CN105269055B

CN105269055B - A kind of wiring board controlled depth milling structure and controlled depth milling method

Info

Publication number: CN105269055B
Application number: CN201510686865.2A
Authority: CN
Inventors: 李成军; 曾祥福; 张晃初
Original assignee: Victory Giant Technology Huizhou Co Ltd
Current assignee: Victory Giant Technology Huizhou Co Ltd
Priority date: 2015-10-22
Filing date: 2015-10-22
Publication date: 2018-12-21
Anticipated expiration: 2035-10-22
Also published as: CN105269055A

Abstract

The present invention relates to a kind of wiring board controlled depth milling structure and corresponding controlled depth milling methods.The wiring board controlled depth milling structure is inclined-plane at two flat faces including longitudinal control depth face and baseplane.The wiring board controlled depth milling method, step are as follows: (1) select the wedge angle milling cutter for being suitble to angle；(2) depth for answering milling plate is calculated according to plate thickness, the residual thick numerical value of controlled depth milling；(3) milling machine board Z axis height is set, and calculates gong plate depth；(4) control milling machine board cuts the control deep position on wedge angle milling cutter diameter central point inclined-plane needed for corresponding；(5) flat-end cutter is used instead, mobile flat-end cutter makes to be cut at the base angle of flat-end cutter edge inclined surface.Compared with prior art, the problem of present invention uses two kinds of cutter separate operations, obtains having bevelled controlled depth milling structure, can greatly increase the stress controlled between deep face and bottom surface, improve easy delamination fractures in wiring board use.

Description

A kind of wiring board controlled depth milling structure and controlled depth milling method

Technical field

The present invention relates to wiring board production technical fields.

Background technique

PCB controlled depth milling process is usually used in single side patchboard, the design of edges of boards card slot etc., in particular to PCB in shape fabricating Depth is cut by controlling CNC on specified position, the L slot for meeting assembly demand is milled out, makes PCB energy during installation Through plug-in type card in equipment, fixed effect is played.As shown in Figure 1, when traditional PCB controlled depth milling, due to the milling cutter of milling cutter A Face 3 is plane, and the control depth face 1 and bottom surface 2 obtained after rotating on assist side B is in 90 ° of right angles, in addition this kind of PCB use process In inevitably reached some strength by external force, such as external force, will result in the deep face of control and bottom surface be layered, cause to be connected The holes such as hole, insert hole copper is broken, and PCB is caused to open a way.

Summary of the invention

To solve the above problems, the present invention provides a kind of wiring board controlled depth milling structure and corresponding controlled depth milling method.

The invention adopts the following technical scheme: a kind of wiring board controlled depth milling structure, control depth face and baseplane including longitudinal direction, Inclined-plane is in longitudinal depth face and baseplane joint controlled.

The bevel inclination angle is preferably 0-90 degree.

The present invention also provides the controlled depth milling methods for making above-mentioned wiring board controlled depth milling structure, the steps include:

(1) by the angle requirement on longitudinal inclined-plane for controlling deep face and baseplane joint, first selection has the point for being suitble to angle Angular cutter；

(2) depth for answering milling plate is calculated according to plate thickness, the residual thick numerical value of controlled depth milling, i.e., reached needed for wedge angle milling cutter point of a knife Depth；

(3) milling machine board Z axis height is set, and depth i.e. gong plate is cut according to plate thickness, residual thick calculate of PCB controlled depth milling Depth；

(4) wedge angle milling cutter milling plate formula is set, is that inclined-plane control needed for wedge angle milling cutter diameter central point is corresponding is deep according to deep face is controlled Position is cut, i.e., inclined-plane control deep position needed for the described wedge angle milling cutter point of a knife is corresponding is cut, and controls what point of a knife reached Depth；

(5) flat-end cutter milling plate formula is set, flat-end cutter is selected, mobile flat-end cutter keeps flat-end cutter edge corresponding oblique At the base angle in face, removal long position reaches the deep required value of control.

Compared with prior art, the method for the invention, which is used, cooperates plain milling cutter separate operations with angled milling cutter, Wiring board controlled depth milling is made, the gradually bevelled controlled depth milling structure of tool of depth is obtained partially, the deep face of control and bottom surface can be greatly increased Between stress, improve wiring board use in easy delamination fractures the problem of.

Detailed description of the invention

Fig. 1 is controlled depth milling structural schematic diagram in the prior art；

Fig. 2 is controlled depth milling structural schematic diagram of the present invention；

Fig. 3 is in controlled depth milling method of the present invention to obtain the embodiment schematic diagram of 45 degree of bevel structures.

Specific embodiment

Below in conjunction with accompanying drawings and embodiments, invention is further described in detail.

For controlled depth milling structure of the present invention as shown in Fig. 2, having longitudinal control depth face 1 and baseplane 2, longitudinal control is deep Face 1 and 2 joint of baseplane are inclined-plane 4, depending on the occasion that can be used according to wiring board controlled depth milling structure is specific.Inclined-plane 4 and bottom It is inclined-plane control deep position C at the base angle on the inclined-plane that plane 2 is crossed to form.

