CN109348624A - A kind of alignment method of laser blind hole - Google Patents
A kind of alignment method of laser blind hole Download PDFInfo
- Publication number
- CN109348624A CN109348624A CN201811182966.6A CN201811182966A CN109348624A CN 109348624 A CN109348624 A CN 109348624A CN 201811182966 A CN201811182966 A CN 201811182966A CN 109348624 A CN109348624 A CN 109348624A
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- China
- Prior art keywords
- location window
- internal layer
- layer location
- copper
- laser
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention provides a kind of alignment methods of laser blind hole, can be to avoid internal layer location hole is burnt up or crumpled during laser blind hole contraposition in traditional handicraft the phenomenon that, aligning accuracy can be improved simultaneously, the following steps are included: corresponding in the upper and lower layers of copper of inner plating open up internal layer location window, internal layer location window is the hole that will be formed after the layers of copper removal on inner plating；Lamina rara externa is pressed on inner plating upper layer；Wad cutter is bored by way of drilling on multilayer circuit board；On the basis of wad cutter, outer layer location window is opened up in the upper and lower layers of copper of lamina rara externa and above internal layer location window, the area of outer layer location window is greater than the area of internal layer location window；The resin layer burn off under outer layer location window is exposed internal layer location window respectively by way of laser；By the resin layer burn off under internal layer location window by way of laser, contraposition funnel hole is formed；On the basis of aligning funnel hole, laser blind hole is bored.
Description
Technical field
The present invention relates to printed circuit board technology field more particularly to a kind of alignment methods of laser blind hole.
Background technique
Laser drill be reach practical laser processing technology earliest, and laser processing main application fields it
One.Laser-beam drilling machine, the internal layer and internal layer for being mainly used in printed wiring board, the connection between outer layer and internal layer are swashed with high-precision
Light punches copper sheet and inner layer resin, using copper facing, i.e. completion connection.Laser drill is not only high-efficient, but also precision is high,
It plays an important role in actual circuit board making field.
Laser blind hole contraposition industry common method is the round copper PAD that one is made at one layer of blind via bottom, lamination fishing side
Afterwards, PAD burning is exposed with laser, is positioned using internal layer location hole, the Chinese invention such as Publication No. CN104244584A is special
A kind of laser drill alignment method is disclosed in benefit.
Traditional handicraft is easy to produce following problem: being easy that PAD is burnt up or crumpled when laser burns target, so as to cause contraposition
Grab bad or contraposition deviation；When blind hole is respectively set in multilayer circuit board upper and lower level, traditional alignment mode is by above and below internal layer two
The contraposition deviation of layer is cumulative, causes the aligning accuracy between upper and lower blind hole not high.
Summary of the invention
In view of the above-mentioned problems, can swash the present invention provides a kind of alignment method of laser blind hole to avoid in traditional handicraft
The phenomenon that internal layer location hole is burnt up or is crumpled during the contraposition of light blind hole, while aligning accuracy can be improved.
Its technical solution is such that a kind of alignment method of laser blind hole, in the manufacturing process of multilayer circuit board,
Characterized by comprising the following steps:
Step S1: correspondence opens up internal layer location window in the upper and lower layers of copper of inner plating, and the internal layer location window is by internal layer
The hole formed after layers of copper removal on plate；
Step S2: lamina rara externa is pressed on inner plating upper layer；
Step S3: after pressing lamina rara externa, wad cutter is bored by way of drilling on multilayer circuit board, the wad cutter is
Through the through-hole of the multilayer circuit board；
Step S4: on the basis of the wad cutter, in the upper and lower layers of copper of the lamina rara externa and it is located at the internal layer location window
Top open up outer layer location window, the area of the outer layer location window is greater than the area of internal layer location window；
Step S5: respectively by the resin layer burn off under outer layer location window by way of laser, by the internal layer location window
Expose；
Step S6: by the resin layer burn off under the internal layer location window by way of laser, contraposition funnel hole is formed；
Step S7: on the basis of the contraposition funnel hole, laser blind hole is bored.
Further, in step sl, the production of the internal layer location window includes following technique: supplied materials, press mold, exposure,
Development, etching.
