CN102711382B

CN102711382B - Printed circuit board (PCB) layer-by-layer para-position laser drilling method

Info

Publication number: CN102711382B
Application number: CN201210197329.2A
Authority: CN
Inventors: 胡翠儿; 姚晓建
Original assignee: Guangzhou Mei Wei Electronics Co Ltd
Current assignee: Guangzhou Mei Wei Electronics Co Ltd
Priority date: 2012-06-14
Filing date: 2012-06-14
Publication date: 2015-02-25
Anticipated expiration: 2032-06-14
Also published as: CN102711382A

Abstract

The invention relates to a printed circuit board (PCB) layer-by-layer para-position laser drilling method. The PCB layer-by-layer para-position laser drilling method comprises the following steps: manufacturing a target on the opposite second layer of circuit board; removing a copper layer covered on the target or removing a copper layer and a resin layer covered on the target, exposing the target and performing para-position; and directing drilling a blind hole by using laser. Owing to the PCB layer-by-layer para-position laser drilling method, the problem of hole misregistration of the blind hole on the inner layer can be effectively solved.

Description

The method of PCB successively contraposition laser drilling

Technical field

The present invention relates to the manufacture method of printed circuit board, the method for the radium-shine drilling blind hole of concrete PCB successively contraposition.

Background technology

Current printed circuit board makes to high, essence, close future development, affects, PAD(pad at the bottom of blind hole by line design) design becomes little, meanwhile, bias effect between restricted flaggy, uses traditional X-RAY to bore target (twice outer graphics is superimposed), blind hole is easily caused to collapse hole, for 4 layer circuit boards

(1) when the contraposition target figure (L02/L03) designed is without skew, as shown in Figure 1a, blind hole (L0102/L0403) to internal layer PAD without skew or side-play amount little, wherein L02/L03 refers to and design contraposition target figure on L02 layer circuit board and L03 circuit board, and the target figure of the two is superimposed, L0102/L0403 makes blind hole between L01 and L02, and makes blind hole between L04 and L03;

(2) because the level to level alignment degree that contraposition target figure is superimposed is lower, when the target figure (L02/L03) designed offsets, as shown in Figure 1 b, because internal layer PAD designs little, blind hole (L0102/L0403) even collapses hole (namely blind hole deflects away from end PAD) to internal layer PAD skew.

And as can be seen from Fig. 1 b, in the process that PCB makes, the increase of pressing number of times increases difficulty for the contraposition precision of end PAD figure corresponding to blind hole, simultaneously, at the bottom of blind hole, PAD design is more and more less, too increase the difficulty of blind hole to the positional precision of end PAD, thus cause blind hole position to offset increase.

Summary of the invention

For the deficiencies in the prior art, the present invention aims to provide and a kind ofly effectively can solve the method for blind hole to the PCB of internal layer inclined hole problem successively contraposition laser drilling.

For achieving the above object, the present invention adopts following technical scheme:

The method of PCB successively contraposition laser drilling, it comprises the following steps:

Relative secondary layer circuit board makes target;

The layers of copper covered on described target is removed, or the layers of copper covered on described target and resin bed are removed simultaneously, manifest target and carry out contraposition;

The direct drilling blind hole of laser.

As improvement, the target on different secondary layer circuit boards is dislocatedly distributed, and is dislocatedly distributed and can increases target and the outer image contrast of target, reduce bit errors.

As the first execution mode appearing target, the described method by the layers of copper covered on described target and resin bed removal is: adopt laser drilling machine the layers of copper on target and resin bed to be got rid of, expose this target, the CCD simultaneously on radium-shine rig identifies this target and compensates location.

As the second execution mode appearing target, describedly by the method that the layers of copper covered on described target is removed be: Position Design corresponding with described target on layer circuit board is outside windowed figure; Use and paste dry film or wet film; Exposure target figure, by described target Graphic transitions on dry film or wet film; Development; Etching; Take off described dry film or wet film; Layers of copper above described target is removed, manifests this target.

As the third execution mode appearing target, the described method by the layers of copper covered on described target removal is: adopt machine dimensions drill, utilizes brill to chew and layers of copper above target is removed, manifest target.

As the 4th kind of execution mode appearing target, describedly by the layers of copper covered on described target with the method that resin bed is removed be: adopt X-RAY to bore target drone and get out individual layer register guide wad cutter according to relative secondary layer circuit board subscript target, manifest target.

