CN1761378A - Method of drilling a hole through Co2 laser directly - Google Patents
Method of drilling a hole through Co2 laser directly Download PDFInfo
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- CN1761378A CN1761378A CN 200510103274 CN200510103274A CN1761378A CN 1761378 A CN1761378 A CN 1761378A CN 200510103274 CN200510103274 CN 200510103274 CN 200510103274 A CN200510103274 A CN 200510103274A CN 1761378 A CN1761378 A CN 1761378A
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Abstract
Drilling method of carbon dioxide laser includes steps: preparing locating point on layer next to the outer layer; before pressfitting added layer, browning oxidizing surface of target bonding pad; after pressfitting added layer, milling location hole / polishing edge, washing surface under high pressure; browning front surface of copper, thinning and coursing the surface before drilling hole by layer; first time to drill hole by laser; positioning film perforation by using plate location hole in original etching method for making window of copper, burning through copper foil and resin above the locating point on layer next to the outer layer so as to expose the locating point; second time to drill hole by laser; using the exposed locating point as position fixing to make micro hole inplate; washing surface under high pressure to remove browning layer after drill hole. The invention saves dry film and etching liquid, and raises process precision.
Description
Technical field
The invention belongs to printed circuit board (PCB) (PCB) manufacturing technology field, relate to the method that a kind of employing CO2 (carbon dioxide) laser drilling machine directly carries out laser drill.
Background technology
In existing P CB course of manufacturing printed circuit board, as making the high density interconnect plate, need on the central layer of carrying out circuit, pressing increase layer, get out the micropore of aiming at target pad (being existing line layer disk figure on the central layer) with laser increasing on the layer then.What existing method for drilling holes adopted usually is traditional etching Conformal Mask (conformal) flow process, promptly earlier be covered with dry film at the plate face, utilize method imaging on dry film of image transfer again, after overexposure, development, etching, removing operation such as glue, need the Copper Foil in laser drill zone to etch away in the plate face, and then carry out laser drill.As shown in Figure 1, this etches open copper window method for drilling holes, specifically comprises the steps:
1) preceding processing procedure (pressing increases layer): central layer increases layer through pressing and obtains plate shown in A among Fig. 1;
2) pre-treatment (cleaning surfaces is scrubbed processing);
3) image transfer: obtain plate shown in B among Fig. 1 through press mold earlier, (be followed successively by photopolymer layer 1, table copper layer 2 on it from outside to inside, increase layer of material 3 and central layer 4, through hole 5 and target pad 10 are arranged on the central layer; Obtain plate shown in C among Fig. 1 through the exposure of engineering egative film with after developing again;
4) etching: obtain plate shown in D among Fig. 1 through etching, the copper window 6 that has lost out is arranged on it;
5) remove glue: after removing glue, obtain plate shown in E among Fig. 1;
6) detect;
7) laser drill: the copper window place that has lost out on outer (promptly pressing increase layer) carries out laser drill processing, obtains plate shown in F among Fig. 1 after the laser drill, and micropore 7 in the plate that laser drill processes is arranged on it.
The shortcoming of this method is:
1, cost is higher: need open copper window (conformal), through image transfer and etchant flow, consume dry film and etching liquid medicine;
2, precision is relatively poor: its precision is egative film precision (0.5mil in), open copper window aligning accuracy (in the 2mil) and laser drill precision (1mil is interior) three's sum.
Summary of the invention
The technical problem to be solved in the present invention is: a kind of copper window that need not to etch open is provided, and cost-saved, the direct CO2 method for drilling holes of raising laser drill precision.
Technical scheme of the present invention is as follows:
A kind of direct CO2 method for drilling holes, it comprises the following steps:
1) in inferior skin (being the central layer outermost layer) epigraph transfer process, designs and produces out the anchor point that is used to process micropore in the plate;
2) before the pressing brown oxidation processes is carried out on the surface of target pad layer;
3) preceding processing procedure (pressing increase layer): pressing increases layer on central layer, this increase layer comprise one deck prepreg (main component is a resin) and on one deck Copper Foil;
4) mill location hole/drag for limit: bore that target drone is got outer earth hole (being the location hole of power auger through hole) and to film perforation (being the egative film location hole of former etching Conformal Mask) with X ray;
5) high-pressure washing: clean is carried out on the copper surface;
6) table copper brown before the laser drill: thinning and roughening treatment are carried out in the copper surface;
7) laser drill for the first time: use film perforation is positioned, will be positioned at time Copper Foil and the resin of outer field anchor point top and ablate, expose the anchor point on time skin;
8) laser drill for the second time: position processing ejecting plate interior micropore in location with the anchor point on inferior skin that exposes after the processing of front;
9) high-pressure washing is carried out on the copper surface after the laser drill and wash away, make to remove the brown layer and handle.
