CN103596368A - Improved direct laser drilling processing method - Google Patents
Improved direct laser drilling processing method Download PDFInfo
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- CN103596368A CN103596368A CN201310479279.1A CN201310479279A CN103596368A CN 103596368 A CN103596368 A CN 103596368A CN 201310479279 A CN201310479279 A CN 201310479279A CN 103596368 A CN103596368 A CN 103596368A
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- skylight
- copper foil
- laser drilling
- target
- windowing
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Abstract
The invention discloses an improved direct laser drilling processing method. The improved direct laser drilling processing method is characterized by including the steps of laminating and direct laser drilling. The laminating includes the steps of opening a window in a copper foil on a skylight layer in a milled mode to form a window opening target region, conducting laminating processing by using a folded plate table infrared ray generator to generate infrared rays to form four intersected ray pots to locate window opening target regions when folded plates are laminated, and conducting melanism processing. The direct laser drilling includes the steps of conducting ablation on prepregs exposed out of the four window opening target regions of the copper foil on the skylight layer through a preset procedure, enabling a sub-outer-layer receiving disc and an aligning target hole to be exposed out, and conducting direct laser drilling with the aligning target hole serving as a location standard. According to the improved direct laser drilling processing method, the mode that the window is directly opened at the position of a location target in the copper foil on the skylight layer is adopted, the problem that the ablation state of the location target is inconsistent due to uneven preprocessing is thoroughly solved, the production process is stable, the production efficiency is obviously improved, the infrared ray intersected ray pots are used for locating, the location accuracy is improved, and the laser ablation quality of the aligning target hole is sufficiently guaranteed.
Description
Technical field
The present invention relates to laser drilling method, specifically the direct drilling method of a kind of improved laser.
Background technology
HDI is the abbreviation of high density interconnect (High Density Interconnection), is a kind of technology of production printed board, uses the higher circuit board of a kind of circuit distribution density of micro-blind buried via hole technology.Electronic Design is when improving constantly overall performance, also making great efforts to dwindle its bulk, while more intensive logical network of framework in limited space, in small portable product from mobile phone to intellectual weapon, device pitch is less, I/O pin and the more packaging body of embedded passive device have shorter and shorter response time and higher frequency, they all require less PCB characteristic size, and this has promoted the tight demand to the miniature via hole of HDI/.The hole that all diameters are less than below 150um is in the industry cycle called as micropore (Microvia), utilize the circuit that the geometry techniques of this micropore has been done can improve the benefit of assembling, space utilization etc., miniaturization for electronic product simultaneously also has its necessity, and HDI is the compact product that aims at low capacity user design.HDI plate generally adopts lamination method (Build-up) manufacture, and the number of times of lamination is more, and the technical grade of plate is higher.Common HDI plate is 1 lamination substantially, and high-order HDI adopts 2 times or above laminating technique, advanced PCB technology such as adopting folded hole simultaneously, electroplate filling perforation, laser is directly holed.
The positioning target of traditional direct drilling technique of laser generally adopts melanism or brown to carry out surface preparation to Copper Foil, then adopts the mode of laser ablation to process; As shown in Figure 2, that conventional laser is directly holed and burnt target mode schematic diagram, in figure, skylight layer Copper Foil 1 presses together by prepreg 3 and core 4, under the effect of laser beam 5, skylight layer Copper Foil 1 be ablated goes out to lose copper target area 1a, now, prepreg 3 is by Partial ablation, and residual thickness is inhomogeneous; Under the continuation effect of laser beam 5, the prepreg 3 of erosion 1a bottom, copper target area is by ablation completely, and the contraposition wad cutter 2a that sees through time outer tray 2 is to core 4 internal ablations, forms deep mixed hole, when serious, can cause core ablation to puncture 4a.As can be seen here, due to pretreated inhomogeneous, the ablation state of positioning target is inconsistent, and production process is unstable, has a strong impact on production efficiency.
Summary of the invention
According to the technical problem of above-mentioned proposition, and provide a kind of improved laser direct drilling method.The present invention mainly utilizes the directly mode of positioning target position windowing on the layer Copper Foil of skylight, replaces the processing method of laser ablation, thereby plays accurate positioning, and production efficiency improves texts.