Preferably, the method for described making target is: on relative secondary layer circuit board, paste dry film or wet film; Exposure target figure, by described target Graphic transitions on dry film or wet film; Development; Etching; Take off described dry film or wet film.

The method of PCB set forth in the present invention successively contraposition laser drilling, compared with prior art, its beneficial effect is: the invention provides a kind of when printed circuit board laser drilling technique makes, adopt burn target, the method that etches or scrape copper manifests internal layer target and carries out successively contraposition, or X-RAY bores target drone brill individual layer target, substitute traditional use X-RAY and drill through target (twice outer graphics is superimposed) method, effectively can solve blind hole to internal layer inclined hole problem.

Accompanying drawing explanation

Accompanying drawing 1a, 1b are the schematic diagram of the contraposition target of existing laser drilling;

Accompanying drawing 2 is the flow chart of the PCB of the present invention successively method of contraposition laser drilling;

Accompanying drawing 3a, 3b, 3c are the manufacturing process schematic diagram of PCB of the present invention successively contraposition laser drilling.

Embodiment

Below, by reference to the accompanying drawings and embodiment, the method for PCB of the present invention successively contraposition laser drilling is described further, understands the present invention's technological thought required for protection so that clearer.

As shown in Figure 2, the method for PCB successively contraposition laser drilling, it comprises the following steps:

S01, on relative secondary layer circuit board, make target;

Here relative secondary layer circuit board is for secondary layer circuit board in the art, the secondary layer circuit board of the art refers to that the one deck inside outermost layer circuit board is referred to as sublevel, such as in eight laminates, the second layer and layer 7 are just referred to as sublevel, and in the present invention, relative secondary layer circuit board refers to that the one deck inside other layer circuit boards except central core is all referred to as relative sublevel, same for eight laminates, wherein layer centered by the 4th layer and layer 5, 4th layer is relative sublevel for third layer, third layer is referred to as again relative sublevel for the second layer, in like manner, layer 5 is relative sublevel for layer 6, it is relative sublevel that layer 6 has relative to layer 7, recursion like this.

Making the method for target is: on relative secondary layer circuit board, paste dry film or wet film → exposure target figure, by described target Graphic transitions on dry film or wet film → carry out developing → etch → take off dry film or wet film.

Target number on each secondary layer circuit board relatively can be multiple, such as, can adopt four four angles places being distributed in circuit board, certainly, in order to contraposition is more accurate, can design more target.The shape of target figure can adopt circle, can facilitate contraposition, certainly, also can be other shape.

In the present invention, when relate to multiple secondary layer circuit board relatively all relates to target make time, in order to increase the outer image contrast of target and target, reduce bit errors, the target mutual dislocation of each layer distributes.

S02, the layers of copper that is pressed together on target and resin bed to be removed, manifest target and carry out contraposition;

The method that layers of copper on target and resin bed are removed has multiple, in the present invention, can take with under type:

A, conduct preferably execution mode, the method of burning target is adopted to remove the layers of copper and resin bed that cover on target, namely be adopt laser drilling machine the Copper Foil on target and resin bed to be got rid of, expose target, radium-shine rig CCD identifies this target and compensates location simultaneously, relative to other kind of method, the method flow burning target is used to be the simplest;

B, etching method can also be adopted to remove the layers of copper covered on target, namely be that dry film or wet film → exposure target figure are pasted in the Position Design corresponding with described target figure → use of windowing on layer circuit board outside, by described target Graphic transitions on dry film or wet film → develop → etch → take off described dry film or wet film → layers of copper above described target removed, manifest this target, this kind of mode only need be removed layers of copper and appear target, outer circuit plate described here refers to a laminate corresponding with relative sublevel press fit of circuit boards, namely blind hole is make on this outer circuit plate.

C, also can adopt the method for scraping copper, namely adopt machine dimensions drill, utilize brill to chew and remove covering layers of copper above target, manifest target.

D, conventional X-RAY can certainly be adopted to bore target drone drill through register guide wad cutter, but unlike the prior art, in the present invention, adopt X-RAY to bore target drone and get out individual layer register guide wad cutter according to relative secondary layer circuit board subscript target, manifest target.

