CN108500485A - A kind of production method of IC support plates laser micropore - Google Patents
A kind of production method of IC support plates laser micropore Download PDFInfo
- Publication number
- CN108500485A CN108500485A CN201710107586.5A CN201710107586A CN108500485A CN 108500485 A CN108500485 A CN 108500485A CN 201710107586 A CN201710107586 A CN 201710107586A CN 108500485 A CN108500485 A CN 108500485A
- Authority
- CN
- China
- Prior art keywords
- processed
- plate
- copper
- dry film
- support plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a kind of production methods of IC support plates laser micropore, include the following steps：Dry film is pasted to plate to be processed first, and removes the dry film in the region that needs to drill on the plate to be processed by way of exposure imaging, produces windowing；Then the layers of copper in the plate uplifting window to be processed region is etched away；Then after etching away the layers of copper of windowed regions, the remaining dry film on the plate to be processed is removed；Then CO is used to the region for etching away layers of copper in the step b2Drilling machine carries out laser drill；Then the glue residue after the laser drill is removed, and outer layer inspection is carried out to the plate to be processed.This method is using copper to CO2The characteristic hardly picked up can produce the IC support plates of special pore size distribution using the method that copper face opens small window as needed, and easy to operate.
Description
Technical field
The present invention relates to communications to be particularly related to a kind of system of IC support plates laser micropore with IC support plate processing technique fields
Make method.
Background technology
With the rise of recent cloud computing and big data, communication is also flourished with IC support plates, due to the type
Plate line density is very high, therefore design aperture is also smaller and smaller, and C02 laser drill minimum-value aperture is 75um at present, can not
Meets the needs of to the apertures 75um or less IC support plates.
Invention content
Present invention aims at a kind of production method of IC support plates laser micropore is provided, to solve not adding in the prior art
The technical issues of apertures work 75um or less IC support plates.
To achieve the above object, the present invention provides a kind of production method of IC support plates laser micropore, includes the following steps：
A, dry film is pasted to plate to be processed, and removes the dry film in the region that needs to drill on the plate to be processed, produced
Windowing；
B, the layers of copper in the plate uplifting window to be processed region is etched away；
C, after etching away the layers of copper of windowed regions, the remaining dry film on the plate to be processed is removed；
D, CO is used to the region for etching away layers of copper in the step b2Drilling machine carries out laser drill；
E, the glue residue after the laser drill is removed, and outer layer inspection is carried out to the plate to be processed.
Further, it is removed by way of exposure imaging in the step a on the plate to be processed and needs bore area
The dry film in domain.
Further, the aperture to open a window described in described step a, b, c is not more than 75um.
The invention has the advantages that：A kind of production method of IC support plates laser micropore of the present invention, this method profit
With copper to CO2The characteristic hardly picked up can produce the IC of special pore size distribution using the method that copper face opens small window as needed
Support plate, and it is easy to operate.
Description of the drawings
Below with reference to figure, the present invention is described in further detail.The attached drawing constituted part of this application is used for
A further understanding of the present invention is provided, the illustrative embodiments of the present invention and their descriptions are used to explain the present invention, does not constitute
Inappropriate limitation of the present invention.In the accompanying drawings：
Fig. 1 is the flow chart of the preferred embodiment of the present invention.
Specific implementation mode
The embodiment of the present invention is described in detail below in conjunction with attached drawing.
Referring to Fig. 1, the preferred embodiment of the present invention provides a kind of production method of IC support plates laser micropore, including with
Lower step：Dry film is pasted to plate to be processed first, and is removed by way of exposure imaging and needs to bore on the plate to be processed
The dry film of bore region, produces windowing, and windowing aperture is not more than 75um；Then the plate uplifting window to be processed region is etched away
Layers of copper, non-windowed regions because have dry film protection layers of copper be retained；Then after etching away the layers of copper of windowed regions, institute is removed
State the remaining dry film on plate to be processed；Then the region for etching away layers of copper is carried out using CO2Drilling machine carries out laser drill；
Then the glue residue after the laser drill is removed, and outer layer inspection is carried out to the plate to be processed, examines base material whether complete
Ablation is clean, and whether glue residue removes totally.
It can be seen from the above description that the above embodiments of the present invention realize following technique effect：This method profit
With copper to CO2The characteristic hardly picked up can produce the IC of special pore size distribution using the method that copper face opens small window as needed
Support plate, and it is easy to operate.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention；For the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (3)
1. a kind of production method of IC support plates laser micropore, which is characterized in that include the following steps：
A, dry film is pasted to plate to be processed, and removes the dry film in the region that needs to drill on the plate to be processed, produce windowing；
B, the layers of copper in the plate uplifting window to be processed region is etched away；
C, after etching away the layers of copper of windowed regions, the remaining dry film on the plate to be processed is removed；
D, CO is used to the region for etching away layers of copper in the step b2Drilling machine carries out laser drill；
E, the glue residue after the laser drill is removed, and outer layer inspection is carried out to the plate to be processed.