Main points of the present invention are as follows:
1. laser drill processing adopts time outer anchor point of producing by image transfer of going up to locate, and has guaranteed the micropore that laser gets out and the Aligning degree of target pad, has improved the laser drill precision;
2. the surface treatment of target pad layer must be walked the brown processing, with the convenient anchor point that grasps;
3. carry out roughening treatment (or adopting Copper Foil of handling through surface coarsening) on thin table copper, can strengthen the absorbability of Copper Foil to laser energy, like this, CO2 laser drilling machine adds man-hour just can be with the energy of the last one directly to the Copper Foil processing of ablating.
4. table copper adopts 0.3 ounce copper foil, handles through brown, plays table copper and stings the effect of thin and alligatoring, and guaranteed uniformity.
Method of the present invention has following advantage:
1. cost reduces: without etching open copper window (conformal) flow process, operation and time have also been saved in the consumption of having saved dry film and etching liquid medicine;
2. machining accuracy improves: have only the mismachining tolerance of laser drilling machine in the process, improved machining accuracy.
Description of drawings:
Fig. 1 is the schematic diagram that tradition is opened copper window method for drilling holes;
Fig. 2 is a direct CO2 method for drilling holes schematic diagram of the present invention;
Fig. 3 is the photo of taking after the direct laser drill among the present invention;
Fig. 4 carries out surperficial reprocessing photo afterwards again among the present invention;
Fig. 5 is the photo after the direct laser drill re-plating of pressing RCC plate among the present invention;
Fig. 6 is the photo after the direct laser drill re-plating of pressing FR-4LDP plate among the present invention.
Embodiment
The invention will be further described below in conjunction with drawings and Examples.
The present invention carries out operation by the following method, is example with single order laser drill (1+n+1):
1) making anchor point on the inferior skin: carry out in the image transfer at inferior skin (being outermost one deck of central layer), on four angles, design and produce out the anchor point that is used to process micropore in the plate;
2) target pad layer surface oxidation before the pressing: can only walk brown and handle (normal operation condition), to improve the adhesion of copper-clad surface and resin face, simultaneously, the convenient anchor point that grasps;
3) pressing prepreg and Copper Foil: prepreg (pre-preg) is selected RCC (gum Copper Foil) or LDP (laser cloth) for use, (this is two kinds of layer materials that increase commonly used, main component is an insulating resin, also contain glass fabric among the LDP), Copper Foil is selected 0.3 ounce copper foil for use, (increase layer through pressing and obtain plate shown in A among Fig. 2);
4) mill location hole/drag for limit: bore that target drone is got outer earth hole (location hole of power auger through hole) and to film perforation (in the former etching Conformal Mask, be positioned on outer field four angles of central layer, be used for the hole that egative film is located on the plate face) with X ray;
5) high-pressure washing is opened brush: the 0.3 ounce copper foil high-pressure washing that need get ahead is opened brush, and it is residual to reduce glue, avoids brown to reveal copper;
6) table copper brown before the laser drill: with Bond film (a kind of brown liquid medicine brand, Germany Instituut Voor Agrotechnologisch Onderzoek (ATO-DLO) product) line carries out the brown operation, control copper is thick, to improve the roughness on copper surface, increase of the absorption of copper surface to laser, (after table copper brown, obtain plate shown in K among Fig. 2, be followed successively by table copper roughened layer 11, table copper layer 2 on it from outside to inside, increase layer of material 3 and central layer 4, through hole 5 and target pad 10 are arranged on the central layer);
7) the laser drill first step: use earlier film perforation is positioned,, will be positioned at time Copper Foil and the resin of outer field anchor point top and ablate, expose the anchor point 8 (shown in M plate among Fig. 2) on time skin with one group of laser drill program; Second step positioned with this group anchor point again, adopted another group laser drill program, and the location processes micropore 9 in the plate of aiming at target pad 10 (shown in N plate among Fig. 2);
8) high-pressure washing is carried out on the copper surface after the laser drill and wash away, make to remove the brown layer and handle (directly the photo of taking after the laser drill is seen Fig. 3, carries out surperficial reprocessing photo afterwards again and sees Fig. 4);
9) machine drilling: for referencial use with the Lapie that contracts that the laser drilling machine provides, make location hole with earth hole and get out through hole;
10) electroplate: at direct laser drill plate, the lateral erosion of hole wall may be bigger, and copper facing must be strengthened quality management and control (photo after the direct laser drill re-plating of pressing RCC plate is seen Fig. 5, and the photo after the direct laser drill re-plating of pressing FR-4LDP plate is seen Fig. 6).
As carrying out second order laser drill (2+n+2), then above-mentioned single order laser drill program the 10th) after the step electroplated and to finish and made circuit, one of pressing is new again increased layer, since the 2nd) go on foot and do again one time by said procedure.
