JP2014133289A - Cutting device, cutting method, and program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting device capable of cutting a semiconductor package without cutting a printed circuit board.SOLUTION: A cutting device 100 is a device for cutting and removing a semiconductor package from a printed circuit board. The cutting device 100 includes: a height information acquisition unit that acquires information on height of a corner at the highest position among four corners of an upper surface of a semiconductor package 210; a depth information acquisition unit that acquires information on a cutting depth; and a cutting control unit that cuts the semiconductor package 210 in parallel to an installation surface of an installation table 110. The cutting control unit cuts the semiconductor package 210 from the height acquired by the height information acquisition unit to the depth acquired by the depth information acquisition unit.

Description

  The present invention relates to a cutting device, a cutting method, and a program.

  A technique for cutting and removing a defective semiconductor package from a printed circuit board is known. Patent Document 1 discloses a CSP removing apparatus that cuts and removes a semiconductor package mounted on a printed circuit board using a cutting tool (end mill).

JP 2005-197612 A

  When removing the semiconductor package by cutting, it is necessary to adjust the cutting depth so as not to cut the printed circuit board. The device of Patent Document 1 measures the height of a flat portion around a semiconductor package with a laser scanner, and cuts the semiconductor package using the measured data, thereby cutting the printed circuit board together with the semiconductor package. I am trying not to.

  However, current printed circuit boards have a high density of components, and the printed circuit board has few flat portions. Therefore, it is difficult to directly measure the printed circuit board in order to adjust the cutting depth. In addition, in order to provide resistance to vibration and impact, the periphery of the semiconductor package may be hardened with resin. In this case, it is more difficult to measure the printed circuit board around the semiconductor package. If the printed circuit board cannot be measured, the printed circuit board may be cut together with the semiconductor package.

  The present invention has been made in view of such problems, and an object thereof is to provide a cutting apparatus, a cutting method, and a program capable of cutting a semiconductor package without cutting a printed circuit board.

A cutting apparatus according to a first aspect of the present invention is a cutting apparatus that cuts and removes a semiconductor package from a printed circuit board,
Height information acquisition means for acquiring information on the height of a corner at the highest position among the four corners of the upper surface of the semiconductor package;
Depth information acquisition means for acquiring information of the depth to be cut;
Cutting control means for cutting the semiconductor package parallel to the installation surface of the printed circuit board,
The cutting control means cuts from the height acquired by the height information acquisition means to the depth acquired by the depth information acquisition means,
It is characterized by that.

A rod-shaped cutting tool,
A cutting tool fixing portion for fixing the cutting tool so that an axis is perpendicular to the installation surface;
A positional relationship specifying means for specifying a positional relationship in the axial direction between the tip of the cutting tool and the cutting tool fixing portion;
The cutting control means determines the amount of movement of the cutting tool fixing portion necessary for the tip of the cutting tool to move to a predetermined depth based on the positional relationship specified by the specifying means, and the determined movement The cutting tool fixing portion may be moved in the axial direction based on the amount.

  The positional relationship specifying means may specify the positional relationship every time the cutting control means newly starts cutting the semiconductor package.

Storage means for storing information on the thickness of the semiconductor package;
The depth information acquisition unit may specify a depth to be cut using information on the thickness of the semiconductor package stored in the storage unit.

  The cutting control unit waits for an additional cutting instruction to be input after cutting to the depth acquired by the depth information acquisition unit, and further receives an additional cutting instruction based on the instruction. You may cut to a deep position.

Means for acquiring information of the semiconductor package to be cut;
The cutting control means may select one of a plurality of cutting patterns based on the acquired information of the semiconductor package and cut the semiconductor package based on the selected cutting pattern.

A cutting method according to a second aspect of the present invention is a cutting method for cutting and removing a semiconductor package from a printed circuit board,
A height information acquisition step of acquiring information on the height of a corner at the highest position among the four corners of the upper surface of the semiconductor package;
A depth information acquisition step for acquiring information on the depth to be cut;
Cutting control step of cutting the semiconductor package in parallel with the installation surface of the printed circuit board,
In the cutting control step, cutting from the height acquired in the height information acquisition step to the depth acquired in the depth information acquisition step,
It is characterized by that.

