CN107318233B - A kind of production method of HDI board blind hole - Google Patents
A kind of production method of HDI board blind hole Download PDFInfo
- Publication number
- CN107318233B CN107318233B CN201710571732.XA CN201710571732A CN107318233B CN 107318233 B CN107318233 B CN 107318233B CN 201710571732 A CN201710571732 A CN 201710571732A CN 107318233 B CN107318233 B CN 107318233B
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- CN
- China
- Prior art keywords
- blind hole
- wad cutter
- windowing
- internal layer
- loci
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of production methods of HDI board blind hole, comprising the following steps: internal layer circuit and wad cutter figure S1, is produced on inner plating, internal layer circuit includes internal layer PAD；S2, pressing inner plating and lamina rara externa；S3, wad cutter is drilled out according to wad cutter figure, wad cutter runs through all plate layers；S4, contraposition is carried out using wad cutter and produces the figure of drilling blind hole loci and blind hole windowing on lamina rara externa, blind hole windowing figure position is corresponding with the position internal layer PAD；S5, blind hole windowing and drilling blind hole loci are etched；S6, align using drilling blind hole loci and produce blind hole in the position of blind hole windowing.A kind of production method of HDI board blind hole of the present invention improves the Aligning degree of blind hole windowing and internal layer PAD since internal layer PAD and wad cutter figure are arranged on same inner plating, and then improves the alignment precision of blind hole Yu internal layer PAD.A kind of production method of the present invention as HDI board blind hole, can be widely applied to blind hole production field.
Description
Technical field
The present invention relates to blind hole production field, especially a kind of production method of HDI board blind hole.
Background technique
As the miniaturization of electronic product, high performance, multifunction and high-frequency high-speed develop, push with high density
HDI manufacturing technology with the characteristics of changing, refining is promoted rapidly, causes PCB design blind hole order more and more；It is domestic at present most
The multi-stage HDI plate of producer mainly uses lamination method technique to make, by pressing often, production process is long, key technology and processing procedure
The restriction of ability, the Aligning degree deviation of each interlayer have exceeded control and require, the alignment index of multi-stage HDI plate include blind hole with
The alignment of top/back welding disk, blind hole and blind hole, through-hole and inside/outside layer pad.Former process design are as follows: sawing sheet → internal layer → pressing →
X-RAY bores gong side → brill registration holes and buried via hole → Conformal mask blind hole windowing → blind hole etching after wad cutter → pressing → blind
Hole AOI → laser drilling → rear process, thus process, which can be seen that, influences having for blind hole alignment: X-RAY precision, drilling hole
Position precision, blind hole windowing contraposition precision, multiple links determine the Aligning degree of blind hole, cause the Aligning degree of blind hole low and be difficult to change
It is kind.
Summary of the invention
In order to solve the above-mentioned technical problem, the object of the present invention is to provide a kind of HDI board blind holes that blind hole alignment is high
Production method.
The technical scheme adopted by the invention is that: a kind of production method of HDI board blind hole, comprising the following steps:
S1, internal layer circuit and wad cutter figure are produced on inner plating, the internal layer circuit includes internal layer PAD；
S2, pressing inner plating and lamina rara externa；
S3, wad cutter is drilled out according to the wad cutter figure, the wad cutter runs through all plate layers；
S4, contraposition is carried out using the wad cutter and produces the figure of drilling blind hole loci and blind hole windowing on lamina rara externa
Shape, blind hole windowing figure position are corresponding with the position internal layer PAD；
S5, blind hole windowing and drilling blind hole loci are etched；
S6, align using drilling blind hole loci and produce blind hole in the position of the blind hole windowing.
Further, the trapezoidal distribution of the wad cutter.
Further, the step S3 includes: to bore target drone identification wad cutter figure using X-RAY to drill out wad cutter.
Further, the step S4 includes:
S41, the first project file is obtained, first project file includes the position of drilling blind hole loci and blind hole windowing
Information；
S42, LDI exposure machine align and made on lamina rara externa according to first project file using the wad cutter
The figure of drilling blind hole loci and blind hole windowing out.
Further, the step S6 includes:
S61, the second project file is obtained, second project file includes the position of drilling blind hole loci and blind hole windowing
Information；
S62, radium-shine drilling machine carry out contraposition and according to second project file described using the drilling blind hole loci
Produce blind hole in the position of blind hole windowing.
Further, the step S3 and S4 further include: align and produce on lamina rara externa using the wad cutter
The figure of ring is aligned, then etches contraposition ring, the wad cutter is located in contraposition ring.
