CN105269055B - A kind of wiring board controlled depth milling structure and controlled depth milling method - Google Patents
A kind of wiring board controlled depth milling structure and controlled depth milling method Download PDFInfo
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- CN105269055B CN105269055B CN201510686865.2A CN201510686865A CN105269055B CN 105269055 B CN105269055 B CN 105269055B CN 201510686865 A CN201510686865 A CN 201510686865A CN 105269055 B CN105269055 B CN 105269055B
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Abstract
The present invention relates to a kind of wiring board controlled depth milling structure and corresponding controlled depth milling methods.The wiring board controlled depth milling structure is inclined-plane at two flat faces including longitudinal control depth face and baseplane.The wiring board controlled depth milling method, step are as follows: (1) select the wedge angle milling cutter for being suitble to angle；(2) depth for answering milling plate is calculated according to plate thickness, the residual thick numerical value of controlled depth milling；(3) milling machine board Z axis height is set, and calculates gong plate depth；(4) control milling machine board cuts the control deep position on wedge angle milling cutter diameter central point inclined-plane needed for corresponding；(5) flat-end cutter is used instead, mobile flat-end cutter makes to be cut at the base angle of flat-end cutter edge inclined surface.Compared with prior art, the problem of present invention uses two kinds of cutter separate operations, obtains having bevelled controlled depth milling structure, can greatly increase the stress controlled between deep face and bottom surface, improve easy delamination fractures in wiring board use.
Description
Technical field
The present invention relates to wiring board production technical fields.
Background technique
PCB controlled depth milling process is usually used in single side patchboard, the design of edges of boards card slot etc., in particular to PCB in shape fabricating
Depth is cut by controlling CNC on specified position, the L slot for meeting assembly demand is milled out, makes PCB energy during installation
Through plug-in type card in equipment, fixed effect is played.As shown in Figure 1, when traditional PCB controlled depth milling, due to the milling cutter of milling cutter A
Face 3 is plane, and the control depth face 1 and bottom surface 2 obtained after rotating on assist side B is in 90 ° of right angles, in addition this kind of PCB use process
In inevitably reached some strength by external force, such as external force, will result in the deep face of control and bottom surface be layered, cause to be connected
The holes such as hole, insert hole copper is broken, and PCB is caused to open a way.
Summary of the invention
To solve the above problems, the present invention provides a kind of wiring board controlled depth milling structure and corresponding controlled depth milling method.
The invention adopts the following technical scheme: a kind of wiring board controlled depth milling structure, control depth face and baseplane including longitudinal direction,
Inclined-plane is in longitudinal depth face and baseplane joint controlled.
The bevel inclination angle is preferably 0-90 degree.
The present invention also provides the controlled depth milling methods for making above-mentioned wiring board controlled depth milling structure, the steps include:
(1) by the angle requirement on longitudinal inclined-plane for controlling deep face and baseplane joint, first selection has the point for being suitble to angle
Angular cutter；
(2) depth for answering milling plate is calculated according to plate thickness, the residual thick numerical value of controlled depth milling, i.e., reached needed for wedge angle milling cutter point of a knife
Depth；
(3) milling machine board Z axis height is set, and depth i.e. gong plate is cut according to plate thickness, residual thick calculate of PCB controlled depth milling
Depth；
(4) wedge angle milling cutter milling plate formula is set, is that inclined-plane control needed for wedge angle milling cutter diameter central point is corresponding is deep according to deep face is controlled
Position is cut, i.e., inclined-plane control deep position needed for the described wedge angle milling cutter point of a knife is corresponding is cut, and controls what point of a knife reached
Depth；
(5) flat-end cutter milling plate formula is set, flat-end cutter is selected, mobile flat-end cutter keeps flat-end cutter edge corresponding oblique
At the base angle in face, removal long position reaches the deep required value of control.
Compared with prior art, the method for the invention, which is used, cooperates plain milling cutter separate operations with angled milling cutter,
Wiring board controlled depth milling is made, the gradually bevelled controlled depth milling structure of tool of depth is obtained partially, the deep face of control and bottom surface can be greatly increased
Between stress, improve wiring board use in easy delamination fractures the problem of.
Detailed description of the invention
Fig. 1 is controlled depth milling structural schematic diagram in the prior art；
Fig. 2 is controlled depth milling structural schematic diagram of the present invention；
Fig. 3 is in controlled depth milling method of the present invention to obtain the embodiment schematic diagram of 45 degree of bevel structures.
Specific embodiment
Below in conjunction with accompanying drawings and embodiments, invention is further described in detail.
For controlled depth milling structure of the present invention as shown in Fig. 2, having longitudinal control depth face 1 and baseplane 2, longitudinal control is deep
Face 1 and 2 joint of baseplane are inclined-plane 4, depending on the occasion that can be used according to wiring board controlled depth milling structure is specific.Inclined-plane 4 and bottom
It is inclined-plane control deep position C at the base angle on the inclined-plane that plane 2 is crossed to form.