A program according to a third aspect of the present invention is a computer that controls a cutting device that cuts and removes a semiconductor package from a printed circuit board.
A height information acquisition function for acquiring information on the height of the corner at the highest position among the four corners of the upper surface of the semiconductor package;
A depth information acquisition function for acquiring information on the depth to be cut;
A cutting control function for cutting the semiconductor package from a height acquired by the height information acquisition function in parallel with an installation surface of the printed circuit board to a depth acquired by the depth information acquisition function is realized.
It is characterized by that.

  According to the present invention, it is possible to provide a cutting device, a cutting method, and a program capable of cutting a semiconductor package without cutting a printed circuit board.

It is a figure which shows the external appearance of the cutting device which concerns on embodiment of this invention, (A) is a front view of a cutting device, (B) is a side view of a cutting device. It is a block diagram of the cutting device concerning an embodiment of the invention. It is a functional block diagram of the control part shown in FIG. It is a flowchart for demonstrating a cutting process. It is a flowchart for demonstrating a Z vs. L conversion table preparation process. It is a figure which shows a mode that the left-right movement part and the front-back movement part were controlled to move so that a light projection lens might be located just above a switch, (A) is a cutting device when a light projection lens is located just above a switch (B) is a front view of the cutting device when the light projection lens is positioned directly above the switch. It is a flowchart for demonstrating a positional relationship specific process. It is a figure for demonstrating operation | movement of a positional relationship specific | specification part, (A) is a front view of a cutting device when a cutting tool is located just above a switch, (B) is until the front-end | tip of a cutting tool presses a switch The front view of a cutting device when a cutting tool fixing | fixed part is moved below, (C) is a front view of a cutting device when a light projection lens is located just above a switch. It is a figure for demonstrating operation | movement of a height information acquisition part, (A) is a figure which shows a mode that a semiconductor package inclines with respect to the installation surface of an installation part, (B) is a semiconductor package which a measurement part measures FIG. 4C is a front view of the cutting apparatus when the light projecting lens is positioned directly above one of the four corners of the semiconductor package. It is a flowchart for demonstrating a height information acquisition process. It is a figure for demonstrating operation | movement of a cutting control part. It is a figure for demonstrating operation | movement of a cutting control part, (A)-(C) is a figure which shows a mode that a semiconductor package is cut | divided into D / n by subdivision, (D) is additional cutting based on a user's instruction | indication. It is a figure which shows a mode that it does. It is a figure for demonstrating a cutting pattern, (A) is a figure which shows the cutting pattern which cuts a semiconductor package in a spiral shape, (B) is a figure which shows the cutting pattern which repeats cutting in L shape, (C) is a figure It is a figure which shows the cutting pattern which repeats cutting in U shape.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

  A cutting apparatus 100 according to an embodiment of the present invention is an apparatus for cutting and removing a semiconductor package mounted on a printed board. As shown in FIGS. 1A and 1B, the cutting device 100 includes an installation table 110, a cutting tool 120, a cutting tool fixing unit 130, a measuring unit 140, a left and right moving unit 150, and front and rear. The moving unit 160, the switch 170, and the main body unit 180 are configured.

  The installation table 110 is a mounting table for mounting the printed circuit board 200 on which the semiconductor package 210 to be cut is mounted. The upper surface (hereinafter referred to as “installation surface”) of the installation table 110 is parallel to the movement direction of a left / right moving unit 150 and a front / rear moving unit 160 described later. The printed circuit board 200 is placed on the installation surface and fixed by a fixing tool 111. In the following description, it is assumed that the semiconductor package 210 to be cut is a CSP (Chip Size Package).

  The cutting tool 120 is a rod-shaped cutting tool having a cutting edge at the tip (for example, a flat end mill having a flat tip shape). One end of the cutting tool 120 in the axial direction is fixed to the cutting tool fixing portion 130.

  The cutting tool fixing unit 130 is a mechanism for fixing the cutting tool 120. The cutting tool 120 is fixed to the cutting tool fixing portion 130 so that its axis is perpendicular to the installation surface of the installation table 110. The cutting tool fixing unit 130 includes a motor for applying a rotational force to the cutting tool 120 inside. The motor applies a rotational force to the cutting tool 120 according to the control of the control unit 182 described later. The cutting tool fixing unit 130 is slidably fixed to the slide rail 151 of the left-right moving unit 150. The cutting tool fixing unit 130 slides in the vertical direction under the control of the control unit 182.