Further, the production method further include:
S7, using the inner plating and lamina rara externa of making blind hole, as inner plating, and repeatedly, step S1-S6 continues blind hole
Production.
The beneficial effects of the present invention are: a kind of production method of HDI board blind hole of the present invention, inner plating carry out interior route and target
After hole pattern, internal layer circuit includes internal layer PAD, presses inner plating and lamina rara externa and makes wad cutter, is aligned simultaneously by wad cutter
Drilling blind hole loci and blind hole windowing are produced on lamina rara externa, blind hole windowing position is opposite with the position internal layer PAD
It answers；Align using drilling blind hole loci and produces blind hole in the position of blind hole windowing；Due to internal layer PAD and wad cutter figure
It is arranged on same inner plating, improves the Aligning degree of blind hole windowing and internal layer PAD, and then improves pair of blind hole Yu internal layer PAD
Quasi- precision.
Detailed description of the invention
Specific embodiments of the present invention will be further explained with reference to the accompanying drawing:
Fig. 1 is a kind of wad cutter distribution schematic diagram of the production method of HDI board blind hole of the present invention；
Fig. 2 is an a kind of specific embodiment schematic diagram of the production method of HDI board blind hole of the present invention.
Specific embodiment
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.
A kind of production method of HDI board blind hole, comprising the following steps:
S1, internal layer circuit and wad cutter figure are produced on inner plating, internal layer circuit includes internal layer PAD；
S2, pressing inner plating and lamina rara externa；
S3, wad cutter is drilled out according to wad cutter figure, wad cutter runs through all plate layers；
S4, contraposition is carried out using wad cutter and produces the figure of drilling blind hole loci and blind hole windowing on lamina rara externa, it is blind
Hole windowing figure position is corresponding with the position internal layer PAD；
S5, blind hole windowing and drilling blind hole loci are etched；
S6, align using drilling blind hole loci and produce blind hole in the position of blind hole windowing.
A kind of production method of HDI board blind hole of the present invention, since the PAD and wad cutter figure of internal layer circuit are arranged same interior
On laminate, the Aligning degree of blind hole windowing Yu internal layer PAD is improved, and then improves the alignment precision of blind hole Yu internal layer PAD.
As the further improvement of technical solution, when executing step S3 and S4, further include carried out using wad cutter contraposition and
The figure that contraposition ring is produced on lamina rara externa, etches contraposition ring, and wad cutter is located in contraposition ring.By checking wad cutter on lamina rara externa
With the situation of contraposition ring, wad cutter may determine that blind hole whether in contraposition ring, according to the alignment case of wad cutter and contraposition ring
Windowing and the alignment case of internal layer PAD facilitate staff to learn contraposition quality (contraposition deviation, inferior to reverse side).Align ring
There is size, generally there is 2mil to 3mil, if contraposition ring is broken, also explanation is that the contraposition quality of blind hole windowing has exception.
As the further improvement of technical solution, the trapezoidal distribution of wad cutter prevents staff from doing wrong to realize fool proof
Plate improves the producing efficiency of HDI plate if if rectangular design, staff, which misplaces plank, is also difficult discovery.
As the further improvement of technical solution, step S3 includes: to bore target drone identification wad cutter figure using X-RAY to drill out
Wad cutter.Wad cutter can precisely be drilled out by boring target drone using X-RAY, guarantee the accurate contraposition of inner plating and lamina rara externa.
As the further improvement of technical solution, step S4 includes:
S41, the first project file is obtained, the first project file includes the position letter of drilling blind hole loci and blind hole windowing
Breath；
S42, LDI exposure machine align using wad cutter and produce drilling blind hole on lamina rara externa according to the first project file
The figure of loci and blind hole windowing.
Specifically, the first project file includes drilling blind hole loci, blind hole windowing and the location information for aligning ring, and LDI exposes
Ray machine using using wad cutter carry out contraposition and drilling blind hole loci produced on lamina rara externa according to the first project file, blind hole is opened
The figure of window and contraposition ring eliminates the deviation of egative film imaging technique generation using LDI exposure machine directly in being imaged on lamina rara externa
Problem, HDI board blind hole weld-ring is usually no more than 4mil in existing production method, is produced using film egative film, artificial contraposition or PIN
Nail contraposition, precision can only ensure 2mil, and the above blind hole accumulation offset of second order will be more than 4mil, not can guarantee multistage blind hole alignment
Degree requires；And LDI aligning accuracy is 1.2mil, accumulates offset still in 4mil, ensure that good aligning accuracy, reduces layer
Between deviate caused by contraposition it is bad, improve the Aligning degree of blind hole Yu internal layer PAD.