Further, in step s 2, lamination lamina rara externa includes following technique: brownification, lamination, lamination, wherein lamination work
Skill includes folded resin layer and layers of copper.
Further, in step s 4, the production of the outer layer location window includes following technique: supplied materials, press mold, exposure,
Development, etching.
Further, in step s 5, laser is carried out using the radium-shine equipment of CO2, laser parameter is energy 2mj-
4mj, several -5 rifles of 2 rifle of rifle.
Further, in step s 6, laser is carried out using the radium-shine equipment of CO2, laser parameter is energy 1mj-
3mj, several -3 rifles of 1 rifle of rifle.
Further, the internal layer location window is separately positioned on the pad of upper and lower layers of copper of the inner plating, the weldering
Disk is square, and the internal layer location window and described and outer layer location window distinguish the straight of rounded internal layer location window in lower layers of copper
Diameter is greater than the diameter of the internal layer location window in upper layers of copper, and in step s 6, the punching direction of laser is by upper layers of copper
The direction of internal layer location window in the downward layers of copper of internal layer location window.
Further, the diameter of the internal layer location window in layers of copper is set as A, the diameter of the internal layer location window in lower layers of copper
For B, the side length diameter of pad is C, and the diameter of outer layer location window is D, and constrains as follows: 2B < D < 0.75C.
Further, the value range of the diameter A of the internal layer location window in the upper layers of copper is 0.8mm-1.5mm, lower copper
It is 0.8mm-1.5mm that the diameter of internal layer location window on layer, which is B,.
Further, the difference of the diameter A of the internal layer location window on the diameter B and upper layers of copper of the internal layer location window in lower layers of copper
Less than or equal to 0.03mm.
In the alignment method of laser blind hole provided by the invention, internal layer location window is set on inner plating, it is outer in pressing
After laminate, outer layer location window is first set on lamina rara externa, then burns up outer layer location window and internal layer with the size of outer layer location window
Resin layer between location window exposes the internal layer location window on inner plating, and first production outer layer location window reburns resin layer in this way
It is distributed the method carried out, laser intensity is not controlled during resin layer being burnt to avoid laser in traditional handicraft and directly burns
The phenomenon that internal layer location window, due to outer layer location window area be greater than internal layer location window, this process can be to avoid traditional handicraft
The phenomenon that internal layer location window is burnt up or crumpled during middle laser blind hole contraposition, is then made by internal layer location window
Funnel hole is aligned, on the basis of aligning funnel hole, bores laser blind hole, pair between upper and lower blind hole can be improved in the setting of funnel hole
Position precision is not high, and interlayer alignment ability is increased to minimum 45um by the minimum 60um of conventional method, is able to suppress due to laser drilling
It is low that hole positions yields caused by the problem of hole precision caused inclined, broken, short/open circuit in laser drill hole of laser drilling hole drill etc.
Problem.
Detailed description of the invention
Fig. 1 is the flow diagram of the step S1 to step S6 of the alignment method of laser blind hole of the invention a kind of；
Fig. 2 is the signal that funnel hole is aligned obtained in a kind of step S6 of the alignment method of laser blind hole of the invention
Figure.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
A kind of alignment method of laser blind hole of the present embodiment can be used in the manufacturing process of multilayer circuit board, in this reality
It applies in example, the wiring board in outside is lamina rara externa, and the wiring board of inside is inner plating.
See Fig. 1, Fig. 2, a kind of alignment method of laser blind hole provided in this embodiment, comprising the following steps:
Step S1: inner plating includes upper layers of copper 11, lower layers of copper 12, resin layer 3, upper layers of copper 11, lower layers of copper in inner plating
Correspondence opens up internal layer location window 21,22 on 12, and internal layer location window 21,22 is to go upper layers of copper 11, the lower layers of copper 12 on inner plating
The hole formed after removing, the production of internal layer location window include following technique: supplied materials, press mold, exposure, development, etching；The present embodiment
In, it is illustrated so that inner plating is central substrate as an example, if inner plating is not central substrate, in current multilayer wiring board
Two sides press lamina rara externa respectively.
