CN102711382A - Printed circuit board (PCB) layer-by-layer para-position laser drilling method - Google Patents
Printed circuit board (PCB) layer-by-layer para-position laser drilling method Download PDFInfo
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- CN102711382A CN102711382A CN2012101973292A CN201210197329A CN102711382A CN 102711382 A CN102711382 A CN 102711382A CN 2012101973292 A CN2012101973292 A CN 2012101973292A CN 201210197329 A CN201210197329 A CN 201210197329A CN 102711382 A CN102711382 A CN 102711382A
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Abstract
The invention relates to a printed circuit board (PCB) layer-by-layer para-position laser drilling method. The PCB layer-by-layer para-position laser drilling method comprises the following steps: manufacturing a target on the opposite second layer of circuit board; removing a copper layer covered on the target or removing a copper layer and a resin layer covered on the target, exposing the target and performing para-position; and directing drilling a blind hole by using laser. Owing to the PCB layer-by-layer para-position laser drilling method, the problem of hole misregistration of the blind hole on the inner layer can be effectively solved.
Description
Technical field
The present invention relates to the manufacture method of printed circuit board, concrete PCB is the method for the radium-shine drilling blind hole of contraposition successively.
Background technology
Printed circuit board is made to high, smart, close direction and is developed at present, influenced by line design, and PAD at the bottom of the blind hole (pad) design becomes little; Simultaneously, the bias effect between flaggy of being limited by uses traditional X-RAY to bore target (twice outer graphics is superimposed); Causing blind hole to collapse the hole easily, is example with 4 layer circuit boards
When (1) the contraposition target figure (L02/L03) of design does not have skew; Shown in Fig. 1 a; Blind hole (L0102/L0403) is little to nothing skew or the side-play amount of internal layer PAD, and wherein L02/L03 is meant design contraposition target figure on L02 layer circuit board and L03 circuit board, and the target figure of the two is superimposed; L0102/L0403 is between L01 and L02, making blind hole, and between L04 and L03, makes blind hole;
(2) owing to the superimposed level to level alignment degree of contraposition target figure is lower; When the target figure (L02/L03) of design squints; Shown in Fig. 1 b, because internal layer PAD design is little, blind hole (L0102/L0403) is to internal layer PAD skew even collapse hole (being that blind hole deflects away from end PAD).
And can find out by Fig. 1 b; In the process that PCB makes; The increase of pressing number of times increases difficulty for the contraposition precision of the corresponding end PAD figure of blind hole, and simultaneously, the PAD design is more and more littler at the bottom of the blind hole; Also increased the difficulty of blind hole, thereby caused the blind hole offset to increase the positional precision of end PAD.
Summary of the invention
To the deficiency of prior art, the present invention aims to provide a kind of method that can effectively solve blind hole to the PCB radium-shine boring of contraposition successively of the inclined to one side hole of internal layer problem.
For realizing above-mentioned purpose, the present invention adopts following technical scheme:
The method of the PCB radium-shine boring of contraposition successively, it may further comprise the steps:
On relative inferior layer circuit board, make target;
The copper layer that covers on the said target is removed, and the copper layer and the resin bed that perhaps will cover on the said target are removed simultaneously, manifest target and carry out contraposition;
The direct drilling blind hole of laser.
As improvement, the target on different inferior layer circuit boards is dislocatedly distributed, and being dislocatedly distributed to increase target and the outer figure contrast of target, reduces bit errors.
As the first kind of execution mode that appears target; The method that said copper layer and the resin bed that will cover on the said target removed is: adopt radium-shine drilling machine that copper layer and resin bed on the target are got rid of; Expose this target, the CCD on the radium-shine rig discerns this target and compensates the location simultaneously.