In order to realize to obtain above structure, made in two steps in the present invention, selection wedge angle milling cutter first makes inclined-plane, then changes With flat-end cutter, the production of baseplane is completed.Such as Fig. 3, the selection of wedge angle milling cutter A ' angle need to control deep face and baseplane by longitudinal The bevel angle of joint requires to be calculated, for obtaining 45 degree of inclined-planes, because bottom surface and the vertical line for controlling deep face are 90 °, Milling cutter radius r should be equal to inclined-plane and baseplane and control the long a of waist of the isosceles triangle of the vertical extension line composition in deep face, and inclined-plane is deep Degree H is also equal to milling cutter radius.Other particular/special requirements in this way are then calculated with trigonometric function.After cutting tool choice is good, concrete operations Steps are as follows:

(1) thick according to pcb board, the residual thick numerical value of controlled depth milling calculates the depth for answering milling plate, i.e., reaches needed for wedge angle milling cutter point of a knife The depth arrived；Such as pcb board thickness is 2.0mm, needs residual thickness 1.0mm after reserved line plate controlled depth milling, then answers the depth of milling plate to be 1.0mm。

(2) milling machine board Z axis height is reset, and depth is cut according to plate thickness, residual thick calculate of PCB controlled depth milling, it will It is set as gong plate depth；When general setting, height value+backing plate of point of a knife contact table top is thick when Z axis setting height=main spindle clamp tool Degree+PCB thickness+safe distance；Then point of a knife contact table surface height value+plate thickness+PCB control is deep when gong plate depth=main spindle clamp tool Mill residual thickness.

(3) above-mentioned calculating parameters obtained is pressed, wedge angle milling cutter milling plate formula is set, is wedge angle milling cutter diameter center according to deep face is controlled The position of inclined-plane control deep needed for point is corresponding is cut, i.e., inclined-plane control deep position needed for the described wedge angle milling cutter point of a knife is corresponding is cut It cuts, and controls the depth that point of a knife reaches；Flat-end cutter is used with existing using the operating process of wedge angle milling cutter and parameter setting etc. Operating process it is consistent, only need to select wedge angle milling cutter radius, and aligned according to the method and control depth.

(4) above-mentioned calculating parameters obtained is pressed, flat-end cutter milling plate formula is set, selects flat-end cutter, mobile flat-end cutter At the base angle for making flat-end cutter edge inclined surface, removal long position reaches the deep required value of control.Actually select flat-end cutter Operating process use existing controlled depth milling operating process, as long as contraposition cut.

The part not specifically described in the present invention is the common knowledge of this field or can be used means commonly used in the art, This is not repeated again.

Above-described embodiment is only preferably implementation of the invention, and the description thereof is more specific and detailed, but can not be because This and be interpreted as limitations on the scope of the patent of the present invention.It should be pointed out that for those of ordinary skill in the art, Under the premise of not departing from present inventive concept, various modifications and improvements can be made, these obvious alternative forms belong to In protection scope of the present invention.

Claims

1. A circuit board controlled depth milling method, which is used to realize the processing of a groove structure with an inclined surface at the junction of the controlled depth surface and the bottom plane by using the controlled depth milling operation. The steps are: (1) longitudinally control the depth surface and the bottom The angle requirements of the slope where the planes meet, choose a sharp-edged milling cutter with a suitable angle;

(2) Calculate the depth of the board to be milled according to the thickness of the PCB and the residual thickness of the controlled depth milling, that is, the depth required by the tip of the sharp-edged milling cutter;

(3) Set the Z-axis height of the milling machine, and calculate the cutting depth according to the thickness of the backing plate and the residual thickness of PCB control depth milling, and set it as the depth of the gong plate; when setting, the Z-axis setting height = the spindle The height value of the tool tip contacting the table when the tool is clamped + the thickness of the backing plate + the thickness of the PCB + the safety distance; then the depth of the gong plate = the height of the tool tip contacting the table when the spindle clamps the tool + the thickness of the backing plate + PCB control deep milling residual thickness;

(4) According to the above calculated parameters, set the milling program of the sharp-angle milling cutter, and cut according to the center point of the diameter of the sharp-angle milling cutter corresponding to the required depth control part of the inclined surface, that is, the tip of the sharp-angle milling cutter corresponds to Cut the desired depth control part of the bevel, and control the depth reached by the tip of the knife;

(5) According to the parameters obtained from the above calculation, set the milling program of the flat end milling cutter, select the flat end milling cutter, move the flat end milling cutter so that the edge of the flat end milling cutter corresponds to the bottom corner of the inclined surface, and remove the redundant parts to reach the required depth control value.

2 . The method for controlled deep milling of circuit boards according to claim 1 , wherein the inclination angle of the slope is 0-90 degrees. 3 .