Step S2: lamina rara externa is pressed on inner plating upper layer, lamina rara externa includes resin layer 3 and is arranged on the outside of resin layer 3
Upper layers of copper 41, lower layers of copper 42, lamination lamina rara externa includes following technique: brownification, lamination, lamination.
Step S3: after pressing lamina rara externa, wad cutter 5 is bored by way of drilling on multilayer circuit board, wad cutter is to pass through
Target, the position of wad cutter and the position one of target is arranged before boring wad cutter in the through-hole for wearing multilayer circuit board on inner plating
It causes.
Step S4: on the basis of wad cutter 5, in the upper layers of copper 41, lower layers of copper 42 of lamina rara externa and be located at internal layer location window 21,
22 top opens up outer layer location window 61,62, and the area of outer layer location window 61,62 is greater than the area of internal layer location window 21,22, outside
The production of layer location window includes following technique: supplied materials, press mold, exposure, development, etching.
Step S5: 3 burn off of resin layer under outer layer location window 61,62 is positioned internal layer respectively by way of laser
Window 21,22 exposes, and carries out laser using the radium-shine equipment of CO2 in step s 5, and laser parameter is energy 2mj-4mj, rifle number 2
- 5 rifle of rifle.
Step S6: radium-shine using CO2 in step s 6 by the resin layer burn off under internal layer location window by way of laser
Equipment carries out laser, and laser parameter is energy 1mj-3mj, and several -3 rifles of 1 rifle of rifle form contraposition funnel hole 8, laser
Punching direction is the direction by the internal layer location window 22 in the downward layers of copper of internal layer location window 21 in upper layers of copper.
Step S7: on the basis of aligning funnel hole, laser blind hole is bored.
Meanwhile in the present embodiment, resin layer uses PP resin, and internal layer location window 21,22 is separately positioned on inner plating
On the pad 71,72 of upper and lower layers of copper, pad 71,72 is square, and internal layer location window 21,22 and outer layer location window 61,62 are in respectively
Circle sets the diameter of the internal layer location window in layers of copper as A, and the diameter of the internal layer location window in lower layers of copper is B, the side of pad
Long diameter is C, and the diameter of outer layer location window is D, and constrains as follows: 2B < D < 0.75C；Internal layer positioning in upper layers of copper
The value range of the diameter A of window is 0.8mm-1.5mm, and it is 0.8mm-1.5mm that the diameter of the internal layer location window in lower layers of copper, which is B,
The difference of the diameter A of internal layer location window on the diameter B and upper layers of copper of internal layer location window in lower layers of copper is 0.03mm.
In the alignment method of laser blind hole provided by the invention, internal layer location window is set on inner plating, it is outer in pressing
After laminate, outer layer location window is first set on lamina rara externa, then burns up outer layer location window and internal layer with the size of outer layer location window
Resin layer between location window exposes the internal layer location window on inner plating, and first production outer layer location window reburns resin layer in this way
It is distributed the method carried out, laser intensity is not controlled during resin layer being burnt to avoid laser in traditional handicraft and directly burns
The phenomenon that internal layer location window, due to outer layer location window area be greater than internal layer location window, this process can be to avoid traditional handicraft
The phenomenon that internal layer location window is burnt up or crumpled during middle laser blind hole contraposition, is then made by internal layer location window
Funnel hole is aligned, on the basis of aligning funnel hole, bores laser blind hole；
The aligning accuracy that the setting of funnel hole can be improved between upper and lower blind hole is not high, and interlayer alignment ability is by conventional method
Minimum 60um be increased to minimum 45um, be able to suppress laser drill position hole precision the problem of caused by laser drill
Bore the low problem of yields caused by inclined, broken, short/open circuit in laser drill hole etc..