  The measuring unit 140 is a device for measuring a linear distance between the cutting tool fixing unit 130 and an object below the cutting tool fixing unit 130. The measurement part 140 is comprised from a laser displacement meter and a laser distance meter, for example. At the center of the lower surface of the measurement unit 140, a light projecting lens 141 that emits a laser in a downward direction is installed. The measurement unit 140 is fixed to the side surface of the cutting tool fixing unit 130. The measuring unit 140 receives the reflected light of the laser emitted from the light projecting lens 141 and measures the distance to the object.

  The left-right moving unit 150 is a mechanism for moving the cutting tool fixing unit 130 in the left-right direction. The left / right moving unit 150 is slidably fixed to the slide rail 161 of the front / rear moving unit 160. The left / right moving unit 150 slides in the left / right direction under the control of the control unit 182.

  The front-rear moving unit 160 is a mechanism for moving the left-right moving unit 150 in the front-rear direction. The front-rear moving unit 160 is slidably fixed to slide rails 181 installed on the left and right side surfaces of the main body unit 180. The front-rear moving unit 160 slides in the front-rear direction under the control of the control unit 182.

  The switch 170 is a button type switch that detects a press and sends a signal to the control unit 182. The switch 170 is installed on the upper part of the main body 180.

  The main body portion 180 is a portion that becomes the main body of the cutting apparatus 100. As shown in FIG. 2, the main body unit 180 includes a control unit 182, a storage unit 183, and an external interface 184.

  The control unit 182 includes a processing device such as a processor. The control unit 182 operates according to a program stored in a ROM (Read Only Memory) or a RAM (Random Access Memory) (not shown), and executes various operations including a “cutting process” described later. As shown in FIG. 3, the control unit 182 operates according to the “cutting process”, so that the conversion table creation unit 182a, the positional relationship specifying unit 182b, the height information acquisition unit 182c, the depth information acquisition unit 182d, and the cutting control are performed. It functions as the part 182e. The operation of these functions will be described later in the description of “cutting process”.

  The storage unit 183 includes a storage device such as a DRAM (Dynamic Random Access Memory), an SRAM (Static Random Access Memory), a flash memory, and a hard disk. The storage unit 183 stores information on the cutting tool (for example, the type of cutting tool and the diameter of the blade), information on the semiconductor package to be cut (for example, information on the coordinates of two diagonal points of the semiconductor package and information on the thickness of the semiconductor package). ), Information on the optimum cutting speed and cutting pattern for cutting the semiconductor package is stored.

  The external interface 184 includes an external device connection interface such as a USB (Universal Serial Bus) cable connection device, a LAN (Local Area Network) cable connection device, and an RS232C cable connection device. The external interface 184 transmits a user instruction transmitted from an external device (not shown) to the control unit 182.

  Next, operation | movement of the cutting device 100 which has such a structure is demonstrated.

  When the start of the cutting process is instructed by the user via the external interface 184, the control unit 182 starts the “cutting process”. The “cutting process” will be described below with reference to the flowchart of FIG.

  First, the control unit 182 executes “Z vs L conversion table creation processing” (step S110). The “Z vs L conversion table creation process” includes the amount of rotation of the motor that moves the cutting tool fixing unit 130 (the number of steps if it is a stepping motor), and the actual amount of movement of the cutting tool fixing unit 130 that accompanies the rotation. Is a process for associating. Hereinafter, the “Z-to-L conversion table creation process” will be described with reference to the flowchart of FIG. 5.

  As shown in FIGS. 6A and 6B, the conversion table creating unit 182a of the control unit 182 performs cutting until the cutting tool fixing unit 130 collides with the upper protrusion of the left and right moving unit 150 and stops moving. The tool fixing part 130 is moved upward (step S111). In the following description, for easy understanding, a position where the cutting tool fixing unit 130 stops moving is expressed as an initial position of the cutting tool fixing unit 130 (a position where the motor rotation amount Z = 0).

  The conversion table creating unit 182a controls the movement of the left / right moving unit 150 and the front / rear moving unit 160 so that the light projecting lens 141 of the measuring unit 140 is positioned directly above the switch 170 (step S112).

  The conversion table creation unit 182a measures the distance L to the switch each time the cutting tool fixing unit 130 is moved downward (that is, the rotation amount Z is gradually increased). The conversion table creation unit 182a stores the measured distance L in a RAM (not shown) in association with the rotation amount Z of the motor when the distance L is measured (step S113). In the following description, the distance L measured when the cutting tool fixing unit 130 is in the initial position (the position where the rotation amount Z = 0) is expressed as Ls.

