KR101525027B1 - method for manufacturing a printed circuit board - Google Patents

Abstract

The present invention relates to a method for manufacturing a printed circuit board using a multipoint type guide using laser processing, and a method for processing a via hole and a circuit pattern on a substrate, A step of forming points for via hole formation by exposure and forming points together for forming a guide hole, a step of boring the via hole and the guide hole by laser drilling, a step of plating the inner wall of the perforated via hole, A dry film exposure process for aligning and exposing a mask film provided for forming the circuit pattern on the basis of a guide hole on the substrate, and forming the circuit pattern on the substrate using the exposed dry film In the case of window work for circuit conduction, the same method of forming a window 8 point, Through to, it will be effective to improve the quality and speed as Bad, reduced treatment times and improve the alignment of the production lead time (Lead time) by a skip of the existing drill guide process.

Description

 [0001] METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board manufacturing method, and more particularly, to a technology for forming a guide for forming an image for a printed circuit board (PCB) ≪ / RTI >

In recent years, with the miniaturization of electronic parts for surface mounting such as IC chips, resistors, capacitors, etc., printed wiring boards to be mounted thereon are also required to have high density and many layers. Multilayered printed wiring boards such as four or six conductor layers are used even for civil use, and a multilayer printed wiring board having a larger number of layers for industrial use is in the trend of being used.

The multilayer printed wiring board is composed of a conductor layer exposed to the outside and a conductor layer of an inner layer not exposed, and an insulating substrate is inserted between the conductor layers, and the conductor layer is bonded by the substrate.
1 is a process diagram showing a conventional method of manufacturing a multilayer printed circuit board.
The multilayer circuit board is manufactured by sequentially performing a series of processes such as drilling, plating, circuit formation, and lamination.
First, a drilling guide hole point is formed on each substrate to indicate a point for a guide hole machining. (S1) The drilling guide hole point is a function of a so-called windowing operation in which the copper foil on the surface of the substrate is cut out to a predetermined size .
Next, the via hole is drilled at a required position by laser drilling (s2)
Next, a necessary number of substrates are stacked and a guide hole passing through all the substrates stacked by X-ray drilling is processed. (S3)
After the respective substrates are separated, the inner wall of the via hole is filled by plating. (s4)
After the substrates of the inner and outer layers are laminated, a circuit pattern is formed on the substrate of the outer layer. (S5)
Specifically, after laminating the dry film on the substrate of the outer layer, aligning the working film with respect to the guide hole, developing the circuit pattern image on the substrate of the outer layer by exposure, The copper foil is removed by etching to form a circuit pattern on the substrate of the outer layer. Step s5 is repeated as necessary to produce a multilayer circuit board. Electronic components are inserted or adhered to the top layer of the substrate.
When aligning the working film on the outer layer substrate, align the artwork points formed on the four corners of the wicking film so that they are at the center of the guide hole. For this purpose, a backlight is irradiated from the bottom of the stacked substrates and the artwork point is placed at the center of the guide hole using light projected through the guide hole.

Since the multilayer printed circuit board is made by laminating a plurality of inner and outer layers in this manner, alignment of wiring and holes between layers is very important.

Therefore, a guiding hole serving as a reference is formed on the inner and outer layers to be the respective layers for accurate matching.

As shown in Fig. 1, a guide hole machining process (s3) precedes the formation of the circuit pattern. Specifically, when six substrates are required, six substrates are stacked and fixed with a fixing pin so as not to move, and then a guide hole penetrating through all the substrates stacked by X-ray laser drilling is drilled.

Since a plurality of sheets are processed at a time in the drill guide processing (s3) as described above, a processing error may occur due to panel warpage.

Further, during the drilling operation, the inter-product fixing pins are inserted, and defects such as scratches and sticking due to the fixing pins may occur during the disassembling operation.

Fig. 2 shows a defective state due to such handling, and the circuit pattern is unclear, scratches or the like have occurred.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a drill bit guide for drilling a guide hole, And to improve quality defects by omitting the process of the method.

The present invention provides a multilayer printed circuit board manufacturing method for manufacturing a multilayer printed circuit board having a plurality of substrates each having an inner layer and an outer layer and having a via hole and a circuit pattern,
Forming a via hole point for via hole processing and a multi-point guide hole point for multi-point guide hole machining on each substrate;
A laser drilling process for drilling a via hole and a multi-point guide hole by drilling a via hole point and a position where the multi-point guide hole point is formed by laser drilling;
Plating the inner wall of the perforated via hole;
A dry film laminating process for aligning the substrates of the inner and outer layers based on the multi-point guide hole, and laminating the dry film on the substrate of the outer layer; And
Aligning a working film provided for forming a circuit pattern on the basis of the multi-point guide hole on the dry film, and performing exposure and etching to form the circuit pattern on the substrate; And a control unit.

At this time, the multi-point guide hole points for the multi-point guide hole machining are preferably formed on the circumference of a circle having a predetermined diameter at a predetermined interval.

According to the present invention as described above, the production lead time is shortened by skipping the existing drill guide process.

In addition, there is an effect of improving quality defects by reducing the number of times of handling and improving alignment.

Further, the printed circuit board is thinned and shortened, the thickness precision of the insulating layer is maximized, the operating characteristics of the printed circuit board are improved, the density of the circuit pattern is increased, and the electrical connection between the layers of the multilayer printed circuit board is more reliably .

