CN107318233A - A kind of preparation method of HDI board blind holes - Google Patents
A kind of preparation method of HDI board blind holes Download PDFInfo
- Publication number
- CN107318233A CN107318233A CN201710571732.XA CN201710571732A CN107318233A CN 107318233 A CN107318233 A CN 107318233A CN 201710571732 A CN201710571732 A CN 201710571732A CN 107318233 A CN107318233 A CN 107318233A
- Authority
- CN
- China
- Prior art keywords
- blind hole
- wad cutter
- windowing
- preparation
- internal layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of preparation method of HDI board blind holes, comprise the following steps：S1, produce internal layer circuit and wad cutter figure on inner plating, internal layer circuit includes internal layer PAD；S2, pressing inner plating and lamina rara externa；S3, get out wad cutter according to wad cutter figure, wad cutter runs through all flaggies；S4, the figure for using wad cutter being aligned and being produced on lamina rara externa drilling blind hole loci and blind hole windowing, blind hole windowing figure position are corresponding with internal layer PAD positions；S5, etch blind hole windowing and drilling blind hole loci；S6, aligned using drilling blind hole loci and produce blind hole in the position of blind hole windowing.A kind of preparation method of HDI board blind holes of the present invention, because internal layer PAD and wad cutter figure are arranged on same inner plating, improves the Aligning degree of blind hole windowing and internal layer PAD, and then improve the alignment precision of blind hole and internal layer PAD.The present invention can be widely applied to blind hole and make field as a kind of preparation method of HDI board blind holes.
Description
Technical field
Field, especially a kind of preparation method of HDI board blind holes are made the present invention relates to blind hole.
Background technology
As the miniaturization of electronic product, high performance, multifunction and high-frequency high-speed develop, promote with high density
Change, become more meticulous with the characteristics of HDI manufacturing technologies lifted rapidly, cause PCB design blind hole exponent number more and more；It is domestic at present most
The multi-stage HDI plate of producer is mainly made using lamination method technique, by pressing often, Making programme length, key technology and processing procedure
The restriction of ability, the Aligning degree deviation of its each interlayer requires beyond control, the alignment index of multi-stage HDI plate include blind hole with
The alignment of top/back welding disk, blind hole and blind hole, through hole and inside/outside layer pad.Former flow scheme design is：Sawing sheet → internal layer → pressing →
X-RAY bores gong side → brill registration holes and buried via hole → Conformal mask blind hole windowings after wad cutter → pressing → blind hole etching → blind
Hole AOI → laser drilling → rear flow, thus flow, which can be seen that, influences having for blind hole alignment：X-RAY precision, drilling hole
Position precision, blind hole windowing contraposition precision, multiple links determine the Aligning degree of blind hole, cause the Aligning degree of blind hole low and be difficult to change
It is kind.
The content of the invention
In order to solve the above-mentioned technical problem, it is an object of the invention to provide a kind of high HDI board blind holes of blind hole alignment
Preparation method.
The technical solution adopted in the present invention is：A kind of preparation method of HDI board blind holes, comprises the following steps：
S1, produce internal layer circuit and wad cutter figure on inner plating, the internal layer circuit includes internal layer PAD；
S2, pressing inner plating and lamina rara externa；
S3, get out wad cutter according to the wad cutter figure, the wad cutter runs through all flaggies；
S4, the figure for using the wad cutter being aligned and being produced on lamina rara externa drilling blind hole loci and blind hole windowing
Shape, the blind hole windowing figure position is corresponding with internal layer PAD positions；
S5, etch blind hole windowing and drilling blind hole loci；
S6, aligned using drilling blind hole loci and produce blind hole in the position of the blind hole windowing.
Further, the trapezoidal distribution of the wad cutter.
Further, the step S3 includes：Bore target drone identification wad cutter figure to get out wad cutter using X-RAY.
Further, the step S4 includes：
S41, the first project file of acquisition, first project file include the position of drilling blind hole loci and blind hole windowing
Information；
S42, LDI exposure machine are aligned using the wad cutter and made according to first project file on lamina rara externa
Go out the figure of drilling blind hole loci and blind hole windowing.
Further, the step S6 includes：
S61, the second project file of acquisition, second project file include the position of drilling blind hole loci and blind hole windowing
Information；
S62, radium-shine rig are aligned using the drilling blind hole loci and according to second project file described
Produce blind hole in the position of blind hole windowing.
Further, the step S3 and S4 also includes：Aligned and produced on lamina rara externa using the wad cutter
The figure of ring is aligned, then etches contraposition ring, the wad cutter is located in contraposition ring.
Further, the preparation method also includes：
S7, the inner plating and lamina rara externa of blind hole will be made as inner plating, and repeat step S1-S6 proceeds blind hole
Make.
