CN103945650B - The method of high-density interconnection circuit board substrate laser drilling - Google Patents
The method of high-density interconnection circuit board substrate laser drilling Download PDFInfo
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- CN103945650B CN103945650B CN201410183302.7A CN201410183302A CN103945650B CN 103945650 B CN103945650 B CN 103945650B CN 201410183302 A CN201410183302 A CN 201410183302A CN 103945650 B CN103945650 B CN 103945650B
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- substrate
- laser drilling
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- surface layers
- circuit board
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Abstract
The present invention relates to a kind of method of high-density interconnection circuit board substrate laser drilling, the substrate includes bottom surface layers of copper, insulating barrier and surface layers of copper, and methods described is including getting the raw materials ready, single spreading, one side become dark treatment, fix the two-sided laser drilling of two plate bases, two panels, break substrate and check the steps such as shipment；The present invention can also include the thin copper step of one side and rubberizing step.The present invention is securely fixed by making two plate bases in back-to-back fashion, and uses the two-sided laser drilling of two panels, radium-shine production capacity is improved one times, improve production efficiency, it is to avoid the waste of resource.
Description
Technical field
The present invention relates to the manufacture method of printed wiring board, specifically a kind of high-density interconnection circuit board substrate is radium-shine
The method of drilling.
Background technology
Random layer high density connecting plate (any-layer HDI) first makes a substrate of centre, carries out laser drilling work
Industry, then using progressively increasing layer and it is radium-shine by the way of be formed by stacking.Substrate includes surface layers of copper, insulating barrier and bottom surface layers of copper, in order to
Surface layers of copper is connected with bottom surface layers of copper, blind hole is machined with the surface layers of copper and insulating barrier of substrate, blind hole is opened on surface
Layers of copper, the bottom of blind hole is connected with bottom surface layers of copper.
Blind hole on substrate is processed by laser drilling machine, and laser drilling machine can simultaneously carry out two-sided processing.But it is existing
In technology, due to not solving the fixation problem of two plate bases reliably, drilling can be produced to bore if two plate bases are processed simultaneously
Inclined problem, therefore substrate laser drilling can only only utilize laser drilling machine one side therein, separately by the way of monolithic one side
Outer one side is idle not to be used, not only low production efficiency, and causes the serious waste of resource.
The content of the invention
A kind of problem of the present invention for above-mentioned low production efficiency, there is provided production efficiency high-density interconnection circuit board base high
The method of plate laser drilling.
According to technical scheme：A kind of method of high-density interconnection circuit board substrate laser drilling, the substrate
Including bottom surface layers of copper, insulating barrier and surface layers of copper, the described method comprises the following steps：
The first step, get the raw materials ready, preparation meets the requirements the substrate and the backing plate that matches with substrate of size；
Second step, single spreading, last layer Protection glue is applied in the outer surface of the bottom surface layers of copper of substrate；
3rd step, one side become dark treatment, it would be desirable to which the surface layers of copper of the substrate of laser drilling carries out brown or melanism, makes
Its surface forms one layer of change blindstory；
4th step, two plate bases are fixed, two treated plate bases of above-mentioned steps of learning from else's experience remove Protection glue, so respectively
Pin hole and ensure that the position of respective pin-and-hole is corresponding respectively together with a piece of backing plate afterwards；By backing plate be placed in two plate bases it
Between, two plate bases is fixed back-to-back by pin, i.e. the change blindstory of two plate bases is outside；
5th step, the two-sided laser drilling of two panels, two plate bases that will be fixed are put into laser drilling machine, and to carry out two panels two-sided
Laser drilling operation；
6th step, substrate is broken, remove pin, two plate bases and backing plate are separated.
Also include the 7th step, inspection shipment.
The thin copper step of one side is provided between second step and the 3rd step, it would be desirable to the surface layers of copper of the substrate of laser drilling
Reduction processing is carried out, makes its thickness thinning.
Rubberizing step is set after the 4th step, and the plank edges of boards surrounding rubberizing linked together at three pieces makes its further
It is fixed；The step of increasing removal adhesive tape after increasing rubberizing step, while removing pin in the 6th step.
The backing plate uses substrate or wood-pulp board.