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram showing a conventional manufacturing process of a pcb,
2 is a diagram showing a defective state according to a conventional process,
3 is a flow chart showing a process for producing a pcb of the present invention,
4 is a view showing a process for manufacturing a pcb of the present invention,
5 is a view showing a guide form by the pcb manufacturing process of the present invention,
6 is a diagram showing a circuit alignment state by the pcb manufacturing process of the present invention.

A method of processing a via hole and a circuit pattern on a substrate in a method of manufacturing a printed circuit board of the present invention is characterized by forming a via hole for processing a via hole on the substrate by a window operation and forming a multi- (S20) of forming the via holes and the multi-point guide holes by laser drilling (S20), plating the inner wall of the perforated via hole (S30), arranging the dry film on the substrate And a step (S40) of exposing and laminating a dry film (S40), and a step of forming the circuit pattern on the substrate using a working film matched on the dry film (S50) .

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
In comparison with the conventional multilayer circuit board manufacturing method shown and described in FIG. 1, the present invention is characterized in that a multi-point guide hole is formed instead of a conventional guide hole, and a working film is aligned using the multi- Since there is a difference, it will be explained intensively and other contents will be referred to with reference to the contents described with reference to Fig.

3 is a flowchart showing a method of processing a via hole and a circuit pattern on the substrate of the present invention.

As shown in FIG. 3, in the improved printed circuit board manufacturing method of the present invention, a via hole point for forming a via hole is formed on a substrate by a window operation, and a multi-point guide hole point Respectively. More specifically, a via hole point for via hole machining and a multi-point guide hole point for machining a multi-point guide hole are formed by a window operation. Here, the window work means that a part of the copper foil is cut out to a predetermined size by exposure and etching.

The multi-point guide hole point is for machining a multi-point guide hole which is a standard for post-processing.

Next, in the step (S20) of drilling the via hole and the multi-point guide hole by laser drilling, the multi-point guide hole and the via hole are simultaneously drilled (s25).

In order to form the multi-point guide as described above, it is preferable to set the point size and check the size of the laser drilled beam to set the optimum size.

FIG. 5 is a diagram showing a guide form by the pcb manufacturing process of the present invention. FIG.

As shown in FIG. 5, it is preferable that a plurality of multi-point guide hole points 80 for multi-point guide hole machining are formed radially with a predetermined interval on a circular circle of a predetermined diameter. In the example of the present invention, the number of multi-point guide hole points is eight.

Since only about 75% of the size of the laser beam is processed correctly, the window size is set to form the through hole using the double-side processing method.

 Marker Recognition of the Exposure Guide size is very important because accuracy can be different depending on the formation of the circular outline line image.

Next, in the step of plating the inner wall of the perforated via hole (S30), since the resin and glass are exposed in a state where the hole in the drilled hole after the hole processing is not conductive, it is plated with a conductive material so as to be electrically connectable do.

Electroless plating on the inner walls and surfaces of the exposed holes, followed by electrolytic plating to form the thickness of the circuit, enabling electrical connection between circuit layers.

Next, a dry film is laminated on the substrate to form the circuit pattern on the basis of the multi-point guide hole. (S40)

And the circuit pattern is formed on the substrate using the dry film. (S50)

In step S50, a working film is aligned on the dry film, and the predetermined pattern intensity, exposure time, and light energy are supplied and reacted to develop the circuit pattern image on the necessary dry film. A circuit pattern is formed by etching according to the formed circuit pattern image. As this is well known to those skilled in the art, a detailed description will be omitted.

Unlike ordinary drill, the laser drilling method is very good for handling and constant processability by progressing work by vacuum fixing one by one.

It is possible to expect a printed circuit board on which the position matching of the substrate holes is precisely processed as shown in FIG.

The present invention aims to reduce the number of times of handling by omitting the conventional drill guide type process as described above. By omitting the conventional drill guide type process, the lead time can be shortened have.

In addition, there is an effect of improving quality defects by reducing the number of times of handling and improving alignment.

S10: Point forming process S20: Via hole and guide hole drilling process
S30: Inner wall plating process of via hole S40: Dry film laminating process
S50: Circuit pattern formation process
80: Multipoint guide hole 90: Beacon point

Claims (2)

A multilayer printed circuit board manufacturing method for manufacturing a multilayer printed circuit board composed of a plurality of substrates each constituting an inner layer and an outer layer and having a via hole and a circuit pattern,
Forming a via hole point for via hole processing and a multi-point guide hole point for multi-point guide hole machining on each substrate;
A laser drilling process for drilling a via hole and a multi-point guide hole by drilling a via hole point and a position where the multi-point guide hole point is formed by laser drilling;
Plating the inner wall of the perforated via hole;
A dry film laminating process of aligning substrates of an inner layer and an outer layer on the basis of the multi-point guide hole and laminating a dry film on the substrate of the outer layer; And
Aligning a working film provided for forming a circuit pattern on the basis of the multi-point guide hole on the dry film, and performing exposure and etching to form the circuit pattern on the substrate; ≪ / RTI >
The method according to claim 1,
Wherein the multi-point guide hole points for the multi-point guide hole machining are formed at predetermined intervals on a circle of a circle having a predetermined diameter.

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