As the further improvement of technical solution, step S6 includes:
S61, the second project file is obtained, the second project file includes the position letter of drilling blind hole loci and blind hole windowing
Breath；
S62, radium-shine drilling machine carry out contraposition and according to the second project file in the position of blind hole windowing using drilling blind hole loci
It sets and produces blind hole.
Radium-shine drilling machine is medium to be processed into molten condition, and reach using its light beam bring thermal energy by infrared ray
Gasification, finally removes pore-forming, to form micro hole.In the present invention, radium-shine drilling machine is according to the second project file directly in blind hole
Blind hole is made in the position of windowing, improves blind hole producing efficiency.
The HDI board blind hole production method of the invention with actual production process description below, process design are as follows: sawing sheet → internal layer
→ pressing → X-RAY bores gong side → blind hole windowing → blind hole etching → blind hole AOI → laser drilling → rear stream after wad cutter → pressing
Journey；Reduce after pressing to the process between laser drilling, eliminates the process for boring registration holes, improve blind hole alignment.It is interior
In laminar flow journey, the internal layer circuit of inner plating is made, after making the internal layer PAD and wad cutter figure of inner plating, pressing inner plating and outer
The step of laminate bores wad cutter, enters blind hole windowing after gong side is a kind of production of HDI board blind hole of the present invention with reference to Fig. 1, Fig. 1
The wad cutter distribution schematic diagram of method, MK2, MK3, C, MK4 are the wad cutter of trapezoidal profile, the positioning wad cutter as blind hole windowing；And
Wad cutter MK1 direction fool proof for identification, is not used in positioning.
It is an a kind of specific embodiment schematic diagram of the production method of HDI board blind hole of the present invention, this implementation with reference to Fig. 2, Fig. 2
In example, HDI plate is by taking 6 laminates as an example, wherein L1-L6 is copper foil layer, and on substrate 1, remaining plate layer is solid by half for L3 and L4 bonding
Change piece (i.e. PP piece) bonding, as between L1 and L2, between L2 and L3；Through-hole 4,3 and of buried via hole are provided in 6 laminates of the present embodiment
Several blind holes 2.The manufacturing process of blind hole 2 are as follows: the blind hole between blind hole 2, L5 and L4 between L2 and L3 can make together,
It is used as inner plating after L3, L4 and substrate bonding, as lamina rara externa (i.e. the secondary lamina rara externas of 6 laminates), L3, L4 carry out internal layer by L2, L5
After route (including internal layer PAD) and wad cutter figure, L2, L5 pass through PP piece respectively and L3, L4 are bonded, and drill out wad cutter, wad cutter penetrates
L2 to L5；LDI exposure machine is positioned by wad cutter, according to the first project file directly by blind hole windowing, drilling blind hole loci, contraposition
In the pattern transfer of ring to lamina rara externa (L2 and L5), then by etch copper foil obtain blind hole windowing, drilling blind hole loci and contraposition
Ring；Radium-shine drilling machine is aligned by drilling blind hole loci, drills out blind hole in the position of blind hole windowing according to the second project file, i.e., blind
Hole 2.With reference to Fig. 1, wherein hole A, B, C are the positioning wad cutter for holes drilled through；It, can be according to hole after L2 carries out blind hole to L5
A, B, C position and make through-hole, and subsequent be closed of through-hole is made into buried via hole 3.
As the further improvement of technical solution, blind via manufacture method of the invention further include:
S7, using the inner plating and lamina rara externa of making blind hole, as inner plating, and repeatedly, step S1-S6 continues blind hole
Production.
With reference to Fig. 2, after L2 to L5 carries out blind hole 2 and through-hole, using L2 to L5 as inner plating, lamina rara externa is continued growing,
Such as L1 and L6, blind hole and through-hole 4 are made in continuation according to the method described above, and after completing, L2 to the through-hole between L5 is closed shape
At buried via hole 3.It is worth noting that, this time blind hole makes, it is that internal layer circuit (including internal layer PAD) and target are made on L2 and L5
Hole pattern, wad cutter position this time are different with last wad cutter position.In the present invention, wad cutter setting is in auxiliary edges of boards.
It is to be illustrated to preferable implementation of the invention, but the invention is not limited to the implementation above
Example, those skilled in the art can also make various equivalent variations on the premise of without prejudice to spirit of the invention or replace
It changes, these equivalent deformations or replacement are all included in the scope defined by the claims of the present application.