The technological means that the present invention adopts is as follows:
The direct drilling method of laser, is characterized in that: comprise that lamination and laser directly holes;
Described lamination comprises the steps:
1) on CNC milling machine, use default milling program at four jiaos of windowings of skylight layer Copper Foil, form the target area of windowing;
2) during laminated stacked plate, the skylight layer Copper Foil that first tiles on lower runner plate, and make its back-adhesive surface upward; Then use lamination table infrared generator to produce infrared ray and form four intersection luminous points, and traveling light spot position aligns itself and four target areas of windowing; Get the printed board core a little welding and keep flat on the layer Copper Foil of skylight by correct direction, and make its inferior outer tray of four jiaos aim at four infrared rays intersection luminous points; Finally, the skylight layer Copper Foil that tiles on core, its back-adhesive surface down, and aim at four infrared rays and intersect luminous points, covers runner plate, lamination process by the target area of windowing of four jiaos;
3) printed board after lamination is carried out to melanism processing;
Described laser directly hole (LDD, laser direct drilling) comprise the steps:
1) prepreg that adopts pre-set programs to expose four target areas of windowing of skylight layer Copper Foil carries out ablation, exposes time outer tray and contraposition wad cutter;
2) take contraposition wad cutter as positioning datum, adopt pre-set programs to carry out laser and directly hole.
Further, the target area of windowing of described skylight layer Copper Foil is the circle of square or the diameter 6-8mm of length of side 6-8mm.
Further, the spacing of target area of windowing described in four is identical with the spacing of four time outer trays on described printed board core.
Compared with prior art, compare, the present invention has the following advantages:
1, use the directly mode of positioning target position windowing on the layer Copper Foil of skylight, the processing method that replaces laser ablation, thoroughly stopped the ablation state inconsistence problems due to the pretreated inhomogeneous positioning target producing, stable production process, production efficiency significantly improves.
2, the infrared ray edges of boards locate mode of laminated stack is changed to and use location, infrared ray crosspoint, improve positioning precision, fully guaranteed the laser ablation quality of contraposition wad cutter.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 1 is laminated stacked plate method schematic diagram of the present invention.
Fig. 2 is that conventional laser is directly holed and burnt target mode schematic diagram.
Fig. 3 is that laser of the present invention is directly holed and burnt target mode schematic diagram.
Fig. 4 is laminated construction schematic diagram of the present invention.
Fig. 5 is that laser of the present invention is directly holed and burnt target structure effect schematic diagram.
In figure: 1, skylight layer Copper Foil 1a, erosion copper target area 1b, the target area 2 of windowing, inferior outer tray 2a, contraposition wad cutter 3, prepreg 4, core 4a, core ablation puncture that 4b, core ablation do not puncture 5, laser beam 6, up/down runner plate 7, infrared ray 7a, luminous point
Embodiment
The invention provides the direct drilling method of a kind of improved laser, as shown in Figure 1, is laminated stacked plate method schematic diagram of the present invention.During laminated stacked plate, the skylight layer Copper Foil 1 that first tiles on lower runner plate 6, and make its back-adhesive surface upward; Then use lamination table infrared generator to produce infrared ray and form four intersection luminous point 7a, and traveling light spot 7a position aligns itself and four target area 1b that window; Get the printed board core 4 a little welding and keep flat on skylight layer Copper Foil 1 by correct direction, and make its inferior outer tray of four jiaos 2 aim at four infrared rays intersection luminous point 7a; Finally, the skylight layer Copper Foil 1 that tiles on core 4, down, and the target area 1b that windows of four jiaos aims at four infrared rays and intersects luminous point 7a its back-adhesive surface, covers runner plate 6, lamination process, then the printed board after lamination is carried out to melanism processing.Wherein, described skylight layer Copper Foil 1 used default milling program processing on CNC milling machine, four jiaos of windowings at Copper Foil, the formation target area 1b that windows, the described target area 1b that windows is for square (length of side 6-8mm) or circular (diameter 6-8mm), and the spacing of four target area 1b that window is identical with the spacing of four outer trays 2 on printed board core 4.
As shown in Figure 3, Figure 4, the prepreg 3 that adopts pre-set programs to expose four of the skylight layer Copper Foil 1 target area 1b that window carries out ablation, be that laser beam 5 acts directly on the consistent prepreg of even thickness 3, time outer tray 2 and contraposition wad cutter 2a are exposed in ablation; The contraposition wad cutter 2a of take is again positioning datum, and the downward ablation depth of laser beam 5 is consistent substantially, carries out laser and directly holes, i.e. core ablation does not puncture 4b, as shown in Figure 5.
The above; it is only preferably embodiment of the present invention; but protection scope of the present invention is not limited to this; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; according to technical scheme of the present invention and inventive concept thereof, be equal to replacement or changed, within all should being encompassed in protection scope of the present invention.