The beneficial effects of the invention are as follows：A kind of preparation method of HDI board blind holes of the present invention, inner plating carries out interior circuit and target
After hole pattern, internal layer circuit includes internal layer PAD, pressing inner plating and lamina rara externa and makes wad cutter, is aligned simultaneously by wad cutter
Drilling blind hole loci and blind hole windowing are produced on lamina rara externa, blind hole windowing position is relative with internal layer PAD positions
Should；Aligned using drilling blind hole loci and produce blind hole in the position of blind hole windowing；Due to internal layer PAD and wad cutter figure
It is arranged on same inner plating, improves the Aligning degree of blind hole windowing and internal layer PAD, and then improves pair of blind hole and internal layer PAD
Quasi- precision.
Brief description of the drawings
The embodiment to the present invention is described further below in conjunction with the accompanying drawings：
Fig. 1 is a kind of wad cutter distribution schematic diagram of the preparation method of HDI board blind holes of the invention；
Fig. 2 is an a kind of specific embodiment schematic diagram of the preparation method of HDI board blind holes of the invention.
Embodiment
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phase
Mutually combination.
A kind of preparation method of HDI board blind holes, comprises the following steps：
S1, produce internal layer circuit and wad cutter figure on inner plating, internal layer circuit includes internal layer PAD；
S2, pressing inner plating and lamina rara externa；
S3, get out wad cutter according to wad cutter figure, wad cutter runs through all flaggies；
S4, the figure for using wad cutter being aligned and being produced on lamina rara externa drilling blind hole loci and blind hole windowing, it is blind
Hole windowing figure position is corresponding with internal layer PAD positions；
S5, etch blind hole windowing and drilling blind hole loci；
S6, aligned using drilling blind hole loci and produce blind hole in the position of blind hole windowing.
A kind of preparation method of HDI board blind holes of the present invention, because the PAD and wad cutter figure of internal layer circuit are arranged in same
On laminate, the Aligning degree of blind hole windowing and internal layer PAD is improved, and then improves the alignment precision of blind hole and internal layer PAD.
As the further improvement of technical scheme, when performing step S3 and S4, also aligned using wad cutter and
The figure of contraposition ring is produced on lamina rara externa, contraposition ring is etched, wad cutter is located in contraposition ring.By checking wad cutter on lamina rara externa
Situation with aligning ring, wad cutter may determine that blind hole whether in contraposition ring according to the alignment case of wad cutter and contraposition ring
Windowing and internal layer PAD alignment case, facilitate staff to learn contraposition quality (contraposition off normal, inferior to reverse side).Align ring
There is size, typically there is 2mil to 3mil, if contraposition ring is broken, also explanation is that the contraposition quality of blind hole windowing has exception.
As the further improvement of technical scheme, the trapezoidal distribution of wad cutter, to realize fool proof, prevents staff from doing wrong
Plate, if if rectangular design, staff, which misplaces plank, also is difficult to what is found, improves the producing efficiency of HDI plates.
As the further improvement of technical scheme, step S3 includes：Bore target drone identification wad cutter figure to get out using X-RAY
Wad cutter.Wad cutter can precisely be got out by boring target drone using X-RAY, it is ensured that the accurate contraposition of inner plating and lamina rara externa.
As the further improvement of technical scheme, step S4 includes：
S41, the first project file of acquisition, the first project file include the position letter of drilling blind hole loci and blind hole windowing
Breath；
S42, LDI exposure machine are aligned using wad cutter and drilling blind hole are produced on lamina rara externa according to the first project file
The figure of loci and blind hole windowing.
Specifically, the first project file includes drilling blind hole loci, blind hole windowing and the positional information for aligning ring, and LDI exposes
Ray machine is opened using being aligned using wad cutter and drilling blind hole loci, blind hole are produced on lamina rara externa according to the first project file
The figure of window and contraposition ring, using LDI exposure machines directly in being imaged on lamina rara externa, eliminates the deviation of egative film imaging technique generation
HDI board blind hole weld-rings are usually no more than 4mil in problem, the existing mode of production, are produced using film egative film, artificial contraposition or PIN
Nail contraposition, precision can only ensure 2mil, and second order above blind hole accumulation skew will exceed 4mil, it is impossible to ensure multistage blind hole alignment
Degree is required；And LDI aligning accuracies are 1.2mil, accumulation offset is still in 4mil, it is ensured that good aligning accuracy, reduces layer
Between offset caused by contraposition it is bad, improve the Aligning degree of blind hole and internal layer PAD.