As the second kind of execution mode that appears target, the method that the said copper layer that will cover on the said target is removed is: outside on the layer circuit board with the corresponding Position Design of the said target figure of windowing; Use and paste dry film or wet film; Exposure target figure, with said target figure transfer on dry film or wet film; Develop; Etching; Take off said dry film or wet film; Said target top copper layer is removed, manifested this target.
As the third execution mode that appears target, the method that the said copper layer that will cover on the said target is removed is: adopt machine dimensions drill, utilize to bore to chew target top copper layer is removed, manifest target.
As the 4th kind of execution mode that appears target, the method that said copper layer and the resin bed that will cover on the said target removed is: adopt X-RAY to bore target drone and get out individual layer register guide wad cutter according to relative inferior layer circuit board subscript target, manifest target.
Preferably, the method for said making target is: on relative inferior layer circuit board, paste dry film or wet film; Exposure target figure, with said target figure transfer on dry film or wet film; Develop; Etching; Take off said dry film or wet film.
The method of the PCB that the present invention the set forth radium-shine boring of contraposition successively; Compared with prior art; Its beneficial effect is: the present invention provides a kind of when the radium-shine bore process of printed circuit board is made, and adopt the method for burning target, etching or scraping copper to manifest the internal layer target and carry out contraposition successively, or X-RAY bores target drone brill individual layer target; Substitute traditional use X-RAY and drill through target (twice outer graphics is superimposed) method, can effectively solve blind hole the inclined to one side hole of internal layer problem.
Description of drawings
Accompanying drawing 1a, 1b are the sketch map of the contraposition target of existing radium-shine boring;
Accompanying drawing 2 is the flow chart of the method for the PCB of the present invention radium-shine boring of contraposition successively;
Accompanying drawing 3a, 3b, 3c are the manufacturing process sketch map of the PCB of the present invention radium-shine boring of contraposition successively.
Embodiment
Below, in conjunction with accompanying drawing and embodiment, the method for the PCB of the present invention radium-shine boring of contraposition successively done further describing, so that clearerly understand the present invention's technological thought required for protection.
As shown in Figure 2, the method for the PCB radium-shine boring of contraposition successively, it may further comprise the steps:
S01, on relative inferior layer circuit board, make target;
Here relative inferior layer circuit board is for inferior layer circuit board in the art, and the inferior layer circuit board in present technique field is meant that the inboard one deck of outermost layer circuit board is referred to as sublevel, for example in eight laminates; The second layer and layer 7 just are referred to as sublevel, and in the present invention, relative inferior layer circuit board is meant that the inboard one deck of other layer circuit boards except that central core all is referred to as relative sublevel; Be example with eight laminates together; Wherein the 4th layer is central core with layer 5, and the 4th layer is relative sublevel for the 3rd layer, and the 3rd layer is referred to as relative sublevel again for the second layer; In like manner; Layer 5 is relative sublevel for layer 6, it is relative sublevel that layer 6 has with respect to layer 7, so recursion.
The method of making target is: subsides dry film or wet film → exposure target figure on relative inferior layer circuit board, with said target figure transfer on dry film or wet film → dry film or wet film develop → etching → take off.
Target number on each relative inferior layer circuit board can for example, can adopt four places, four angles that are distributed in circuit board for a plurality of, and is more accurate for contraposition certainly, can design more a plurality of targets.The shape of target figure can adopt circle, can make things convenient for contraposition, certainly, also can be other shape.
In the present invention, when on relating to a plurality of relative inferior layer circuit boards, all relating to the target making, in order to increase the outer figure contrast of target and target, reduce bit errors, the target mutual dislocation of each layer distributes.