  The conversion table creation unit 182a collects a plurality of data acquired in step S113 into one table, and saves it in the storage unit 183 as a Z-to-L conversion table (step S114).

  Returning to the flow of the cutting process of FIG. 4, the control unit 182 next executes a “positional relationship specifying process” (step S <b> 120). The “positional relationship specifying process” is for accurately specifying the positional relationship between the cutting tool fixing portion 130 and the tip of the cutting tool 120 (that is, the length of the cutting tool 120) in order to precisely cut the semiconductor package 210. It is processing of. The “positional relationship specifying process” will be described below with reference to the flowchart of FIG.

  The positional relationship specifying unit 182b of the control unit 182 moves the cutting tool fixing unit 130 to the initial position (position where the rotation amount Z = 0) (step S121).

  As shown in FIG. 8A, the positional relationship specifying unit 182b controls the movement of the left / right moving unit 150 and the front / rear moving unit 160 so that the center of the axis of the cutting tool 120 is located directly above the switch 170 (see FIG. 8A). Step S122).

  As shown in FIG. 8B, the positional relationship specifying unit 182b moves the cutting tool fixing unit 130 downward until the tip of the cutting tool 120 presses the switch 170 (step S123).

  As shown in FIG. 8C, the positional relationship specifying unit 182b slides the left / right moving unit 150 to the left so that the light projecting lens 141 is positioned directly above the switch 170. At this time, the positional relationship specifying unit 182b slides the left / right moving unit 150 to the left while maintaining the current height of the cutting tool fixing unit 130 (step S124).

  The positional relationship specifying unit 182b controls the measuring unit 140 to measure the distance L from the light projecting lens 141 to the switch 170 (step S125). In the following description, the distance L measured at this time is expressed as L0.

  The positional relationship specifying unit 182b stores the measured L0 in the storage unit 183 as the positional relationship between the cutting tool fixing unit 130 and the tip of the cutting tool 120 (that is, the length of the cutting tool 120) (step S126).

  Returning to the flow of the cutting process of FIG. 4, the control unit 182 next executes a “height information acquisition process” (step S <b> 130). In many cases, the printed circuit board 200 is slightly warped or bent. Even if the printed circuit board 200 is installed parallel to the installation surface of the installation table 110, the semiconductor package 210 is slightly inclined with respect to the installation surface of the installation table 110, as shown in FIG. In the “height information acquisition process”, the heights of four corners (for example, (a) to (d) shown in FIG. 9B) of the upper surface of the semiconductor package 210 are measured, and the highest among the measured four corners. The height of the corner at the position is acquired as the height of the semiconductor package 210. In addition, although the warp and the flexure of the printed circuit board 200 are actually slight, in FIG. 9A, the warp and the flexure of the print circuit board 200 are slightly emphasized in order to make the warp and the flexure easy to see. . Hereinafter, the “height information acquisition process” will be described with reference to the flowchart of FIG. 10.

  The height information acquisition unit 182c of the control unit 182 moves the cutting tool fixing unit 130 to the initial position (position of the rotation amount Z = 0) (step S131).

  As shown in FIG. 9C, the height information acquisition unit 182c controls movement of the left / right moving unit 150 and the front / rear moving unit 160 so that the light projecting lens 141 is positioned right above one of the four corners. (Step S132). Note that the position of the light projecting lens 141 may not be just above the corner of the semiconductor package 210. It may be slightly inside the corner of the semiconductor package 210 as shown in FIGS.

  The height information acquisition unit 182c controls the measurement unit 140 to measure the distance L from the light projecting lens 141 to the switch 170 (step S133).

  The height information acquisition unit 182c determines whether the heights of all four corners have been measured (step S134). When the heights of all four corners are not measured, Steps S132 to S134 are repeated until the heights of all four corners are measured (Step S134: No). When the measurement of the heights of all four corners is completed, the process proceeds to step S135 (step S134: Yes).

  The height information acquisition unit 182c determines the smallest distance among the four measurement data (that is, the height information of the corner at the highest position, hereinafter referred to as the distance L1) (step S135).

  The height information acquisition unit 182c stores the distance L1 determined in step S135 in the storage unit 183 as the height information of the semiconductor package 210. Note that the height information acquisition unit 182c may store the distance L2 instead of the distance L1 as the height information of the semiconductor package 210. The distance L2 is a distance from the tip of the cutting tool 120 to the corner of the semiconductor package 210 at the highest position. The distance L2 is calculated using, for example, the length L0 of the cutting tool 120 acquired in step S120 and the distance L1 acquired in step S135 (step S136).