In order to realize to obtain above structure, made in two steps in the present invention, selection wedge angle milling cutter first makes inclined-plane, then changes
With flat-end cutter, the production of baseplane is completed.Such as Fig. 3, the selection of wedge angle milling cutter A ' angle need to control deep face and baseplane by longitudinal
The bevel angle of joint requires to be calculated, for obtaining 45 degree of inclined-planes, because bottom surface and the vertical line for controlling deep face are 90 °,
Milling cutter radius r should be equal to inclined-plane and baseplane and control the long a of waist of the isosceles triangle of the vertical extension line composition in deep face, and inclined-plane is deep
Degree H is also equal to milling cutter radius.Other particular/special requirements in this way are then calculated with trigonometric function.After cutting tool choice is good, concrete operations
Steps are as follows:
(1) thick according to pcb board, the residual thick numerical value of controlled depth milling calculates the depth for answering milling plate, i.e., reaches needed for wedge angle milling cutter point of a knife
The depth arrived；Such as pcb board thickness is 2.0mm, needs residual thickness 1.0mm after reserved line plate controlled depth milling, then answers the depth of milling plate to be
1.0mm。
(2) milling machine board Z axis height is reset, and depth is cut according to plate thickness, residual thick calculate of PCB controlled depth milling, it will
It is set as gong plate depth；When general setting, height value+backing plate of point of a knife contact table top is thick when Z axis setting height=main spindle clamp tool
Degree+PCB thickness+safe distance；Then point of a knife contact table surface height value+plate thickness+PCB control is deep when gong plate depth=main spindle clamp tool
Mill residual thickness.
(3) above-mentioned calculating parameters obtained is pressed, wedge angle milling cutter milling plate formula is set, is wedge angle milling cutter diameter center according to deep face is controlled
The position of inclined-plane control deep needed for point is corresponding is cut, i.e., inclined-plane control deep position needed for the described wedge angle milling cutter point of a knife is corresponding is cut
It cuts, and controls the depth that point of a knife reaches；Flat-end cutter is used with existing using the operating process of wedge angle milling cutter and parameter setting etc.
Operating process it is consistent, only need to select wedge angle milling cutter radius, and aligned according to the method and control depth.
(4) above-mentioned calculating parameters obtained is pressed, flat-end cutter milling plate formula is set, selects flat-end cutter, mobile flat-end cutter
At the base angle for making flat-end cutter edge inclined surface, removal long position reaches the deep required value of control.Actually select flat-end cutter
Operating process use existing controlled depth milling operating process, as long as contraposition cut.
The part not specifically described in the present invention is the common knowledge of this field or can be used means commonly used in the art,
This is not repeated again.
Above-described embodiment is only preferably implementation of the invention, and the description thereof is more specific and detailed, but can not be because
This and be interpreted as limitations on the scope of the patent of the present invention.It should be pointed out that for those of ordinary skill in the art,
Under the premise of not departing from present inventive concept, various modifications and improvements can be made, these obvious alternative forms belong to
In protection scope of the present invention.
Claims (2)
1. a kind of wiring board controlled depth milling method controls deep face and baseplane joint for using controlled depth milling operation to realize as inclined-plane
The processing of slot structure the steps include: (1) by the angle requirement on longitudinal inclined-plane for controlling deep face and baseplane joint, and selection has
It is suitble to the wedge angle milling cutter of angle；
(2) thick according to pcb board, the residual thick numerical value of controlled depth milling calculates the depth for answering milling plate, i.e., reaches needed for wedge angle milling cutter point of a knife
Depth；
(3) milling machine board Z axis height is reset, and depth is cut according to plate thickness, residual thick calculate of PCB controlled depth milling, is set
It is set to gong plate depth；When setting, height value+plate thickness+PCB of point of a knife contact table top is thick when Z axis setting height=main spindle clamp tool
Degree+safe distance；Then point of a knife contacts table surface height value+residual thickness of plate thickness+PCB controlled depth milling when gong plate depth=main spindle clamp tool；
(4) above-mentioned calculating parameters obtained is pressed, wedge angle milling cutter milling plate formula is set, is wedge angle milling cutter diameter central point pair according to deep face is controlled
Answer required inclined-plane control deep position to be cut, i.e., inclined-plane control deep position needed for the described wedge angle milling cutter point of a knife is corresponding is cut, and
The depth that control point of a knife reaches；
(5) above-mentioned calculating parameters obtained is pressed, flat-end cutter milling plate formula is set, selects flat-end cutter, mobile flat-end cutter makes to put down
At the base angle of head milling cutter edge inclined surface, removal long position reaches the deep required value of control.
2. wiring board controlled depth milling method according to claim 1, which is characterized in that the bevel inclination angle is 0-90
Degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510686865.2A CN105269055B (en) | 2015-10-22 | 2015-10-22 | A kind of wiring board controlled depth milling structure and controlled depth milling method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510686865.2A CN105269055B (en) | 2015-10-22 | 2015-10-22 | A kind of wiring board controlled depth milling structure and controlled depth milling method |
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| CN105269055A CN105269055A (en) | 2016-01-27 |
| CN105269055B true CN105269055B (en) | 2018-12-21 |
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| CN201510686865.2A Active CN105269055B (en) | 2015-10-22 | 2015-10-22 | A kind of wiring board controlled depth milling structure and controlled depth milling method |
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| CN113477994A (en) * | 2021-06-24 | 2021-10-08 | 无锡锡压压缩机有限公司 | Machining method for engine body oil groove of dry type screw compressor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687338A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Method for drilling circuit board with high-precision and depth-controlled hole |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04130790A (en) * | 1990-09-21 | 1992-05-01 | Matsushita Electric Works Ltd | Working method for printed wiring board |
| CN201940675U (en) * | 2011-01-27 | 2011-08-24 | 广州杰赛科技股份有限公司 | Precisely controlled depth processing device for ordinary milling machine |
| JP2014133289A (en) * | 2013-01-10 | 2014-07-24 | Omiya Ind Co Ltd | Cutting device, cutting method, and program |
| CN204504325U (en) * | 2014-12-31 | 2015-07-29 | 广州兴森快捷电路科技有限公司 | PCB controls dark milling apparatus |
| CN104968147B (en) * | 2015-05-29 | 2019-02-19 | 广州杰赛科技股份有限公司 | A kind of bent printed wiring board and preparation method thereof |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687338A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Method for drilling circuit board with high-precision and depth-controlled hole |
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