S02, the copper layer and the resin bed that will be pressed together on the target are removed, and manifest target and carry out contraposition;
The method that copper layer on the target and resin bed are removed has multiple, in the present invention, can take following mode:
A, as preferred implementation; Adopt the method for burning target to remove and cover copper layer and the resin bed on the target; Promptly be to adopt radium-shine drilling machine that Copper Foil on the target and resin bed are got rid of, expose target, simultaneously radium-shine rig CCD this target of identification also compensates the location; With respect to other kinds method, it is the simplest using the method flow that burns target;
B, can also adopt etching method to remove to cover the copper layer on the target; Promptly be to paste dry film or wet film → exposure target figure with the figure → use of windowing of the corresponding Position Design of said target on the layer circuit board outside; With said target figure transfer on dry film or wet film → the said dry film of development → etching → take off or wet film → said target top copper layer is removed; Manifest this target; This kind mode only need be removed the copper layer and appear target, and outer circuit plate described here is meant a laminate corresponding with relative inferior layer circuit board pressing, and blind hole promptly is on this outer circuit plate, to make.
C, also can adopt the method for scraping copper, promptly adopt machine dimensions drill, utilize to bore to chew and remove, manifest target covering target top copper layer.
D, can certainly adopt conventional X-RAY to bore target drone to drill through the register guide wad cutter, but different with prior art, in the present invention, adopt X-RAY to bore target drone and get out individual layer register guide wad cutter according to relative inferior layer circuit board subscript target, manifest target.
S03, the direct drilling blind hole of laser.For directly playing the direct radium-shine boring making sheet of the radium-shine boring of copper, use a kind of target that appears in above-mentioned four kinds of methods, when radium-shine boring, directly use this target to position the back and directly play the radium-shine boring of copper.
Be example with eight laminates below, further protection scope of the present invention elaborated.
Accompanying drawing 3a, 3b, 3c are the manufacturing process sketch map of the PCB of the present invention radium-shine boring of contraposition successively.Shown in Fig. 3 a; It carries out contraposition and drilling blind hole (L0304/L0605) for the L03-L06 layer circuit board with pressing, at first, on the L04 circuit board, makes target 11; On the L05 circuit board, make target 12; Through the radium-shine blind hole 21 that drills through after the contraposition between target 11 realization L04 circuit boards and the L03 circuit board, through the radium-shine blind hole 22 that drills through after the contraposition between target 12 realization L06 circuit boards and the L05 circuit board, wherein target 11 is dislocatedly distributed with target 12.
Shown in Fig. 3 b; Further realize blind hole and the making of the blind hole between L07 and the L06 circuit board between L03 and the L02 circuit board; Be relative inferior layer circuit board with L03 and L06 this moment respectively, makes target 13, target 14 above that respectively, the same; Drill through blind hole 23 and blind hole 24 respectively, wherein target 13, target 14 and target 11, target 12 all are dislocatedly distributed.
At last; Shown in Fig. 3 c, realize that further blind hole and the blind hole between L08 and the L07 circuit board between L02 and the L01 circuit board made, be relative inferior layer circuit board with L02 and L07 this moment respectively; Make target 15, target 16 above that respectively; The same, drill through blind hole 25 and blind hole 26 respectively, wherein target 15, target 16, target 13, target 14 and target 11, target 12 all are dislocatedly distributed.
Need to prove; More than just detailed description is carried out in contraposition successively for example, it does not represent that the flow process of making must be shown in Fig. 3 a-3c, because the making of blind hole is successively made; Therefore, drilling through in proper order of the making of target and blind hole can be decided according to actual conditions.
For a person skilled in the art, can make other various corresponding changes and distortion, and these all changes and distortion should belong within the protection range of claim of the present invention all according to the technical scheme and the design of above description.
Claims (7)
1.PCB the method for the radium-shine boring of contraposition successively is characterized in that, it may further comprise the steps:
On relative inferior layer circuit board, make target;
The copper layer that covers on the said target is removed, and the copper layer and the resin bed that perhaps will cover on the said target are removed simultaneously, manifest target and carry out contraposition;
The direct drilling blind hole of laser.
2. the method for the PCB according to claim 1 radium-shine boring of contraposition successively is characterized in that the target on different inferior layer circuit boards is dislocatedly distributed.
