the two planes is an inclined plane. The depth control milling method for the circuit board comprises the steps that firstly, a sharp-corner milling cutter with a proper angle is selected; secondly, the depth that a plate should be milled is calculated according to the thickness of the plate and a depth control milling residue thickness numerical value; thirdly, the height of the Z axis of a milling machine cabinet is set, and the depth of a gong plate is calculated; fourthly, the milling machine cabinet is controlled for cutting the depth control part of the needed inclined plane corresponding to the center point of the diameter of the sharp-corner milling cutter; and fifthly, a flattop milling cutter is used and moved so that the edge of the flattop milling cutter corresponds to a bottom corner of the inclined plane for cutting. Compared with the prior art, the two kinds of cutters are adopted, operation is conducted step by step, the depth control milling structure with the inclined plane is obtained, the stress between the depth control plane and the bottom plane can be greatly increased, and the problem that the circuit board is prone to being layered and cracked during use is solved.
Description
Technical field
The present invention relates to wiring board production technical field.
Background technology
PCB is controlled dark miller sequence and is usually used in one side patchboard, the design of edges of boards draw-in groove etc., specifically refer to PCB when shape fabricating on the position of specifying by the cutter degree of depth under control CNC, mill out the L groove meeting assembling demand, make PCB install process in by plug-in type card on equipment, play fixing effect.As shown in Figure 1, during the dark milling of traditional PCB control, because the milling cutter face 3 of milling cutter A is plane, the dark face 1 of the control obtained after wiring board B rotates is 90 ° of right angles with bottom surface 2, in addition be inevitably subject to External Force Acting in this kind of PCB use procedure, as external force reaches some strength, the dark face of control and bottom surface layering will be caused, cause the hole such as via, insert hole copper to be broken, cause PCB to open a way.
Summary of the invention
For solving the problem, the invention provides a kind of wiring board control dark milling structure and the dark milling method of corresponding control.
The present invention is by the following technical solutions: the dark milling structure of a kind of wiring board control, comprises the dark face of longitudinal control and baseplane, and the described longitudinally dark face of control and joint, baseplane are inclined-plane.
Described bevel inclination angle is preferably 0-90 degree.
The present invention also provides the dark milling method of control making above-mentioned wiring board control dark milling structure, the steps include:
(1) by longitudinal angle requirement controlling the inclined-plane of dark face and joint, baseplane, the wedge angle milling cutter with applicable angle is first selected;
(2) according to thickness of slab, control the degree of depth that the residual thick numerical computations of dark milling goes out to answer milling plate, the degree of depth namely reached needed for wedge angle milling cutter point of a knife;
(3) set milling machine board Z axis height, and control the cutter degree of depth and the gong plate degree of depth under the residual thick calculating of dark milling according to plate thickness, PCB;
(4) arrange wedge angle milling cutter milling plate formula, cut position, control deep, inclined-plane needed for wedge angle milling cutter diameter central point correspondence according to the dark face of control, namely needed for described wedge angle milling cutter point of a knife correspondence, position, control deep, inclined-plane is cut, and controls the degree of depth that point of a knife reaches;
(5) arrange flat-end cutter milling plate formula, select flat-end cutter, mobile flat-end cutter makes the base angle place of flat-end cutter edge inclined surface, removes long position and reaches the dark required value of control.
Compared with prior art, the method of the invention adopts the angled milling cutter of band to coordinate plain milling cutter separate operations, make the dark milling of wiring board control, obtain the dark milling structure of the bevelled control of tool that part is gradually dark, greatly can increase the stress between the dark face of control and bottom surface, the problem of easy delamination fractures during improvement wiring board uses.
Accompanying drawing explanation
Fig. 1 controls dark milling structural representation in prior art;
Fig. 2 is the dark milling structural representation of control of the present invention;
Fig. 3 is to obtain the embodiment schematic diagram of 45 degree of ramp structures in the dark milling method of control of the present invention.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in further detail.
The dark milling structure of control of the present invention as shown in Figure 2, has the dark face 1 of longitudinal control and baseplane 2, and the described dark face 1 of longitudinally control is inclined-plane 4 with joint, baseplane 2, and the occasion that can use according to the dark milling structure of wiring board control is concrete and determine.The base angle place on the inclined-plane that formed crossing with baseplane 2, inclined-plane 4 is control deep, inclined-plane position C.
In order to realize obtaining said structure, making in two steps in the present invention, first selecting wedge angle milling cutter to make inclined-plane, then using flat-end cutter instead, completing the making of baseplane.As Fig. 3, the selection of wedge angle milling cutter A ' angle, need calculate by the bevel angle requirement longitudinally controlling dark face and joint, baseplane, to obtain 45 degree of inclined-planes, because bottom surface and the vertical line in the dark face of control are 90 °, milling cutter radius r should equal the long a of waist of the isosceles triangle that inclined-plane and baseplane and the vertical extension line of controlling dark face form, and bevel depth H also equals milling cutter radius.Other particular/special requirement then calculates with trigonometric function in this way.After cutting tool choice is good, concrete operation step is as follows:
(1) according to pcb board thick, control the degree of depth that the residual thick numerical computations of dark milling goes out to answer milling plate, the degree of depth namely reached needed for wedge angle milling cutter point of a knife; Such as pcb board is thick is 2.0mm, needs residual thick 1.0mm after the dark milling of reserved line plate control, then answers the degree of depth of milling plate to be 1.0mm.