As the further improvement of technical scheme, step S6 includes：
S61, the second project file of acquisition, the second project file include the position letter of drilling blind hole loci and blind hole windowing
Breath；
S62, radium-shine rig are aligned using drilling blind hole loci and according to the second project file in the position of blind hole windowing
Put and produce blind hole.
Radium-shine rig is the heat energy brought by infrared ray using its light beam, medium is processed into molten condition, and reach
Gasification, finally removes pore-forming, so as to form micro hole.In the present invention, radium-shine rig is according to the second project file directly in blind hole
Blind hole is made in the position of windowing, improves blind hole producing efficiency.
Below with the HDI board blind hole preparation methods of the actual production process description present invention, flow scheme design is：Sawing sheet → internal layer
→ pressing → X-RAY bores gong side → blind hole windowing → blind hole etching → blind hole AOI → laser drilling after wad cutter → pressing → rear stream
Journey；Reduce after pressing to the flow between laser drilling, eliminate the flow for boring registration holes, improve blind hole alignment.It is interior
In laminar flow journey, the internal layer circuit of inner plating is made, is made after the internal layer PAD and wad cutter figure of inner plating, inner plating is pressed and outer
The step of entering blind hole windowing after laminate, brill wad cutter, gong side, with reference to Fig. 1, Fig. 1 is a kind of making of HDI board blind holes of the invention
The wad cutter distribution schematic diagram of method, MK2, MK3, C, MK4 are the wad cutter of trapezoidal profile, are used as the positioning wad cutter of blind hole windowing；And
Wad cutter MK1 is used to recognize direction fool proof, is not used in positioning.
With reference to Fig. 2, Fig. 2 is an a kind of specific embodiment schematic diagram of the preparation method of HDI board blind holes of the invention, this implementation
In example, HDI plates by taking 6 laminates as an example, wherein, L1-L6 is copper foil layer, and on substrate 1, it is solid that remaining flaggy passes through half for L3 and L4 bondings
Change piece (i.e. PP pieces) to bond, between such as L1 and L2, between L2 and L3；Through hole 4, the and of buried via hole 3 are provided with 6 laminates of the present embodiment
Several blind holes 2.The manufacturing process of blind hole 2 is：The blind hole between blind hole 2, L5 and L4 between L2 and L3 can make in the lump,
As inner plating after L3, L4 and base plate bonding, L2, L5 are as lamina rara externa (i.e. the secondary lamina rara externas of 6 laminates), and L3, L4 carry out internal layer
After circuit (including internal layer PAD) and wad cutter figure, L2, L5 are bonded by PP pieces and L3, L4 respectively, get out wad cutter, wad cutter is penetrated
L2 to L5；LDI exposure machines are positioned by wad cutter, according to the first project file directly by blind hole windowing, drilling blind hole loci, contraposition
The pattern transfer of ring obtains blind hole windowing, drilling blind hole loci and contraposition on lamina rara externa (L2 and L5), then by etching copper foil
Ring；Radium-shine rig is aligned by drilling blind hole loci, and blind hole is got out in the position of blind hole windowing according to the second project file, i.e., blind
Hole 2.With reference to Fig. 1, wherein, hole A, B, C are the positioning wad cutter for holes drilled through；, can be according to hole after L2 carries out blind hole to L5
A, B, C are positioned and are made through hole, and through hole, which is subsequently closed, makes buried via hole 3.
As the further improvement of technical scheme, blind via manufacture method of the invention also includes：
S7, the inner plating and lamina rara externa of blind hole will be made as inner plating, and repeat step S1-S6 proceeds blind hole
Make.
With reference to Fig. 2, L2 to L5 is carried out after blind hole 2 and through hole, using L2 to L5 as inner plating, continues to increase lamina rara externa,
Such as L1 and L6, blind hole and through hole 4 are made in continuation according to the method described above, and after completing, L2 to the through hole between L5 is closed shape
Into buried via hole 3.It is worth noting that, this time blind hole makes, it is that internal layer circuit (including internal layer PAD) and target are made on L2 and L5
Hole pattern, wad cutter position this time is different with last wad cutter position.In the present invention, wad cutter is arranged on auxiliary edges of boards.
Above is the preferable implementation to the present invention is illustrated, but the invention is not limited to the implementation
Example, those skilled in the art can also make a variety of equivalent variations or replace on the premise of without prejudice to spirit of the invention
Change, these equivalent deformations or replacement are all contained in the application claim limited range.
Claims (7)
1. a kind of preparation method of HDI board blind holes, it is characterised in that comprise the following steps：
S1, produce internal layer circuit and wad cutter figure on inner plating, the internal layer circuit includes internal layer PAD；
S2, pressing inner plating and lamina rara externa；
S3, get out wad cutter according to the wad cutter figure, the wad cutter runs through all flaggies；
S4, the figure for using the wad cutter being aligned and being produced on lamina rara externa drilling blind hole loci and blind hole windowing, institute
State blind hole windowing figure position corresponding with internal layer PAD positions；
S5, etch blind hole windowing and drilling blind hole loci；
S6, aligned using drilling blind hole loci and produce blind hole in the position of the blind hole windowing.