3. the method for the PCB according to claim 1 radium-shine boring of contraposition successively is characterized in that, the method that said copper layer and the resin bed that will cover on the said target removed is:
Adopt radium-shine drilling machine that copper layer and resin bed on the target are got rid of, expose this target, the CCD on the radium-shine rig discerns this target and compensates the location simultaneously.
4. the method for the PCB according to claim 1 radium-shine boring of contraposition successively is characterized in that, the method that the said copper layer that will cover on the said target is removed is:
Outside on the layer circuit board with the corresponding Position Design of the said target figure of windowing;
Use and paste dry film or wet film;
Exposure target figure, with said target figure transfer on dry film or wet film;
Develop;
Etching;
Take off said dry film or wet film;
Said target top copper layer is removed, manifested this target.
5. the method for the PCB according to claim 1 radium-shine boring of contraposition successively is characterized in that, the method that the said copper layer that will cover on the said target is removed is:
Adopt machine dimensions drill, utilize to bore to chew target top copper layer is removed, manifest target.
6. the method for the PCB according to claim 1 radium-shine boring of contraposition successively is characterized in that, the method that said copper layer and the resin bed that will cover on the said target removed is:
Adopt X-RAY to bore target drone and get out individual layer register guide wad cutter, manifest target according to relative inferior layer circuit board subscript target.
7. the method for the PCB according to claim 1 radium-shine boring of contraposition successively is characterized in that the method for said making target is:
On relative inferior layer circuit board, paste dry film or wet film;
Exposure target figure, with said target figure transfer on dry film or wet film;
Develop;
Etching;
Take off said dry film or wet film.
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| CN201210197329.2A CN102711382B (en) | 2012-06-14 | 2012-06-14 | Printed circuit board (PCB) layer-by-layer para-position laser drilling method |
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| CN201210197329.2A CN102711382B (en) | 2012-06-14 | 2012-06-14 | Printed circuit board (PCB) layer-by-layer para-position laser drilling method |
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| CN102711382A true CN102711382A (en) | 2012-10-03 |
| CN102711382B CN102711382B (en) | 2015-02-25 |
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| CN102974964A (en) * | 2012-10-23 | 2013-03-20 | 廖怀宝 | Method for fixing printed circuit board (PCB) with mark point location function |
| CN104244584A (en) * | 2013-06-24 | 2014-12-24 | 北大方正集团有限公司 | Laser drilling alignment method |
| CN104816098A (en) * | 2015-03-24 | 2015-08-05 | 河源西普电子有限公司 | Technological method for machining second-order blind holes through UV laser |
| CN104955266A (en) * | 2015-06-17 | 2015-09-30 | 安徽达胜电子有限公司 | Circuit board capable of facilitating blind hole alignment |
| CN104972511A (en) * | 2015-07-08 | 2015-10-14 | 沪士电子股份有限公司 | Drilling method improving PCB plate counter-drilling precision |
| CN105376941A (en) * | 2015-11-02 | 2016-03-02 | 深圳市五株科技股份有限公司 | Printed circuit board processing method |
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| CN1761378A (en) * | 2005-09-20 | 2006-04-19 | 沪士电子股份有限公司 | Method of drilling a hole through Co2 laser directly |
| CN101959373A (en) * | 2009-07-17 | 2011-01-26 | 北大方正集团有限公司 | Method for improving blind hole alignment of printed circuit board |
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| CN102974964B (en) * | 2012-10-23 | 2014-05-21 | 廖怀宝 | Method for fixing printed circuit board (PCB) with mark point location function |
| CN102974964A (en) * | 2012-10-23 | 2013-03-20 | 廖怀宝 | Method for fixing printed circuit board (PCB) with mark point location function |
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| CN105472910B (en) * | 2014-09-12 | 2019-03-01 | 深南电路有限公司 | A kind of control method of circuit board machining accuracy |
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