2. a kind of production method of IC support plates laser micropore according to claim 1, it is characterised in that：In the step a
The dry film in the region that needs to drill on the plate to be processed is removed by way of exposure imaging.
3. a kind of production method of IC support plates laser micropore according to claim 1, it is characterised in that：The step a, b,
The aperture to open a window described in c is not more than 75um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710107586.5A CN108500485A (en) | 2017-02-27 | 2017-02-27 | A kind of production method of IC support plates laser micropore |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710107586.5A CN108500485A (en) | 2017-02-27 | 2017-02-27 | A kind of production method of IC support plates laser micropore |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108500485A true CN108500485A (en) | 2018-09-07 |
Family
ID=63373996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710107586.5A Pending CN108500485A (en) | 2017-02-27 | 2017-02-27 | A kind of production method of IC support plates laser micropore |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108500485A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1761378A (en) * | 2005-09-20 | 2006-04-19 | 沪士电子股份有限公司 | Method of drilling a hole through Co2 laser directly |
| KR100827485B1 (en) * | 2006-08-16 | 2008-05-06 | 동부일렉트로닉스 주식회사 | Method for manufacturing in semiconductor device |
| CN201887039U (en) * | 2010-03-20 | 2011-06-29 | 厦门市英诺尔电子科技有限公司 | IC (integrated circuit) package substrate |
| CN102711382A (en) * | 2012-06-14 | 2012-10-03 | 广州美维电子有限公司 | Printed circuit board (PCB) layer-by-layer para-position laser drilling method |
| CN103068186A (en) * | 2012-12-20 | 2013-04-24 | 深圳市中兴新宇软电路有限公司 | Manufacture method of flexible printed circuit board blind hole |
| CN103369864A (en) * | 2012-03-27 | 2013-10-23 | 珠海方正科技高密电子有限公司 | Method of processing through hole on circuit board |
| CN103456643A (en) * | 2012-05-31 | 2013-12-18 | 富葵精密组件(深圳)有限公司 | Ic carrier plate and manufacturing method thereof |
| CN102802360B (en) * | 2012-08-17 | 2014-10-01 | 大连太平洋电子有限公司 | Anti-breakdown isolated laser hole blasting method in PCB processing |
| CN104869763A (en) * | 2014-02-25 | 2015-08-26 | 深圳崇达多层线路板有限公司 | High-density interconnected PCB and processing method thereof |
| CN105101623A (en) * | 2015-08-27 | 2015-11-25 | 高德（无锡）电子有限公司 | Circuit board with ultra-thin medium layers and fabrication technology of circuit board |
-
2017
- 2017-02-27 CN CN201710107586.5A patent/CN108500485A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1761378A (en) * | 2005-09-20 | 2006-04-19 | 沪士电子股份有限公司 | Method of drilling a hole through Co2 laser directly |
| KR100827485B1 (en) * | 2006-08-16 | 2008-05-06 | 동부일렉트로닉스 주식회사 | Method for manufacturing in semiconductor device |
| CN201887039U (en) * | 2010-03-20 | 2011-06-29 | 厦门市英诺尔电子科技有限公司 | IC (integrated circuit) package substrate |
| CN103369864A (en) * | 2012-03-27 | 2013-10-23 | 珠海方正科技高密电子有限公司 | Method of processing through hole on circuit board |
| CN103456643A (en) * | 2012-05-31 | 2013-12-18 | 富葵精密组件(深圳)有限公司 | Ic carrier plate and manufacturing method thereof |
| CN102711382A (en) * | 2012-06-14 | 2012-10-03 | 广州美维电子有限公司 | Printed circuit board (PCB) layer-by-layer para-position laser drilling method |
| CN102802360B (en) * | 2012-08-17 | 2014-10-01 | 大连太平洋电子有限公司 | Anti-breakdown isolated laser hole blasting method in PCB processing |
| CN103068186A (en) * | 2012-12-20 | 2013-04-24 | 深圳市中兴新宇软电路有限公司 | Manufacture method of flexible printed circuit board blind hole |
| CN104869763A (en) * | 2014-02-25 | 2015-08-26 | 深圳崇达多层线路板有限公司 | High-density interconnected PCB and processing method thereof |
| CN105101623A (en) * | 2015-08-27 | 2015-11-25 | 高德（无锡）电子有限公司 | Circuit board with ultra-thin medium layers and fabrication technology of circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 龚永林: "IC载板的制造工艺与设备特征", 《印制电路信息》 * |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180907 |