2. the preparation method of HDI board blind holes according to claim 1, it is characterised in that the trapezoidal distribution of the wad cutter.
3. the preparation method of HDI board blind holes according to claim 1, it is characterised in that the step S3 includes：Utilize X-
RAY bores target drone identification wad cutter figure to get out wad cutter.
4. the preparation method of the HDI board blind holes according to any one of claims 1 to 3, it is characterised in that the step S4 bags
Include：
S41, the first project file of acquisition, first project file include the position letter of drilling blind hole loci and blind hole windowing
Breath；
S42, LDI exposure machine are aligned using the wad cutter and brill are produced on lamina rara externa according to first project file
The figure of blind hole loci and blind hole windowing.
5. the preparation method of the HDI board blind holes according to any one of claims 1 to 3, it is characterised in that the step S6 bags
Include：
S61, the second project file of acquisition, second project file include the position letter of drilling blind hole loci and blind hole windowing
Breath；
S62, radium-shine rig are aligned using the drilling blind hole loci and according to second project file in the blind hole
Produce blind hole in the position of windowing.
6. the preparation method of the HDI board blind holes according to any one of claims 1 to 3, it is characterised in that the step S3 and
S4 also includes：The figure of contraposition ring is aligned and produced on lamina rara externa using the wad cutter, then etches contraposition ring, institute
Wad cutter is stated to be located in contraposition ring.
7. the preparation method of the HDI board blind holes according to any one of claims 1 to 3, it is characterised in that the preparation method
Also include：
S7, the inner plating and lamina rara externa of blind hole will be made as inner plating, and repeat step S1-S6 proceeds blind hole system
Make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710571732.XA CN107318233B (en) | 2017-07-13 | 2017-07-13 | A kind of production method of HDI board blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710571732.XA CN107318233B (en) | 2017-07-13 | 2017-07-13 | A kind of production method of HDI board blind hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107318233A true CN107318233A (en) | 2017-11-03 |
| CN107318233B CN107318233B (en) | 2019-09-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710571732.XA Active CN107318233B (en) | 2017-07-13 | 2017-07-13 | A kind of production method of HDI board blind hole |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109348624A (en) * | 2018-10-11 | 2019-02-15 | 安捷利（番禺）电子实业有限公司 | A kind of alignment method of laser blind hole |
| CN113784549A (en) * | 2021-09-08 | 2021-12-10 | 广东和鑫达电子股份有限公司 | Novel X-RAY target hole design method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036508A (en) * | 2011-01-05 | 2011-04-27 | 惠州中京电子科技股份有限公司 | Multi-layer HDI circuit board blind hole windowing process |
| CN104507252A (en) * | 2014-11-28 | 2015-04-08 | 惠州聚创汇智科技开发有限公司 | Printed circuit board |
| CN205071431U (en) * | 2015-09-11 | 2016-03-02 | 东莞市诚志电子有限公司 | PCB board is with preventing partially to bit architecture |
| CN205912325U (en) * | 2016-08-01 | 2017-01-25 | 深圳市嘉立创科技发展有限公司 | High -density interconnection board |
-
2017
- 2017-07-13 CN CN201710571732.XA patent/CN107318233B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036508A (en) * | 2011-01-05 | 2011-04-27 | 惠州中京电子科技股份有限公司 | Multi-layer HDI circuit board blind hole windowing process |
| CN104507252A (en) * | 2014-11-28 | 2015-04-08 | 惠州聚创汇智科技开发有限公司 | Printed circuit board |
| CN205071431U (en) * | 2015-09-11 | 2016-03-02 | 东莞市诚志电子有限公司 | PCB board is with preventing partially to bit architecture |
| CN205912325U (en) * | 2016-08-01 | 2017-01-25 | 深圳市嘉立创科技发展有限公司 | High -density interconnection board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109348624A (en) * | 2018-10-11 | 2019-02-15 | 安捷利（番禺）电子实业有限公司 | A kind of alignment method of laser blind hole |
| CN113784549A (en) * | 2021-09-08 | 2021-12-10 | 广东和鑫达电子股份有限公司 | Novel X-RAY target hole design method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107318233B (en) | 2019-09-10 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Method for making blind hole of HDI board Effective date of registration: 20210926 Granted publication date: 20190910 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: SHENZHEN SUNSHINE CIRCUIT TECHNOLOGY Co.,Ltd. Registration number: Y2021980009918 |
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