The technical effects of the invention are that：The present invention is securely fixed by making two plate bases in back-to-back fashion, and is adopted
With the two-sided laser drilling of two panels, radium-shine production capacity is improved one times, improve production efficiency, it is to avoid the waste of resource.
Brief description of the drawings
Fig. 1 is the structural representation that the two panels substrate mounting in the present invention is fixed.
Fig. 2 is flow chart of the invention.
Specific embodiment
It is below in conjunction with the accompanying drawings and specific real to enable the above objects, features and advantages of the present invention more obvious understandable
The present invention is further detailed explanation to apply mode.
In Fig. 1, including bottom surface layers of copper 1, insulating barrier 2, surface layers of copper 3, change blindstory 4, blind hole 5, substrate 10, backing plate 20, pin
Son 30 etc..
The present invention is a kind of method of high-density interconnection circuit board substrate laser drilling, as shown in figure 1, the substrate 10 is wrapped
Include bottom surface layers of copper 1, insulating barrier 2 and surface layers of copper 3, it is necessary in surface layers of copper 3 radium-shine processing blind hole 5.
As shown in Figure 1 and Figure 2, a specific embodiment of the invention is comprised the following steps：
The first step, get the raw materials ready.Preparation meets the requirements the substrate 10 and the backing plate 20 that matches with substrate 10 of size.Backing plate 20
Using the planar materials that can be used to thicken, such as the material such as substrate or wood-pulp board.
Get the raw materials ready including material issuing and sanction plate.
Material issuing：It is 0.1mm from substrate thickness, base copper thickness is the sheet material of 1/2OZ, and substrate size is 2400mm*
2000mm.1OZ refers to that the uniform Copper Foil weight on 1 square feet of area is 28.35g, is represented with the weight of unit area
The average thickness of Copper Foil.
Cut out plate：Sawing sheet size is 600mm*500mm.
Second step, single spreading.Last layer Protection glue is applied in the outer surface of the bottom surface layers of copper 1 of substrate 10, copper face is protected not
Under fire.
3rd step, one side become dark treatment.The surface layers of copper 3 of the substrate 10 of laser drilling will be needed carries out brown or black
Change, its surface is formed one layer of change blindstory 4.The effect for becoming dark treatment is to make the layers of copper of light dimmed, it is absorbed laser light
Ability strengthens.
4th step, fix two plate bases.Two treated plate bases 10 of above-mentioned steps of learning from else's experience, remove Protection glue respectively,
Then pin hole and ensure that the position of respective pin-and-hole is corresponding respectively together with a piece of backing plate 20；Backing plate 20 is placed in two chip bases
Between plate 10, two plate bases 10 are made to fix back-to-back by pin 30, i.e. the change blindstory 4 of two plate bases 10 is outside.Backing plate 20
Directly can be replaced using substrate 10.
5th step, the two-sided laser drilling of two panels.Two plate bases 10 that will be fixed are put into laser drilling machine and carry out two panels pair
There is blind hole 5 in face laser drilling operation, processing；
6th step, break substrate.Pin 30 is removed, two plate bases 10 and backing plate 20 are separated.
7th step, inspection shipment.
The thin copper step of one side is also provided between second step and the 3rd step, it would be desirable to the substrate 10 of laser drilling
Surface layers of copper 3 carries out reduction processing, makes its thickness thinning, and thinning from 1/2OZ is 1/3OZ.The effect of the thin copper step of one side is to make
Laser drilling is more prone to.
Rubberizing step can also be set after the 4th step, the plank edges of boards surrounding rubberizing linked together at three pieces makes it
It is further fixed；The step of increasing removal adhesive tape is needed after increasing rubberizing step, while removing pin 30 in the 6th step.
The present invention is securely fixed in together by making two plate bases in back-to-back fashion, and uses the two-sided radium-shine brill of two panels
Hole, can prevent them from loosening in process and bore partially, so as to radium-shine production capacity is improved into one times, improve production efficiency,
Avoid the waste of resource.
The description with certain particularity detailed enough has been carried out to the present invention above.Ordinary skill in art
Personnel it should be understood that what the description in embodiment was merely exemplary, before without departing from true spirit and scope of the present invention
Put make it is all change should all belong to protection scope of the present invention.Scope of the present invention is by described power
What sharp claim was defined, rather than what is limited by the foregoing description in embodiment.