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (10)
1. a kind of alignment method of laser blind hole, in the manufacturing process of multilayer circuit board, which is characterized in that including following step
It is rapid:
Step S1: correspondence opens up internal layer location window in the upper and lower layers of copper of inner plating, and the internal layer location window is will be on inner plating
Layers of copper removal after the hole that is formed；
Step S2: lamina rara externa is pressed on inner plating upper layer；
Step S3: after pressing lamina rara externa, boring wad cutter on multilayer circuit board by way of drilling, the wad cutter be through
The through-hole of the multilayer circuit board；
Step S4: on the basis of the wad cutter, in the upper and lower layers of copper of the lamina rara externa and it is located at the upper of the internal layer location window
Fang Kaishe outer layer location window, the area of the outer layer location window are greater than internal layer and position window ara；
Step S5: the resin layer burn off under outer layer location window is exposed the internal layer location window respectively by way of laser；
Step S6: by the resin layer burn off under the internal layer location window by way of laser, contraposition funnel hole is formed；
Step S7: on the basis of the contraposition funnel hole, laser blind hole is bored.
2. a kind of alignment method of laser blind hole according to claim 1, it is characterised in that: in step sl, described interior
The production of layer location window includes following technique: supplied materials, press mold, exposure, development, etching.
3. a kind of alignment method of laser blind hole according to claim 2, it is characterised in that: in step s 2, lamination is outer
Laminate includes following technique: brownification, lamination, lamination, and wherein lamination technique includes folded resin layer and layers of copper.
4. a kind of alignment method of laser blind hole according to claim 3, it is characterised in that: in step s 4, described outer
The production of layer location window includes following technique: supplied materials, press mold, exposure, development, etching.
5. a kind of alignment method of laser blind hole according to claim 4, it is characterised in that: in step s 5, using CO2
Radium-shine equipment carries out laser, and laser parameter is energy 2mj-4mj, several -5 rifles of 2 rifle of rifle.
6. a kind of alignment method of laser blind hole according to claim 5, it is characterised in that: in step s 6, using CO2
Radium-shine equipment carries out laser, and laser parameter is energy 1mj-3mj, several -3 rifles of 1 rifle of rifle.
7. a kind of alignment method of laser blind hole according to claim 1, it is characterised in that: the internal layer location window difference
It is arranged on the pad of upper and lower layers of copper of the inner plating, the pad is square, the internal layer location window and described and outer layer
Location window difference is rounded, and the diameter of the internal layer location window in lower layers of copper is greater than the diameter of the internal layer location window in upper layers of copper,
In step S6, the punching direction of laser is the side by the internal layer location window in the downward layers of copper of internal layer location window in upper layers of copper
To.
8. a kind of alignment method of laser blind hole according to claim 7, it is characterised in that: the internal layer in setting in layers of copper
The diameter of location window is A, and the diameter of the internal layer location window in lower layers of copper is B, and the side length diameter of pad is C, outer layer location window
Diameter is D, and is constrained as follows: 2B < D < 0.75C.
9. a kind of alignment method of laser blind hole according to claim 8, it is characterised in that: the internal layer in the upper layers of copper
The value range of the diameter A of location window is 0.8mm-1.5mm, and it is 0.8mm- that the diameter of the internal layer location window in lower layers of copper, which is B,
1.5mm。
10. a kind of alignment method of laser blind hole according to claim 8, it is characterised in that: the internal layer in lower layers of copper is fixed
The difference of the diameter A of internal layer location window on the diameter B and upper layers of copper of position window is less than or equal to 0.03mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811182966.6A CN109348624B (en) | 2018-10-11 | 2018-10-11 | Laser blind hole alignment method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811182966.6A CN109348624B (en) | 2018-10-11 | 2018-10-11 | Laser blind hole alignment method |
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| CN109348624A true CN109348624A (en) | 2019-02-15 |
| CN109348624B CN109348624B (en) | 2020-09-01 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110933870A (en) * | 2019-12-24 | 2020-03-27 | 江苏弘信华印电路科技有限公司 | Positioning method for processing six-layer rigid-flex board |
| WO2022000810A1 (en) * | 2020-07-03 | 2022-01-06 | 瑞声声学科技(深圳)有限公司 | Lamination method for flexible circuit board |
| CN117998753A (en) * | 2024-04-03 | 2024-05-07 | 淄博芯材集成电路有限责任公司 | Laser drilling alignment method |
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