(2) reset milling machine board Z axis height, and control the cutter degree of depth under the residual thick calculating of dark milling according to plate thickness, PCB, set it to the gong plate degree of depth; During general setting, the height value+plate thickness+PCB thickness+safe distance of point of a knife contact table top during Z axis setting height=main spindle clamp tool; Then during the gong plate degree of depth=main spindle clamp tool point of a knife contact table surface height that value+plate thickness+PCB controls dark milling is residual thick.
(3) by above-mentioned calculating parameters obtained, wedge angle milling cutter milling plate formula is set, cut position, control deep, inclined-plane needed for wedge angle milling cutter diameter central point correspondence according to the dark face of control, namely needed for described wedge angle milling cutter point of a knife correspondence, position, control deep, inclined-plane is cut, and controls the degree of depth that point of a knife reaches; Adopt the operating process of wedge angle milling cutter and setting parameter etc. consistent with the operating process of existing employing flat-end cutter, only need select wedge angle milling cutter radius, and also control is dark according to described method contraposition.
(4) by above-mentioned calculating parameters obtained, arrange flat-end cutter milling plate formula, select flat-end cutter, mobile flat-end cutter makes the base angle place of flat-end cutter edge inclined surface, removes long position and reaches the dark required value of control.In fact the operating process of flat-end cutter is selected to adopt the dark milling operating process of existing control, as long as cutter under contraposition.
Not specifically described part in the present invention, the common practise being this area maybe can adopt this area conventional means, then this does not repeat.
Above-described embodiment is only preferably implementation of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.
Claims (3)
1. the dark milling structure of wiring board control, is characterized in that: comprise the dark face of longitudinal control and baseplane, and the described longitudinally dark face of control and joint, baseplane are inclined-plane.
2. the dark milling structure of wiring board control according to claim 1, is characterized in that: described bevel inclination angle is 0-90 degree.
3. the dark milling method of wiring board control, the steps include:
(1) by longitudinal angle requirement controlling the inclined-plane of dark face and joint, baseplane, the wedge angle milling cutter with applicable angle is first selected;
(2) according to thickness of slab, control the degree of depth that the residual thick numerical computations of dark milling goes out to answer milling plate, the degree of depth namely reached needed for wedge angle milling cutter point of a knife;
(3) set milling machine board Z axis height, and control the cutter degree of depth and the gong plate degree of depth under the residual thick calculating of dark milling according to plate thickness, PCB;
(4) arrange wedge angle milling cutter milling plate formula, cut position, control deep, inclined-plane needed for wedge angle milling cutter diameter central point correspondence according to the dark face of control, namely needed for described wedge angle milling cutter point of a knife correspondence, position, control deep, inclined-plane is cut, and controls the degree of depth that point of a knife reaches;
(5) arrange flat-end cutter milling plate formula, select flat-end cutter, mobile flat-end cutter makes the base angle place of flat-end cutter edge inclined surface, removes long position and reaches the dark required value of control.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510686865.2A CN105269055B (en) | 2015-10-22 | 2015-10-22 | A kind of wiring board controlled depth milling structure and controlled depth milling method |
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CN201510686865.2A CN105269055B (en) | 2015-10-22 | 2015-10-22 | A kind of wiring board controlled depth milling structure and controlled depth milling method |
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CN105269055A true CN105269055A (en) | 2016-01-27 |
CN105269055B CN105269055B (en) | 2018-12-21 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113477994A (en) * | 2021-06-24 | 2021-10-08 | 无锡锡压压缩机有限公司 | Machining method for engine body oil groove of dry type screw compressor |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH04130790A (en) * | 1990-09-21 | 1992-05-01 | Matsushita Electric Works Ltd | Working method for printed wiring board |
CN201940675U (en) * | 2011-01-27 | 2011-08-24 | 广州杰赛科技股份有限公司 | Precisely controlled depth processing device for ordinary milling machine |
CN103687338A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Method for drilling circuit board with high-precision and depth-controlled hole |
JP2014133289A (en) * | 2013-01-10 | 2014-07-24 | Omiya Ind Co Ltd | Cutting device, cutting method, and program |
CN204504325U (en) * | 2014-12-31 | 2015-07-29 | 广州兴森快捷电路科技有限公司 | PCB controls dark milling apparatus |
CN104968147A (en) * | 2015-05-29 | 2015-10-07 | 广州杰赛科技股份有限公司 | Bendable printed circuit board and manufacturing method thereof |
-
2015
- 2015-10-22 CN CN201510686865.2A patent/CN105269055B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04130790A (en) * | 1990-09-21 | 1992-05-01 | Matsushita Electric Works Ltd | Working method for printed wiring board |
CN201940675U (en) * | 2011-01-27 | 2011-08-24 | 广州杰赛科技股份有限公司 | Precisely controlled depth processing device for ordinary milling machine |
JP2014133289A (en) * | 2013-01-10 | 2014-07-24 | Omiya Ind Co Ltd | Cutting device, cutting method, and program |
CN103687338A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Method for drilling circuit board with high-precision and depth-controlled hole |
CN204504325U (en) * | 2014-12-31 | 2015-07-29 | 广州兴森快捷电路科技有限公司 | PCB controls dark milling apparatus |
CN104968147A (en) * | 2015-05-29 | 2015-10-07 | 广州杰赛科技股份有限公司 | Bendable printed circuit board and manufacturing method thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113477994A (en) * | 2021-06-24 | 2021-10-08 | 无锡锡压压缩机有限公司 | Machining method for engine body oil groove of dry type screw compressor |
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