The direct drilling blind hole of S03, laser.For directly playing the direct laser drilling making sheet of copper laser drilling, using the one in above-mentioned four kinds of methods to appear target, after directly using when laser drilling this target to position, directly beating copper laser drilling.

Below for eight laminates, further protection scope of the present invention is elaborated.

Accompanying drawing 3a, 3b, 3c are the manufacturing process schematic diagram of PCB of the present invention successively contraposition laser drilling.As shown in Figure 3 a, it is for carry out contraposition and drilling blind hole (L0304/L0605) by the L03-L06 layer circuit board of pressing, first, L04 circuit board makes target 11, L05 circuit board makes target 12, radium-shinely after the contraposition realizing between L04 circuit board and L03 circuit board by target 11 drill through blind hole 21, radium-shine after the contraposition realizing between L06 circuit board and L05 circuit board drill through blind hole 22 by target 12, wherein target 11 and target 12 are dislocatedly distributed.

As shown in Figure 3 b, the blind hole realized further between blind hole between L03 and L02 circuit board and L07 and L06 circuit board makes, now respectively with the secondary layer circuit board that L03 with L06 is relative, make target 13, target 14 respectively thereon, the same, drill through blind hole 23 and blind hole 24 respectively, wherein target 13, target 14 and target 11, target 12 are all dislocatedly distributed.

Finally, as shown in Figure 3 c, the blind hole realized further between blind hole between L02 and L01 circuit board and L08 and L07 circuit board makes, now respectively with the secondary layer circuit board that L02 with L07 is relative, make target 15, target 16 respectively thereon, the same, drill through blind hole 25 and blind hole 26 respectively, wherein target 15, target 16, target 13, target 14 and target 11, target 12 are all dislocatedly distributed.

It should be noted that, more than citing is just described in detail successively contraposition, and it does not represent that the flow process of making must be shown in Fig. 3 a-3c, because the making of blind hole is layer-by-layer preparation, therefore, the drilling through order and can determine according to actual conditions of the making of target and blind hole.

For a person skilled in the art, according to technical scheme described above and design, other various corresponding change and distortion can be made, and all these change and distortion all should belong within the protection range of the claims in the present invention.

Claims

The method of 1.PCB successively contraposition laser drilling, it is characterized in that, it comprises the following steps:

Relative secondary layer circuit board makes target, and the target on different secondary layer circuit boards is dislocatedly distributed;

The layers of copper covered on described target is removed, or the layers of copper covered on described target and resin bed are removed simultaneously, manifest target and carry out contraposition;

The direct drilling blind hole of laser.
2. the method for PCB according to claim 1 successively contraposition laser drilling, is characterized in that, describedly by the method that the layers of copper covered on described target and resin bed are removed is:

Laser drilling machine is adopted the layers of copper on target and resin bed to be got rid of, expose this target, CCD simultaneously on laser drilling machine identifies this target and compensates location, this laser drilling machine burning is synchronously located according to this target and direct drilling blind hole after going out sublevel target, realizes the direct drilling blind hole of described laser.
3. the method for PCB according to claim 1 successively contraposition laser drilling, is characterized in that, describedly by the method that the layers of copper covered on described target is removed is:

Position Design corresponding with described target on layer circuit board is outside windowed figure;

Use and paste dry film or wet film;

Exposure target figure, by described target Graphic transitions on dry film or wet film;

Development;

Etching;

Take off described dry film or wet film;

Layers of copper above described target is removed, manifests this target.
4. the method for PCB according to claim 1 successively contraposition laser drilling, is characterized in that, describedly by the method that the layers of copper covered on described target is removed is:

Adopt machine dimensions drill, utilize brill to chew and layers of copper above target is removed, manifest target.
5. the method for PCB according to claim 1 successively contraposition laser drilling, is characterized in that, describedly by the method that the layers of copper covered on described target and resin bed are removed is:

Adopt X-RAY to bore target drone and get out individual layer register guide wad cutter according to relative secondary layer circuit board subscript target, manifest target.
6. the method for PCB according to claim 1 successively contraposition laser drilling, it is characterized in that, the method for described making target is:

Relative secondary layer circuit board pastes dry film or wet film;

Exposure target figure, by described target Graphic transitions on dry film or wet film;

Development;

Etching;

Take off described dry film or wet film.