Find out that from above directly the laser drill method is different from the characteristics that tradition etches open copper window laser drill method and mainly shows following several respects:
(1), anchor point and Aligning degree control
1. anchor point adopts the anchor point that comes out by the image transfer etching on the central layer to locate;
2. just the location is used earlier by what X ray brill target drone was got film perforation (being the egative film location hole of former etching Conformal Mask) is made location hole, (for preventing that anchor point comes off when ablating, (2.0 * 2.0mm) than anchor point periphery copper clad patterns (2.5 * 2.5mm) is little) for the machining area of anchor point to expose anchor point on the central layer after the laser ablation processing;
3. make micropore in the benchmark processing plate (for improving its positioning accuracy, anchor point need grasp 2 times) with anchor point;
4. adopt with one deck positioning principle, no matter want the several layers that increase of pressing, its laser drill location is that (the machine drilling location hole is still used earth hole on time skin with the outermost layer that figure (pad) all designs at central layer, need not to add and dash), example: 6 laminates of 1+4+1 in this way, the layer at L2/L5 is all designed with figure (pad) in its location; 8 laminates of 2+4+2 in this way, then the layer at L3/L6 is all designed with figure (pad) in its location.
(2), oxide side alligatoring mode
Only adopt the brown processing mode, add in the hope of laser drill and can more clearly grasp anchor point man-hour, the brown condition is normal.
(3), pressing prepreg and Copper Foil
1. pressing obtains processing quality preferably with first-selected RCC of prepreg and LDP during in the hope of laser drill;
2. table copper is selected 0.3 ounce copper foil for use, and purpose is in order to reduce the thinning flow process, to reduce the thick variation of copper.
(4), high-pressure washing flow process
It is residual to reduce copper foil surface glue, reduces the brown surface and reveals the copper phenomenon.
(5), table copper roughening treatment
Adopt brown to carry out copper surface coarsening (than melanism, can adjust alligatoring by adjusting transmission speed), production line for Copper Foil being controlled certain thickness (about 7um), adopts 2 browns processing not for the Bond-film line more conveniently.
(6), laser drill processing
1. adopt the mode of substep processing, first energy is stronger, processing Copper Foil and part prepreg (laser drill medium); Several the energy in back a little less than, processing prepreg (processing RCC only need 1-2 to send out); Laser drill is opened copper window condition (board is Mitsubishi's laser drilling machine): first: aperture 5mil, pulsewidth 10us, energy 15mj/ send out; Several of backs: aperture 4mil, pulsewidth 10us, energy 12mj/ send out.
2. utilize the Lapie that contracts (mean value) of laser drill board statistics to offer machine drilling usefulness.
(7), surperficial reprocessing
Open the mode of brush with high-pressure washing and promptly the splashings on surface can be removed totally, so also do not increase flow process.
Claims (8)
1, a kind of direct CO2 method for drilling holes is characterized in that it comprises the following steps:
Earlier in inferior outer epigraph transfer process, design and produce out the anchor point that is used to process micropore in the plate;
Before pressing increases layer, brown oxidation processes is carried out on target pad layer surface;
Increase layer in preceding processing procedure pressing, and mill location hole/drag for after the limit, carry out cleaning surfaces with the high-pressure washing mode and handle;
Before laser drill, show the copper brown earlier, roughening treatment is carried out on the copper surface;
Laser drill is carried out step by step:
Laser drill for the first time: use by X ray and bore target drone gets film perforation is positioned, will be positioned at time Copper Foil and the resin of outer field anchor point top and ablate, expose the anchor point on time skin;
Laser drill for the second time: position micropore in the location processing ejecting plate with the anchor point that exposes after the processing of front.
2, direct CO2 method for drilling holes according to claim 1 is characterized in that said method also comprises: high-pressure washing is carried out on the copper surface after the laser drill wash away, make to remove the brown layer and handle.
3, direct CO2 method for drilling holes according to claim 1 and 2 is characterized in that said method also comprises: during table copper brown before laser drill, according to circumstances did copper surface thinning earlier and handle before alligatoring.
4, direct CO2 method for drilling holes according to claim 3, it is characterized in that said method also comprises: follow-up machine drilling is for referencial use with the Lapie that contracts that the laser drilling machine provides, and makees location hole with earth hole and gets out through hole.
5, direct CO2 method for drilling holes according to claim 4 is characterized in that, several layers that increase of pressing no matter, be used to process micropore in the plate the second time laser drill anchor point all design at the i.e. time skin of the outermost layer of central layer.
6, the direct method for drilling holes of CO2 according to claim 5 is characterized in that, in the said method, Copper Foil is selected 0.3 ounce copper foil for use, and pressing is selected RCC (gum Copper Foil) or LDP (laser cloth) for use with prepreg.
7, the direct method for drilling holes of CO2 according to claim 6 is characterized in that, in the said method, before laser drill, his-and-hers watches copper carries out 2 browns to be handled.
8, the direct method for drilling holes of CO2 according to claim 7 is characterized in that, in the said method, when for the second time laser drill was made in the benchmark processing plate micropore with anchor point, anchor point grasped 2 times.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510103274 CN1761378A (en) | 2005-09-20 | 2005-09-20 | Method of drilling a hole through Co2 laser directly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510103274 CN1761378A (en) | 2005-09-20 | 2005-09-20 | Method of drilling a hole through Co2 laser directly |
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| CN1761378A true CN1761378A (en) | 2006-04-19 |
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| CN 200510103274 Pending CN1761378A (en) | 2005-09-20 | 2005-09-20 | Method of drilling a hole through Co2 laser directly |
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