Claims (6)
1. a kind of production method of HDI board blind hole, which comprises the following steps:
S1, internal layer circuit and wad cutter figure are produced on inner plating, the internal layer circuit includes internal layer PAD；
S2, pressing inner plating and lamina rara externa；
S3, wad cutter is drilled out according to the wad cutter figure, the wad cutter runs through all plate layers；
S4, contraposition is carried out using the wad cutter and produces the figure of drilling blind hole loci and blind hole windowing, institute on lamina rara externa
It is corresponding with the position internal layer PAD to state blind hole windowing figure position；
S5, blind hole windowing and drilling blind hole loci are etched；
S6, align using drilling blind hole loci and produce blind hole in the position of the blind hole windowing；
The step S3 and S4 includes: the figure for carrying out contraposition using the wad cutter and producing contraposition ring on lamina rara externa, then
Contraposition ring is etched, the wad cutter is located in contraposition ring.
2. the production method of HDI board blind hole according to claim 1, which is characterized in that the trapezoidal distribution of wad cutter.
3. the production method of HDI board blind hole according to claim 1, which is characterized in that the step S3 includes: to utilize X-
RAY bores target drone identification wad cutter figure to drill out wad cutter.
4. the production method of HDI board blind hole according to any one of claims 1 to 3, which is characterized in that the step S4 packet
It includes:
S41, the first project file is obtained, first project file includes the position letter of drilling blind hole loci and blind hole windowing
Breath；
S42, LDI exposure machine align using the wad cutter and produce brill on lamina rara externa according to first project file
The figure of blind hole loci and blind hole windowing.
5. the production method of HDI board blind hole according to any one of claims 1 to 3, which is characterized in that the step S6 packet
It includes:
S61, the second project file is obtained, second project file includes the position letter of drilling blind hole loci and blind hole windowing
Breath；
S62, radium-shine drilling machine carry out contraposition and according to second project file in the blind hole using the drilling blind hole loci
Produce blind hole in the position of windowing.
6. the production method of HDI board blind hole according to any one of claims 1 to 3, which is characterized in that the production method
Further include:
S7, using the inner plating and lamina rara externa of making blind hole, as inner plating, and repeatedly, step S1-S6 continues blind hole system
Make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710571732.XA CN107318233B (en) | 2017-07-13 | 2017-07-13 | A kind of production method of HDI board blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710571732.XA CN107318233B (en) | 2017-07-13 | 2017-07-13 | A kind of production method of HDI board blind hole |
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| Publication Number | Publication Date |
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| CN107318233A CN107318233A (en) | 2017-11-03 |
| CN107318233B true CN107318233B (en) | 2019-09-10 |
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| CN201710571732.XA Active CN107318233B (en) | 2017-07-13 | 2017-07-13 | A kind of production method of HDI board blind hole |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109348624B (en) * | 2018-10-11 | 2020-09-01 | 安捷利（番禺）电子实业有限公司 | Laser blind hole alignment method |
| CN113784549A (en) * | 2021-09-08 | 2021-12-10 | 广东和鑫达电子股份有限公司 | Novel X-RAY target hole design method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036508A (en) * | 2011-01-05 | 2011-04-27 | 惠州中京电子科技股份有限公司 | Multi-layer HDI circuit board blind hole windowing process |
| CN104507252A (en) * | 2014-11-28 | 2015-04-08 | 惠州聚创汇智科技开发有限公司 | Printed circuit board |
| CN205071431U (en) * | 2015-09-11 | 2016-03-02 | 东莞市诚志电子有限公司 | PCB board is with preventing partially to bit architecture |
| CN205912325U (en) * | 2016-08-01 | 2017-01-25 | 深圳市嘉立创科技发展有限公司 | High -density interconnection board |
-
2017
- 2017-07-13 CN CN201710571732.XA patent/CN107318233B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036508A (en) * | 2011-01-05 | 2011-04-27 | 惠州中京电子科技股份有限公司 | Multi-layer HDI circuit board blind hole windowing process |
| CN104507252A (en) * | 2014-11-28 | 2015-04-08 | 惠州聚创汇智科技开发有限公司 | Printed circuit board |
| CN205071431U (en) * | 2015-09-11 | 2016-03-02 | 东莞市诚志电子有限公司 | PCB board is with preventing partially to bit architecture |
| CN205912325U (en) * | 2016-08-01 | 2017-01-25 | 深圳市嘉立创科技发展有限公司 | High -density interconnection board |
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| CN107318233A (en) | 2017-11-03 |
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Denomination of invention: Method for making blind hole of HDI board Effective date of registration: 20210926 Granted publication date: 20190910 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: SHENZHEN SUNSHINE CIRCUIT TECHNOLOGY Co.,Ltd. Registration number: Y2021980009918 |