  Returning to the flow of the cutting process in FIG. 4, the depth information acquisition unit 182d of the control unit 182 acquires information on the depth to be cut (for example, the depth D shown in FIG. 11) (step S140). The depth information acquisition unit 182d may use the thickness information of the semiconductor package 210 stored in the storage unit 183 as the depth D as it is, or a value calculated by adding the thickness of the ball solder to the thickness of the semiconductor package 210. May be the depth D.

  As shown in FIG. 11, the cutting control unit 182e of the control unit 182 cuts the semiconductor package 210 from the height specified in step S136 to the depth D in parallel with the installation surface of the installation table 110 (step S150). At this time, the cutting control unit 182e may cut to the depth D by repeating the cutting in small increments of D / n. For example, the cutting control unit 182e refers to the Z-to-L conversion table, and determines the amount of movement (that is, the amount of rotation Z) of the cutting tool fixing unit 130 necessary to move the tip of the cutting tool 120 to the position of L2 + Δd. Determine. Then, the cutting control unit 182e moves the cutting tool fixing unit 130 in the axial direction (vertical direction) by the determined movement amount. Then, the cutting control unit 182e moves the cutting tool 120 in parallel with the installation surface of the installation table 110, and cuts the semiconductor package 210 in parallel with the installation surface as shown in FIG. When the cutting is completed, the cutting control unit 182e then moves the tip of the cutting tool 120 to the position of L2 + Δd × 2 with reference to the Z vs. L conversion table. Then, the cutting controller 182e cuts the semiconductor package 210 in parallel with the installation surface of the installation table 110, as shown in FIG. The cutting control unit 182e repeats this operation n times, and finally cuts the semiconductor package 210 to a depth of L2 + D as shown in FIG.

  Further, the cutting control unit 182e specifies an optimal cutting pattern for cutting the semiconductor package 210 using the information of the semiconductor package 210 stored in the storage unit 183, and the semiconductor package 210 is based on the specified cutting pattern. May be cut. For example, the cutting control unit 182e acquires the coordinates of the two diagonal points of the semiconductor package 210 and the position information of the surrounding parts, and generates a cutting pattern with a low possibility of the cutting tool 120 coming into contact with the surrounding parts. Select one of the patterns. Then, the semiconductor package 210 is cut based on the selected cutting pattern. The cutting pattern may be a cutting pattern for cutting the semiconductor package 210 in a spiral shape as shown in FIG. 13A, for example. Further, for example, as shown in FIG. 13B, a cutting pattern in which cutting is repeated in an L shape may be used. For example, as shown in FIG. 13C, a cutting pattern in which cutting is repeated in a U shape may be used. When the cutting is completed, the cutting control unit 182e stops the cutting at one end.

  Returning to the flow of FIG. 4, the cutting control unit 182e determines whether a new instruction has been received from the user (step S160). When the instruction is not received from the user, step S160 is repeated until the instruction is received (step S160: No). If an instruction has been received, the process proceeds to step S170 (step S160: Yes).

  The cutting control unit 182e determines whether the received instruction is an additional cutting instruction from the user or an instruction to end cutting (step S170). In the case of a cutting end instruction, the cutting control unit 182e ends the cutting process (step S170: No). In the case of an instruction for additional cutting, the process proceeds to step S180 (step S170: Yes).

The cutting control unit 182e additionally cuts the semiconductor package 210 based on an instruction from the user (step S180). For example, if the user has instructed to additionally cut the depth a, as shown in FIG. 12 (D), further from the position of the depth D (position _dn shown in FIG. 12 (D)) The semiconductor package 210 is cut by the depth a (step S180). If cutting is completed, it will return to step S160 and will wait for the instruction | indication from a user again.

  If there is still uncut material even after additional cutting, the user removes the uncut material using a soldering iron or the like. In FIG. 12D, it appears that a large amount of uncut residue is generated, but in reality, the inclination of the semiconductor package 210 is slight, and hardly left uncut. Even if uncut residue is generated, in most cases, there is only a small amount of uncut residue at one of the four corners, which can be easily removed by the user.