Claims (4)
1. a kind of method of high-density interconnection circuit board substrate laser drilling, the substrate includes bottom surface layers of copper, insulating barrier and table
Face layers of copper, it is characterized in that, the described method comprises the following steps：
The first step, get the raw materials ready, preparation meets the requirements the substrate and the backing plate that matches with substrate of size；
Second step, single spreading, last layer Protection glue is applied in the outer surface of the bottom surface layers of copper of substrate；
3rd step, one side become dark treatment, it would be desirable to which the surface layers of copper of the substrate of laser drilling carries out brown or melanism, makes its table
Face forms one layer of change blindstory；
4th step, two plate bases are fixed, two treated plate bases of above-mentioned steps of learning from else's experience remove Protection glue, Ran Houyu respectively
A piece of backing plate pin hole and ensures that the position of respective pin-and-hole is corresponding respectively together；Backing plate is placed between two plate bases, is led to
Crossing pin makes two plate bases fix back-to-back, i.e. the change blindstory of two plate bases is outside；
5th step, the two-sided laser drilling of two panels, two plate bases that will be fixed are put into laser drilling machine, and to carry out two panels two-sided radium-shine
Bore operation；
6th step, substrate is broken, remove pin, two plate bases and backing plate are separated；
Rubberizing step is set after the 4th step, and the plank edges of boards surrounding rubberizing linked together at three pieces makes its further fixation；
The step of increasing removal adhesive tape after increasing rubberizing step, while removing pin in the 6th step.
2. according to the method for the high-density interconnection circuit board substrate laser drilling described in claim 1, it is characterized in that：Also include the
Seven steps, inspection shipment.
3. according to the method for the high-density interconnection circuit board substrate laser drilling described in claim 1, it is characterized in that：In second step
The thin copper step of one side is provided between the 3rd step, it would be desirable to which the surface layers of copper of the substrate of laser drilling carries out reduction processing, makes
Its thickness is thinning.
4. according to the method for the high-density interconnection circuit board substrate laser drilling described in claim 1, it is characterized in that：The backing plate
Using substrate or wood-pulp board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410183302.7A CN103945650B (en) | 2014-04-30 | 2014-04-30 | The method of high-density interconnection circuit board substrate laser drilling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410183302.7A CN103945650B (en) | 2014-04-30 | 2014-04-30 | The method of high-density interconnection circuit board substrate laser drilling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103945650A CN103945650A (en) | 2014-07-23 |
| CN103945650B true CN103945650B (en) | 2017-06-06 |
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| CN201410183302.7A Active CN103945650B (en) | 2014-04-30 | 2014-04-30 | The method of high-density interconnection circuit board substrate laser drilling |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109219251B (en) * | 2018-08-30 | 2020-11-13 | 广州广合科技股份有限公司 | Manufacturing method of fine circuit of flexible circuit board |
| CN109379833A (en) * | 2018-09-21 | 2019-02-22 | 胜宏科技（惠州）股份有限公司 | A kind of high heat conduction metal-based method for manufacturing circuit board |
| CN110278669A (en) * | 2019-07-23 | 2019-09-24 | 信泰电子（西安）有限公司 | The production method of via hole on multi-layer PCB board |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003204137A (en) * | 2002-01-09 | 2003-07-18 | Hitachi Via Mechanics Ltd | Machining method for drilling with laser beam |
| CN101537505B (en) * | 2008-12-30 | 2011-05-25 | 南京依利安达电子有限公司 | Small-aperture high-density drilling method of printed circuit board |
| CN201366530Y (en) * | 2009-03-02 | 2009-12-23 | 汕头超声印制板公司 | Panel positioning device for printed circuit board drilling machine |
| CN103369865A (en) * | 2012-03-30 | 2013-10-23 | 宏启胜精密电子(秦皇岛)有限公司 | A method for producing a circuit board |
| CN103079363B (en) * | 2012-12-27 | 2015-05-27 | 红板（江西）有限公司 | PCB (Printed Circuit Board) core board electroplating and porefilling process |
| CN103313532A (en) * | 2013-05-20 | 2013-09-18 | 江苏迈世达电子有限公司 | Direct laser drilling method for processing blind hole of circuit board |
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