Claims (3)
1. the direct drilling method of improved laser, is characterized in that: comprise that lamination and laser directly holes;
Described lamination comprises the steps:
1) at four angular milling windowings of skylight layer Copper Foil, form the target area of windowing;
2) during laminated stacked plate, the skylight layer Copper Foil that first tiles on lower runner plate, and make its back-adhesive surface upward; Then use lamination table infrared generator to produce infrared ray and form four intersection luminous points, and traveling light spot position aligns itself and four target areas of windowing; Get the printed board core a little welding and keep flat on the layer Copper Foil of skylight by correct direction, and make its inferior outer tray of four jiaos aim at four infrared rays intersection luminous points; Finally, the skylight layer Copper Foil that tiles on core, its back-adhesive surface down, and aim at four infrared rays and intersect luminous points, covers runner plate, lamination process by the target area of windowing of four jiaos;
3) printed board after lamination is carried out to melanism processing;
Described laser directly boring comprises the steps:
1) prepreg that adopts pre-set programs to expose four target areas of windowing of skylight layer Copper Foil carries out ablation, exposes time outer tray and contraposition wad cutter;
2) take contraposition wad cutter as positioning datum, carry out laser and directly hole.
2. the direct drilling method of a kind of improved laser according to claim 1, is characterized in that: the target area of windowing of described skylight layer Copper Foil is the circle of square or the diameter 6-8mm of length of side 6-8mm.
3. the direct drilling method of a kind of improved laser according to claim 1, is characterized in that: the spacing of the target area of windowing described in four is identical with the spacing of four outer trays on described printed board core.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310479279.1A CN103596368A (en) | 2013-10-14 | 2013-10-14 | Improved direct laser drilling processing method |
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| CN201310479279.1A CN103596368A (en) | 2013-10-14 | 2013-10-14 | Improved direct laser drilling processing method |
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| CN103596368A true CN103596368A (en) | 2014-02-19 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104690769A (en) * | 2015-02-12 | 2015-06-10 | 大连崇达电路有限公司 | Processing method of finished holes of circuit board with inner-layer copper thickness of more than 420 micrometers |
| CN106170181A (en) * | 2016-08-31 | 2016-11-30 | 博敏电子股份有限公司 | Hole docking calculation is folded in a kind of wiring board production high-precision laser hole |
| CN106341961A (en) * | 2016-09-12 | 2017-01-18 | 深圳市景旺电子股份有限公司 | High-density interconnection printed circuit board and method of increasing aligning degree of blind hole and graph |
| CN104303608B (en) * | 2014-08-11 | 2017-05-31 | 深圳崇达多层线路板有限公司 | One kind row's panel assembly and row's plate method |
| CN109104829A (en) * | 2018-08-31 | 2018-12-28 | 生益电子股份有限公司 | A kind of profound and subtle hole production method and PCB |
| CN109348651A (en) * | 2018-10-16 | 2019-02-15 | 欣强电子（清远）有限公司 | A kind of ELIC pcb board part position alignment of inner layer plates processing method |
| CN109348624A (en) * | 2018-10-11 | 2019-02-15 | 安捷利（番禺）电子实业有限公司 | A kind of alignment method of laser blind hole |
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| JPH0555724A (en) * | 1991-08-13 | 1993-03-05 | Hitachi Seiko Ltd | Formation of hole through printed circuit board by use of laser |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104303608B (en) * | 2014-08-11 | 2017-05-31 | 深圳崇达多层线路板有限公司 | One kind row's panel assembly and row's plate method |
| CN104690769A (en) * | 2015-02-12 | 2015-06-10 | 大连崇达电路有限公司 | Processing method of finished holes of circuit board with inner-layer copper thickness of more than 420 micrometers |
| CN106170181A (en) * | 2016-08-31 | 2016-11-30 | 博敏电子股份有限公司 | Hole docking calculation is folded in a kind of wiring board production high-precision laser hole |
| CN106170181B (en) * | 2016-08-31 | 2018-12-21 | 博敏电子股份有限公司 | A kind of wiring board production folded hole interconnection method in high-precision laser hole |
| CN106341961A (en) * | 2016-09-12 | 2017-01-18 | 深圳市景旺电子股份有限公司 | High-density interconnection printed circuit board and method of increasing aligning degree of blind hole and graph |
| CN106341961B (en) * | 2016-09-12 | 2019-04-16 | 深圳市景旺电子股份有限公司 | High density interconnected printed circuit board and the method for improving blind hole and pattern alignment degree |
| CN109104829A (en) * | 2018-08-31 | 2018-12-28 | 生益电子股份有限公司 | A kind of profound and subtle hole production method and PCB |
| CN109348624A (en) * | 2018-10-11 | 2019-02-15 | 安捷利（番禺）电子实业有限公司 | A kind of alignment method of laser blind hole |
| CN109348651A (en) * | 2018-10-16 | 2019-02-15 | 欣强电子（清远）有限公司 | A kind of ELIC pcb board part position alignment of inner layer plates processing method |
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