  According to the present embodiment, information on the height of the highest corner among the four corners of the upper surface of the semiconductor package 210 is acquired, and the semiconductor package 210 is cut based on the acquired height. The semiconductor package 210 is manufactured with extremely high precision, and it is considered that the upper surface thereof has almost no warpage or inclination. Therefore, by using the height of the highest corner of the semiconductor package 210 as a reference, even if the printed board 200 cannot be directly measured, only the semiconductor package 210 can be cut accurately without cutting the printed board 200.

  If the height of the highest corner is used as a reference, uncut parts may occur. However, in the present embodiment, since it is configured so that additional cutting can be performed based on a user's instruction, the uncut portion of the semiconductor package 210 can be minimized. Even if there is an uncut material, the uncut material is so small that it can be easily removed using a soldering iron or the like.

  Further, since the positional relationship between the cutting tool fixing portion 130 and the tip of the cutting tool 120 (that is, the length of the cutting tool 120) is precisely measured using a laser displacement meter or a laser distance meter, the cutting tool 120 The tip can be accurately moved to a desired height (depth). Therefore, the semiconductor package 210 can be cut accurately, and as a result, the printed circuit board 200 can be prevented from being cut by mistake.

  In addition, since the positional relationship between the cutting tool fixing portion 130 and the tip of the cutting tool 120 is specified every time cutting of the semiconductor package 210 is newly started, the semiconductor tool 210 is repeatedly cut and the cutting tool 120 is worn. Even if it occurs (that is, even if the length of the cutting tool 120 is slightly changed), the tip of the cutting tool 120 can be accurately moved to a desired height (depth). Therefore, the semiconductor package 210 can be cut accurately.

  The above-described embodiment is an example, and various changes and applications are possible.

  For example, in the above-described embodiment, the cutting tool 120 is a flat end mill, but the cutting tool 120 is not limited to a flat end mill. For example, other end mills such as a ball end mill, a roughing end mill, and a radius end mill may be used. Moreover, the cutting tool 120 is not limited to an end mill, For example, milling machines other than end mills, such as a face mill and a flat milling machine, may be sufficient. Moreover, the cutting tool 120 is not limited to a milling cutter, and can be various other known cutting tools. For example, the cutting tool 120 may be a drill in which an abrasive is applied to the peripheral surface near the tip, and cutting in a direction orthogonal to the axial direction is also possible.

  The cutting apparatus 100 may include a pressing unit that presses the printed circuit board 200 against the installation surface of the installation table 110 and corrects the warp or the deflection of the printed circuit board 200. The pressing portion may be configured to press the four corners of the printed circuit board 200 from above, or may be configured to press only the periphery of the semiconductor package 210 to be cut from above. The inclination of the semiconductor package 210 can be suppressed to a minimum by correcting the warp and the bending of the printed circuit board 200. As a result, the uncut portion of the semiconductor package 210 can be minimized.

  In the above-described embodiment, the height of the four corners of the upper surface of the semiconductor package 210 is measured, and the height information of the corner at the highest position is obtained by comparing the four measurement data. There is no need to measure the height of the corners. If three points on the upper surface of the semiconductor package 210 can be measured, the height of the corner at the highest position can be calculated and acquired.

  Moreover, the cutting device 100 may be provided with a dust collection mechanism that absorbs cutting waste cut by the cutting tool 120 and stores it in a dust box. Interference with cutting by cutting waste can be prevented.

  In addition, the cutting apparatus 100 may include a camera installed so as to be able to image the printed circuit board 200 installed on the installation table 110. The camera may be configured to output a video signal to an external device (for example, a monitor) via the external interface 184. Since the cutting state can be easily visually confirmed, the user can easily estimate the additional cutting amount when additional cutting is necessary.

  Further, the cutting device 100 is connected to an abnormality detection device that detects an abnormality of the semiconductor package mounted on the printed circuit board, and information on the semiconductor package in which the abnormality is detected (for example, the position of the semiconductor package on the printed circuit board or the part number). ) May be obtained. The cutting apparatus 100 may be configured to remove the semiconductor package based on the acquired information.

  In the above-described embodiment, the semiconductor package 210 to be cut is described as being a CSP. However, the semiconductor package 210 to be cut is not limited to a CSP. For example, it may be a surface mount package such as SOP (Small Outline Package) or BGA (Ball Grid Array), or an insert package such as DIP (Dual Inline Package) or PGA (Pin Grid Array). May be.

  Cutting device 100 of the present embodiment may be realized by a dedicated system or an ordinary computer system. For example, the cutting apparatus 100 may be configured by storing and distributing a program for performing the above-described operation in a computer-readable recording medium, installing the program in a computer, and executing the above-described processing. Good. Further, it may be stored in a disk device provided in a server device on a network such as the Internet so that it can be downloaded to a computer, for example. Further, the above-described functions may be realized by joint operation of the OS and application software. In this case, only the part other than the OS may be stored and distributed in a medium, or may be downloaded to a computer.

  Various embodiments and modifications can be made to the present invention without departing from the broad spirit and scope of the present invention. The above-described embodiments are for explaining the present invention and do not limit the scope of the present invention. In other words, the scope of the present invention is shown not by the embodiments but by the claims. Various modifications within the scope of the claims and within the scope of the equivalent invention are considered to be within the scope of the present invention.

DESCRIPTION OF SYMBOLS 100 Cutting device 110 Installation stand 111 Fixing tool 120 Cutting tool 130 Cutting tool fixing | fixed part 140 Measuring part 141 Light projection lens 150 Right-and-left moving part 151 Slide rail 160 Front and rear moving part 161 Slide rail 170 Switch 180 Main part 181 Slide rail 182 Control part 182a Conversion table creation unit 182b Position relation identification unit 182c Height information acquisition unit 182d Depth information acquisition unit 182e Cutting control unit 183 Storage unit 184 External interface 200 Printed circuit board 210 Semiconductor package

Claims (8)

A cutting device for cutting and removing a semiconductor package from a printed circuit board,
Height information acquisition means for acquiring information on the height of a corner at the highest position among the four corners of the upper surface of the semiconductor package;
Depth information acquisition means for acquiring information of the depth to be cut;
Cutting control means for cutting the semiconductor package parallel to the installation surface of the printed circuit board,
The cutting control means cuts from the height acquired by the height information acquisition means to the depth acquired by the depth information acquisition means,
The cutting device characterized by the above. A rod-shaped cutting tool,
A cutting tool fixing portion for fixing the cutting tool so that an axis is perpendicular to the installation surface;
A positional relationship specifying means for specifying a positional relationship in the axial direction between the tip of the cutting tool and the cutting tool fixing portion;
The cutting control means determines the amount of movement of the cutting tool fixing portion necessary for the tip of the cutting tool to move to a predetermined depth based on the positional relationship specified by the specifying means, and the determined movement Moving the cutting tool fixing portion in the axial direction based on the amount;
The cutting apparatus according to claim 1. The positional relationship specifying means specifies the positional relationship every time the cutting control means newly starts cutting the semiconductor package,
The cutting apparatus according to claim 2. Storage means for storing information on the thickness of the semiconductor package;
The depth information acquisition means specifies a depth to be cut using information on the thickness of the semiconductor package stored in the storage means.
The cutting device according to any one of claims 1 to 3, wherein The cutting control unit waits for an additional cutting instruction to be input after cutting to the depth acquired by the depth information acquisition unit, and further receives an additional cutting instruction based on the instruction. Cutting deeper,
The cutting device according to any one of claims 1 to 4, wherein Means for acquiring information of the semiconductor package to be cut;
The cutting control means selects one of a plurality of cutting patterns based on the acquired information of the semiconductor package, and cuts the semiconductor package based on the selected cutting pattern.
The cutting apparatus according to any one of claims 1 to 5, wherein A cutting method for cutting and removing a semiconductor package from a printed circuit board,
A height information acquisition step of acquiring information on the height of a corner at the highest position among the four corners of the upper surface of the semiconductor package;
A depth information acquisition step for acquiring information on the depth to be cut;
Cutting control step of cutting the semiconductor package in parallel with the installation surface of the printed circuit board,
In the cutting control step, cutting from the height acquired in the height information acquisition step to the depth acquired in the depth information acquisition step,
The cutting method characterized by the above-mentioned. To a computer that controls a cutting device that cuts and removes a semiconductor package from a printed circuit board,
A height information acquisition function for acquiring information on the height of the corner at the highest position among the four corners of the upper surface of the semiconductor package;
A depth information acquisition function for acquiring information on the depth to be cut;
A cutting control function for cutting the semiconductor package from a height acquired by the height information acquisition function in parallel with an installation surface of the printed circuit board to a depth acquired by the depth information acquisition function is realized.
A program characterized by that.

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